USD317300S - Semi-conductor mounting substrate - Google Patents
Semi-conductor mounting substrate Download PDFInfo
- Publication number
- USD317300S USD317300S US07/140,433 US14043388F USD317300S US D317300 S USD317300 S US D317300S US 14043388 F US14043388 F US 14043388F US D317300 S USD317300 S US D317300S
- Authority
- US
- United States
- Prior art keywords
- semi
- mounting substrate
- conductor mounting
- conductor
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Description
FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.
Claims (1)
- The ornamental design for a semi-conductor mounting substrate, as shown.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2727487 | 1987-07-04 | ||
| JP62-27274 | 1987-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| USD317300S true USD317300S (en) | 1991-06-04 |
Family
ID=70290335
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US07/140,433 Expired - Lifetime USD317300S (en) | 1987-07-04 | 1988-01-04 | Semi-conductor mounting substrate |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | USD317300S (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD632821S1 (en) * | 2009-09-21 | 2011-02-15 | Glowble SSL, Inc. | LED light fixture |
| USD673712S1 (en) * | 2011-10-19 | 2013-01-01 | Infinilux, Inc. | LED lighting fixture |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
| USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4288841A (en) | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4437141A (en) | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4677526A (en) | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
-
1988
- 1988-01-04 US US07/140,433 patent/USD317300S/en not_active Expired - Lifetime
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4288841A (en) | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| US4338621A (en) | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
| US4458291A (en) | 1981-07-22 | 1984-07-03 | Fujitsu Limited | Package for enclosing semiconductor elements |
| US4437141A (en) | 1981-09-14 | 1984-03-13 | Texas Instruments Incorporated | High terminal count integrated circuit device package |
| US4513355A (en) | 1983-06-15 | 1985-04-23 | Motorola, Inc. | Metallization and bonding means and method for VLSI packages |
| US4677526A (en) | 1984-03-01 | 1987-06-30 | Augat Inc. | Plastic pin grid array chip carrier |
| US4698663A (en) | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
Non-Patent Citations (4)
| Title |
|---|
| CMOS Chip Pictured on p. 131, Electronics, 8-7-86. |
| Disc Controller Pictured on p. 190, Electronic Design, 10-16-86. |
| Fujitsu Substrate Pictured on p. 7, Electronics, 2-24-86. |
| NCR IC Package Pictured on p. 7, Electronic Design, 10-16-86. |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD632821S1 (en) * | 2009-09-21 | 2011-02-15 | Glowble SSL, Inc. | LED light fixture |
| USD673712S1 (en) * | 2011-10-19 | 2013-01-01 | Infinilux, Inc. | LED lighting fixture |
| USD719537S1 (en) * | 2013-05-08 | 2014-12-16 | Mitsubishi Electric Corporation | Semiconductor device |
| USD769834S1 (en) | 2013-05-08 | 2016-10-25 | Mitsubishi Electric Corporation | Semiconductor device |
| USD877708S1 (en) | 2013-10-17 | 2020-03-10 | Vlt, Inc. | Electrical terminal |
| USD942406S1 (en) | 2013-10-17 | 2022-02-01 | Vicor Corporation | Electric terminal |
| USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
| USD775092S1 (en) | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
| USD775093S1 (en) | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
| USD798249S1 (en) | 2013-10-17 | 2017-09-26 | Vlt, Inc. | Electric terminal |
| USD834548S1 (en) | 2013-10-17 | 2018-11-27 | Vlt, Inc. | Electric terminal |
| US9497570B2 (en) | 2014-02-06 | 2016-11-15 | Nimbelink Corp. | Embedded wireless modem |
| USD731491S1 (en) * | 2014-02-07 | 2015-06-09 | NimbeLink L.L.C. | Embedded cellular modem |
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