JPH05166977A - Molded semiconductor sensor holder - Google Patents

Abstract

PURPOSE:To enable a sensor to be easily handled or replaced by a method wherein the sensor is built in a holder equipped with a cord. CONSTITUTION:As a molded semiconductor sensor 1 is mounted in a detachable manner on the front of a holder equipped with a cord 11 as protected by a case A through the intermediary of a socket B, a holder section can be easily handled, and the sensor 1 can be easily replaced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention easily installs a mold type semiconductor detection sensor (hereinafter simply referred to as an IC) in a detection sensor of a non-contact type proximity detection device or the like at any place to be inspected. It is about the holder that made it possible.

[0002]

2. Description of the Related Art In a conventional non-contact type proximity detection device, a detection sensor portion is used by incorporating it into a main body substrate or an auxiliary substrate of the proximity detection device, or only the detection sensor is separated from a main body basic plate or the like, and the sensor is removed. I used it by attaching it to the key points of the equipment to be used.

[0003]

However, it may be difficult to attach the main body substrate or the auxiliary substrate to a desired portion of the device, and if only the detection sensor is attached to the device, the detection sensor is a mold type conductor or the like. Since the device itself is so small, it may be difficult to attach it stably and firmly without being affected by the electromagnetic effect of the device, and when the detection sensor malfunctions or fails, it is difficult to replace it. It is an object of the present invention to provide a holder with a cord that facilitates handling of a mold type semiconductor sensor and can be easily replaced.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a mold type semiconductor sensor is connected to a connecting part of a synthetic resin sensor case in which a connecting part is connected to a rear part of a support cylinder into which a mold type semiconductor sensor can be detachably incorporated. For molded semiconductors, in which a sensor socket made of synthetic resin with a connecting terminal for connecting the cord to the cord and a cord supporter made of synthetic resin holding the end of the cord connected to the sensor socket are sequentially connected in an integral structure The above-mentioned problem was solved by mounting a semiconductor sensor on the sensor holder and using it.

[0005]

According to the present invention, a minute and difficult to handle mold type semiconductor sensor can be detachably attached to the front part of a holder with a strong cord through a socket whose periphery is protected by a case and which has a connection terminal. Since it is attached to
The holder part is easy to handle and can be easily installed anywhere in the device, and when the detection sensor breaks down or malfunctions, it can be easily replaced by the socket.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The drawings show an embodiment of the present invention. The semiconductor sensor holder of the present invention is a sensor case made of synthetic resin.
(A) and a sensor case (A) which is detachably fitted to the central portion of the sensor case (A), and a cord supporter (C) which is detachably fitted to the rear portion of the sensor case (A).

A mold type semiconductor sensor (hereinafter abbreviated as a sensor) (1) is fitted into the front portion of the sensor case (A) (the right portion of FIG. 1; the same applies hereinafter) in the form of a rectangular tube. A support cylinder (2) is formed, and a sensor is provided at the center of the bottom surface of the support cylinder (2).
When the (1) is inserted, a hook (3) is formed at the front end of the bottom surface thereof so as to be elastically engaged from below.

A guide hole (5) through which a plurality of connection terminals (1a) of the sensor (1) are inserted is formed in a partition portion (4) formed in the central portion of the sensor case (A).

At the rear part of the sensor case (A), an upper surface and a left rear part are opened to form a connecting part (6) having a U-shaped groove in a plan view, and an engaging hole (7) is formed at the center of the bottom surface. And a guide groove (8) is formed on both side surfaces thereof so as to face forward from the rear end.

The sensor socket (B) is a sensor case (A)
It has such a size that it can be fitted into the connecting portion (6) of the sensor from the rear side, and is fitted in the guide grooves (8) of the sensor case (A) at the front portions of both side surfaces to guide the attachment and detachment of the sensor socket (B). A ridge (9) is provided.

A female contactor (10) facing in the front-rear direction is provided at a position corresponding to the guide hole (5) in the sensor socket (B), and the contactor is located on the right front side of (10). The terminal (1a) of the sensor (1) is fitted into the part, and the fitting tube (10a) is elastically and electrically connected. The rear part projects rearward from the sensor socket (B). 11) It is a connection piece (10b) for connection.

A partition plate (12) is provided on the rear end surface of the sensor socket (B) so as to prevent the wires of the connected cord (11) from coming into contact with each other.

