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US20180036861A1 - Polishing pad, polishing apparatus and method for manufacturing polishing pad - Google Patents

Polishing pad, polishing apparatus and method for manufacturing polishing pad Download PDF

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Publication number
US20180036861A1
US20180036861A1 US15/666,335 US201715666335A US2018036861A1 US 20180036861 A1 US20180036861 A1 US 20180036861A1 US 201715666335 A US201715666335 A US 201715666335A US 2018036861 A1 US2018036861 A1 US 2018036861A1
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US
United States
Prior art keywords
polishing
polishing pad
titanium dioxide
layer
dioxide nanowires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US15/666,335
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English (en)
Inventor
Chung-Chih Feng
I-Peng Yao
Yung-Chang Hung
Pin-Hsien Sung
Chin-Wei Chen
Wen-Chieh Wu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
San Fang Chemical Industry Co Ltd
Original Assignee
San Fang Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by San Fang Chemical Industry Co Ltd filed Critical San Fang Chemical Industry Co Ltd
Assigned to SAN FANG CHEMICAL INDUSTRY CO., LTD. reassignment SAN FANG CHEMICAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHEN, CHIN-WEI, FENG, CHUNG-CHIH, HUNG, YUNG-CHANG, SUNG, PIN-HSIEN, WU, WEN-CHIEH, YAO, I-PENG
Publication of US20180036861A1 publication Critical patent/US20180036861A1/en
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
    • B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • B24D3/346—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties utilised during polishing, or grinding operation

Definitions

  • the present invention relates to a polishing pad, a polishing apparatus, and a method for manufacturing the polishing pad.
  • a polishing process generally refers to a wear control for a preliminary coarse surface in a process of chemical mechanical polishing (CMP), which makes slurry containing fine particles evenly dispersed on an upper surface of a polishing pad, and at the same time places a substrate against the polishing pad and then rubs the substrate repeatedly with the polishing pad in a regular motion.
  • the substrate may be a semiconductor, a storage medium substrate, an integrated circuit, an LCD flat-panel glass, an optical glass or a photoelectric panel.
  • a polishing pad must be used to rub the substrate, thus the quality of the polishing pad directly influences the polishing effect to the substrate.
  • FIG. 1 shows a schematic view of a polishing apparatus with a conventional polishing pad.
  • the polishing apparatus 1 includes a pressure plate 11 , a mounting sheet 12 , a substrate 13 , a polishing plate 14 , a polishing pad 15 and slurry 16 .
  • the pressure plate 11 is positioned opposite to the polishing plate 14 .
  • the mounting sheet 12 is adhered to the pressure plate 11 through a backside adhesive (not shown) and is used for carrying and mounting the substrate 13 .
  • the polishing pad 15 is mounted on the polishing plate 14 and faces the pressure plate 11 for polishing the substrate 13 .
  • the operation manner of the polishing apparatus 1 is as follows. First, the substrate 13 is mounted on the mounting sheet 12 , and then both the pressure plate 11 and the polishing plate 14 are rotated and the pressure plate 11 is simultaneously moved toward the polishing plate 14 , such that the polishing pad 15 contacts the surface of the substrate 13 . Accordingly, the substrate 13 is polished by the polishing pad 15 with the continuously supplemented slurry 16 .
  • FIG. 2 shows a cross sectional view of a conventional polishing pad.
  • the polishing pad 2 includes a plurality of pores 22 and a resin 21 .
  • a method for manufacturing the polishing pad 2 is filling a resin composition (which is usually a foaming polymer formed by thermoplastic polyurethane) into a columnar mold. After cooling and solidifying, the polishing pad 2 is produced by cutting the cured resin composition into slices.
  • the polishing pad 2 has an independent foam structure, which is often used in a polishing process with a higher degree of planarity.
  • the biggest problem of the polishing pad 2 is that when filling the resin 21 in the columnar mold, the resin 21 cannot be uniformly distributed in the columnar mold due to the effect of surface tension.
