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US20080223552A1 - Liquid cooling system - Google Patents

Liquid cooling system Download PDF

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Publication number
US20080223552A1
US20080223552A1 US12/046,187 US4618708A US2008223552A1 US 20080223552 A1 US20080223552 A1 US 20080223552A1 US 4618708 A US4618708 A US 4618708A US 2008223552 A1 US2008223552 A1 US 2008223552A1
Authority
US
United States
Prior art keywords
heat
flow passage
radiating sheet
liquid cooling
cooling system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/046,187
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English (en)
Inventor
Hitoshi Onishi
Jiro Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Assigned to ALPS ELECTRIC CO., LTD. reassignment ALPS ELECTRIC CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NAKAJIMA, JIRO, ONISHI, HITOSHI
Publication of US20080223552A1 publication Critical patent/US20080223552A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • F28D1/0325—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another
    • F28D1/0333—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members
    • F28D1/0341—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other the plates having lateral openings therein for circulation of the heat-exchange medium from one conduit to another the plates having integrated connecting members with U-flow or serpentine-flow inside the conduits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H10W40/47—
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems

Definitions

  • the present invention relates to a thin liquid cooling (water cooling) system, and particularly, to a liquid cooling system that is suitable to be used for a notebook computer having a plurality of heat-generating elements (heat-generating sources).
  • Recent notebook computers have a plurality of heat-generating elements, such as a GPU and a chip set as well as a CPU. How to effectively cool the plurality of heat-generating elements becomes a technical object for the computers. Further, in a notebook computer in which the storage space for components is limited, as is shown, for example, in Japanese Unexamined Patent Application Publication Nos. 2005-166030, 2003-324174, 2002-94277, and the like, a liquid cooling system is needed that is thin and which is highly unitary property.
  • a conventional liquid cooling system needs tubes in order to connect elements to one another because a pump, a heat-absorbing unit, a heat-radiating unit (radiator), and the like are provided independently. Therefore, the system lacks in integrity (unit property), has a large amount of evaporation in coolant and has a problem even in assembling performance. Further, in a notebook computer in which a plurality of heat-generating elements exist, a heat-radiating structure that can radiate heat more efficiently is desired.
  • a liquid cooling system includes a heat-radiating sheet having a pair of heat-conductive metal plates that are superimposed on each other, and having a circulating flow passage between the pair of heat-conductive metal plates.
  • a plurality of heat-receiving areas are partitioned on the heat-radiating sheet.
  • a plurality of heat-generating elements are installed on each of the heat-receiving areas via a heat spreader made of a heat-conductive material.
  • An inlet hole and an outlet hole are opened to the surface of the heat-radiating sheet and located at both ends of the circulating flow passage.
  • a pump has a discharge port and a suction port that communicate with the inlet hole and the outlet hole, and is installed on the heat-radiating sheet.
  • a radiator continuous with the circulating flow passage of the heat-radiating sheet.
  • FIG. 1 is an exploded perspective view showing one embodiment of a liquid cooling system
  • FIG. 2 is an exploded perspective view of a heat-radiating sheet of FIG. 1 ;
  • FIG. 3 is a plan view of FIG. 2 .
  • FIG. 4 is a side view of FIG. 3 ;
  • FIG. 5 is a plan view of a piezoelectric pump as a single body
  • FIG. 6 is a sectional view taken along a line VI-VI of FIG. 5 ;
  • FIG. 7 is a perspective view of a radiator as a single body
  • FIG. 8 is a sectional view taken along a line VIII-VIII line of FIG. 7 ;
  • FIG. 9 is a sectional view taken along a line IX-IX of FIG. 7 ;
  • FIG. 10 is a plan view of a flow passage plate as a single body that constitutes each flow passage unit of the radiator.
  • a liquid cooling system 100 of this embodiment includes, as its main components, a heat-radiating sheet 10 , a piezoelectric pump 20 , a radiator 40 , and a cooling fan (sirocco fan) 50 , and cools three heat-generating sources of a CPU 101 , a GPU 102 , and a chip set 103 .
  • the heat-radiating sheet 10 is composed of a pair of heat-conductive metal plates 10 U and 10 L that are superimposed on each other, and three planar rectangular heat-receiving areas A, B, and C are set on the sheet 10 by facing slits (easily deformable portion) 10 a.
  • the CPU 101 , GPU 102 , and chip set 103 that are located on the heat-receiving areas A, B, and C, respectively, are mounted (contacted) via heat spreaders 101 H, 102 H, and 103 H, respectively.
