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US20130112387A1 - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

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Publication number
US20130112387A1
US20130112387A1 US13/338,252 US201113338252A US2013112387A1 US 20130112387 A1 US20130112387 A1 US 20130112387A1 US 201113338252 A US201113338252 A US 201113338252A US 2013112387 A1 US2013112387 A1 US 2013112387A1
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US
United States
Prior art keywords
heat sink
base
rib
dissipation device
face
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/338,252
Inventor
Ji-Yun Qin
Jin-Song Feng
Qiang YAN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fuzhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuzhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fuzhun Precision Industry Shenzhen Co Ltd
Assigned to FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD. reassignment FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: FENG, JIN-SONG, QIN, Ji-yun, YAN, QIANG
Publication of US20130112387A1 publication Critical patent/US20130112387A1/en
Abandoned legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H10W40/22
    • H10W40/237

Definitions

  • the present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device including two self-connecting heat sinks.
  • Heat dissipation devices are used with electronic components due to a large amount of heat generated by the electronic components.
  • a typical heat dissipation device includes a base and a plurality of fins extending from the base.
  • the base contacts the electronic component to absorb heat from the electronic component.
  • the fins dissipate the heat from the base to the outside environment atmosphere.
  • the base of the typical heat dissipation device often has a small size, resulting in heat dissipation areas of the heat dissipation device limited.
  • FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure, with an electronic component on a printed circuit board.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1 .
  • FIG. 3 is similar to FIG. 2 , but viewed from another aspect.
  • FIG. 4 is a front view of the heat dissipation device of FIG. 1 .
  • the heat dissipation device 100 includes a first heat sink 10 and a second heat sink 20 connected to the first heat sink 10 .
  • each of the first heat sink 10 and the second heat sink 20 is made by aluminum-extrusion.
  • Each of the first heat sink 10 and the second heat sink 20 includes a base 12 , 22 and a plurality of fins 14 , 24 extending from the base 12 , 22 , respectively.
  • the base 12 , 22 of each of the first heat sink 10 and the second heat sink 20 is rectangular.
  • the base 12 , 22 of each of the first heat sink 10 and the second heat sink 20 includes a flat top face 121 , 221 , a flat bottom face 123 , 223 opposite to the top face 121 , 221 and four lateral faces 120 , 220 interconnecting the top face 121 , 221 and the bottom face 123 , 223 .
  • the bottom face 123 , 223 of one of the first heat sink 10 and the second heat sink 10 contacts an electronic component 30 mounted on a printed circuit board 40 to absorb heat from the electronic component 30 .
  • the fins 14 , 24 are formed perpendicularly on the top face 121 , 221 of the base 12 , 22 .
  • the fins 14 , 24 are uniformly spaced from each other.
  • the fins 14 of the first heat sink 10 are parallel to the fins 24 of the second heat sink 20 .
  • One lateral face 120 of the first heat sink 10 facing the second heat sink 20 forms a rib 122 thereon.
  • the rib 122 protrudes towards the second heat sink 20 .
  • the rib 122 has a length identical to that of the base 12 .
  • a cross section of the rib 122 is a trapezoid.
  • the rib 122 has a narrow end connected to the lateral face 120 of the base 12 of the first heat sink 10 and a wide end away from the lateral face 120 of the base 12 of the first heat sink 10 .
  • a width of the rib 122 gradually increases in a direction away from the lateral face 120 of the first heat sink 10 where the narrow end of the rib 122 is connected.
  • a width of the wide end of the rib 122 is less than a thickness of the base 12 , 22 of the each of the first heat sink 10 and the second heat sink 20 .
  • the second heat sink 20 defines a groove 222 in one lateral face 220 thereof facing the rib 122 of the first heat sink 10 .
  • the groove 222 has a shape corresponding to that of the rib 122 .
  • the groove 222 has a length identical to that of the base 22 of the second heat sink 20 .
  • a width of the groove 222 gradually increases in a direction away from the lateral face 220 of the base 22 where the groove 222 is defined.
  • the groove 222 has an elongated opening 224 facing the rib 122 of the first heat sink 10 .
  • a width of the opening 224 of the groove 222 is less than that of the wide end of the rib 122 and larger that that of the narrow end of the rib 122 .
  • the groove 222 has a depth similar to a thickness of the rib 122 .
  • the first heat sink 10 and the second heat sink 20 are assembled to each other.
  • the first heat sink 10 and the second heat sink 20 are firstly staggered with each other to align the rib 122 of the first heat sink 10 with the groove 222 of the second heat sink 20 in a line.
  • the rib 122 is brought to slide into the groove 222 to make the first heat sink 10 and the second heat sink 20 moving towards each other.
  • the first heat sink 10 and the second heat sink 20 are assembled completely.
  • the rib 122 is entirely received in the groove 222 .
  • the rib 122 has three different faces thereof thermally contacting the second heat sink 20 in the groove 222 . Especially, the three different faces of the rib 122 each directly contact the second heat sink 20 without intermedium therebetween.
  • the bottom face 123 of the first heat sink 10 is coplanar with the bottom face 223 of the second heat sink 20 .
  • Each of the first heat sink 10 and the second heat sink 20 cannot be made largely due to technology limitation of aluminum-extrusion. However, after the first heat sink 10 and the second heat sink 20 are assembled together, the combination of the first heat sink 10 and the second heat sink 20 can obtain a large area. Thus, heat dissipation areas of the heat dissipation device 100 are large enough to meet the heat dissipation requirement of the electronic component 30 .

