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USD711330S1 - Elastic membrane for semiconductor wafer polishing - Google Patents

Elastic membrane for semiconductor wafer polishing Download PDF

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Publication number
USD711330S1
USD711330S1 US29/384,219 US201129384219F USD711330S US D711330 S1 USD711330 S1 US D711330S1 US 201129384219 F US201129384219 F US 201129384219F US D711330 S USD711330 S US D711330S
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US
United States
Prior art keywords
semiconductor wafer
elastic membrane
wafer polishing
view
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/384,219
Inventor
Makoto Fukushima
Hozumi Yasuda
Osamu Nabeya
Katsuhide Watanabe
Keisuke Namiki
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Ebara Corp
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Ebara Corp
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Filing date
Publication date
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Assigned to EBARA CORPORATION reassignment EBARA CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FUKUSHIMA, MAKOTO, NABEYA, OSAMU, NAMIKI, KEISUKE, WATANABE, KATSUHIDE, YASUDA, HOZUMI
Priority to US29/496,207 priority Critical patent/USD729753S1/en
Application granted granted Critical
Publication of USD711330S1 publication Critical patent/USD711330S1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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FIG. 1 is a front view of an elastic membrane for semiconductor wafer polishing showing our new design;
FIG. 2 is a rear view thereof;
FIG. 3 is a plain view thereof;
FIG. 4 is a bottom view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a left side view thereof;
FIG. 7 is a cross section view taken along the line 7-7 of FIG. 2 thereof;
FIG. 8 is a enlarged view of part 8 of FIG. 7 thereof; and,
FIG. 9 is an enlarged view taken of portion 9-9′ of FIG. 8 thereof.
The broken lines depict environmental subject matter only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for an elastic membrane for semiconductor wafer polishing, as shown and described.
US29/384,219 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing Active USD711330S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/496,207 USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2010-031214 2010-12-28
JP2010-031215 2010-12-28
JP2010-031213 2010-12-28
JP2010031214 2010-12-28
JP2010031213 2010-12-28
JP2010031216 2010-12-28
JP2010-031216 2010-12-28
JP2010031215 2010-12-28

Related Child Applications (1)

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US29/496,207 Division USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

Publications (1)

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USD711330S1 true USD711330S1 (en) 2014-08-19

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US29/384,219 Active USD711330S1 (en) 2010-12-28 2011-01-28 Elastic membrane for semiconductor wafer polishing
US29/496,207 Active USD729753S1 (en) 2010-12-28 2014-07-10 Elastic membrane for semiconductor wafer polishing

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729753S1 (en) * 2010-12-28 2015-05-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD814473S1 (en) * 2016-01-19 2018-04-03 Sony Corporation Memory card

Citations (69)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US645938A (en) 1900-01-05 1900-03-27 Tubular Rivet And Stud Company Gage attachment for fastener-setting machines.
US2576673A (en) * 1946-09-09 1951-11-27 Prentiss I Cole Fluid seal
US3064984A (en) * 1959-08-20 1962-11-20 Gen Motors Corp Sealing grommet
US3347556A (en) * 1965-02-24 1967-10-17 Lambert W Fleckenstein Sealing ring for piston and cylinder assemblies
US3848880A (en) * 1972-06-09 1974-11-19 Tanner Eng Co Fluid seal
USD244533S (en) * 1975-06-11 1977-05-31 Ite Imperial Corporation Water resistant gasket for conduits and the like
US4109716A (en) * 1975-07-21 1978-08-29 Otis Engineering Corporation Seal
US4421330A (en) * 1982-02-08 1983-12-20 Greene, Tweed & Co., Inc. Antifriction fluid seal assembly
US4570944A (en) * 1985-05-15 1986-02-18 W. S. Shamban & Company Seal assembly with reduced wear low pressure sealing ring
USD286361S (en) * 1983-09-29 1986-10-28 Dart Industries Inc Coaster or the like
US4709522A (en) * 1986-11-20 1987-12-01 Carnahan V B Remountable wall/ceiling molding
USD304862S (en) * 1987-07-06 1989-11-28 Thomas Industries Inc. Cornice lighting reflector or the like
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
JP2000167762A (en) 1998-12-04 2000-06-20 Speedfam-Ipec Co Ltd Carrier and cmp device
US6110026A (en) 1998-04-29 2000-08-29 Speedfam Co., Ltd. Carrier and polishing apparatus
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
JP2000301452A (en) 1999-04-20 2000-10-31 Speedfam-Ipec Co Ltd Carrier and cmp device
US6147001A (en) * 1996-04-25 2000-11-14 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit device
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6217433B1 (en) * 1995-05-16 2001-04-17 Unova Ip Corp. Grinding device and method
US6296555B1 (en) * 1998-10-19 2001-10-02 Tokyo Seimitsu Co., Ltd. Wafer machining apparatus
US6305695B1 (en) * 1997-09-09 2001-10-23 Federal-Mogul Technology Limited Gaskets
US6315649B1 (en) * 1999-11-30 2001-11-13 Taiwan Semiconductor Manufacturing Company Ltd Wafer mounting plate for a polishing apparatus and method of using
JP2002075936A (en) 2000-08-25 2002-03-15 Mitsubishi Materials Corp Wafer polishing head and polishing apparatus using the same
US6358129B2 (en) * 1998-11-11 2002-03-19 Micron Technology, Inc. Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
US6494769B1 (en) * 1997-07-25 2002-12-17 Applied Materials, Inc. Wafer carrier for chemical mechanical planarization polishing
US20030057089A1 (en) * 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US20030171076A1 (en) 2002-01-22 2003-09-11 Moloney Gerard S. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6739958B2 (en) * 2002-03-19 2004-05-25 Applied Materials Inc. Carrier head with a vibration reduction feature for a chemical mechanical polishing system
US20040175951A1 (en) * 2003-03-07 2004-09-09 Applied Materials, Inc. Substrate carrier with a textured membrane
JP2004297029A (en) 2003-02-10 2004-10-21 Ebara Corp Substrate holding device and polishing apparatus
JP2004363505A (en) 2003-06-06 2004-12-24 Ebara Corp Substrate holding device and polishing device
US6852019B2 (en) 2000-10-11 2005-02-08 Ebara Corporation Substrate holding apparatus
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US6890402B2 (en) 2000-07-31 2005-05-10 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US6923714B1 (en) * 2001-12-27 2005-08-02 Applied Materials, Inc. Carrier head with a non-stick membrane
US6988942B2 (en) * 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7025664B2 (en) * 2000-03-31 2006-04-11 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US7033260B2 (en) 2001-12-06 2006-04-25 Ebara Corporation Substrate holding device and polishing device
JP2006159392A (en) 2004-12-10 2006-06-22 Ebara Corp Substrate holding device and polishing device
JP2006255851A (en) 2005-03-18 2006-09-28 Ebara Corp Polishing equipment
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
US20080070479A1 (en) 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
US7357699B2 (en) 2003-02-10 2008-04-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
US20080119119A1 (en) * 2006-11-22 2008-05-22 Applied Materials, Inc. Carrier Ring for Carrier Head
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US7479304B2 (en) * 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US20090247057A1 (en) * 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) * 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD638523S1 (en) * 2010-07-20 2011-05-24 Wärtsilä Japan Ltd. Seal ring for stern tube
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD650053S1 (en) * 2011-02-15 2011-12-06 Prinsco, Inc. Pipe rib gasket
USD655797S1 (en) * 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
US8202140B2 (en) * 2007-09-04 2012-06-19 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
USD681176S1 (en) * 2012-07-13 2013-04-30 Kmt Waterjet Systems Inc. Seal ring
USD696751S1 (en) * 2011-10-27 2013-12-31 Mueller International, Llc Slip-on gasket

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8454413B2 (en) * 2005-12-29 2013-06-04 Applied Materials, Inc. Multi-chamber carrier head with a textured membrane
US7654888B2 (en) * 2006-11-22 2010-02-02 Applied Materials, Inc. Carrier head with retaining ring and carrier ring
US7727055B2 (en) * 2006-11-22 2010-06-01 Applied Materials, Inc. Flexible membrane for carrier head
JP5552401B2 (en) * 2010-09-08 2014-07-16 株式会社荏原製作所 Polishing apparatus and method
USD711330S1 (en) * 2010-12-28 2014-08-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
KR101196652B1 (en) * 2011-05-31 2012-11-02 주식회사 케이씨텍 Membrane assembly in carrier head
JP5635482B2 (en) * 2011-11-30 2014-12-03 株式会社荏原製作所 Elastic membrane
KR20130131120A (en) * 2012-05-23 2013-12-03 삼성전자주식회사 A flexible membrane for polishing head

Patent Citations (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US645938A (en) 1900-01-05 1900-03-27 Tubular Rivet And Stud Company Gage attachment for fastener-setting machines.
US2576673A (en) * 1946-09-09 1951-11-27 Prentiss I Cole Fluid seal
US3064984A (en) * 1959-08-20 1962-11-20 Gen Motors Corp Sealing grommet
US3347556A (en) * 1965-02-24 1967-10-17 Lambert W Fleckenstein Sealing ring for piston and cylinder assemblies
US3848880A (en) * 1972-06-09 1974-11-19 Tanner Eng Co Fluid seal
USD244533S (en) * 1975-06-11 1977-05-31 Ite Imperial Corporation Water resistant gasket for conduits and the like
US4109716A (en) * 1975-07-21 1978-08-29 Otis Engineering Corporation Seal
US4421330A (en) * 1982-02-08 1983-12-20 Greene, Tweed & Co., Inc. Antifriction fluid seal assembly
USD286361S (en) * 1983-09-29 1986-10-28 Dart Industries Inc Coaster or the like
US4570944A (en) * 1985-05-15 1986-02-18 W. S. Shamban & Company Seal assembly with reduced wear low pressure sealing ring
US4709522A (en) * 1986-11-20 1987-12-01 Carnahan V B Remountable wall/ceiling molding
USD304862S (en) * 1987-07-06 1989-11-28 Thomas Industries Inc. Cornice lighting reflector or the like
US5422316A (en) * 1994-03-18 1995-06-06 Memc Electronic Materials, Inc. Semiconductor wafer polisher and method
US6217433B1 (en) * 1995-05-16 2001-04-17 Unova Ip Corp. Grinding device and method
US6147001A (en) * 1996-04-25 2000-11-14 Hitachi, Ltd. Method of manufacturing semiconductor integrated circuit device
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US20020086624A1 (en) 1996-11-08 2002-07-04 Applied Materials, Inc. A Delaware Corporation Carrier head with a flexible membrane for a chemical mechanical polishing system
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6494769B1 (en) * 1997-07-25 2002-12-17 Applied Materials, Inc. Wafer carrier for chemical mechanical planarization polishing
US6305695B1 (en) * 1997-09-09 2001-10-23 Federal-Mogul Technology Limited Gaskets
US6116992A (en) * 1997-12-30 2000-09-12 Applied Materials, Inc. Substrate retaining ring
US6110026A (en) 1998-04-29 2000-08-29 Speedfam Co., Ltd. Carrier and polishing apparatus
US6159079A (en) 1998-09-08 2000-12-12 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
JP2002527894A (en) 1998-10-09 2002-08-27 スピードファム−アイピーイーシー コーポレイション Semiconductor wafer polishing apparatus with variable polishing pressure carrier head
US6296555B1 (en) * 1998-10-19 2001-10-02 Tokyo Seimitsu Co., Ltd. Wafer machining apparatus
US6358129B2 (en) * 1998-11-11 2002-03-19 Micron Technology, Inc. Backing members and planarizing machines for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods of making and using such backing members
JP2000167762A (en) 1998-12-04 2000-06-20 Speedfam-Ipec Co Ltd Carrier and cmp device
JP2000301452A (en) 1999-04-20 2000-10-31 Speedfam-Ipec Co Ltd Carrier and cmp device
US6315649B1 (en) * 1999-11-30 2001-11-13 Taiwan Semiconductor Manufacturing Company Ltd Wafer mounting plate for a polishing apparatus and method of using
US6988942B2 (en) * 2000-02-17 2006-01-24 Applied Materials Inc. Conductive polishing article for electrochemical mechanical polishing
US7025664B2 (en) * 2000-03-31 2006-04-11 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6722965B2 (en) * 2000-07-11 2004-04-20 Applied Materials Inc. Carrier head with flexible membranes to provide controllable pressure and loading area
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US6890402B2 (en) 2000-07-31 2005-05-10 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
JP2002075936A (en) 2000-08-25 2002-03-15 Mitsubishi Materials Corp Wafer polishing head and polishing apparatus using the same
US6852019B2 (en) 2000-10-11 2005-02-08 Ebara Corporation Substrate holding apparatus
US7491117B2 (en) * 2000-10-11 2009-02-17 Ebara Corporation Substrate holding apparatus
US7083507B2 (en) 2000-10-11 2006-08-01 Ebara Corporation Substrate holding apparatus
US20030057089A1 (en) * 2000-12-01 2003-03-27 Tin Nguyen Disk carrier
US6666948B2 (en) * 2001-04-23 2003-12-23 Phuong Van Nguyen Silicon wafer polisher
US7311585B2 (en) 2001-12-06 2007-12-25 Ebara Corporation Substrate holding apparatus and polishing apparatus
