US20130020056A1

US20130020056A1 - Heat dissipation device

Info

Publication number: US20130020056A1
Application number: US13/241,276
Authority: US
Inventors: Xue-Wen Peng; Wei Li; Ji-Yun Qin; Hao-Xia Liu
Original assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Foxconn Technology Co Ltd
Current assignee: Fuzhun Precision Industry Shenzhen Co Ltd; Foxconn Technology Co Ltd
Priority date: 2011-07-22
Filing date: 2011-09-23
Publication date: 2013-01-24
Also published as: CN102892276B; CN102892276A

Abstract

A heat dissipation device includes a base and a fin group fixed on the base. The base includes a container, a flattened heat pipe and a solid supporting member. The container includes a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween. The heat pipe and the supporting member are housed in the receiving chamber. Opposite sides of the heat pipe and the supporting member respectively abut against the baffle plate and the cover of the container.

Description

BACKGROUND

1. Technical Field
The present disclosure relates to heat dissipation devices.
2. Description of Related Art
Heat dissipation devices are used to remove heat from heat-generating electronic components such as central processing units (CPUs) and others, keeping the electronic components within safe working temperature limits, thereby enabling stable operation of the electronic components. A typical heat dissipation device includes a base for contacting an electronic component and absorbing heat therefrom, a number of fins located at a top of the base, and a heat pipe connecting the base and the fins. The heat pipe has one end embedded in the base and the other end extending through the fins. This type of heat dissipation device is bulky and is not suitable for portable electronic device.
What is called for, then, is a heat dissipation device which can overcome the limitations described.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an assembled, isometric view of a heat dissipation device according to an embodiment of the present disclosure.

FIG. 2 is an isometric view of a base of the heat dissipation device of FIG. 1.

FIG. 3 is an exploded view of the base of FIG. 2.

DETAILED DESCRIPTION

Referring to FIG. 1, a heat dissipation device 100 is shown. The heat dissipation device 100 includes a base 10 and a fin group 20 mounted on the base 10. The heat dissipation device 100 is used to dissipate heat generated from a heat-generating component (not shown).
Referring also to FIGS. 2-3, the base 10 is rectangular and thin, and includes a container 16, a heat pipe 14, and two supporting members 13. The container 16 receives the supporting members 13 and the heat pipe 14 therein.
The container 16 is made of heat conductive material and includes a rectangular baffle plate 11 and a cover 12 engaging with the baffle plate 11 to define a receiving chamber 15 therebetween. Four through holes 111 are respectively defined in corners of the baffle plate 11. The cover 12 includes a rectangular supporting plate 121 and four sidewalls 122 extending from edges of the supporting plate 121 to the baffle plate 11. The baffle plate 11 connects top ends of the sidewalls 122. The receiving chamber 15 is cooperatively defined by the baffle plate 11, the sidewalls 122 and the supporting plate 121. Four through holes 123 are defined in corners of the supporting plate 121 corresponding to the through holes 111 of the baffle plate 11. A thickness of the supporting plate 121 and the baffle plate 11 is less than 0.8 millimeter.
Each of the supporting members 13 is an elongated, solid strip, which has two through holes 133 defined in opposite ends thereof. A length of the supporting member 13 is equal to a width of the receiving chamber 15. A thickness of the supporting member 13 is equal to a depth of the receiving chamber 15. The supporting members 13 are mounted on opposite sides of the supporting plate 121 of the cover 12. The through holes 133 are respectively aligned with the through holes 111 of the baffle plate 11 and the through holes 123 of the supporting plate 121. Fasteners 30 extend through the through holes 111, 133, 123 in series and engage with the supporting plate 12 to assemble the baffle plate 11, the supporting members 13 and the cover 12 together. Opposite ends of the supporting member 13 respectively abut against the opposite sidewalls 122 of the cover 12. Opposite sides of the supporting member 13 respectively abut against the supporting plate 121 and the baffle plate 11. When the container 16 is pressed, the supporting members 13 support the supporting plate 121 and the baffle plate 11 to enhance stable performance of the heat dissipation device. The supporting member 13 is made of heat conductive material, such as aluminium or copper.
The heat pipe 14 is flattened and located at a central portion of the container 16. A thickness of the heat pipe 14 is equal to the depth of the receiving chamber 15. Opposite sides of the heat pipe 14 are planar and respectively coplanar with the opposite sides of the supporting member 13. The opposite sides of the heat pipe 14 respectively abut against the supporting plate 121 of the cover 12 and the baffle plate 11 of the container 16. The heat pipe 14 is located between the supporting members 13 and spaced from the supporting members 13. The heat pipe 14 has an S-shaped configuration. The heat pipe 14 includes a straight evaporating portion 141, two straight condensing portions 142, and two arc-shaped connecting portions 143. The condensing portions 142 are located at opposite sides of the evaporating portion 141 and parallel to the evaporating portion 141. A length of the evaporating portion 141 is equal to that of the condensing portion 142. The connecting portions 143 are located at the opposite sides of the evaporating portion 141 and respectively connect the evaporating portion 141 and the condensing portions 142. The condensing portions 142 of the heat pipe 14 are near and parallel to the supporting members 13. The evaporating portion 141 is located at a middle of the container 14.
Referring to FIG. 1 again, the fin group 20 includes a plurality of rectangular fins 21. The fins 21 are parallel to each other and spaced from each other. A channel 22 is defined between every two adjacent fins 21 to allow air flowing therethrough. The fin group 20 is fixed on the baffle plate 11 of the container 16.
In use, when the cover 12 of the container 16 contacts the heat-generating component, the evaporating portion 141 of the heat pipe 14 absorbs heat generated from the heat-generating component and transfers the heat to the condensing portions 142. The supporting members 13 also absorb heat generated from the heat-generating component. Then the supporting members 13 and the condensing portions 142 transfers heat to the baffle plate 11. Finally, the fins 21 of the fin group 20 absorb the heat and dissipate the heat to the environment.
In this embodiment, the condensing portions 142 are located at the central portion of the container 16, and the supporting members 13 are located at the opposite sides of the container 16, therefore, the condensing portions 142 and the supporting members 13 transfer heat to the baffle plate 11 more evenly.
It is to be understood, however, that even though numerous characteristics and advantages of the embodiment(s) have been set forth in the foregoing description, together with details of the structures and functions of the embodiment(s), the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims

1. A heat dissipation device comprising:

a base for thermally contacting a heat generating component, the base comprising a container, a flattened heat pipe and a solid supporting member, the container comprising a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween, the heat pipe and the supporting member housed in the receiving chamber, opposite sides of the heat pipe and the supporting member respectively abutting against the baffle plate and the cover of the container; and

a fin group fixed on the base.

2. The heat dissipation device of claim 1, wherein the heat pipe comprises an evaporating portion and two condensing portion located at opposite sides of the evaporating portion and spaced from the evaporating portion, and the supporting member is spaced from and located at a side of the heat pipe.

3. The heat dissipation device of claim 2, wherein through holes are respectively defined in the baffle plate and the cover of the container and the supporting member, fasteners extending through the through holes of the baffle plate, the supporting member and the cover in series and engaging with the cover to assemble the container and the supporting member together.

4. The heat dissipation device of claim 1 further comprising another solid supporting member, the heat pipe located between the two supporting members.

5. The heat dissipation device of claim 4, wherein the heat pipe is located at a central portion of the container and the two supporting members are located at opposite sides of the container.

6. The heat dissipation device of claim 5, wherein the heat pipe comprises an evaporating portion and two condensing portion located at opposite sides of the evaporating portion and spaced from the evaporating portion, and the supporting members are spaced from the heat pipe.

7. The heat dissipation device of claim 4, wherein through holes are respectively defined in the baffle plate and the cover of the container and the supporting members, fasteners extending through the through holes of the baffle plate, the supporting members and the cover in series and engaging with the cover to assemble the container and the supporting members together.

8. The heat dissipation device of claim 1, wherein the fin group comprises a plurality of fins parallel to each other.

9. A heat dissipation device comprising:

a container, the container comprising a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween, a through hole respectively defined in the baffle plate and the cover;

a flattened heat pipe;

a solid supporting member, a through hole defined in the supporting member, the heat pipe and the supporting member housed in the receiving chamber, and opposite sides of the heat pipe and the supporting member respectively abutting against the baffle plate and the cover of the container; and

a fastener extending through the through holes the baffle plate, the supporting member and the cover and engaging with the cover to assemble the container and the supporting member together.

10. The heat dissipation device of claim 9, wherein the heat pipe comprises an evaporating portion and two condensing portion located at opposite sides of the evaporating portion and spaced from the evaporating portion, and the supporting member is spaced from the heat pipe.

11. The heat dissipation device of claim 10, wherein the heat pipe has an S-shaped configuration.

12. The heat dissipation device of claim 10, wherein the supporting member is elongated, the condensing portions and the evaporating portion of the heat pipe are straight, and the supporting member is parallel to the condensing portions and the evaporating portion.

13. The heat dissipation device of claim 10, wherein opposite sides of the supporting member are respectively coplanar with opposite sides of the heat pipe.

14. The heat dissipation device of claim 9 further comprising another solid supporting member, the heat pipe sandwiched between the supporting members.

15. The heat dissipation device of claim 9, wherein the baffle plate and the cover are made of heat conductive material.

16. The heat dissipation device of claim 9, wherein a fin group is fixed on the baffle plate.

17. The heat dissipation device of claim 16, wherein the fin group comprises a plurality fins, and the fins are parallel to each other.

18. The heat dissipation device of claim 9, wherein the supporting member is made of aluminium.

19. A heat dissipation device comprising:

a container comprising a baffle plate and a cover engaging with the baffle plate to define a receiving chamber therebetween;

a flattened heat pipe received in the chamber and contacting the cover and the baffle plate; and

a solid supporting member received in the chamber and contacting the cover and the baffle plate.

20. The heat dissipation device of claim 19, further comprising a fastener extending through the baffle plate, the supporting member and the cover to assemble the baffle plate, the supporting member and the cover together.