  • such non-uniform distribution of the resin 21 in the columnar mold results in varying sizes and uneven distribution of the pores 22 , which cannot be easily controlled.
  • the pores 22 with varying sizes can be clearly seen on a sliced surface of the polishing pad 2 .
  • the pores 22 are not connected to each other, thus the slurry cannot easily flow therethrough.
  • polishing the slurry is unable to infiltrate into the interior region of the polishing pad, thus reducing the slurry retention capacity of the surface.
  • R.O.C. Patent Publication 200609315 discloses a porous chemical mechanical polishing pad with component-filled pores.
  • the polishing pad includes a polymeric material, and the pores of the polishing pad are controlled by limiting void spaces within the polymeric material matrix.
  • liquid, solid or a mixture thereof is added for improving polishing uniformity of the polishing pad.
  • the above method cannot easily control the sizes of the pores, and small pores on a surface of the polishing pad may easily be filled by polishing powder.
  • the polishing pad is provided with poor slurry retention capacity, which tends to cause scratches on the substrate.
  • the present invention provides a specific polishing layer having titanium dioxide nanowires for increasing hydrophilicity of the polishing layer. As such, slurry can adhere to the titanium dioxide nanowires, thus increasing slurry retention capacity of the polishing layer.
  • the invention provides a polishing pad comprising:
  • the invention also provides a polishing apparatus comprising:
  • the invention further provides a method for manufacturing the polishing pad according to the above, comprising:
  • FIG. 1 shows a schematic view of a polishing apparatus having a conventional polishing pad.
  • FIG. 2 shows a cross sectional view of the conventional polishing pad.
  • FIG. 3 shows a cross sectional view of a polishing pad according to the present invention.
  • FIG. 4 shows a schematic view of a polishing apparatus having the polishing pad according to the present invention.
  • the invention provides a polishing pad comprising:
  • polishing pad refers to a pad adapted for abutting against a substrate to be polished in a process of chemical mechanical polishing.
  • the polishing pad rubs the to-be-polished substrate repeatedly in a regular motion with the cooperation of slurry containing small particles, so as to wear a preliminary coarse surface of the substrate into a smooth surface.
  • polishing layer in the present invention refers to an element of a polishing pad, which element is adapted for contacting with and rubbing the substrate to be polished. That is, the polishing layer is the element which actually executes polishing with the cooperation of the slurry.
  • the polishing layer can be a single sheet, or can be laminated with other elements into a sheet structure.
  • a polishing layer 3 includes an elastomer main body 32 and a plurality of titanium dioxide nanowires 31 , with each of the titanium dioxide nanowires 31 being independent and distributed evenly and randomly in the elastomer main body 32 .
  • the term “elastomer main body” in the present invention refers to a main body made of an elastomer.
  • the elastomer is a type of polymer which has rubber-like characteristics. During the polishing process, the elastomer main body provides polishing function while preventing scratches on the surface of the substrate to be polished.
  • the elastomer is provided in an elastomer composition, with said composition including a resin and a crosslinking agent.
  • crosslinking agent in the present invention refers to a reagent which undergoes a crosslinking reaction with the resin of the present invention, so as to cure the resin under appropriate conditions.
  • the type of the crosslinking agent can be selected in accordance with the type of the resin.
  • a proper solvent for the elastomer composition includes dimethyl formamide (DMF) or water.
  • the elastomer can optionally include an additive, such as a surfactant.
  • a concentration of the elastomer in the elastomer composition is preferably in a range of about 2 wt % to about 60 wt %.
  • the polishing layer further includes a plurality of pores 33 dispersed in the elastomer main body 32 .
  • the elastomer main body and the plurality of pores can be provided by a foaming resin simultaneously.
  • foaming resin in the present invention refers to a material containing a thermoplastic resin and a thermodecomposing foaming agent.
  • the resin includes at least one selected from a group consisting of polyurethane, polyolefin, polycarbonate, polyvinyl alcohol, nylon, elastic rubber, polystyrene, poly aromatic molecules, fluorine-containing polymer, polyimide, crosslinked polyurethane, crosslinked polyolefin, polyether, polyester, polyacrylate, elastic polyethylene, polytetrafluoroethene, poly (ethylene terephthalate), poly aromatic amide, polyarylalkene, polymethyl methacrylate, a copolymer thereof, a block copolymer thereof, a mixture thereof, and a blend thereof.
  • a manner of foaming the resin according to the present invention can be chemically foaming or physically foaming, wherein the chemically foaming manner uses an agent capable of conducting a chemical reaction to yield gas, with the gas evenly distributed in the resin composition.
  • the physically foaming manner includes infiltrating gas into the resin composition, and making the gas evenly distributed in the resin composition by stirring.
  • the plurality of pores is provided by disposing a plurality of hollow polymeric micropheres in the elastomer.
  • hollow micropheres are Expancel® 551DE40d42 (weight average diameter of 30 to 50 ⁇ m, produced by Akzo Nobel N.V.) or Expancel® 551DE20d60 (weight average diameter of 15 to 25 ⁇ m, produced by Akzo Nobel N.V.).
  • the plurality of pores according to the present invention can be continuous pores or independent pores.
  • continuous pores in the present invention refers to at least two pores connecting to each other to form a pore system similar to an ant nest, which is beneficial to flow of the slurry, distribution of the polishing particles and removal of polishing residues.
  • independent pores in the present invention refers to pores which are independent without connecting to each other. Generally, the independent pores have cross sections of circle shape or oval shape, and are ball-shaped or egg-shaped pores. The independent pores provide greater hardness and higher removal rate.
  • each of the pores 33 is independent and is not connected to each other.
  • the plurality of pores 33 is preferably ball-shaped or egg-shaped.
  • the plurality of pores has a pore diameter of about 2 ⁇ m to about 250 ⁇ m, preferably about 10 ⁇ m to about 150 ⁇ m, and more preferably about 20 ⁇ m to about 80 ⁇ m.
  • the polishing layer further includes a nonwoven fabric.
  • the nonwoven fabric can be arranged above or below the elastomer main body, or can be immersed in the elastomer composition to form the polishing layer.
  • nonwoven fabric refers to a sheet, web or bat manufactured by directionally or randomly oriented fibers, bonded by friction, and/or cohesion and/or adhesion, excluding paper or products which are woven, knitted, tufted stitch bonded incorporating binding yarns or filaments, or felted by wet milling, whether or not additionally needled.
  • the fibers may be of natural or man-made origin. They may be staple or continuous filaments or may be formed in situ.
  • the nonwoven fabric usually includes a composite nonwoven fabric, a needle-punched nonwoven fabric, a melt-blown nonwoven fabric, a spun bonded nonwoven fabric, a dry-laid nonwoven fabric, a wet-laid nonwoven fabric, a stitch-bonded nonwoven fabric, or a spun lace nonwoven fabric.
  • a nonwoven fabric has a better material property.
  • fibers in the present invention refers to single fibers or composite fibers, preferably composite fibers.
  • the fibers are made of at least one material selected from the group consisting of polyamide, terephthalamide, polyester, polymethyl methacrylate, polyethylene terephthalate, polyacrylonitrile, and a mixture thereof.
  • the plurality of pores of the polishing pad is the void spaces between the fibers of the nonwoven fabric.
  • the plurality of pores is constructed by the elastomer main body and the fibers jointly.
  • One technical feature of the present invention is to provide the plurality of titanium dioxide nanowires, which is independent from each other, and is dispersed evenly and randomly in the elastomer main body.
  • the polishing pad of the present invention can provide improved slurry retention capacity. While not wishing to be limited to any particular theory, it is believed that since the titanium dioxide nanowires have extremely high hydrophilicity (superhydrophilicity), the slurry can be continuously adhered to the titanium dioxide nanowires during the polishing process, thus dramatically increasing slurry retention capacity of the polishing pad. As such, polishing efficiency can be improved while preventing scratches on the substrate to be polished.
