US20130112387A1 - Heat dissipation device - Google Patents
Heat dissipation device Download PDFInfo
- Publication number
- US20130112387A1 US20130112387A1 US13/338,252 US201113338252A US2013112387A1 US 20130112387 A1 US20130112387 A1 US 20130112387A1 US 201113338252 A US201113338252 A US 201113338252A US 2013112387 A1 US2013112387 A1 US 2013112387A1
- Authority
- US
- United States
- Prior art keywords
- heat sink
- base
- rib
- dissipation device
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H10W40/22—
-
- H10W40/237—
Definitions
- the present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device including two self-connecting heat sinks.
- Heat dissipation devices are used with electronic components due to a large amount of heat generated by the electronic components.
- a typical heat dissipation device includes a base and a plurality of fins extending from the base.
- the base contacts the electronic component to absorb heat from the electronic component.
- the fins dissipate the heat from the base to the outside environment atmosphere.
- the base of the typical heat dissipation device often has a small size, resulting in heat dissipation areas of the heat dissipation device limited.
- FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure, with an electronic component on a printed circuit board.
- FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
- FIG. 3 is similar to FIG. 2 , but viewed from another aspect.
- FIG. 4 is a front view of the heat dissipation device of FIG. 1 .
- the heat dissipation device 100 includes a first heat sink 10 and a second heat sink 20 connected to the first heat sink 10 .
- each of the first heat sink 10 and the second heat sink 20 is made by aluminum-extrusion.
- Each of the first heat sink 10 and the second heat sink 20 includes a base 12 , 22 and a plurality of fins 14 , 24 extending from the base 12 , 22 , respectively.
- the base 12 , 22 of each of the first heat sink 10 and the second heat sink 20 is rectangular.
- the base 12 , 22 of each of the first heat sink 10 and the second heat sink 20 includes a flat top face 121 , 221 , a flat bottom face 123 , 223 opposite to the top face 121 , 221 and four lateral faces 120 , 220 interconnecting the top face 121 , 221 and the bottom face 123 , 223 .
- the bottom face 123 , 223 of one of the first heat sink 10 and the second heat sink 10 contacts an electronic component 30 mounted on a printed circuit board 40 to absorb heat from the electronic component 30 .
- the fins 14 , 24 are formed perpendicularly on the top face 121 , 221 of the base 12 , 22 .
- the fins 14 , 24 are uniformly spaced from each other.
- the fins 14 of the first heat sink 10 are parallel to the fins 24 of the second heat sink 20 .
- One lateral face 120 of the first heat sink 10 facing the second heat sink 20 forms a rib 122 thereon.
- the rib 122 protrudes towards the second heat sink 20 .
- the rib 122 has a length identical to that of the base 12 .
- a cross section of the rib 122 is a trapezoid.
- the rib 122 has a narrow end connected to the lateral face 120 of the base 12 of the first heat sink 10 and a wide end away from the lateral face 120 of the base 12 of the first heat sink 10 .
- a width of the rib 122 gradually increases in a direction away from the lateral face 120 of the first heat sink 10 where the narrow end of the rib 122 is connected.
- a width of the wide end of the rib 122 is less than a thickness of the base 12 , 22 of the each of the first heat sink 10 and the second heat sink 20 .
- the second heat sink 20 defines a groove 222 in one lateral face 220 thereof facing the rib 122 of the first heat sink 10 .
- the groove 222 has a shape corresponding to that of the rib 122 .
- the groove 222 has a length identical to that of the base 22 of the second heat sink 20 .
- a width of the groove 222 gradually increases in a direction away from the lateral face 220 of the base 22 where the groove 222 is defined.
- the groove 222 has an elongated opening 224 facing the rib 122 of the first heat sink 10 .
- a width of the opening 224 of the groove 222 is less than that of the wide end of the rib 122 and larger that that of the narrow end of the rib 122 .
- the groove 222 has a depth similar to a thickness of the rib 122 .
- the first heat sink 10 and the second heat sink 20 are assembled to each other.
- the first heat sink 10 and the second heat sink 20 are firstly staggered with each other to align the rib 122 of the first heat sink 10 with the groove 222 of the second heat sink 20 in a line.
- the rib 122 is brought to slide into the groove 222 to make the first heat sink 10 and the second heat sink 20 moving towards each other.
- the first heat sink 10 and the second heat sink 20 are assembled completely.
- the rib 122 is entirely received in the groove 222 .
- the rib 122 has three different faces thereof thermally contacting the second heat sink 20 in the groove 222 . Especially, the three different faces of the rib 122 each directly contact the second heat sink 20 without intermedium therebetween.
