[go: up one dir, main page]

USD317300S - Semi-conductor mounting substrate - Google Patents

Semi-conductor mounting substrate Download PDF

Info

Publication number
USD317300S
USD317300S US07/140,433 US14043388F USD317300S US D317300 S USD317300 S US D317300S US 14043388 F US14043388 F US 14043388F US D317300 S USD317300 S US D317300S
Authority
US
United States
Prior art keywords
semi
mounting substrate
conductor mounting
conductor
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US07/140,433
Inventor
Terutomi Hasegawa
Nobumichi Goto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Application granted granted Critical
Publication of USD317300S publication Critical patent/USD317300S/en
Assigned to IBIDEN CO., LTD. reassignment IBIDEN CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST. Assignors: GOTO, NOBUMICHI, HASEGAWA, TERUTOMI
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Description

FIG. 1 is a top perspective view of a semi-conductor mounting substrate showing our new design;
FIG. 2 is a bottom perspective view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a rear elevational view thereof; and
FIG. 6 is a front elevational view thereof.

Claims (1)

  1. The ornamental design for a semi-conductor mounting substrate, as shown.
US07/140,433 1987-07-04 1988-01-04 Semi-conductor mounting substrate Expired - Lifetime USD317300S (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2727487 1987-07-04
JP62-27274 1987-07-04

Publications (1)

Publication Number Publication Date
USD317300S true USD317300S (en) 1991-06-04

Family

ID=70290335

Family Applications (1)

Application Number Title Priority Date Filing Date
US07/140,433 Expired - Lifetime USD317300S (en) 1987-07-04 1988-01-04 Semi-conductor mounting substrate

Country Status (1)

Country Link
US (1) USD317300S (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD632821S1 (en) * 2009-09-21 2011-02-15 Glowble SSL, Inc. LED light fixture
USD673712S1 (en) * 2011-10-19 2013-01-01 Infinilux, Inc. LED lighting fixture
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288841A (en) 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4338621A (en) 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
US4437141A (en) 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
US4458291A (en) 1981-07-22 1984-07-03 Fujitsu Limited Package for enclosing semiconductor elements
US4513355A (en) 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4677526A (en) 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
US4698663A (en) 1986-09-17 1987-10-06 Fujitsu Limited Heatsink package for flip-chip IC

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288841A (en) 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
US4338621A (en) 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
US4458291A (en) 1981-07-22 1984-07-03 Fujitsu Limited Package for enclosing semiconductor elements
US4437141A (en) 1981-09-14 1984-03-13 Texas Instruments Incorporated High terminal count integrated circuit device package
US4513355A (en) 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4677526A (en) 1984-03-01 1987-06-30 Augat Inc. Plastic pin grid array chip carrier
US4698663A (en) 1986-09-17 1987-10-06 Fujitsu Limited Heatsink package for flip-chip IC

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
CMOS Chip Pictured on p. 131, Electronics, 8-7-86.
Disc Controller Pictured on p. 190, Electronic Design, 10-16-86.
Fujitsu Substrate Pictured on p. 7, Electronics, 2-24-86.
NCR IC Package Pictured on p. 7, Electronic Design, 10-16-86.

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD632821S1 (en) * 2009-09-21 2011-02-15 Glowble SSL, Inc. LED light fixture
USD673712S1 (en) * 2011-10-19 2013-01-01 Infinilux, Inc. LED lighting fixture
USD719537S1 (en) * 2013-05-08 2014-12-16 Mitsubishi Electric Corporation Semiconductor device
USD769834S1 (en) 2013-05-08 2016-10-25 Mitsubishi Electric Corporation Semiconductor device
USD877708S1 (en) 2013-10-17 2020-03-10 Vlt, Inc. Electrical terminal
USD942406S1 (en) 2013-10-17 2022-02-01 Vicor Corporation Electric terminal
USD754083S1 (en) * 2013-10-17 2016-04-19 Vlt, Inc. Electric terminal
USD775092S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD775093S1 (en) 2013-10-17 2016-12-27 Vlt, Inc. Electric terminal
USD798249S1 (en) 2013-10-17 2017-09-26 Vlt, Inc. Electric terminal
USD834548S1 (en) 2013-10-17 2018-11-27 Vlt, Inc. Electric terminal
US9497570B2 (en) 2014-02-06 2016-11-15 Nimbelink Corp. Embedded wireless modem
USD731491S1 (en) * 2014-02-07 2015-06-09 NimbeLink L.L.C. Embedded cellular modem

Similar Documents

Publication Publication Date Title
USD318461S (en) Semi-conductor mounting substrate
USD317592S (en) Semiconductor element
USD319045S (en) Semi-conductor substrate with conducting pattern
USD316156S (en) Spotlight
USD306964S (en) Slotted hang bracket
USD302664S (en) Electronic watch
USD297162S (en) Sink
USD318104S (en) Sink
USD314766S (en) Telephone set
USD306926S (en) Sink tray
USD306992S (en) Bike carrier
USD311189S (en) Microphone mount
USD297163S (en) Sink
USD293977S (en) Camera case
USD298609S (en) Electronic clock
USD306024S (en) Loudspeaker
USD319589S (en) Clock
USD303382S (en) Telephone
USD310083S (en) Microphone mount
USD298414S (en) Electronic clock
USD323061S (en) Package for electronic parts or the like
USD318271S (en) Substrate for mounting semiconductors
USD317300S (en) Semi-conductor mounting substrate
USD319455S (en) Electronic saxhorn
USD320997S (en) Electronic saxhorn