The cord supporter (C) has an open upper surface at the front end on the right front side, and has a reverse U-shaped groove in plan view. At the front ends of both side surfaces, the guide groove (of the sensor case (A) faces forward. A connecting piece (13) that can be fitted into the connecting hole (8) is bored, and when the connecting piece (13) is fitted into the guide groove (8), the engaging hole of the connecting portion (6) is formed in the center of the front part of the bottom surface.
A hook (14) that is elastically engaged from below is formed in (7), and an insertion groove (15) for the cord (11) is formed in the rear end surface.

In each of the above-mentioned members, the cord (11) is semicircularly attached to the connection piece (10b) of the connection terminal (10) of the sensor socket (B), and the sensor socket (B) is first attached to the sensor case (A). Insert the connecting piece (13) of the cord supporter (C) into the connecting portion (6) from the rear along the guide groove (8) to the far end and guide groove.
When inserted into (8), the hook (14) is elastically engaged with the engagement hole (7) from below, the cord (11) is fitted into the insertion groove (15), and the respective elements are integrally connected. It

Next, in the engaging portion of the cord supporter (C),
As shown in FIG. 1, for example, by immersing and curing the normal-humidity-curable synthetic resin (16) in the exposed space of the connecting portion (10b) of the connecting terminal (10) and the connecting portion of the cord (11). It is possible to obtain a semiconductor sensor holder in which the above-described constituent elements except the simple sensor (1) are fixed in an integral structure.

The sensor (1) is pressed onto the support cylinder (2) of the holder case (A), and the packing (17) of rubber or elastomer or soft plastic is pressed onto the lower end of the sensor (1), When it is pressed and inserted in the rear end direction, the hook (3) is elastically engaged with the lower front end of the sensor (1) from below by the elasticity of the packing (17) and firmly supported, and the sensor (1) has its terminal ( 1a) is inserted through the guide hole (5) of the sensor case (A),
Cord (11) through the connection terminal (10) of the sensor socket (B)
To be

The packing (17) has an outer shape that is pressed into close contact with the chamber (18) in front of the branch opening (4) of the sensor case (2), and the sensor (1) is engaged with the hook (3). Combined packing
When the (17) is repressed, the packing (17) is pressure-tightly pressed to the chamber (12) to maintain the airtightness and watertightness of the connection part.

The sensor attached to the holder of the present invention is not limited to a proximity sensor semiconductor sensor such as a Hall IC, but a temperature detecting semiconductor sensor, a mold type IC element, a mold type transistor element or the like may be attached as a sensor. It can also be used.

[0019]

According to the present invention, since it is not necessary to incorporate a mold type semiconductor sensor into the body of the proximity detection device, the body can be installed anywhere.

Further, since the minute mold type semiconductor sensor is incorporated in the front portion of the strong holder with the periphery being protected in the case, it is easy to handle and can be easily attached to any place of the device for detecting proximity. Moreover, if the sensor fails or malfunctions, it can be easily replaced.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor sensor holder of the present invention.

FIG. 2 is an exploded plan view of the same.

FIG. 3 is also a central longitudinal disassembly side view.

FIG. 4 is a view taken along line XX of FIG.

5 is a view taken along the line YY of FIG.

FIG. 6 is a view taken along the line ZZ in FIG.

[Explanation of symbols]

 (A) Sensor case (B) Sensor socket (C) Cord supporter (1) Sensor (1a) Connection terminal (2) Support tube (3) Hook (4) Partition section (5) Guide hole (6) Connecting section (7) ) Engagement hole (8) Guide groove (9) Protrusion (10) Contact (10a) Fitting tube (10b) Connection terminal (11) Cord (12) Separator (13) Connecting piece (14) Hook (15) ) Insertion groove (16) Synthetic resin (17) Packing (18) Chamber

Claims (1)

[Claims] 1. A connecting terminal for connecting a molded semiconductor sensor to a cord is provided at a connecting portion of a sensor case made of a synthetic resin, in which a connecting portion is connected to a rear portion of a support cylinder into which the molded semiconductor sensor can be detachably incorporated. A sensor holder for a molded semiconductor, in which a sensor socket made of synthetic resin provided therein and a code supporter made of synthetic resin for holding an end portion of a cord connected to the sensor socket are sequentially connected in an integral structure.