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WO2001018870A3 - Ladungskompensationshalbleiteranordnung und verfahren zu deren herstellung - Google Patents

Ladungskompensationshalbleiteranordnung und verfahren zu deren herstellung Download PDF

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Publication number
WO2001018870A3
WO2001018870A3 PCT/EP2000/008707 EP0008707W WO0118870A3 WO 2001018870 A3 WO2001018870 A3 WO 2001018870A3 EP 0008707 W EP0008707 W EP 0008707W WO 0118870 A3 WO0118870 A3 WO 0118870A3
Authority
WO
WIPO (PCT)
Prior art keywords
production
semiconductor device
charge compensating
compensating semiconductor
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2000/008707
Other languages
English (en)
French (fr)
Other versions
WO2001018870A2 (de
Inventor
Anton Mauder
Hans-Joachim Schulze
Gerald Deboy
Helmut Strack
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19942677A external-priority patent/DE19942677C2/de
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Publication of WO2001018870A2 publication Critical patent/WO2001018870A2/de
Publication of WO2001018870A3 publication Critical patent/WO2001018870A3/de
Priority to US10/093,306 priority Critical patent/US6504230B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H10P30/204—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/01—Manufacture or treatment
    • H10D62/051—Forming charge compensation regions, e.g. superjunctions
    • H10D62/054—Forming charge compensation regions, e.g. superjunctions by high energy implantations in bulk semiconductor bodies, e.g. forming pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/109—Reduced surface field [RESURF] PN junction structures
    • H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/834—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge further characterised by the dopants
    • H10P30/21—
    • H10P30/22—

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Light Receiving Elements (AREA)

Abstract

Es wird ein Kompensationsbauelement und ein Verfahren zu dessen Herstellung beschrieben, wobei Kompensationsgebiete (3) durch Implantation von Schwefel oder Selen in einer p-leiten-den Halbleiterschicht (3) erzeugt werden oder als p-leitende Gebiete (8), die mit Indium, Thallium und/oder Palladium dotiert sind, clusterartig in einem n-leitenden Gebiet (7) vorgesehen werden.
PCT/EP2000/008707 1999-09-07 2000-09-06 Ladungskompensationshalbleiteranordnung und verfahren zu deren herstellung Ceased WO2001018870A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US10/093,306 US6504230B2 (en) 1999-09-07 2002-03-07 Compensation component and method for fabricating the compensation component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19942677A DE19942677C2 (de) 1999-09-07 1999-09-07 Kompensationsbauelement und Verfahren zu dessen Herstellung
DE19942677.5 1999-09-07

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/093,306 Continuation US6504230B2 (en) 1999-09-07 2002-03-07 Compensation component and method for fabricating the compensation component

Publications (2)

Publication Number Publication Date
WO2001018870A2 WO2001018870A2 (de) 2001-03-15
WO2001018870A3 true WO2001018870A3 (de) 2001-08-02

Family

ID=7921087

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/008707 Ceased WO2001018870A2 (de) 1999-09-07 2000-09-06 Ladungskompensationshalbleiteranordnung und verfahren zu deren herstellung

Country Status (3)