- the bottom face 123 of the first heat sink 10 is coplanar with the bottom face 223 of the second heat sink 20 .
- Each of the first heat sink 10 and the second heat sink 20 cannot be made largely due to technology limitation of aluminum-extrusion. However, after the first heat sink 10 and the second heat sink 20 are assembled together, the combination of the first heat sink 10 and the second heat sink 20 can obtain a large area. Thus, heat dissipation areas of the heat dissipation device 100 are large enough to meet the heat dissipation requirement of the electronic component 30 .
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
- 1. Technical Field
- The present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device including two self-connecting heat sinks.
- 2. Description of Related Art
- Heat dissipation devices are used with electronic components due to a large amount of heat generated by the electronic components. A typical heat dissipation device includes a base and a plurality of fins extending from the base. The base contacts the electronic component to absorb heat from the electronic component. The fins dissipate the heat from the base to the outside environment atmosphere. However, the base of the typical heat dissipation device often has a small size, resulting in heat dissipation areas of the heat dissipation device limited.
- What is needed, therefore, is a heat dissipation device which can overcome the limitations described above.
- Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure, with an electronic component on a printed circuit board. -
FIG. 2 is an exploded view of the heat dissipation device ofFIG. 1 . -
FIG. 3 is similar toFIG. 2 , but viewed from another aspect. -
FIG. 4 is a front view of the heat dissipation device ofFIG. 1 . - Referring to
FIG. 1 , aheat dissipation device 100 in accordance with an embodiment of the present disclosure is shown. Theheat dissipation device 100 includes afirst heat sink 10 and asecond heat sink 20 connected to thefirst heat sink 10. - Also referring to
FIGS. 2-4 , each of thefirst heat sink 10 and thesecond heat sink 20 is made by aluminum-extrusion. Each of thefirst heat sink 10 and thesecond heat sink 20 includes a 12, 22 and a plurality ofbase 14, 24 extending from thefins 12, 22, respectively. Thebase 12, 22 of each of thebase first heat sink 10 and thesecond heat sink 20 is rectangular. The 12, 22 of each of thebase first heat sink 10 and thesecond heat sink 20 includes a flat 121, 221, atop face 123, 223 opposite to theflat bottom face 121, 221 and fourtop face 120, 220 interconnecting thelateral faces 121, 221 and thetop face 123, 223. Thebottom face 123, 223 of one of thebottom face first heat sink 10 and thesecond heat sink 10 contacts anelectronic component 30 mounted on a printedcircuit board 40 to absorb heat from theelectronic component 30. The 14, 24 are formed perpendicularly on thefins 121, 221 of thetop face 12, 22. Thebase 14, 24 are uniformly spaced from each other. Thefins fins 14 of thefirst heat sink 10 are parallel to thefins 24 of thesecond heat sink 20. Onelateral face 120 of thefirst heat sink 10 facing thesecond heat sink 20 forms arib 122 thereon. Therib 122 protrudes towards thesecond heat sink 20. Therib 122 has a length identical to that of thebase 12. A cross section of therib 122 is a trapezoid. Therib 122 has a narrow end connected to thelateral face 120 of thebase 12 of thefirst heat sink 10 and a wide end away from thelateral face 120 of thebase 12 of thefirst heat sink 10. A width of therib 122 gradually increases in a direction away from thelateral face 120 of thefirst heat sink 10 where the narrow end of therib 122 is connected. A width of the wide end of therib 122 is less than a thickness of the 12, 22 of the each of thebase first heat sink 10 and thesecond heat sink 20. - The
second heat sink 20 defines agroove 222 in onelateral face 220 thereof facing therib 122 of thefirst heat sink 10. Thegroove 222 has a shape corresponding to that of therib 122. Thegroove 222 has a length identical to that of thebase 22 of thesecond heat sink 20. A width of thegroove 222 gradually increases in a direction away from thelateral face 220 of thebase 22 where thegroove 222 is defined. Thegroove 222 has anelongated opening 224 facing therib 122 of thefirst heat sink 10. A width of the opening 224 of thegroove 222 is less than that of the wide end of therib 122 and larger that that of the narrow end of therib 122. Thegroove 222 has a depth similar to a thickness of therib 122. - In use, the
first heat sink 10 and thesecond heat sink 20 are assembled to each other. The first heat sink 10 and thesecond heat sink 20 are firstly staggered with each other to align therib 122 of thefirst heat sink 10 with thegroove 222 of the second heat sink 20 in a line. Then therib 122 is brought to slide into thegroove 222 to make thefirst heat sink 10 and the second heat sink 20 moving towards each other. When therib 122 of thefirst heat sink 10 is retained in thegroove 222 of thesecond heat sink 20, thefirst heat sink 10 and thesecond heat sink 20 are assembled completely. Therib 122 is entirely received in thegroove 222. Therib 122 has three different faces thereof thermally contacting thesecond heat sink 20 in thegroove 222. Especially, the three different faces of therib 122 each directly contact thesecond heat sink 20 without intermedium therebetween. Thebottom face 123 of thefirst heat sink 10 is coplanar with thebottom face 223 of thesecond heat sink 20. - Each of the
first heat sink 10 and thesecond heat sink 20 cannot be made largely due to technology limitation of aluminum-extrusion. However, after thefirst heat sink 10 and thesecond heat sink 20 are assembled together, the combination of thefirst heat sink 10 and thesecond heat sink 20 can obtain a large area. Thus, heat dissipation areas of theheat dissipation device 100 are large enough to meet the heat dissipation requirement of theelectronic component 30. - It is believed that the present disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the present disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments.