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a first heat sink and a second heat sink connected to each other. Each of the first and second heat sinks includes a base and a plurality of fins extending from the base. The base of the first heat sink forms a rib on a lateral face thereof, and the base of the second heat sink defines a groove in a lateral face thereof. The rib is received in the groove to connect the first heat sink with the second heat sink.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to heat dissipation devices, and more particularly, to a heat dissipation device including two self-connecting heat sinks.
  • 2. Description of Related Art
  • Heat dissipation devices are used with electronic components due to a large amount of heat generated by the electronic components. A typical heat dissipation device includes a base and a plurality of fins extending from the base. The base contacts the electronic component to absorb heat from the electronic component. The fins dissipate the heat from the base to the outside environment atmosphere. However, the base of the typical heat dissipation device often has a small size, resulting in heat dissipation areas of the heat dissipation device limited.
  • What is needed, therefore, is a heat dissipation device which can overcome the limitations described above.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an isometric view of a heat dissipation device in accordance with an embodiment of the present disclosure, with an electronic component on a printed circuit board.
  • FIG. 2 is an exploded view of the heat dissipation device of FIG. 1.
  • FIG. 3 is similar to FIG. 2, but viewed from another aspect.
  • FIG. 4 is a front view of the heat dissipation device of FIG. 1.
  • DETAILED DESCRIPTION OF THE EMBODIMENTS
  • Referring to FIG. 1, a heat dissipation device 100 in accordance with an embodiment of the present disclosure is shown. The heat dissipation device 100 includes a first heat sink 10 and a second heat sink 20 connected to the first heat sink 10.
  • Also referring to FIGS. 2-4, each of the first heat sink 10 and the second heat sink 20 is made by aluminum-extrusion. Each of the first heat sink 10 and the second heat sink 20 includes a base 12, 22 and a plurality of fins 14, 24 extending from the base 12, 22, respectively. The base 12, 22 of each of the first heat sink 10 and the second heat sink 20 is rectangular. The base 12, 22 of each of the first heat sink 10 and the second heat sink 20 includes a flat top face 121, 221, a flat bottom face 123, 223 opposite to the top face 121, 221 and four lateral faces 120, 220 interconnecting the top face 121, 221 and the bottom face 123, 223. The bottom face 123, 223 of one of the first heat sink 10 and the second heat sink 10 contacts an electronic component 30 mounted on a printed circuit board 40 to absorb heat from the electronic component 30. The fins 14, 24 are formed perpendicularly on the top face 121, 221 of the base 12, 22. The fins 14, 24 are uniformly spaced from each other. The fins 14 of the first heat sink 10 are parallel to the fins 24 of the second heat sink 20. One lateral face 120 of the first heat sink 10 facing the second heat sink 20 forms a rib 122 thereon. The rib 122 protrudes towards the second heat sink 20. The rib 122 has a length identical to that of the base 12. A cross section of the rib 122 is a trapezoid. The rib 122 has a narrow end connected to the lateral face 120 of the base 12 of the first heat sink 10 and a wide end away from the lateral face 120 of the base 12 of the first heat sink 10. A width of the rib 122 gradually increases in a direction away from the lateral face 120 of the first heat sink 10 where the narrow end of the rib 122 is connected. A width of the wide end of the rib 122 is less than a thickness of the base 12, 22 of the each of the first heat sink 10 and the second heat sink 20.
  • The second heat sink 20 defines a groove 222 in one lateral face 220 thereof facing the rib 122 of the first heat sink 10. The groove 222 has a shape corresponding to that of the rib 122. The groove 222 has a length identical to that of the base 22 of the second heat sink 20. A width of the groove 222 gradually increases in a direction away from the lateral face 220 of the base 22 where the groove 222 is defined. The groove 222 has an elongated opening 224 facing the rib 122 of the first heat sink 10. A width of the opening 224 of the groove 222 is less than that of the wide end of the rib 122 and larger that that of the narrow end of the rib 122. The groove 222 has a depth similar to a thickness of the rib 122.
  • In use, the first heat sink 10 and the second heat sink 20 are assembled to each other. The first heat sink 10 and the second heat sink 20 are firstly staggered with each other to align the rib 122 of the first heat sink 10 with the groove 222 of the second heat sink 20 in a line. Then the rib 122 is brought to slide into the groove 222 to make the first heat sink 10 and the second heat sink 20 moving towards each other. When the rib 122 of the first heat sink 10 is retained in the groove 222 of the second heat sink 20, the first heat sink 10 and the second heat sink 20 are assembled completely. The rib 122 is entirely received in the groove 222. The rib 122 has three different faces thereof thermally contacting the second heat sink 20 in the groove 222. Especially, the three different faces of the rib 122 each directly contact the second heat sink 20 without intermedium therebetween. The bottom face 123 of the first heat sink 10 is coplanar with the bottom face 223 of the second heat sink 20.
  • Each of the first heat sink 10 and the second heat sink 20 cannot be made largely due to technology limitation of aluminum-extrusion. However, after the first heat sink 10 and the second heat sink 20 are assembled together, the combination of the first heat sink 10 and the second heat sink 20 can obtain a large area. Thus, heat dissipation areas of the heat dissipation device 100 are large enough to meet the heat dissipation requirement of the electronic component 30.
  • It is believed that the present disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the present disclosure or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments.