  • the heat-conductive metal plates 10 U and 10 L of the heat-radiating sheet 10 are preferably made of a metallic material that contains SUS, copper, or aluminum as its main constituent, and the lower heat-conductive metal plate 10 L is formed with a flow passage recess 11 a that constitutes a circulating flow passage 11 .
  • the depth of the flow-passage recess 11 a is, for example, around 0.5 mm.
  • a flow passage cutoff protrusion 11 b is formed within the flow passage recess 11 a (circulating flow passage 11 ), and portions in front of or behind the flow passage cutoff protrusion 11 b constitute a flow passage starting end 11 c and a flow passage terminating end 11 d.
  • the flow passage starting end 11 c communicates with a heat-absorbing outgoing flow passage 11 e that runs in order of the heat-receiving areas C, B, and A, a heat-absorbing folded-back flow passage 11 f, and a heat-absorbing incoming flow passage 11 g that runs in order of the heat-receiving areas A, B, and C, leads to an inflow end 11 h extending to the radiator 40 , and is then connected with the flow passage terminating end 11 d from a discharge end 11 i extending from the radiator 40 .
  • the flow passages are drawn simply, they can be suitably made to meander so as to increase flow passage length.
  • an inlet projection (inlet hole) 12 and an outlet projection (outlet hole) 13 that communicates with the circulating flow passage 11 are formed so as to project in correspondence with the flow passage starting end 11 c and the flow passage terminating end 11 d, and an outlet projection (outlet hole) 14 and an inlet projection (inlet hole) 15 are formed in correspondence with the radiator inflow end 11 h and the radiator discharge end 11 i.
  • the inlet projection 12 and the outlet projection 13 communicate with and fit into a discharge port (hole) 34 and a suction port (hole) 35 of the piezoelectric pump 20 , respectively.
  • the piezoelectric pump 20 is set on the upper heat-conductive substrate 10 U of the heat-radiating sheet 10 . That is, the piezoelectric pump 20 is located on any one of the surface and back of the heat-radiating sheet 10 , and the CPU 101 , GPU 102 , and the chip set 103 are located on the other face thereof. According to this arrangement, planar superimposition with a cooling fan can be permitted, cooling efficiency can be improved, and the planar size of the whole liquid cooling system 100 can be suppressed. Further, if the piezoelectric pump 20 and the radiator 40 are arranged on the lower side in FIG. 1 , the pump can be provided on the same face as a heat source. Thus, the upper face of the liquid cooling system 100 can be made flat, and the liquid cooling system 100 can be efficiently arranged below a keyboard of, for example, a notebook computer.
  • the piezoelectric pump 20 has a lower housing 21 and an upper housing 22 sequentially from below.
  • the discharge port 34 and the suction port 35 are bored in the lower housing 21 so as to be orthogonal to a plate thickness plane of the housing and parallel to each other.
  • a piezoelectric vibrator (diaphragm) 28 is liquid-tightly sandwiched and supported between the upper housing 21 and the lower housing 22 via the O ring 29 , and a pump chamber P is formed between the piezoelectric vibrator 28 and the lower housing 21 .
  • An atmospheric chamber P is formed between the piezoelectric vibrator 28 and the upper housing 22 .
  • the piezoelectric vibrator 28 is a unimorph vibrator having a central shim 28 a, and a piezoelectric body 28 b stacked on one (upper face of FIG. 6 ) of the surface and back of the shim 28 a.
  • the shim 28 a faces the pump chamber P and contacts liquid.
  • the shim 28 a is made of a conductive metallic thin plate material, for example, a metallic thin plate having a thickness of about 50 to 300 ⁇ m and formed of stainless steel, a 42 alloy, or the like.
  • the piezoelectric body 28 b is made of, for example PZT (Pb(Zr, Ti)O 3 ) having a thickness of about 300 ⁇ m, and is subjected to polarizing treatment in the direction of the surface and back thereof. Such a piezoelectric vibrator is widely known.
  • the discharge port 34 and suction port 35 of the lower housing 21 are respectively provided with check valves (umbrella) 32 and 33 .
  • the check valve 32 is a suction-side check valve that allows flow of fluid from the inlet port 35 to the pump chamber P, and does not allow flow of the fluid in a direction reverse thereto
  • the check valve 33 is a discharge-side check valve that allows flow of the fluid from the pump chamber P to the outlet port 34 , and does not allow flow of the fluid in a direction reverse thereto.
  • the check valves 32 and 33 have the same form, and are constructed by mounting umbrellas 32 b and 33 b made of an elastic material on perforated substrates 32 a and 33 a bonded and fixed to flow passages.
  • Such check valves (umbrellas) themselves are widely known.
  • a pumping action is obtained by making the piezoelectric vibrator 28 continuously elastically deform (vibrate), and liquid flows through the heat-absorbing outgoing flow passage lie, heat-absorbing folded-back flow passage 11 f, and heat-absorbing incoming flow passage 11 g in the heat-receiving areas A, B, and C from the flow passage starting end 11 c of the circulating flow passage 11 of the heat-radiating sheet 10 , thereby absorbing heat therefrom, then reaches the radiator inflow end 11 h, and then enters the radiator 40 .
