200900909 九、發明說明 【發明所屬之技術領域】 本發明係有關一種薄型的液冷（水冷）系統，特別是有 關一種使用於具有複數個發熱體（發熱源）的筆記型電腦之 較佳的液冷系統。 【先前技術】 最近的筆記型電腦不僅具有CPU，也具有GPU、晶片 組等的複數個發熱體，而如何有效的冷卻此等複數個發熱 體爲技術上的課題。又，在有限的零件收納空間之筆記型 電腦中，如日本特開2005-166030號、日本特開2003-324174號、日北特開2002-94277號等所揭示，全體尋求 薄型且單元性高的液冷系統。 但是，以往產品分別具備泵浦、吸熱部、放熱部（散 熱器）’爲了連接各要素間，而需要管部，因此缺乏一體 性（單元性），也有冷卻液的蒸發量多和組裝性的問題。又 ，希望存在複數個發熱體的筆記型電腦，可更有效率的放 熱之放熱構造。 【發明內容】 〔發明所欲解決之課題〕 因而’本發明之目的是在於當存在複數個發熱體時， 可有效率地放熱之單元性高的液冷系統。又，本發明之目 的係在於獲得系統全體不需要管體之單元性較優，且可抑 -4- 200900909 制冷卻液的蒸發量之液冷系統。 〔用以解決課題之手段〕 本發明之液冷系統，係具備有：具有重合的一對傳熱 性金屬板，於該一對的傳熱性金屬板之間具有循環流路之 放熱片；被區隔設定在放熱片的複數個受熱區；介由分別 由傳熱材料所構成的散熱片而設置於各受熱區上之複數個 發熱體；於該放熱片表面開口，位於上述循環流路的兩端 部之入口孔和出口孔；具有與該入口孔和出口孔連通的吐 出埠和吸入埠，並設置於該放熱片上的泵浦；以及與放熱 片的上述循環流路連續的散熱器。 複數個受熱區係介由形成於放熱片的變形容易部來區 劃設定。變形容易部之一態樣，係形成於構成放熱片之一 對傳熱性金屬板的至少一方之縫隙。 放熱片和散熱器之一態樣係構成平面C字狀，於該C 字狀的空間配置對散熱器供給冷卻空氣的風扇。 散熱片和發熱體係位於放熱片的表背之一面，泵浦係 位於另一面。 循環流路的上述入口孔和出口孔，係形成於放熱片作 爲筒狀突起，上述泵浦的吐出埠和吸入埠，係形成做爲與 該入口孔筒狀突起連通的吐出流路孔、和與出口孔筒狀突 起連通的吸入埠孔。 上述泵浦爲壓電泵浦時，可獲得薄型的液冷系統。200900909 IX. INSTRUCTIONS OF THE INVENTION [Technical Field] The present invention relates to a thin liquid-cooled (water-cooled) system, and more particularly to a preferred liquid for use in a notebook computer having a plurality of heating elements (heat sources) Cold system. [Prior Art] Recently, notebook computers have not only a CPU but also a plurality of heat generating bodies such as a GPU and a wafer set, and how to effectively cool these plurality of heat generating bodies is a technical problem. In addition, in the case of a notebook computer having a limited part storage space, as disclosed in Japanese Laid-Open Patent Publication No. 2005-166030, Japanese Patent Laid-Open No. 2003-324174, and Japanese Patent Application Publication No. 2002-94277, all of them seek thinness and high unitiness. Liquid cooling system. However, in the conventional products, the pump, the heat absorbing portion, and the heat radiating portion (heat sink) are required to connect the respective elements, so that the tube portion is required, so that the integral (unitary) is lacking, and the evaporation amount of the coolant is large and the assembly property is also problem. Also, it is desirable to have a notebook computer with a plurality of heating elements, which can provide a more efficient exothermic structure. DISCLOSURE OF THE INVENTION PROBLEM TO BE SOLVED BY THE INVENTION Therefore, the object of the present invention is to provide a liquid cooling system which can efficiently exotherm when a plurality of heating elements are present. Further, the object of the present invention is to obtain a liquid cooling system which is excellent in the unit of the system and which does not require the tubular body to be excellent, and which can suppress the evaporation amount of the coolant of the 2009-200900909. [Means for Solving the Problem] The liquid cooling system of the present invention includes a pair of heat transfer metal sheets having a plurality of overlapping heat transfer sheets, and a heat release sheet having a circulation flow path between the pair of heat transfer metal sheets; a plurality of heat generating regions disposed in the heat radiating sheet; a plurality of heat generating bodies disposed on each of the heat receiving regions through heat sinks respectively composed of heat transfer materials; and opening on the surface of the heat radiating sheet, located in the circulation flow path An inlet hole and an outlet hole at both end portions; a discharge port and a suction port communicating with the inlet hole and the outlet hole, and a pump disposed on the heat release sheet; and a heat sink continuous with the circulation flow path of the heat release sheet . The plurality of heated zones are zoned by the deformation easy portion formed in the heat release sheet. One of the deformation facilitating portions is formed in a gap constituting at least one of the heat transfer sheet and the heat transfer metal sheet. One of the heat radiating fins and the heat sink is formed in a plane C shape, and a fan that supplies cooling air to the heat sink is disposed in the C-shaped space. The heat sink and heat generation system are located on one side of the front and back of the heat release sheet, and the pump is located on the other side. The inlet hole and the outlet hole of the circulation flow path are formed in the heat release sheet as a cylindrical protrusion, and the pumping discharge port and the suction port are formed as a discharge flow path hole that communicates with the inlet hole cylindrical protrusion, and A suction bore that communicates with the outlet bore cylindrical projection. When the pump described above is piezoelectrically pumped, a thin liquid cooling system can be obtained.