  • the titanium dioxide nanowires possess extremely high hydrophilicity, surface tension of the elastomer composition dispersed with the titanium dioxide nanowires can be reduced.
  • the elastomer composition dispersed with the titanium dioxide nanowires has a small contact angle to a wall of the mold, and the surface of the elastomer composition lowers to serve as nucleation sites for the pores.
  • the titanium dioxide nanowires are dispersed on surfaces of the pores, thus enlarging contact area with the slurry and overcoming the defect of varying sizes of the pores.
  • a length of the plurality of titanium dioxide nanowires is about 0.1 nm to about 100 nm, preferably about 0.5 nm to about 40 nm, and more preferably about 1 nm to about 20 nm.
  • a diameter of the plurality of titanium dioxide nanowires is about 0.1 nm to about 50 nm, preferably about 0.5 nm to about 20 nm, and more preferably about 1 nm to about 10 nm.
  • a ratio of the plurality of titanium dioxide nanowires in the polishing layer is about 0.1% to about 20% by weight, preferably about 0.5% to about 10% by weight, and more preferably about 1% to about 5% by weight.
  • preparation of the plurality of titanium dioxide nanowires includes a hydrothermal method which comprises growing a lot of titanium dioxide nanowires on a titanium dioxide substrate, sonicating the plurality of titanium dioxide nanowires into an aqueous solution with a supersonic apparatus, and then removing water by heating, thus providing the plurality of titanium dioxide nanowires required in the present invention.
  • a portion of the plurality of titanium dioxide nanowires is exposed on a surface of the polishing layer.
  • a portion of the plurality of titanium dioxide nanowires is disposed in the plurality of pores.
  • the polishing layer includes a plurality of polishing particles.
  • the plurality of polishing particles is evenly distributed in the elastomer main body, as well as disposed in the plurality of pores.
  • the plurality of polishing particles is made of cerium dioxide, silicon dioxide, aluminum oxide, yttrium oxide, or ferric oxide.
  • a particle size of the plurality of polishing particles is between about 0.01 ⁇ m to about 10 ⁇ m.
  • the polishing pad further includes a buffer layer on a surface of the polishing layer.
  • buffer layer refers to a thin layer located between the polishing layer and a polishing apparatus.
  • the buffer layer withstands the pressure in various directions from a pressure plate and a polishing plate during the polishing process, so as to prevent scratches on the substrate to be polished.
  • the buffer layer according to the present invention includes fibers which can be the same as those fibers of the nonwoven fabric described above, and are not repeated again.
  • the polishing pad further includes a binder layer for binding the polishing layer and the buffer layer together.
  • a material of the binder layer is selected from a group consisting of pressure-sensitive adhesive, one-part adhesive, two-part adhesive, polyol curing-type PU paste, acrylic resin, and epoxy resin.
  • the pressure-sensitive adhesive generally includes a supporting film which can be, for instance, a polyester film.
  • a fluidic adhesive agent is coated on upper and lower sides of the supporting film.
  • the one-part adhesive refers to an adhesive agent which utilizes an elastomer with high molecular weight for providing adhesion function, preferably includes polyurethane.
  • the one-part adhesive includes oil-modified paste and moisture-curing paste.
  • the oil-modified paste is formed by reacting natural oil-modified or diglyceride-modified polyols with toluene diisocyanate (TDI).
  • the moisture-curing paste includes hydroxyl-containing polyesters and polyethers, with excess NCO groups (NCO/OH>1) reacting with hydroxyl groups of toluene diisocyanate, diphenylmethane diisocyanate (MDI), hexamethylene diisocyanate (HMDI), etc., to form isocyanate-terminated prepolymers.
  • NCO/OH>1 excess NCO groups
  • MDI diphenylmethane diisocyanate
  • HMDI hexamethylene diisocyanate
  • Such isocyanate groups can react with moisture in the air to produce amines, which undergoes further reactions to form urea linkage and biuret, thus forming a cured film.
  • the two-part adhesive refers to an adhesive agent including two components which react or crosslink with each other to provide adhesion function; preferably includes an elastomer and polyisocyanate.
  • the two-part adhesive may be of catalyst-curing type, which is cured by reacting a mono-diglyceride mixture transesterified by polyethylene glycol, polypropylene glycol or polyol with a catalyst, such as tertiary amines or metal salts.
  • the polyolcuring-type PU paste may be formed by reacting isocyanate prepolymers and a hydroxyl group of polyol-esters or polyethers or polyols, such as hydroxyl-containing acrylic resins.
  • the acrylic resin may be cold curing type or dry-heat curing type.
  • the cold curing-type acrylic resin which can be cured under room temperature, is essentially composed of acrylic resin monomers.
  • the heat-dry curing-type acrylic resin includes acrylic resin polymers as the basic structure, with active reacting groups introduced therein. When heated, said resin alone or with a resin containing reacting groups and crosslinking agent undergo a reaction to form a 3D network structure.
  • the epoxy resin can form 3D network structure with the addition of the crosslinking agent.
  • the polishing layer and the buffer layer are produced separately, and then bound together by the binder layer.
  • Means for binding the polishing layer with the buffer layer can be varied according to the forms of the binder layer.
  • the binder layer for binding the polishing layer and the buffer layer is preferably applied on a surface of the buffer layer or the polishing layer by coating, transferring, printing or scraping, more preferably by coating on a surface of the buffer layer or the polishing layer.
  • the polishing layer further includes a polishing surface, and the polishing surface includes a groove.
  • a proper processing for forming the groove on the polishing surface may be chosen by ordinarily skilled artisans based on the disclosure of the specification. For instance, laser processing can be used.
  • the groove assists slurry flow during the polishing process.
  • the ratio of the groove interval and the groove width is from about 1 to about 0.05.
  • the polishing pad further includes an adhesive layer on a surface of the polishing layer, which is adapted for fixing the polishing pad on a polishing plate.
  • a material of the adhesive layer can be the same as that of the binder layer, thus is not repeated again.
  • the present invention also provides a polishing apparatus, including:
  • the polishing apparatus further includes:
  • FIG. 4 shows a schematic view of a polishing apparatus according to the polishing pad of the invention.
  • the polishing apparatus 4 includes a pressure plate 41 , a mounting sheet 42 , a substrate 43 , a polishing plate 44 , a polishing pad 45 and slurry 46 .
  • the pressure plate 41 is positioned opposite to the polishing plate 44 .
  • the mounting sheet 42 is adhered to the pressure plate 41 through a backside adhesive (not shown) and is used for carrying and mounting the substrate 43 .
  • the polishing pad 45 is mounted on the polishing plate 44 and faces the pressure plate 41 for polishing the substrate 43 .
  • the operation manner of the polishing apparatus 4 is as follows. First, the substrate 43 is mounted on the mounting sheet 42 , and then both the pressure plate 41 and the polishing plate 44 are rotated and the pressure plate 41 is simultaneously moved toward the polishing plate 44 , such that the polishing pad 45 contacts the surface of the substrate 43 . Accordingly, the substrate 43 can be polished by the polishing pad 45 with the continuously supplemented slurry 46 .
  • the present invention further provides a method for manufacturing the polishing pad according to claim 1 , comprising:
  • definition of the elastomer composition is the same as described above, thus is not repeated again.
  • the method further includes coating the elastomer composition randomly dispersed with the plurality of titanium dioxide nanowires of the step (c) on a carrier before the step (d).
  • carrier in the present invention refers to an element which allows the elastomer composition to be formed thereon and to be easily removed therefrom after cured.
  • the carrier is a sheet; in another aspect, the carrier is a release liner.
  • release liner in the present invention refers to a material which does not react with the elastomer composition during the polishing pad manufacturing process, and the cured elastomer composition can be easily removed from such material.
  • the release liner is “a film with low permeability.”
