USD318461S - Semi-conductor mounting substrate - Google Patents
Semi-conductor mounting substrate Download PDFInfo
- Publication number
- USD318461S USD318461S US07/181,252 US18125288F USD318461S US D318461 S USD318461 S US D318461S US 18125288 F US18125288 F US 18125288F US D318461 S USD318461 S US D318461S
- Authority
- US
- United States
- Prior art keywords
- semi
- mounting substrate
- conductor mounting
- conductor
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 3
- 239000000758 substrate Substances 0.000 title claims description 3
Images
Description
FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
FIG. 7 is a top plan view thereof; and
FIG. 8 is a bottom plan view thereof.
Claims (1)
- The ornamental design for a semi-conductor mounting substrate, as shown.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/181,252 USD318461S (en) | 1988-04-13 | 1988-04-13 | Semi-conductor mounting substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/181,252 USD318461S (en) | 1988-04-13 | 1988-04-13 | Semi-conductor mounting substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD318461S true USD318461S (en) | 1991-07-23 |
Family
ID=70293435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/181,252 Expired - Lifetime USD318461S (en) | 1988-04-13 | 1988-04-13 | Semi-conductor mounting substrate |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD318461S (en) |
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD534133S1 (en) * | 2005-04-18 | 2006-12-26 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD540273S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD687387S1 (en) | 2009-02-06 | 2013-08-06 | Abb S.P.A. | Circuit breakers |
| USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD700441S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD700440S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD716241S1 (en) * | 2013-07-11 | 2014-10-28 | Sumitomo Electric Printed Circuits, Inc. | Wiring board |
| USD716741S1 (en) * | 2013-07-11 | 2014-11-04 | Sumitomo Electric Printed Circuits, Inc. | Wiring board |
| USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
| USD752524S1 (en) | 2012-11-09 | 2016-03-29 | Abb S.P.A. | Circuit breaker |
| USD808664S1 (en) | 2016-05-16 | 2018-01-30 | Ninja Brand Incorporated | Sheet with camouflage pattern |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD926716S1 (en) * | 2019-07-31 | 2021-08-03 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD937232S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
| USD999748S1 (en) * | 2021-12-02 | 2023-09-26 | Ace Technologies Corporation | Printed circuit board |
| USD1030688S1 (en) * | 2022-05-31 | 2024-06-11 | Faraidoon Pundole | Circuit board for an electrical connector |
| USD1054389S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
| USD1054390S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4288841A (en) | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4437141A (en) | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4677526A (en) | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| EP0232827A2 (en) | 1986-02-04 | 1987-08-19 | Hitachi, Ltd. | Vector processor |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
-
1988
- 1988-04-13 US US07/181,252 patent/USD318461S/en not_active Expired - Lifetime
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4288841A (en) | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| US4437141A (en) | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4677526A (en) | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| EP0232827A2 (en) | 1986-02-04 | 1987-08-19 | Hitachi, Ltd. | Vector processor |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
Non-Patent Citations (4)
| Title |
|---|
| Electronic Design, p. 190, dtd 10-16-86, Disc Controll pictured thereon. |
| Electronic Design, p. 7, dtd 10-16-86, NRC 1C package pictured thereon. |
| Electronics, p. 131, dtd 8-7-86, CMOS chip pictured thereon. |
| Electronics, p. 7, Feb. 24, 1986 by Fujitsu Microelectronics, Inc. |
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD534133S1 (en) * | 2005-04-18 | 2006-12-26 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD540273S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
| USD757659S1 (en) | 2009-02-06 | 2016-05-31 | Abb S.P.A. | Circuit breakers |
| USD853337S1 (en) | 2009-02-06 | 2019-07-09 | Abb S.P.A. | Circuit breakers |
| USD707636S1 (en) | 2009-02-06 | 2014-06-24 | Abb S.P.A. | Circuit breakers |
| USD883939S1 (en) | 2009-02-06 | 2020-05-12 | Abb S.P.A. | Circuit breakers |
| USD687387S1 (en) | 2009-02-06 | 2013-08-06 | Abb S.P.A. | Circuit breakers |
| USD804430S1 (en) | 2009-02-06 | 2017-12-05 | Abb S.P.A. | Circuit breakers |
| USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
| USD700441S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD700440S1 (en) * | 2011-10-14 | 2014-03-04 | Under Armour, Inc. | Camouflage pattern |
| USD789895S1 (en) | 2012-11-09 | 2017-06-20 | Abb S.P.A. | Circuit breaker |
| USD752524S1 (en) | 2012-11-09 | 2016-03-29 | Abb S.P.A. | Circuit breaker |
| USD883940S1 (en) | 2012-11-09 | 2020-05-12 | Abb S.P.A. | Circuit breaker |
| USD858460S1 (en) | 2012-11-09 | 2019-09-03 | Abb S.P.A. | Circuit breaker |
| USD823816S1 (en) | 2012-11-09 | 2018-07-24 | Abb S.P.A. | Circuit breaker |
| USD734732S1 (en) * | 2013-07-10 | 2015-07-21 | Sumitomo Electric Fine Polymer, Inc. | Circuit board material |
| USD716741S1 (en) * | 2013-07-11 | 2014-11-04 | Sumitomo Electric Printed Circuits, Inc. | Wiring board |
| USD716241S1 (en) * | 2013-07-11 | 2014-10-28 | Sumitomo Electric Printed Circuits, Inc. | Wiring board |
| USD808664S1 (en) | 2016-05-16 | 2018-01-30 | Ninja Brand Incorporated | Sheet with camouflage pattern |
| USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
| USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD913256S1 (en) * | 2019-07-31 | 2021-03-16 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD926716S1 (en) * | 2019-07-31 | 2021-08-03 | Eryn Smith | Antenna pattern for a semiconductive substrate carrier |
| USD937233S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD937232S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD938925S1 (en) * | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
| USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
| USD988300S1 (en) * | 2021-03-09 | 2023-06-06 | Thales Dis Ais Deutschland Gmbh | IoT module |
| USD999748S1 (en) * | 2021-12-02 | 2023-09-26 | Ace Technologies Corporation | Printed circuit board |
| USD1054389S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
| USD1054390S1 (en) * | 2022-01-05 | 2024-12-17 | Nec Corporation | Semiconductor device |
| USD1030688S1 (en) * | 2022-05-31 | 2024-06-11 | Faraidoon Pundole | Circuit board for an electrical connector |
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