US20130105123A1

US20130105123A1 - Heat dissipation device

Info

Publication number: US20130105123A1
Application number: US13/653,588
Authority: US
Inventors: Chun-Chi Chen; Xue-Wen Peng; Wei Li; Hao-Xia Liu
Original assignee: Individual
Current assignee: Champ Tech Optical Foshan Corp; Foxconn Technology Co Ltd
Priority date: 2011-10-27
Filing date: 2012-10-17
Publication date: 2013-05-02
Also published as: CN103096678A; CN103096678B

Abstract

An exemplary heat dissipation device is adapted for dissipating heat generated from electronic components having different heights. The heat dissipation device includes a base plate and a first heat absorbing member and a second heat absorbing member extending from a top side of the base plate and having different heights for contacting the electronic components having different heights.

Description

BACKGROUND

1. Technical Field
The disclosure generally relates to heat dissipation devices, and more particularly to a heat dissipation device for dissipating heat from heat generating components which having different heights.
2. Description of Related Art
As electronic products continue to develop, heat generated from electronic components of the electronic products become more and more. If the heat can not be removed rapidly, the electronic components are prone to be overheated. Generally, a metallic base plate is mounted on the electronic components to absorb heat generated therefrom. However, if one electronic component has a height different from that of an adjacent electronic component, the base plate is not able to tightly contacting all of the electronic components with different heights; as a result, a larger heat resistance will exist between the electronic components and the base plate, which will adversely affect the heat dissipation of the electronic components.
What is needed, therefore, is an improved heat dissipation device which overcomes the above described shortcomings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric, assembled view of a heat dissipation device according to an embodiment of the present disclosure.

FIG. 2 is an isometric, exploded view of the heat dissipation device of FIG. 1.

FIG. 3 is an inverted view of the heat dissipation device of FIG. 2.

FIG. 4 is a partly assembled view of the heat dissipation device of FIG. 3.

DETAILED DESCRIPTION

Embodiments of heat dissipation devices will now be described in detail below and with reference to the drawings.
Referring to FIGS. 1-2, a heat dissipation device 1 in accordance with an embodiment of the disclosure is shown. The heat dissipation device 1 includes a base plate 10 and a first heat absorbing member 11 and a second heat absorbing member 12 extending outwardly from the base plate 10. The first heat absorbing member 11 and the second heat absorbing member 12 have different heights and are adapted for thermally contacting electronic components with different heights.
Referring also to FIG. 3, the base plate 10 is a metallic plate having good heat conductive efficiency. In this embodiment, the base plate 10 is a rectangular aluminum plate. Four sidewalls 13 extend downwardly from edges of the base plate 10. The sidewalls 13 and the base plate 10 cooperatively define a receiving chamber 14 therebetween. A rectangular opening 101 is defined in a central of the base plate 10.
The first heat absorbing member 11, the second heat absorbing member 12 and the base plate 10 are formed by a single piece. The first heat absorbing member 11 and the second heat absorbing member 12 are punched from an end of the base plate 10 and each thereof is an elastic L-shaped sheet. The first heat absorbing member 11 includes a first connecting plate 112 bended from the base plate 10 and a first heat absorbing plate 114 bended from a top end of the first connecting plate 112. The second heat absorbing member 12 includes a second connecting plate 122 bended from the base plate 10 and a second heat absorbing plate 124 bended from a top end of the second connecting plate 122. The first connecting plate 112 and the second connecting plate 122 are aligned with and parallel to each other and perpendicular to the base plate 10. The first heat absorbing plate 114 and the second heat absorbing plate 124 are aligned with and parallel to each other. The first heat absorbing plate 114 and the second heat absorbing plate 124 are parallel to and spaced from the base plate 10. When the first heat absorbing member 11 and the second heat absorbing member 12 are compressed, the first heat absorbing plate 114 and the second heat absorbing plate 124 can elastically move toward the base plate 10. A size of the first heat absorbing plate 114 is equal to that of the second heat absorbing plate 124. A height of the first connecting plate 112 is different from that of the second connecting plate 122.
The heat dissipation device 1 includes a covering plate 40 having good heat conductive efficiency. The covering plate 40 is rectangular and a size thereof is equal to that of the base plate 10. A periphery of a side of the covering plate 40 is sealed to the bottom ends of the sidewalls 13. Thus, the covering plate 40 and the base plate 10 are assembled together. A plurality of spaced fins 41 is mounted on the other side of the covering plate 40 to dissipate heat thereof. The fins 41 are parallel to each other. In this embodiment, the fins 41 and the covering plate 40 each are an aluminum plate.
A heat absorbing block 50 is embedded in the opening 101 of the base plate 10 and a top portion thereof is beyond to the base plate 10. A top surface of the heat absorbing block 50 is used to contact a required electronic component. A height of the top portion of the absorbing block 50 is different from that of the first connecting plate 112 and the second connecting plate 122. Thus, the heat absorbing block 50, the first heat absorbing member 11, and the second heat absorbing member 12 can contact electronic components with different heights. In other embodiment, the height of the top portion of the heat absorbing block 50 may be equal to that of the first connecting plate 112 or the second connecting plate 122, as long as the absorbing block 50 contacts the required electronic component. In this embodiment, the heat absorbing block 50 is a solid metallic block. In other embodiment, the heat absorbing block 50 may be a vapor chamber.
Referring also to FIG. 4, the heat dissipation device 1 further comprises four heat pipes 20 received in the receiving chamber 14. Each heat pipe 20 has a C-shaped configuration and includes a flatted top surface and a flatted bottom surface opposite to the top surface. The top surface and the bottom surfaces of each heat pipe 20 respectively abut against the covering plate 10 and the base plate 10. Each heat pipe 20 includes a straight evaporator section 21 and two arc-shaped condenser sections 22 bended from opposite ends of the evaporator section 21. The evaporator sections 21 of the heat pipes 20 are aligned and parallel to each other. The evaporator sections 21 are intimately contact each other and are located at a center of the receiving chamber 14. The condenser sections 22 are located at opposite ends of the receiving chamber 14.
Two supporting members 30 are received in the receiving chamber 14 and located at lateral sides of the evaporator sections 21 of the heat pipes 20. Each supporting member 30 is rectangular, and top and bottom surfaces thereof respectively abut the covering plate 40 and the base plate 10 to enhance an intensity of lateral sides of the covering plate 40 and the base plate 10. The top surface of each supporting member 30 is coplanar to the top surface of each heat pipe 20. The bottom surface of each supporting member 30 is coplanar to the bottom surface of each heat pipe 20. Each supporting member 30 has good heat conductive efficiency and can rapidly transfers heat thereof to the fins 41 to dissipate.
In use, the first heat absorbing member 11, the second heat absorbing member 12 and the heat absorbing block 50 respectively contact the electronic components having different heights and absorb heat generated from the electronic components. The heat rapidly transfers to the fins 41 to dissipate by the heat pipes 20 and the supporting members 30.
It is to be further understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

What is claimed is:

1. A heat dissipation device adapted for dissipating heat generated from electronic components having different heights, the heat dissipation device comprising:

a base plate; and

a first heat absorbing member and a second heat absorbing member extending from the base plate and having different heights for thermally contacting the electronic components having different heights.

2. The heat dissipation device of claim 1, wherein the first heat absorbing member comprises a first connecting plate extending from a first side of the base plate and a first heat absorbing plate bent from the first connecting plate, the second heat absorbing member comprises a second connecting plate extending from the first side of the base plate and a second heat absorbing plate bent from the second connecting plate, the first and second heat absorbing plates are spaced from the base plate and respectively contact different electronic components, and a height of the first connecting plate away from the first side of the base plate is different from that of the second connecting plate.

3. The heat dissipation device of claim 2, wherein the first connecting plate and the second connecting plate are perpendicular to the base plate and the first and second heat absorbing plates.

4. The heat dissipation device of claim 2, wherein the first and second connecting plates are aligned with and parallel to each other, and the first and second heat absorbing plates are aligned with and parallel to each other.

5. The heat dissipation device of claim 2, wherein each of the first heat absorbing member and the second heat absorbing member is an elastic sheet and has an L-shaped configuration.

6. The heat dissipation device of claim 1, wherein the first and second heat absorbing members are integrally formed with the base plate as a single piece.

7. The heat dissipation device of claim 1, wherein a heat absorbing block is embedded in the base plate, and one end of the heat absorbing block is beyond the base plate adapted for thermally connecting another electronic component and absorbing heat from the another electronic component.

8. The heat dissipation device of claim 7, wherein a height of the end of the heat absorbing block away from the base plate is different from that of the first heat absorbing member or the second heat absorbing member.

9. The heat dissipation device of claim 7, wherein the heat absorbing block is a solid metal block or a vapor chamber.

10. The heat dissipation device of claim 1, wherein a plurality of heat pipes are arranged on the base plate to transfer heat absorbed by the first and second heat absorbing members.

11. The heat dissipation device of claim 10, wherein each of the heat pipes comprises an evaporator section and two arc-shaped condenser sections extending from opposite ends of the evaporator section, the evaporator sections are aligned with each other and located at a central portion of the base plate, and the condenser sections are located at opposite ends of the base plate.

12. The heat dissipation device of claim 11, wherein the evaporator sections intimately contact each other.

13. The heat dissipation device of claim 10, wherein a covering plate covers the base plate, and opposite surfaces of the heat pipes respectively abut the covering plate and the base plate.

14. The heat dissipation device of claim 13, wherein a plurality of fins is formed on the covering plate.

15. The heat dissipation device of claim 13, wherein two supporting members are located at lateral sides of the heat pipes and opposite surfaces thereof abut the covering plate and the base plate.

16. A heat dissipation device comprising:

a base plate;

a first heat absorbing member extending from the base plate; and

a heat absorbing block extending through the base plate, one end of the heat absorbing block exceeding the base plate, a height of the heat absorbing block exceeding the base plate being different from a height of the first heat absorbing member away from the base plate, the heat absorbing block and the first heat absorbing member being adapted for thermally contacting different electronic components respectively.

17. The heat dissipation device of claim 16, further comprising a second heat absorbing member extending from the base plate, wherein a height of the second heat absorbing member away from the base plate is different from the height of the heat absorbing block exceeding the base plate, and thermally contacts another electronic component.

18. The heat dissipation device of claim 16, wherein a plurality of heat pipes are arranged on the base plate to transfer heat absorbed by the first heat absorbing member and the heat absorbing block.

19. The heat dissipation device of claim 18, wherein each of the heat pipes comprises an evaporator section and two arc-shaped condenser sections extending from opposite ends of the evaporator section, the evaporator sections are aligned with each other and located at a central portion of the base plate, and the condenser sections are located at opposite ends of the base plate.

20. The heat dissipation device of claim 19, wherein a covering plate covers the base plate, and opposite surfaces of the heat pipes respectively abut the covering plate and the base plate.