  • film with low permeability in the present invention refers to a film or a thin membrane which substantially prevents the elastomer composition on an upper surface thereof from permeating to a lower surface thereof.
  • the film with low permeability can be formed on a base material, such as paper.
  • the carrier includes a polyethylene glycol terephthalate film, a polypropylene film, a polycarbonate film, a polyethylene film, a polyethylene terephthalate film, releasing paper or a releasing fabric.
  • the preferable polypropylene is oriented polypropylene.
  • the carrier is continuously provided, such as a release liner roll.
  • the release liner roll can be used in a roll-to-roll manner Comparing to the conventional manufacture process related to molding or casting a single polishing pad, the method according to the invention improves batch uniformity.
  • the method further includes filling the elastomer composition randomly dispersed with the plurality of titanium dioxide nanowires of the step (c) in a cavity of a mold before the step (d).
  • the plurality of titanium dioxide nanowires can be mixed or stirred with the components of the elastomer composition, so as to prepare the elastomer composition and disperse the titanium dioxide nanowires evenly and randomly in the elastomer composition at the same time.
  • the method further includes immersing a nonwoven fabric in the elastomer composition randomly dispersed with the plurality of titanium dioxide nanowires of the step (c) before the step (d), which is performed by a common method for immersing a fabric in an elastomer liquid.
  • the immersing conditions can be readily understood by ordinarily skilled artisans.
  • the step (d) cures the elastomer composition of the step (c).
  • Particular means for the curing step can be determined ordinarily skilled artisans based on the types of the resin and the optional crosslinking agent.
  • the curing step includes curing the elastomer composition at about 60° C. to about 130° C. after the elastomer composition is dried under a high temperature.
  • the method according to the present invention further includes a slicing step of cutting the elastomer cured in the mold into slices as the polishing pads.
  • a slicing step of cutting the elastomer cured in the mold into slices as the polishing pads.
  • Particular means for the slicing step can be readily understood by ordinarily skilled artisans.
  • the method further includes a step of removing the carrier.
  • the step of removing the carrier can be performed right after the manufacture process, removing the polishing pad from the manufacturing equipment.
  • the carrier-removing step can be performed just before the polishing process, removing the carrier from the polishing pad.
  • Particular means for the carrier-removing step can be choosen based on the type of the carrier, such as a teering process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
US15/666,335 2016-08-05 2017-08-01 Polishing pad, polishing apparatus and method for manufacturing polishing pad Abandoned US20180036861A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW105125047 2016-08-05
TW105125047A TWI604001B (zh) 2016-08-05 2016-08-05 研磨墊、研磨裝置及製造研磨墊之方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115816291A (zh) * 2022-12-09 2023-03-21 万华化学集团电子材料有限公司 一种具有改善边缘效应的化学机械抛光垫、制备方法及其应用
JP2023108208A (ja) * 2022-01-25 2023-08-04 株式会社ノリタケカンパニーリミテド 研磨パッド、研磨パッドの製造方法及びウェハ研磨方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2929757B1 (fr) * 2008-04-08 2010-09-03 Commissariat Energie Atomique Procede d'elaboration d'une membrane comportant des micropassages en materiau poreux par polissage mecano-chimique
TW201002475A (en) * 2008-07-14 2010-01-16 Ind Tech Res Inst Polishing pad, method of forming the same, and polishing method
TW201116366A (en) * 2009-11-13 2011-05-16 Rong-Fang Chen Grinding tool trimmer with protection film and its protection film formation method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023108208A (ja) * 2022-01-25 2023-08-04 株式会社ノリタケカンパニーリミテド 研磨パッド、研磨パッドの製造方法及びウェハ研磨方法
JP7573556B2 (ja) 2022-01-25 2024-10-25 ノリタケ株式会社 研磨パッド、研磨パッドの製造方法及びウェハ研磨方法
CN115816291A (zh) * 2022-12-09 2023-03-21 万华化学集团电子材料有限公司 一种具有改善边缘效应的化学机械抛光垫、制备方法及其应用

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TWI604001B (zh) 2017-11-01

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