  • the liquid that is circulated through the radiator 40 and has radiated heat is discharged to the radiator discharge end 11 i, and returns to the flow passage terminating end 11 d.
  • the radiator 40 is obtained by connecting the outlet projection (outlet hole) 14 and the inlet projection (inlet hole) 15 of the heat-radiating sheet 10 directly (without via a tube). As shown in FIGS. 7 to 9 , the radiator 40 of this embodiment is composed of a plurality of stages of stacked flow passage units 41 .
  • the flow passage units 41 have the same structure except for an uppermost flow passage unit 41 .
  • Each flow passage unit 41 is constituted by a pair of flow passage plates 42 U and 42 L that are superimposed on and coupled with each other.
  • the flow passage plates 42 U and 42 L are constituted from, for example, press-molding articles made of a metallic material (brazing sheet) that is excellent in heat-conductivity, and have a symmetrical shape (the same single body shape) with respect to a superimposed face (stacked face).
  • FIG. 10 shows a single body shape of the flow passage plate 42 U ( 42 L).
  • the flow passage plate 42 U ( 42 L) has an elongated shape, and has a flat joining face 45 at a peripheral edge of a planar U-shaped flow passage recess 46 .
  • Both ends (ends opposite to the U-shaped folded-back portion) of the U-shaped flow passage recess 46 are formed with spacers 47 S and 48 S that protrude outward from portions of the U-shaped flow passage recesses 46 , and an inlet hole 47 and an outlet hole 48 are bored in the spacers 47 S and 48 S, respectively.
  • outlet projection (outlet hole) 14 and inlet projection (inlet hole) 15 that are formed in the heat-conductive metal plate 10 U fit into the inlet hole 47 and outlet hole 48 , respectively, of the lowermost flow passage unit 41 , and a plurality of layers of radiator flow passages are formed from the radiator inflow end 11 h to the radiator discharge end 11 i.
  • the heat-radiating sheet 10 and the radiator 40 have a planar U-shaped space as a whole, and the cooling fan (sirocco fan) 50 is disposed within this U-shaped space.
  • a blow-off direction W ( FIG. 1 , FIG. 3 ) of cooling wind of the cooling fan (sirocco fan) 50 turns to the radiator 40 , and the cooling wind cool the liquid that passes through the spaces S between the flow passage units 41 and flows through the flow passage units 41 .
  • the cooling fan 50 can be efficiently applied to the cooling system 100 , space can be saved.
  • the heat-receiving areas A, B, and C are defined on the single (made of a continuous metallic material) heat-radiating sheet 10 , and the CPU 101 (heat sink 101 H), the GPU 102 (heat sink 102 H), and the chip set 103 (heat sink 103 H) are mounted on the heat-receiving areas A, B, and C, respectively. Further, since the piezoelectric pump 20 and the radiator 40 are coupled together in the heat-radiating sheet 10 , all circulating flow passages are formed without using a flexible tube.
  • each heat-receiving area can be deformed flexibly so as to follow the height difference, and thermal coupling to the flat face of each heat-generating elements can be made easy.
  • the liquid discharged from the discharge port 34 of the piezoelectric pump 20 enters the circulating flow passage 11 (flow passage starting end 11 c ) from the inlet projection 12 of the heat-conductive metal plate 10 U, then flows through the heat-absorbing flow passage 11 e, 11 f, and 11 g in the heat-receiving areas A, B, and C, thereby absorbing heat from the CPU 101 , the GPU 102 , and the chipset 103 , and then reaches the outlet projection 14 of the heat-radiating sheet 10 at the radiator inflow end 11 h.
  • the liquid that has reached the outlet projection 14 enters the cooling flow passage 11 X from the inlet hole 47 of each flow passage unit 41 of the radiator 40 and leaves the outlet hole 48 , the liquid is discharged to the radiator discharge end 11 i from the inlet projection 15 , and returns to the flow passage terminating end 11 d.
  • the liquid that has reached the flow passage terminating end 11 d returns to the inside of the piezoelectric pump 20 from the inlet projection 12 , and thereafter, repeats the same circulation.
  • the liquid that passes through the cooling flow passage 11 X within the radiator 40 is more sufficiently cooled by the cooling wind from the cooling fan (sirocco fan) 50 .
  • easily deformable portions are formed in the heat-radiating sheet 10 by the facing slits (easily deformable portions) 10 a.
  • the easily deformable portions may be formed by thin-walled portions.
  • the facing slits (easily deformable portions) 10 a are formed in both the heat-conductive metal plates 10 U and 10 L, the facing slits (easily deformable portions) 10 a may be formed only at one of them.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
US12/046,187 2007-03-12 2008-03-11 Liquid cooling system Abandoned US20080223552A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-061507 2007-03-12
JP2007061507A JP2008225731A (ja) 2007-03-12 2007-03-12 液冷システム