Claims (17)

What is claimed is:
1. A heat dissipation device comprising:
a first heat sink comprising a base and a plurality of fins extending from the base, the base of the first heat sink forming a rib on a face thereof; and
a second heat sink comprising a base and a plurality of fins extending from the base, the base of the second heat sink defining a groove in a face thereof facing the face of the base of the first heat sink, the rib being received in the groove to connect the first heat sink to the second heat sink.
2. The heat dissipation device of claim 1, wherein the base of the first heat sink has a top face, a bottom face opposite to the top face and a plurality of lateral faces between the top face and the bottom face, the rib being formed on one of the lateral faces of the base of the first heat sink.
3. The heat dissipation device of claim 2, wherein the base of the second heat sink has a top face, a bottom face and a plurality of lateral faces between the top face and the bottom face, the groove being defined in one of the lateral faces of the base of the second heat sink.
4. The heat dissipation device of claim 3, wherein the rib has a width gradually increasing in a direction away from the one of the lateral faces of the base of the first heat sink.
5. The heat dissipation device of claim 3, wherein the rib has a width gradually increasing in a direction away from the one of the lateral faces of the base of the second heat sink.
6. The heat dissipation device of claim 2, wherein the rib has a narrow end connected to the one of the lateral faces of the base of the first heat sink and a wide end away from the base of the first heat sink.
7. The heat dissipation device of claim 6, wherein the groove has an opening facing the one of the lateral faces of the base of the first heat sink.
8. The heat dissipation device of claim 7, wherein a width of the opening of the groove is larger than a width of the narrow end of the rib and smaller than a width of the wide end of the rib.
9. The heat dissipation device of claim 1, wherein each of the first heat sink and the second heat sink is made by aluminum-extrusion.
10. The heat dissipation device of claim 3, wherein the fins of the first heat sink are formed on the top face of the base of the first heat sink, and the fins of the second heat sink are formed on the top face of the base of the second heat sink.
11. A heat dissipation device comprising:
a first heat sink comprising a base and a plurality of fins extending from the base, the base of the first heat sink forming a rib on a face thereof, the rib has a narrow end connected to the face of the base of the first heat sink and a wide end away from the face of the base of the first heat sink; and
a second heat sink comprising a base and a plurality of fins extending from the base; the base of the second heat sink defining a groove in a face thereof to receive the rib, the groove having an opening facing the first heat sink, the opening having a width less than a width of the wide end of the rib and larger than a width of the narrow end of the rib.
12. The heat dissipation device of claim 11, wherein each of the base of the first heat sink and the second heat sink comprises a top face, a bottom face opposite to the top face and a plurality of lateral faces between the top face and the bottom face, the rib being formed on one of the lateral faces of the base of the first heat sink, and the groove being defined in one of the lateral faces of the base of the second heat sink.
13. The heat dissipation device of claim 11, wherein each of the first heat sink and the second heat sink is made by aluminum-extrusion.
14. The heat dissipation device of claim 11, wherein the rib has a width gradually increasing in a direction away from the face of the base of the first heat sink where the rib is formed.
15. The heat dissipation device of claim 11, wherein the groove has a width gradually increasing in a direction away from the face of the base of the second heat sink where the groove is defined.
16. The heat dissipation device of claim 12, wherein the fins of the first heat sink are formed on the top face of the base of the first heat sink, and the fins of the second heat sink are formed on the top face of the base of the second heat sink.
17. The heat dissipation device of claim 12, wherein the bottom face of the first heat sink is coplanar with the bottom face of the second heat sink.
US13/338,252 2011-11-08 2011-12-28 Heat dissipation device Abandoned US20130112387A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2011103495498A CN103096688A (en) 2011-11-08 2011-11-08 Heat dissipation device
CN201110349549.8 2011-11-08

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TW (1) TW201319786A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1023686B1 (en) * 2015-11-12 2017-06-15 Maes Jonker Nv DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER
US20230282547A1 (en) * 2022-03-07 2023-09-07 Xilinx, Inc. Chip package with decoupled thermal management

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104066302B (en) * 2013-03-22 2016-12-28 技嘉科技股份有限公司 Heat dissipation module and manufacturing method thereof
CN104571398B (en) * 2013-10-15 2018-04-13 英业达科技有限公司 Servomechanism and its radiating subassembly
CN104168744A (en) * 2014-07-30 2014-11-26 太仓陶氏电气有限公司 Intensive radiator
CN105472942B (en) * 2014-09-26 2018-07-31 华为技术有限公司 Radiator and electronic product
CN110007721B (en) * 2018-01-05 2023-08-22 联想企业解决方案(新加坡)有限公司 Computer server and main board assembly
CN112702887A (en) * 2019-10-23 2021-04-23 北京配天技术有限公司 Robot driving assembly, heat dissipation structure thereof and robot control cabinet

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6708757B2 (en) * 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink
US20070279872A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat dissipation device
US20080302509A1 (en) * 2007-06-08 2008-12-11 Ama Precision Inc. Heat sink and modular heat sink

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101808490A (en) * 2009-02-17 2010-08-18 富准精密工业(深圳)有限公司 Heat dissipating device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6708757B2 (en) * 2000-02-28 2004-03-23 Epcos Ag Heat sink module and an arrangment of heat sink modules
US6958914B2 (en) * 2003-12-09 2005-10-25 Dell Products L.P. Interlocking heat sink
US20070279872A1 (en) * 2006-06-02 2007-12-06 Foxconn Technology Co., Ltd. Heat dissipation device
US20080302509A1 (en) * 2007-06-08 2008-12-11 Ama Precision Inc. Heat sink and modular heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE1023686B1 (en) * 2015-11-12 2017-06-15 Maes Jonker Nv DEVICE WITH METAL FOAM FOR ACCELERATED HEAT TRANSFER
US20230282547A1 (en) * 2022-03-07 2023-09-07 Xilinx, Inc. Chip package with decoupled thermal management

Also Published As

Publication number Publication date
CN103096688A (en) 2013-05-08
TW201319786A (en) 2013-05-16

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Legal Events

Date Code Title Description
AS Assignment

Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QIN, JI-YUN;FENG, JIN-SONG;YAN, QIANG;REEL/FRAME:027449/0208

Effective date: 20111227

Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QIN, JI-YUN;FENG, JIN-SONG;YAN, QIANG;REEL/FRAME:027449/0208

Effective date: 20111227

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION