USD318271S - Substrate for mounting semiconductors - Google Patents
Substrate for mounting semiconductors Download PDFInfo
- Publication number
- USD318271S USD318271S US07/140,348 US14034888F USD318271S US D318271 S USD318271 S US D318271S US 14034888 F US14034888 F US 14034888F US D318271 S USD318271 S US D318271S
- Authority
- US
- United States
- Prior art keywords
- substrate
- mounting semiconductors
- mounting
- semiconductors
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 239000000758 substrate Substances 0.000 title claims description 3
Images
Description
FIG. 1 is a top perspective view of a substrate for mounting semi-conductors showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
Claims (1)
- The ornamental design for a substrate for mounting semiconductors, as shown.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62-27272 | 1987-07-04 | ||
| JP2727287 | 1987-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD318271S true USD318271S (en) | 1991-07-16 |
Family
ID=70455383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/140,348 Expired - Lifetime USD318271S (en) | 1987-07-04 | 1988-01-04 | Substrate for mounting semiconductors |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD318271S (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| USD443253S1 (en) | 1999-07-14 | 2001-06-05 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Transistor substrate |
| USD566060S1 (en) * | 2005-04-13 | 2008-04-08 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4288441A (en) | 1980-07-30 | 1981-09-08 | Daiichi Seiyaku Co., Ltd. | Nicotinoyl pantetheine derivatives |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4437141A (en) | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4677526A (en) | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| EP0232837A2 (en) | 1986-02-14 | 1987-08-19 | Matsushita Electric Works, Ltd. | Plastic molded chip carrier package and method of fabricating the same |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
-
1988
- 1988-01-04 US US07/140,348 patent/USD318271S/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4288441A (en) | 1980-07-30 | 1981-09-08 | Daiichi Seiyaku Co., Ltd. | Nicotinoyl pantetheine derivatives |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| US4437141A (en) | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4677526A (en) | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| EP0232837A2 (en) | 1986-02-14 | 1987-08-19 | Matsushita Electric Works, Ltd. | Plastic molded chip carrier package and method of fabricating the same |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
Non-Patent Citations (4)
| Title |
|---|
| CMOS Chip pictured on p. 131, Electronics, 8-7-86. |
| Disc Controller pictured on p. 190, Electronic Design, 10-16-86. |
| Electronics, p. 7, Feb. 24, 1986 by Fujitsu Microelectronics, Inc. |
| NCR IC package pictured on p. 7, Electronic Design, 10-16-86. |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD345731S (en) | 1992-12-03 | 1994-04-05 | Motorola, Inc. | Semiconductor package |
| USD416872S (en) * | 1997-11-06 | 1999-11-23 | Zf Microsystems, Inc. | Single component computer |
| USD443253S1 (en) | 1999-07-14 | 2001-06-05 | Kabushiki Kaisha Toyoda Jidoshokki Seisakusho | Transistor substrate |
| USD566060S1 (en) * | 2005-04-13 | 2008-04-08 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| USD577691S1 (en) * | 2005-04-13 | 2008-09-30 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| USD577692S1 (en) * | 2005-04-13 | 2008-09-30 | Nitto Denko Corporation | Grooves formed around a semiconductor device on a circuit board |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
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