Claims (17)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103495498A CN103096688A (en) | 2011-11-08 | 2011-11-08 | Heat dissipation device |
| CN201110349549.8 | 2011-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US20130112387A1 true US20130112387A1 (en) | 2013-05-09 |
Family
ID=48208613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US13/338,252 Abandoned US20130112387A1 (en) | 2011-11-08 | 2011-12-28 | Heat dissipation device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20130112387A1 (en) |
| CN (1) | CN103096688A (en) |
| TW (1) | TW201319786A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1023686B1 (en) * | 2015-11-12 | 2017-06-15 | Maes Jonker Nv | DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER |
| US20230282547A1 (en) * | 2022-03-07 | 2023-09-07 | Xilinx, Inc. | Chip package with decoupled thermal management |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104066302B (en) * | 2013-03-22 | 2016-12-28 | 技嘉科技股份有限公司 | Heat dissipation module and manufacturing method thereof |
| CN104571398B (en) * | 2013-10-15 | 2018-04-13 | 英业达科技有限公司 | Servomechanism and its radiating subassembly |
| CN104168744A (en) * | 2014-07-30 | 2014-11-26 | 太仓陶氏电气有限公司 | Intensive radiator |
| CN105472942B (en) * | 2014-09-26 | 2018-07-31 | 华为技术有限公司 | Radiator and electronic product |
| CN110007721B (en) * | 2018-01-05 | 2023-08-22 | 联想企业解决方案(新加坡)有限公司 | Computer server and main board assembly |
| CN112702887A (en) * | 2019-10-23 | 2021-04-23 | 北京配天技术有限公司 | Robot driving assembly, heat dissipation structure thereof and robot control cabinet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6708757B2 (en) * | 2000-02-28 | 2004-03-23 | Epcos Ag | Heat sink module and an arrangment of heat sink modules |
| US6958914B2 (en) * | 2003-12-09 | 2005-10-25 | Dell Products L.P. | Interlocking heat sink |
| US20070279872A1 (en) * | 2006-06-02 | 2007-12-06 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080302509A1 (en) * | 2007-06-08 | 2008-12-11 | Ama Precision Inc. | Heat sink and modular heat sink |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101808490A (en) * | 2009-02-17 | 2010-08-18 | 富准精密工业(深圳)有限公司 | Heat dissipating device |
-
2011
- 2011-11-08 CN CN2011103495498A patent/CN103096688A/en active Pending
- 2011-11-23 TW TW100142831A patent/TW201319786A/en unknown
- 2011-12-28 US US13/338,252 patent/US20130112387A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6708757B2 (en) * | 2000-02-28 | 2004-03-23 | Epcos Ag | Heat sink module and an arrangment of heat sink modules |
| US6958914B2 (en) * | 2003-12-09 | 2005-10-25 | Dell Products L.P. | Interlocking heat sink |
| US20070279872A1 (en) * | 2006-06-02 | 2007-12-06 | Foxconn Technology Co., Ltd. | Heat dissipation device |
| US20080302509A1 (en) * | 2007-06-08 | 2008-12-11 | Ama Precision Inc. | Heat sink and modular heat sink |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE1023686B1 (en) * | 2015-11-12 | 2017-06-15 | Maes Jonker Nv | DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER |
| US20230282547A1 (en) * | 2022-03-07 | 2023-09-07 | Xilinx, Inc. | Chip package with decoupled thermal management |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103096688A (en) | 2013-05-08 |
| TW201319786A (en) | 2013-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QIN, JI-YUN;FENG, JIN-SONG;YAN, QIANG;REEL/FRAME:027449/0208 Effective date: 20111227 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QIN, JI-YUN;FENG, JIN-SONG;YAN, QIANG;REEL/FRAME:027449/0208 Effective date: 20111227 |
|
| STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |