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US20130020052A1 - Heat dissipation device with heat pipe within base - Google Patents

Heat dissipation device with heat pipe within base Download PDF

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Publication number
US20130020052A1
US20130020052A1 US13/442,001 US201213442001A US2013020052A1 US 20130020052 A1 US20130020052 A1 US 20130020052A1 US 201213442001 A US201213442001 A US 201213442001A US 2013020052 A1 US2013020052 A1 US 2013020052A1
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US
United States
Prior art keywords
heat
base
interface
dissipation device
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/442,001
Inventor
Guo-He Huang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Assigned to HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD. reassignment HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HUANG, GUO-HE
Publication of US20130020052A1 publication Critical patent/US20130020052A1/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present disclosure relates to a heat dissipation device.
  • a heat sink may be used to dissipate heat from a heat generating element.
  • the heat sink may include a base, a number of fins, and a heat pipe.
  • the heat pipe may be connected to the base at one end and to the number of fins at the other end.
  • a fan may be mounted on a top or a side of the number of fins to dissipate heat from the heat sink.
  • heat from the base may only be dissipated from the number of fins through the heat pipe since a heat contact surface is limited. There is room for improvement within the art.
  • FIG. 1 is an exploded, isometric view of a heat dissipation device in one embodiment.
  • FIG. 2 is a partially assembled view of FIG. 1 .
  • FIG. 3 is an assembled view of FIG. 1 .
  • a heat dissipation device includes a base 30 , a plurality of heat pipes 50 , and a fin assembly 10 .
  • the heat dissipation device can dissipate heat from a heat element 110 on a motherboard 100 .
  • the heat element 110 may be a processor.
  • the base 30 is substantially planar.
  • the base 30 may be rectangular.
  • the base 30 includes a first interface 31 for contacting the heat element 110 and a second interface 33 on opposite sides of the first interface 31 .
  • the base 30 includes a thermal contact area 332 for contacting the heat element 110 .
  • the thermal contact area 332 may be located at a middle portion of the base 30 .
  • the base 30 defines two through openings 35 at opposite sides of the thermal contact area 332 . Each of the two through openings 35 may be rectangular-shaped.
  • the base 30 defines a slot 37 at the second interface 33 for receiving the plurality of heat pipes 50 . A depth of the slot 37 is less than a thickness of the base 30 .
  • the plurality of heat pipes 50 includes a first heat pipe 51 and two second heat pipes 53 .
  • the first heat pipe 51 is configured to a substantially Z shape.
  • Each of the two second heat pipes 53 is configured to a substantially L shape.
  • the first heat pipe 51 includes a first main portion 511 and two first extension portions 513 connected to opposite sides of the first main portion 511 .
  • the first main portion 511 is located at the thermal contact area 332 .
  • the two first extension portions 513 extend out from the thermal contact area 332 .
  • Each of the two second heat pipes 53 includes a second main portion 531 and a second extension portion 533 .
  • the second main portion 531 is located at the thermal contact area 332 .
  • the second extension portion 533 extends around each of the two through openings 35 .
  • the two second heat pipes 53 may have substantially the same configuration.
  • the two second heat pipes 53 may be symmetrical about a central point of the base 30 .
  • the fin assembly 10 may include a plurality of parallel fins.
  • the plurality of heat pipes 50 are positioned into the slot 37 of the base 30 .
  • the plurality of heat pipes 50 are located substantially within the base 30 .
  • the plurality of heat pipes 50 extend within an extension plane, which is substantially parallel to a plane of the second interface 33 .
  • a top surface of each of the plurality of heat pipes 50 is substantially flushed with the second interface 33 .
  • the fin assembly 10 is fixed to the base 30 .
  • the fin assembly 10 contacts the second interface 33 of the base 30 and the plurality of heat pipes 50 simultaneously.
  • the assembled heat dissipation device may be located on the motherboard 100 to dissipate heat from the heat element 110 .
  • the thermal area 332 contacts the heat element 110 .
  • Heat generated from the heat element 110 may be transmitted to the base 30 .
  • the base 30 may transmit the heat through the plurality of heat pipes 50 or directly transmit the heat to fin assembly 10 .
  • one or more heat pipe may be used.
  • a cross-sectional view of each heat pipe may be rectangular, round or ellipse.
  • the shape of the slot 37 may alternate according to different kinds of heat pipe.
  • the base 30 and the plurality of heat pipes 50 may use different materials due to consideration for cost or weight.
  • a weight-to-volume density of the plurality of heat pipes 50 may be larger than a weight-to-volume density of the base 30 .
  • the plurality of heat pipes 50 may include copper, and the base 30 may include aluminum.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat dissipation device includes a base, at least one heat pipe, and a fin assembly. The base is substantially planar. The base includes a first interface and a second interface opposite to the first interface. The first interface is adapted to contact a heat element. The base defines a slot at the second interface. The at least one heat pipe is received in the slot. The fin assembly contacts the second interface and the at least one heat pipe simultaneously.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a heat dissipation device.
  • 2. Description of Related Art
  • In an electronic device, a heat sink may be used to dissipate heat from a heat generating element. The heat sink may include a base, a number of fins, and a heat pipe. The heat pipe may be connected to the base at one end and to the number of fins at the other end. A fan may be mounted on a top or a side of the number of fins to dissipate heat from the heat sink. However, heat from the base may only be dissipated from the number of fins through the heat pipe since a heat contact surface is limited. There is room for improvement within the art.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • Many aspects of the embodiments can be better understood with references to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
  • FIG. 1 is an exploded, isometric view of a heat dissipation device in one embodiment.
  • FIG. 2 is a partially assembled view of FIG. 1.
  • FIG. 3 is an assembled view of FIG. 1.
    •  DETAILED DESCRIPTION
  • The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
  • Referring to FIG. 1, in one embodiment, a heat dissipation device includes a base 30, a plurality of heat pipes 50, and a fin assembly 10. The heat dissipation device can dissipate heat from a heat element 110 on a motherboard 100. The heat element 110 may be a processor.
  • The base 30 is substantially planar. The base 30 may be rectangular. The base 30 includes a first interface 31 for contacting the heat element 110 and a second interface 33 on opposite sides of the first interface 31. The base 30 includes a thermal contact area 332 for contacting the heat element 110. The thermal contact area 332 may be located at a middle portion of the base 30. The base 30 defines two through openings 35 at opposite sides of the thermal contact area 332. Each of the two through openings 35 may be rectangular-shaped. The base 30 defines a slot 37 at the second interface 33 for receiving the plurality of heat pipes 50. A depth of the slot 37 is less than a thickness of the base 30.
  • In one embodiment, the plurality of heat pipes 50 includes a first heat pipe 51 and two second heat pipes 53. The first heat pipe 51 is configured to a substantially Z shape. Each of the two second heat pipes 53 is configured to a substantially L shape. The first heat pipe 51 includes a first main portion 511 and two first extension portions 513 connected to opposite sides of the first main portion 511. The first main portion 511 is located at the thermal contact area 332. The two first extension portions 513 extend out from the thermal contact area 332. Each of the two second heat pipes 53 includes a second main portion 531 and a second extension portion 533. The second main portion 531 is located at the thermal contact area 332. The second extension portion 533 extends around each of the two through openings 35. The two second heat pipes 53 may have substantially the same configuration. The two second heat pipes 53 may be symmetrical about a central point of the base 30.
  • The fin assembly 10 may include a plurality of parallel fins.
  • Referring to FIG. 2, in assembly, the plurality of heat pipes 50 are positioned into the slot 37 of the base 30. The plurality of heat pipes 50 are located substantially within the base 30. The plurality of heat pipes 50 extend within an extension plane, which is substantially parallel to a plane of the second interface 33. A top surface of each of the plurality of heat pipes 50 is substantially flushed with the second interface 33. The fin assembly 10 is fixed to the base 30. The fin assembly 10 contacts the second interface 33 of the base 30 and the plurality of heat pipes 50 simultaneously.
  • Referring to FIG. 3, in use, the assembled heat dissipation device may be located on the motherboard 100 to dissipate heat from the heat element 110. The thermal area 332 contacts the heat element 110. Heat generated from the heat element 110 may be transmitted to the base 30. The base 30 may transmit the heat through the plurality of heat pipes 50 or directly transmit the heat to fin assembly 10.
  • In other embodiment, one or more heat pipe may be used. A cross-sectional view of each heat pipe may be rectangular, round or ellipse. The shape of the slot 37 may alternate according to different kinds of heat pipe.
  • In other embodiment, the base 30 and the plurality of heat pipes 50 may use different materials due to consideration for cost or weight. A weight-to-volume density of the plurality of heat pipes 50 may be larger than a weight-to-volume density of the base 30. For example, the plurality of heat pipes 50 may include copper, and the base 30 may include aluminum.
  • It is also to be understood, however, that even though numerous characteristics and advantages have been set forth in the foregoing description of preferred embodiments, together with details of the structures and functions of the preferred embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (20)

