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USD566060S1 - Grooves formed around a semiconductor device on a circuit board - Google Patents

Grooves formed around a semiconductor device on a circuit board Download PDF

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Publication number
USD566060S1
USD566060S1 US29/240,188 US24018805F USD566060S US D566060 S1 USD566060 S1 US D566060S1 US 24018805 F US24018805 F US 24018805F US D566060 S USD566060 S US D566060S
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US
United States
Prior art keywords
circuit board
semiconductor device
formed around
grooves formed
shows
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US29/240,188
Inventor
Tetsuya Ohsawa
Emiko TANI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Assigned to NITTO DENKO CORPORATION reassignment NITTO DENKO CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OHSAWA, TETSUYA, TANI, EMIKO
Priority to US29/303,837 priority Critical patent/USD577692S1/en
Priority to US29/303,833 priority patent/USD577691S1/en
Application granted granted Critical
Publication of USD566060S1 publication Critical patent/USD566060S1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

FIG. 1 shows a plan view of grooves formed around a semiconductor device on a circuit board showing our new design.
FIG. 2 shows an enlarged view of the claimed portion identified by the dot-dash line in FIG. 1; and,
FIG. 3 shows an enlarged sectional view along the line 3—3 in FIG. 2.
The special dot-dash broken line defines the boundary of the claimed design; the gray stippling indicates the surface of the groove bed; the broken lines show environmental detail for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
US29/240,188 2005-04-13 2005-10-11 Grooves formed around a semiconductor device on a circuit board Expired - Lifetime USD566060S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/303,837 USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board
US29/303,833 USD577691S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005-010992 2005-01-18
JP2005010991 2005-04-13
JP2005010995 2005-04-13
JP2005-010991 2005-04-13
JP2005010992 2005-04-13
JP2005-010995 2005-04-13

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US29/303,837 Division USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board
US29/303,833 Division USD577691S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Publications (1)

Publication Number Publication Date
USD566060S1 true USD566060S1 (en) 2008-04-08

Family

ID=39263869

Family Applications (3)

Application Number Title Priority Date Filing Date
US29/240,188 Expired - Lifetime USD566060S1 (en) 2005-04-13 2005-10-11 Grooves formed around a semiconductor device on a circuit board
US29/303,837 Expired - Lifetime USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board
US29/303,833 Expired - Lifetime USD577691S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

Family Applications After (2)

Application Number Title Priority Date Filing Date
US29/303,837 Expired - Lifetime USD577692S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board
US29/303,833 Expired - Lifetime USD577691S1 (en) 2005-04-13 2008-02-19 Grooves formed around a semiconductor device on a circuit board

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD584250S1 (en) * 2006-05-01 2009-01-06 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD701182S1 (en) * 2011-04-12 2014-03-18 Plasyl Limited Wave circuit pattern
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD788723S1 (en) * 2015-03-04 2017-06-06 Osram Sylvania Inc. Serrated light engine and circuit board
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD615927S1 (en) * 2008-05-09 2010-05-18 Fujifilm Corporation Conductive sheet
USD598380S1 (en) * 2008-05-09 2009-08-18 Fujifilm Corporation Conductive sheet
USD613690S1 (en) * 2008-12-09 2010-04-13 Fujifilm Corporation Conductive sheet
USD658119S1 (en) * 2010-12-23 2012-04-24 Deutsche Cell Gmbh Metallization pattern of a solar cell
JP1603672S (en) * 2017-07-10 2018-05-14
JP1603673S (en) * 2017-07-10 2018-05-14

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
USD279670S (en) * 1978-07-31 1985-07-16 Lukits John J Component side of a printed circuit board
USD288556S (en) * 1984-02-21 1987-03-03 Pace, Incorporated Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards
USD295401S (en) * 1985-03-11 1988-04-26 Detects Inc. Electronic circuit board housing
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
USD374541S (en) * 1995-08-25 1996-10-15 Franciso Garza Bite size snack food
JPH118275A (en) 1997-06-13 1999-01-12 Nec Corp Manufacture of semiconductor device
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
US6114937A (en) * 1996-08-23 2000-09-05 International Business Machines Corporation Integrated circuit spiral inductor
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD510103S1 (en) * 2004-06-03 2005-09-27 American Express Travel Related Services Company, Inc. Transparent card with an antenna

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676748A (en) * 1970-04-01 1972-07-11 Fuji Electrochemical Co Ltd Frame structures for electronic circuits
USD279670S (en) * 1978-07-31 1985-07-16 Lukits John J Component side of a printed circuit board
USD288556S (en) * 1984-02-21 1987-03-03 Pace, Incorporated Ornamental design for a frame of circuit elements utilized to replace damaged elements on printed circuit boards
USD295401S (en) * 1985-03-11 1988-04-26 Detects Inc. Electronic circuit board housing
USD318271S (en) * 1987-07-04 1991-07-16 Terutomi Hasegawa Substrate for mounting semiconductors
USD319629S (en) * 1988-04-13 1991-09-03 Ibiden Co., Ltd. Semiconductor substrate with conducting pattern
US5008614A (en) * 1988-10-11 1991-04-16 Hewlett-Packard Company TAB frame and process of testing same
USD374541S (en) * 1995-08-25 1996-10-15 Franciso Garza Bite size snack food
US6114937A (en) * 1996-08-23 2000-09-05 International Business Machines Corporation Integrated circuit spiral inductor
JPH118275A (en) 1997-06-13 1999-01-12 Nec Corp Manufacture of semiconductor device
US5969590A (en) * 1997-08-05 1999-10-19 Applied Micro Circuits Corporation Integrated circuit transformer with inductor-substrate isolation
USD487430S1 (en) * 2002-07-10 2004-03-09 Matsushita Electric Industrial Co., Ltd. Semiconductor memory element
USD510103S1 (en) * 2004-06-03 2005-09-27 American Express Travel Related Services Company, Inc. Transparent card with an antenna

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
English Translation of Japanese Publication No. 11-8275 dated Jan. 12, 1999 (16 pages).
English translation of Office Action dated Nov. 4, 2005 for Japanese Patent Application No. 2005-010995 (1 page).
Office Action dated Nov. 4, 2005 for Japanese Application No. 2005-010995 (2 pages).

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD584250S1 (en) * 2006-05-01 2009-01-06 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD584249S1 (en) * 2006-05-01 2009-01-06 Nitto Denko Corporation Grooves formed around a semiconductor device on a circuit board
USD701182S1 (en) * 2011-04-12 2014-03-18 Plasyl Limited Wave circuit pattern
USD731990S1 (en) * 2012-04-18 2015-06-16 Nok Corporation Integrated circuit tag
USD788723S1 (en) * 2015-03-04 2017-06-06 Osram Sylvania Inc. Serrated light engine and circuit board
USD833405S1 (en) * 2015-03-04 2018-11-13 Osram Sylvania Inc. Serrated light engine and circuit board
USD871357S1 (en) * 2015-03-04 2019-12-31 Osram Sylvania Inc. Serrated light engine and circuit board
USD876373S1 (en) 2015-03-04 2020-02-25 Osram Sylvania Inc. Serrated light engine and circuit board
USD876374S1 (en) 2015-03-04 2020-02-25 Osram Sylvania Inc. Serrated light engine and circuit board
USD1054390S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device
USD1054389S1 (en) * 2022-01-05 2024-12-17 Nec Corporation Semiconductor device

Also Published As

Publication number Publication date
USD577692S1 (en) 2008-09-30
USD577691S1 (en) 2008-09-30

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