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US20080223552A1 true US20080223552A1 (en) 2008-09-18

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US12/046,187 Abandoned US20080223552A1 (en) 2007-03-12 2008-03-11 Liquid cooling system

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JP (1) JP2008225731A (zh)
TW (1) TW200900909A (zh)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010142492A1 (de) * 2009-06-10 2010-12-16 Siemens Aktiengesellschaft Kühlmediumsleitungsverschaltung zum erreichen sehr gleichmässiger kühltemperaturen und hoher verfügbarkeit insbesondere von leistungsmaschinen
US20110232872A1 (en) * 2010-03-29 2011-09-29 Mou Hao Jan Liquid heat-dissipating module
US20120103576A1 (en) * 2010-10-28 2012-05-03 Asetek, A/S Integrated liquid cooling system
WO2012057763A1 (en) * 2010-10-28 2012-05-03 Asetek A/S Integrated liquid cooling system
US20120287577A1 (en) * 2011-05-13 2012-11-15 Abb Oy Liquid cooling element
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
US20150289416A1 (en) * 2013-04-02 2015-10-08 Gerald Ho Kim Silicon-based heat-dissipation device for heat-generating devices
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
US20170055371A1 (en) * 2015-08-20 2017-02-23 Fujitsu Limited Cooling apparatus and electronic equipment
US20190212077A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator structure with internal partition member
CN113543578A (zh) * 2020-04-17 2021-10-22 建准电机工业股份有限公司 液冷式散热模组及具有该液冷式散热模组的电子装置

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JP5002522B2 (ja) * 2008-04-24 2012-08-15 株式会社日立製作所 電子機器用冷却装置及びこれを備えた電子機器
JP2010251465A (ja) * 2009-04-14 2010-11-04 Stanley Electric Co Ltd 液冷システム
KR200479465Y1 (ko) 2014-06-23 2016-02-01 매니코어소프트주식회사 냉각장치
JP2019159068A (ja) * 2018-03-12 2019-09-19 株式会社リコー 画像形成装置
TWI720802B (zh) * 2020-01-22 2021-03-01 酷基因科技有限公司 具有泵浦結構之液冷裝置
CN113225974A (zh) * 2020-02-06 2021-08-06 酷基因科技有限公司 具有泵浦结构的液冷装置
JP2022094020A (ja) * 2020-12-14 2022-06-24 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102460617A (zh) * 2009-06-10 2012-05-16 西门子公司 尤其功率设备的用于达到非常均匀的冷却温度和高度可用性的冷却剂管道连接
WO2010142492A1 (de) * 2009-06-10 2010-12-16 Siemens Aktiengesellschaft Kühlmediumsleitungsverschaltung zum erreichen sehr gleichmässiger kühltemperaturen und hoher verfügbarkeit insbesondere von leistungsmaschinen
US8746326B2 (en) 2010-03-29 2014-06-10 Microjet Technology Co., Ltd. Liquid heat-dissipating module
US20110232872A1 (en) * 2010-03-29 2011-09-29 Mou Hao Jan Liquid heat-dissipating module
WO2012057763A1 (en) * 2010-10-28 2012-05-03 Asetek A/S Integrated liquid cooling system
US20120103576A1 (en) * 2010-10-28 2012-05-03 Asetek, A/S Integrated liquid cooling system
US8358505B2 (en) * 2010-10-28 2013-01-22 Asetek A/S Integrated liquid cooling system
US8432691B2 (en) 2010-10-28 2013-04-30 Asetek A/S Liquid cooling system for an electronic system
US20120287577A1 (en) * 2011-05-13 2012-11-15 Abb Oy Liquid cooling element
US20150289416A1 (en) * 2013-04-02 2015-10-08 Gerald Ho Kim Silicon-based heat-dissipation device for heat-generating devices
US9167723B1 (en) * 2013-04-02 2015-10-20 Gerald Ho Kim Silicon-based heat-dissipation device for heat-generating devices
US20160234968A1 (en) * 2015-02-10 2016-08-11 Dynatron Corporation Liquid-Cooled Heat Sink for Electronic Devices
US9818671B2 (en) * 2015-02-10 2017-11-14 Dynatron Corporation Liquid-cooled heat sink for electronic devices
US20170055371A1 (en) * 2015-08-20 2017-02-23 Fujitsu Limited Cooling apparatus and electronic equipment
US20190212077A1 (en) * 2018-01-11 2019-07-11 Asia Vital Components Co., Ltd. Water-cooling radiator structure with internal partition member
US10921067B2 (en) * 2018-01-11 2021-02-16 Asia Vital Components Co., Ltd Water-cooling radiator structure with internal partition member
CN113543578A (zh) * 2020-04-17 2021-10-22 建准电机工业股份有限公司 液冷式散热模组及具有该液冷式散热模组的电子装置

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Publication number Publication date
TW200900909A (en) 2009-01-01
JP2008225731A (ja) 2008-09-25

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AS Assignment

Owner name: ALPS ELECTRIC CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ONISHI, HITOSHI;NAKAJIMA, JIRO;REEL/FRAME:020633/0599

Effective date: 20080303

STCB Information on status: application discontinuation

Free format text: EXPRESSLY ABANDONED -- DURING EXAMINATION