1. A heat dissipation device comprising:
a base, the base being substantially planar, the base comprising a first interface and a second interface opposite to the first interface, the first interface being configured to contact a heat element, and the base defining a slot at the second interface;
at least one heat pipe received in the slot; and
a fin assembly contacting the second interface and the at least one heat pipe simultaneously.
2. The heat dissipation device of claim 1, wherein an interface between the at least one heat pipe and the fin assembly is substantially flushed with the second interface.
3. The heat dissipation device of claim 1, wherein a depth of the slot is less than a thickness of the base.
4. The heat dissipation device of claim 1, wherein the at least one heat pipe is located substantially within the base.
5. The heat dissipation device of claim 1, wherein the at least one heat pipe extends within an extension plane substantially parallel to a plane of the second interface.
6. The heat dissipation device of claim 1, wherein the base comprises a thermal contact area and two through openings at opposite sides of the thermal contact area, the thermal contact area is configured to contact the heat element.
7. The heat dissipation device of claim 6, wherein the at least one heat pipe comprises a first heat pipe and two second heat pipes, the first heat pipe is substantially Z shaped, and each of the two heat pipes is substantially L shaped.
8. The heat dissipation device of claim 7, wherein the first heat pipe comprises a first main portion and two first extension portions, each of the two first extension portions is connected to each opposite side of the first main portion, the first main portion is located at the thermal contact area, and each of the two first extension portions extends out from the thermal contact area.
9. The heat dissipation device of claim 7, wherein each of the two second pipes comprises a second main portion and a second extension portion, the second main portion is located at the thermal contact area, and the second extension portion extends around each of the two through openings.
10. The heat dissipation device of claim 7, wherein the two second heat pipes are symmetrical about a central point of the base.
11. The heat dissipation device of claim 1, wherein a weight-to-volume density of the at least one heat pipe is larger than a weight-to-volume density of the base.
12. The heat dissipation device of claim 11, wherein the at least one heat pipe comprises copper, and the base comprises aluminum.
13. A heat dissipation device comprising:
a base, the base being substantially planar, the base comprising a first interface and a second interface opposite to the first interface, the first interface being configured to contact a heat element, and the base defining a slot at the second interface;
at least one heat pipe received in the slot and located substantially within the base; and
a fin assembly contacting the second interface.
14. The heat dissipation device of claim 13, wherein an interface between the at least one heat pipe and the fin assembly is substantially flushed with the second interface.
15. The heat dissipation device of claim 13, wherein a depth of the slot is less than a thickness of the base.
16. The heat dissipation device of claim 13, wherein the fin assembly contacting the second interface and the at least one heat pipe simultaneously.
17. The heat dissipation device of claim 13, wherein the base comprises a thermal contact area and two through openings at opposite sides of the thermal contact area, the thermal contact area is configured to contact the heat element.
18. The heat dissipation device of claim 17, wherein the at least one heat pipe comprises a first heat pipe and two second heat pipes, the first heat pipe is substantially Z shaped, and each of the two heat pipes is substantially L shaped.
19. The heat dissipation device of claim 17, wherein the first heat pipe comprises a first main portion and two first extension portions, each of the tow first extension portions is connected to each opposite side of the first main portion, the first main portion is located at the thermal contact area, and each of the two first extension portions extends out from the thermal contact area.
20. The heat dissipation device of claim 17, wherein each of the two second pipes comprises a second main portion and a second extension portion, the second main portion is located at the thermal contact area, and the second extension portion extends around each of the through openings.
US13/442,001 2011-07-20 2012-04-09 Heat dissipation device with heat pipe within base Abandoned US20130020052A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201110203634.3 2011-07-20
CN2011102036343A CN102891119A (en) 2011-07-20 2011-07-20 Radiating device

Publications (1)

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CN (1) CN102891119A (en)
TW (1) TW201306726A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130183469A1 (en) * 2012-01-16 2013-07-18 Nitto Denko Corporation Resin sheet for hollow encapsulation and production method for the sheet, and production method for hollow electronic part apparatus and hollow electronic part apparatus
US20180374814A1 (en) * 2014-07-09 2018-12-27 Mitsubishi Electric Corporation Semiconductor device
US20190103382A1 (en) * 2016-06-23 2019-04-04 Taiwan Semiconductor Manufacturing Company Ltd. Manufacturing method of semiconductor package
US20210345517A1 (en) * 2020-04-29 2021-11-04 Auras Technology Co., Ltd. Heat dissipation base

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US20070107871A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat sink
US20080173431A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080173430A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20090000768A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Heat dissipation device
US7576986B2 (en) * 2007-06-15 2009-08-18 Hon Hai Precision Industry Co., Ltd. Thermal dissipating device
US20100126700A1 (en) * 2008-11-24 2010-05-27 Li-Ling Chen Heat-radiating base plate and heat sink using the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6625021B1 (en) * 2002-07-22 2003-09-23 Intel Corporation Heat sink with heat pipes and fan
US20070074857A1 (en) * 2005-10-05 2007-04-05 Foxconn Technology Co., Ltd. Heat sink with heat pipes
US20070107871A1 (en) * 2005-11-17 2007-05-17 Foxconn Technology Co., Ltd. Heat sink
US20080173431A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US20080173430A1 (en) * 2007-01-23 2008-07-24 Foxconn Technology Co., Ltd. Heat dissipation device with heat pipes
US7694727B2 (en) * 2007-01-23 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device with multiple heat pipes
US7576986B2 (en) * 2007-06-15 2009-08-18 Hon Hai Precision Industry Co., Ltd. Thermal dissipating device
US20090000768A1 (en) * 2007-06-27 2009-01-01 Foxconn Technology Co., Ltd. Heat dissipation device
US20100126700A1 (en) * 2008-11-24 2010-05-27 Li-Ling Chen Heat-radiating base plate and heat sink using the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130183469A1 (en) * 2012-01-16 2013-07-18 Nitto Denko Corporation Resin sheet for hollow encapsulation and production method for the sheet, and production method for hollow electronic part apparatus and hollow electronic part apparatus
US20180374814A1 (en) * 2014-07-09 2018-12-27 Mitsubishi Electric Corporation Semiconductor device
US20190103382A1 (en) * 2016-06-23 2019-04-04 Taiwan Semiconductor Manufacturing Company Ltd. Manufacturing method of semiconductor package
US20210345517A1 (en) * 2020-04-29 2021-11-04 Auras Technology Co., Ltd. Heat dissipation base
US11553621B2 (en) * 2020-04-29 2023-01-10 Auras Technology Co., Ltd. Heat dissipation base

Also Published As

Publication number Publication date
CN102891119A (en) 2013-01-23
TW201306726A (en) 2013-02-01

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AS Assignment

Owner name: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, GUO-HE;REEL/FRAME:028011/0055

Effective date: 20120405

Owner name: HON HAI PRECISION INDUSTRY CO., LTD., TAIWAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HUANG, GUO-HE;REEL/FRAME:028011/0055

Effective date: 20120405

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION