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USD722031S1 - Top contact layout board in an electrical system - Google Patents

Top contact layout board in an electrical system Download PDF

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Publication number
USD722031S1
USD722031S1 US29/478,155 US201329478155F USD722031S US D722031 S1 USD722031 S1 US D722031S1 US 201329478155 F US201329478155 F US 201329478155F US D722031 S USD722031 S US D722031S
Authority
US
United States
Prior art keywords
electrical system
top contact
contact layout
layout board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/478,155
Inventor
John L. Dunklee
William A. Funk
Matthew Page
Dennis Flanders
Bryan J. Root
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Celadon Systems Inc
Original Assignee
Celadon Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celadon Systems Inc filed Critical Celadon Systems Inc
Priority to US29/478,155 priority Critical patent/USD722031S1/en
Assigned to CELADON SYSTEMS, INC. reassignment CELADON SYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FLANDERS, DENNIS, DUNKLEE, JOHN L., FUNK, WILLIAM A., PAGE, MATTHEW, ROOT, BRYAN J.
Application granted granted Critical
Publication of USD722031S1 publication Critical patent/USD722031S1/en
Assigned to CELADON SYSTEMS, INC. reassignment CELADON SYSTEMS, INC. CHANGE OF ADDRESS Assignors: CELADON SYSTEMS, INC.
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

FIG. 1 is an enlarged front view of a top contact layout board in an electrical system showing our new design, the motherboard is shown in broken lines as unclaimed environment and forms no part of the claimed design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a top view thereof;
FIG. 5 is a bottom view thereof;
FIG. 6 is a right side view thereof; and,
FIG. 7 is a left side view thereof.

Claims (1)

    CLAIM
  1. The ornamental design for a top contact layout board in an electrical system, as shown and described.
US29/478,155 2013-12-31 2013-12-31 Top contact layout board in an electrical system Active USD722031S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/478,155 USD722031S1 (en) 2013-12-31 2013-12-31 Top contact layout board in an electrical system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/478,155 USD722031S1 (en) 2013-12-31 2013-12-31 Top contact layout board in an electrical system

Publications (1)

Publication Number Publication Date
USD722031S1 true USD722031S1 (en) 2015-02-03

Family

ID=52396066

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/478,155 Active USD722031S1 (en) 2013-12-31 2013-12-31 Top contact layout board in an electrical system

Country Status (1)

Country Link
US (1) USD722031S1 (en)

Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3795845A (en) * 1972-12-26 1974-03-05 Ibm Semiconductor chip having connecting pads arranged in a non-orthogonal array
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5091822A (en) * 1989-06-15 1992-02-25 Graphico Co., Ltd. Radial type of parallel system bus structure with printed, twisted conductor lines
US5210682A (en) * 1990-10-19 1993-05-11 Graphico Co., Ltd. Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements
US5491364A (en) * 1994-08-31 1996-02-13 Delco Electronics Corporation Reduced stress terminal pattern for integrated circuit devices and packages
US6310398B1 (en) * 1998-12-03 2001-10-30 Walter M. Katz Routable high-density interfaces for integrated circuit devices
US6556454B1 (en) * 2000-10-31 2003-04-29 Agilent Technologies, Inc. High density contact arrangement
US6664620B2 (en) * 1999-06-29 2003-12-16 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
US6793500B1 (en) * 2003-09-18 2004-09-21 International Business Machines Corporation Radial contact pad footprint and wiring for electrical components
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD639757S1 (en) * 2010-08-16 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD639755S1 (en) * 2010-01-20 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD654033S1 (en) * 2010-01-20 2012-02-14 Celadon Systems, Inc. Grooved wire support for a probe test core
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate

Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3795845A (en) * 1972-12-26 1974-03-05 Ibm Semiconductor chip having connecting pads arranged in a non-orthogonal array
USD320361S (en) * 1989-06-02 1991-10-01 Tokyo Electron Limited Wafer probe plate holder
US5091822A (en) * 1989-06-15 1992-02-25 Graphico Co., Ltd. Radial type of parallel system bus structure with printed, twisted conductor lines
US5210682A (en) * 1990-10-19 1993-05-11 Graphico Co., Ltd. Radial type of parallel system bus structure having pairs of conductor lines with impedance matching elements
US5491364A (en) * 1994-08-31 1996-02-13 Delco Electronics Corporation Reduced stress terminal pattern for integrated circuit devices and packages
US6310398B1 (en) * 1998-12-03 2001-10-30 Walter M. Katz Routable high-density interfaces for integrated circuit devices
US20020060318A1 (en) * 1998-12-03 2002-05-23 Katz Walter M. Routable high-density interfaces for integrated circuit devices
US6664620B2 (en) * 1999-06-29 2003-12-16 Intel Corporation Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
US6556454B1 (en) * 2000-10-31 2003-04-29 Agilent Technologies, Inc. High density contact arrangement
US6793500B1 (en) * 2003-09-18 2004-09-21 International Business Machines Corporation Radial contact pad footprint and wiring for electrical components
USD616389S1 (en) * 2008-10-20 2010-05-25 Ebara Corporation Vacuum contact pad
USD649126S1 (en) * 2008-10-20 2011-11-22 Ebara Corporation Vacuum contact pad
USD639755S1 (en) * 2010-01-20 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD654033S1 (en) * 2010-01-20 2012-02-14 Celadon Systems, Inc. Grooved wire support for a probe test core
USD639757S1 (en) * 2010-08-16 2011-06-14 Celadon Systems, Inc. Top contact layout board in an electrical system
USD654883S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD654884S1 (en) * 2010-10-21 2012-02-28 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655257S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD655259S1 (en) * 2010-10-21 2012-03-06 Tokyo Electron Limited Top plate for reactor for manufacturing semiconductor
USD664249S1 (en) * 2011-07-01 2012-07-24 Applied Materials, Inc. Flow blocker plate

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