Country Link
US (1) US6504230B2 (de)
DE (1) DE19964214C2 (de)
WO (1) WO2001018870A2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10022268B4 (de) * 2000-05-08 2005-03-31 Infineon Technologies Ag Halbleiterbauelement mit zwei Halbleiterkörpern in einem gemeinsamen Gehäuse
DE10122364B4 (de) * 2001-05-09 2006-10-19 Infineon Technologies Ag Kompensationsbauelement, Schaltungsanordnung und Verfahren
DE10217610B4 (de) * 2002-04-19 2005-11-03 Infineon Technologies Ag Metall-Halbleiter-Kontakt, Halbleiterbauelement, integrierte Schaltungsanordnung und Verfahren
US7015104B1 (en) * 2003-05-29 2006-03-21 Third Dimension Semiconductor, Inc. Technique for forming the deep doped columns in superjunction
WO2005065179A2 (en) * 2003-12-19 2005-07-21 Third Dimension (3D) Semiconductor, Inc. Method of manufacturing a superjunction device
US7023069B2 (en) * 2003-12-19 2006-04-04 Third Dimension (3D) Semiconductor, Inc. Method for forming thick dielectric regions using etched trenches
EP1706899A4 (de) * 2003-12-19 2008-11-26 Third Dimension 3D Sc Inc Planarisierungsverfahren zur herstellung eines superjunction-bauelements
KR20080100265A (ko) * 2003-12-19 2008-11-14 써드 디멘존 세미컨덕터, 인코포레이티드 종래의 종단을 갖는 수퍼 접합 장치를 제조하는 방법
KR20070029655A (ko) * 2003-12-19 2007-03-14 써드 디멘존 세미컨덕터, 인코포레이티드 넓은 메사를 갖는 수퍼 접합 장치의 제조 방법
TWI401749B (zh) * 2004-12-27 2013-07-11 ３Ｄ半導體股份有限公司 用於高電壓超接面終止之方法
US7439583B2 (en) 2004-12-27 2008-10-21 Third Dimension (3D) Semiconductor, Inc. Tungsten plug drain extension
TW200727367A (en) * 2005-04-22 2007-07-16 Icemos Technology Corp Superjunction device having oxide lined trenches and method for manufacturing a superjunction device having oxide lined trenches
US7446018B2 (en) 2005-08-22 2008-11-04 Icemos Technology Corporation Bonded-wafer superjunction semiconductor device
US20080116494A1 (en) * 2006-11-20 2008-05-22 Matthias Goldbach Method for manufacturing a semiconductor device
US7723172B2 (en) 2007-04-23 2010-05-25 Icemos Technology Ltd. Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
US8580651B2 (en) * 2007-04-23 2013-11-12 Icemos Technology Ltd. Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
US20090085148A1 (en) * 2007-09-28 2009-04-02 Icemos Technology Corporation Multi-directional trenching of a plurality of dies in manufacturing superjunction devices
US8159039B2 (en) * 2008-01-11 2012-04-17 Icemos Technology Ltd. Superjunction device having a dielectric termination and methods for manufacturing the device
US7795045B2 (en) * 2008-02-13 2010-09-14 Icemos Technology Ltd. Trench depth monitor for semiconductor manufacturing
US7846821B2 (en) * 2008-02-13 2010-12-07 Icemos Technology Ltd. Multi-angle rotation for ion implantation of trenches in superjunction devices
US8030133B2 (en) 2008-03-28 2011-10-04 Icemos Technology Ltd. Method of fabricating a bonded wafer substrate for use in MEMS structures
US8779462B2 (en) * 2008-05-19 2014-07-15 Infineon Technologies Ag High-ohmic semiconductor substrate and a method of manufacturing the same
US8946814B2 (en) 2012-04-05 2015-02-03 Icemos Technology Ltd. Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates
DE102014119384A1 (de) * 2014-12-22 2016-06-23 Infineon Technologies Austria Ag Ladungkompensationsvorrichtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0760528A2 (de) * 1995-08-25 1997-03-05 Siemens Aktiengesellschaft Halbleiterbauelement auf Siliciumbasis mit hochsperrendem Randabschluss
EP0915521A2 (de) * 1997-11-10 1999-05-12 Harris Corporation Hochspannung-MOSFET-Struktur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW286435B (de) * 1994-07-27 1996-09-21 Siemens Ag
DE59711481D1 (de) * 1996-02-05 2004-05-06 Infineon Technologies Ag Durch Feldeffekt steuerbares Halbleiterbauelement
DE19604043C2 (de) 1996-02-05 2001-11-29 Siemens Ag Durch Feldeffekt steuerbares Halbleiterbauelement
DE19606043A1 (de) * 1996-02-19 1997-08-21 Telefunken Microelectron Neigungssensor
US5767533A (en) * 1996-05-08 1998-06-16 Vydyanath; Honnavalli R. High-conductivity semiconductor material having a dopant comprising coulombic pairs of elements
US6239463B1 (en) * 1997-08-28 2001-05-29 Siliconix Incorporated Low resistance power MOSFET or other device containing silicon-germanium layer
JP3244057B2 (ja) * 1998-07-16 2002-01-07 日本電気株式会社 基準電圧源回路

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0760528A2 (de) * 1995-08-25 1997-03-05 Siemens Aktiengesellschaft Halbleiterbauelement auf Siliciumbasis mit hochsperrendem Randabschluss
EP0915521A2 (de) * 1997-11-10 1999-05-12 Harris Corporation Hochspannung-MOSFET-Struktur

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DEBOY G ET AL: "NEW GENERATION OF HIGH VOLTAGE MOSFETS BREAKS THE LIMIT LINE OF SILICON", INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, SAN FRANCISCO, CA, 6 December 1998 (1998-12-06) - 9 December 1998 (1998-12-09), IEEE, NEW YORK, NY, USA, pages 683 - 685, XP000859463, ISBN: 0-7803-4775-7 *

Also Published As

Publication number Publication date
DE19964214A1 (de) 2001-04-26
WO2001018870A2 (de) 2001-03-15
US20020123188A1 (en) 2002-09-05
DE19964214C2 (de) 2002-01-17
US6504230B2 (en) 2003-01-07

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