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USD1025935S1 - Collimator for a physical vapor deposition (PVD) chamber - Google Patents

Collimator for a physical vapor deposition (PVD) chamber Download PDF

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Publication number
USD1025935S1
USD1025935S1 US29/858,764 US202229858764F USD1025935S US D1025935 S1 USD1025935 S1 US D1025935S1 US 202229858764 F US202229858764 F US 202229858764F US D1025935 S USD1025935 S US D1025935S
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United States
Prior art keywords
collimator
pvd
chamber
vapor deposition
physical vapor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
US29/858,764
Inventor
Martin Lee Riker
Luke Vianney Varkey
Xiangjin Xie
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
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Priority to US29/858,764 priority Critical patent/USD1025935S1/en
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: RIKER, MARTIN LEE, VARKEY, LUKE VIANNEY, XIE, XIANGJIN
Priority to TW112302115F priority patent/TWD234473S/en
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Publication of USD1025935S1 publication Critical patent/USD1025935S1/en
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FIG. 1 is a top isometric view of a collimator for a physical vapor deposition (PVD) chamber.
FIG. 2 is bottom isometric view thereof.
FIG. 3 is a top plan view thereof.
FIG. 4 is a bottom plan view thereof.
FIG. 5 is a front elevation view thereof.
FIG. 6 is a back elevation view thereof.
FIG. 7 is a left side elevation view thereof.
FIG. 8 is a right side elevation view thereof; and,
FIG. 9 is a cross-sectional view taken along line 9-9 in FIG. 3 .
The broken lines in the drawings illustrate portions of the article that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a collimator for a physical vapor deposition (PVD) chamber, as shown and described.
US29/858,764 2022-11-03 2022-11-03 Collimator for a physical vapor deposition (PVD) chamber Active USD1025935S1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US29/858,764 USD1025935S1 (en) 2022-11-03 2022-11-03 Collimator for a physical vapor deposition (PVD) chamber
TW112302115F TWD234473S (en) 2022-11-03 2023-05-02 Collimator for use in a physical vapor deposition (pvd) chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US29/858,764 USD1025935S1 (en) 2022-11-03 2022-11-03 Collimator for a physical vapor deposition (PVD) chamber

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USD1025935S1 true USD1025935S1 (en) 2024-05-07

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TW (1) TWD234473S (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1103950S1 (en) * 2024-03-21 2025-12-02 Applied Materials, Inc. Process chamber collimator
USD1110289S1 (en) * 2024-10-18 2026-01-27 Applied Materials, Inc. Process chamber collimator
USD1110979S1 (en) * 2024-10-18 2026-02-03 Applied Materials, Inc. Process chamber collimator
USD1110975S1 (en) * 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber

Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5544771A (en) * 1994-02-23 1996-08-13 Samsung Electronics Co., Ltd. Method for manufacturing a collimator
US5770026A (en) * 1996-09-19 1998-06-23 Lg Semicon Co., Ltd. Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus
TW200420001A (en) * 2003-01-06 2004-10-01 Interdigital Tech Corp Method and system for controlling the distribution of multimedia broadcast services
US20090308739A1 (en) * 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
US20150114823A1 (en) * 2013-10-24 2015-04-30 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
US20150354054A1 (en) * 2014-06-06 2015-12-10 Applied Materials, Inc. Cooled process tool adapter for use in substrate processing chambers
US20160145735A1 (en) * 2014-11-26 2016-05-26 Applied Materials, Inc. Collimator for use in substrate processing chambers
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
US20170117121A1 (en) * 2015-10-27 2017-04-27 Applied Materials, Inc. Biasable flux optimizer / collimator for pvd sputter chamber
US20170253959A1 (en) * 2016-03-05 2017-09-07 Applied Materials, Inc. Methods and apparatus for controlling ion fraction in physical vapor deposition processes
US20170301525A1 (en) * 2014-11-05 2017-10-19 Kabushiki Kaisha Toshiba Processing apparatus and collimator
US20180233335A1 (en) * 2016-03-14 2018-08-16 Kabushiki Kaisha Toshiba Processing device and collimator
US20180237903A1 (en) * 2016-03-14 2018-08-23 Kabushiki Kaisha Toshiba Processing device, sputtering device, and collimator
US20180265964A1 (en) * 2017-03-17 2018-09-20 Kabushiki Kaisha Toshiba Collimator and processing apparatus
US20190027346A1 (en) * 2016-03-14 2019-01-24 Kabushiki Kaisha Toshiba Processing apparatus and collimator
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
TW202102001A (en) * 2019-05-10 2021-01-01 美商尼爾森(美國)有限公司 Content-modification system with use of multiple fingerprint data types feature
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Patent Citations (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5544771A (en) * 1994-02-23 1996-08-13 Samsung Electronics Co., Ltd. Method for manufacturing a collimator
US5770026A (en) * 1996-09-19 1998-06-23 Lg Semicon Co., Ltd. Semiconductor fabrication apparatus having improved sputtering collimator and wiring method for a semiconductor device using such apparatus
TW200420001A (en) * 2003-01-06 2004-10-01 Interdigital Tech Corp Method and system for controlling the distribution of multimedia broadcast services
US20090308739A1 (en) * 2008-06-17 2009-12-17 Applied Materials, Inc. Wafer processing deposition shielding components
US20150114823A1 (en) * 2013-10-24 2015-04-30 Applied Materials, Inc. Bipolar collimator utilized in a physical vapor deposition chamber
USD760180S1 (en) * 2014-02-21 2016-06-28 Hzo, Inc. Hexcell channel arrangement for use in a boat for a deposition apparatus
US20150354054A1 (en) * 2014-06-06 2015-12-10 Applied Materials, Inc. Cooled process tool adapter for use in substrate processing chambers
US20170301525A1 (en) * 2014-11-05 2017-10-19 Kabushiki Kaisha Toshiba Processing apparatus and collimator
US20160145735A1 (en) * 2014-11-26 2016-05-26 Applied Materials, Inc. Collimator for use in substrate processing chambers
US9543126B2 (en) * 2014-11-26 2017-01-10 Applied Materials, Inc. Collimator for use in substrate processing chambers
US20170117121A1 (en) * 2015-10-27 2017-04-27 Applied Materials, Inc. Biasable flux optimizer / collimator for pvd sputter chamber
US20170253959A1 (en) * 2016-03-05 2017-09-07 Applied Materials, Inc. Methods and apparatus for controlling ion fraction in physical vapor deposition processes
US20180233335A1 (en) * 2016-03-14 2018-08-16 Kabushiki Kaisha Toshiba Processing device and collimator
US20180237903A1 (en) * 2016-03-14 2018-08-23 Kabushiki Kaisha Toshiba Processing device, sputtering device, and collimator
US20190027346A1 (en) * 2016-03-14 2019-01-24 Kabushiki Kaisha Toshiba Processing apparatus and collimator
US20180265964A1 (en) * 2017-03-17 2018-09-20 Kabushiki Kaisha Toshiba Collimator and processing apparatus
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
TWD200242S (en) * 2018-03-16 2019-10-11 美商應用材料股份有限公司 A collimator for use in a physical vapor deposition (pvd) chamber
TWD202102S (en) * 2018-03-16 2020-01-11 美商應用材料股份有限公司 A collimator for use in a physical vapor deposition (pvd) chamber
TW202102001A (en) * 2019-05-10 2021-01-01 美商尼爾森(美國)有限公司 Content-modification system with use of multiple fingerprint data types feature
USD998575S1 (en) * 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD997111S1 (en) * 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1110975S1 (en) * 2022-01-12 2026-02-03 Applied Materials Inc. Collimator for a physical vapor deposition (PVD) chamber
USD1103950S1 (en) * 2024-03-21 2025-12-02 Applied Materials, Inc. Process chamber collimator
USD1110289S1 (en) * 2024-10-18 2026-01-27 Applied Materials, Inc. Process chamber collimator
USD1110979S1 (en) * 2024-10-18 2026-02-03 Applied Materials, Inc. Process chamber collimator

Also Published As

Publication number Publication date
TWD234473S (en) 2024-11-01

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