US7632173B2 (en) * 2001-12-06 2009-12-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
US20100056028A1 (en) 2001-12-06 2010-03-04 Tetsuji Togawa Substrate holding apparatus and polishing apparatus
US7033260B2 (en) 2001-12-06 2006-04-25 Ebara Corporation Substrate holding device and polishing device
US6923714B1 (en) * 2001-12-27 2005-08-02 Applied Materials, Inc. Carrier head with a non-stick membrane
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
US20030171076A1 (en) 2002-01-22 2003-09-11 Moloney Gerard S. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
US7479304B2 (en) * 2002-02-14 2009-01-20 Applied Materials, Inc. Gas distribution plate fabricated from a solid yttrium oxide-comprising substrate
US6739958B2 (en) * 2002-03-19 2004-05-25 Applied Materials Inc. Carrier head with a vibration reduction feature for a chemical mechanical polishing system
JP2004297029A (en) 2003-02-10 2004-10-21 Ebara Corp Substrate holding device and polishing apparatus
US7988537B2 (en) * 2003-02-10 2011-08-02 Ebara Corporation Substrate holding apparatus and polishing apparatus
US20090233532A1 (en) 2003-02-10 2009-09-17 Tetsuji Togawa Substrate holding apparatus and polishing apparatus
US7357699B2 (en) 2003-02-10 2008-04-15 Ebara Corporation Substrate holding apparatus and polishing apparatus
US20040175951A1 (en) * 2003-03-07 2004-09-09 Applied Materials, Inc. Substrate carrier with a textured membrane
JP2004363505A (en) 2003-06-06 2004-12-24 Ebara Corp Substrate holding device and polishing device
US7235139B2 (en) * 2003-10-28 2007-06-26 Veeco Instruments Inc. Wafer carrier for growing GaN wafers
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
US20080070479A1 (en) 2004-11-01 2008-03-20 Ebara Corporation Polishing Apparatus
JP2006159392A (en) 2004-12-10 2006-06-22 Ebara Corp Substrate holding device and polishing device
EP1833640A1 (en) 2004-12-10 2007-09-19 Ebara Corporation Substrate holding device and polishing apparatus
US7635292B2 (en) * 2004-12-10 2009-12-22 Ebara Corporation Substrate holding device and polishing apparatus
JP2006255851A (en) 2005-03-18 2006-09-28 Ebara Corp Polishing equipment
US20090247057A1 (en) * 2005-09-14 2009-10-01 Ebara Corporation Polishing platen and polishing apparatus
USD548705S1 (en) * 2005-09-29 2007-08-14 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
USD546784S1 (en) * 2005-09-29 2007-07-17 Tokyo Electron Limited Attracting disc for an electrostatic chuck for semiconductor production
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US20080119119A1 (en) * 2006-11-22 2008-05-22 Applied Materials, Inc. Carrier Ring for Carrier Head
US8202140B2 (en) * 2007-09-04 2012-06-19 Samsung Electronics Co., Ltd. Wafer polishing carrier apparatus and chemical mechanical polishing equipment using the same
USD609652S1 (en) * 2008-07-22 2010-02-09 Tokyo Electron Limited Wafer attracting plate
USD609655S1 (en) * 2008-10-03 2010-02-09 Ngk Insulators, Ltd. Electrostatic chuck
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD616390S1 (en) * 2009-03-06 2010-05-25 Tokyo Electron Limited Quartz cover for manufacturing semiconductor wafers
USD633452S1 (en) * 2009-08-27 2011-03-01 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD634719S1 (en) * 2009-08-27 2011-03-22 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD655797S1 (en) * 2010-03-24 2012-03-13 Nippon Valqua Industries, Ltd. Hybrid seal member
USD638523S1 (en) * 2010-07-20 2011-05-24 Wärtsilä Japan Ltd. Seal ring for stern tube
USD650053S1 (en) * 2011-02-15 2011-12-06 Prinsco, Inc. Pipe rib gasket
USD696751S1 (en) * 2011-10-27 2013-12-31 Mueller International, Llc Slip-on gasket
USD681176S1 (en) * 2012-07-13 2013-04-30 Kmt Waterjet Systems Inc. Seal ring

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729753S1 (en) * 2010-12-28 2015-05-19 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD769200S1 (en) 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD770990S1 (en) 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD813180S1 (en) 2013-05-15 2018-03-20 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
USD913977S1 (en) 2016-12-12 2021-03-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing

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