本發明的液冷系統之發熱體係包含筆記型電腦的CPU 200900909 及GPU時，較爲有效。 散熱器之一態樣，係具有積層的複數個流路單元’各 流路單元係具備：入口孔、出口孔、及連結該入口孔和出 口孔的冷卻流路。 各流路單元係積層結合形成至少彎曲U字狀一次的液 流路之一對流路板而構成’於該一對的流路板穿設上述入 口孔及出口孔。 更具體而言，構成各流路單元的一對流路板’係構成 與重合面對稱的面對稱形狀’並形成：構成平面U字狀的 流路凹部；以及形成於該流路凹部的一端部和形成於另一 端部的上述入口孔和出口孔。 【實施方式】 本實施形態的液冷系統單元100，係如第1圖至第4 圖所示，以放熱片10、壓電泵浦20、散熱器40、以及冷 卻扇50(西羅科扇（Sirocco Fan))爲主的構成要素，係冷卻 CPU101、GPU102、以及晶片組103的三個發熱源。 由於放熱片10是由一對重合的傳熱性金屬板10U和 10L所構成，因此於該放熱片10上藉由對向縫隙（變形容 易部）l〇a，設定有三個平面矩形的受熱區A、B、c。於下 方傳熱性金屬板1 0L的上方傳熱性金屬板1 〇u之相反側的 面上，分別位於受熱區A、B、C上，介由散熱片ιοίΗ、 120H、103H’搭載有（接觸）CPU101、GPU102、以及晶片 組 103。 -6- 200900909 放熱片10的傳熱性金屬板10U、10L係分別由以sus 、銅或鋁爲主成分的金屬材料所構成，下方傳熱性金屬板 1 0 L係形成構成循環流路1 1的流路凹部1 1 a。流路凹部 Ua的深度例如爲〇.5mm前後。 於流路凹部11a的（循環流路11)內形成流路遮斷突部 1 1 b ’該流路遮斷突部1 1 b的前後構成流路始端1 1 c和流 路終端1 1 d。流路始端1 1 c係與依受熱區C、B、A的順序 流動的吸熱往流路1 1 e連通，與依序在吸熱折返流路1 1 f 及受熱區A、B、C流動的吸熱復流路〗1 g連通，而流到 與散熱器40相對的流入端llh之後，從來自散熱器40的 吐出端1Π與流路終端1 1 d相連。流路雖簡略描述，但可 加長流路長度，適當的彎曲。 傳熱性金屬板1 0 U係與流路始端1 1 C和流路終端1 1 d 對應，突出形成有與循環流路11連通的入口突起（入口 孔）1 2和出口突起（出口孔）1 3，與散熱器流入端1 1 h和 散熱器吐出端Ui對應，形成出口突起（出口孔）14和入口 突起（入口孔）15。入口突起12和出口突起13係分別與壓 電泵浦20的吐出埠（孔）34和吸入埠（孔）35連通且嵌 合。 壓電泵浦20係設置於放熱片10的上方傳熱性基板 1 0U上。換言之，使壓電泵浦20位於放熱片1 0的表背之 一面，使CPU101、GPU102以及晶片組103位於另一面。 根據該配置，容許與冷卻扇之平面重疊，提升冷卻效率， 可抑制液冷系統單元1 〇〇全體的平面大小。又，在第1圖 200900909 中，若將壓電泵浦20及散熱器40配置於下側，則由於可 使泵浦構成與熱源同一面，故可使液冷系統單元100的上 面平坦’例如於筆記型電腦的鍵盤下側可配置效率佳的液 冷系統單元100。 本發明雖不問泵浦20(壓電流浦）本身的構成，但說明 第5圖及第6圖的實施形態之壓電泵浦20。該壓電泵浦 20係從下方依序具有底殼體21和上殼體22。 於底殼體21與該外殼的板厚平面垂直，彼此平行穿 設有上述吐出埠34和吸入埠35。於底殻體21和上殻體 22之間介由Ο型環，液密挾持著壓電振動子（膜片）28，於 該壓電振動子28和底殻體21之間構成流浦室P。壓電振 動子28和上殻體22之間係形成大氣室A。 壓電振動子28爲單壓電晶片型（Unimorph Type)，係 具有中心部的墊片2 8 a、積層形成於墊片2 8 a的表背之一 面（第6圖的上面）的壓電體28b。於泵浦室P面臨墊片28a 並與液體接觸。墊片28a係與藉由導電性的金屬薄板材料 ，例如厚度50至300μιη左右的不鏽鋼，42合金（alloy)等 所形成的金屬至之薄板所構成。壓電體28b係例如由厚度 3 00 μιη左右的PZT(Pb(Zr、Ti)〇3)所構成，因此於其表背 方向進行分極處理。這種壓電振動子係爲週知。 於底殼體21的吐出埠34和吸入埠35係分別設置有 逆止閥（傘形閥）32和33。逆止閥32係允許從吸入璋35往 流浦室P的流體流，不允許其相反的流體流之吸入側逆止 閥，逆止閥3 3係允許從流浦室P往吐出埠34的流體流， -8 - 200900909 不允許其相反的流體流之吐出側逆止閥。 逆止閥32、33爲相同形態，於與流路接著固定的開 孔基板32a、33a上裝設由彈性材料所構成的傘狀物32b、 33b而成。這種逆止閥（傘形閥）本身爲週知。 以上的壓電泵浦20之壓電振動子28，當正反彈性變 形（振動）時，在擴大流浦室P的容積之行程中，由於打開 吸入側逆止閥3 2而關閉吐出側逆止閥3 3，故液體從吸入 埠3 5(放熱片10的出口突起13)流入至流浦室P內。另外 ，在縮小流浦室P的容積之行程中，由於打開吐出側逆止 閥3 3而關閉吸入側逆止閥3 2，故液體從流浦室P流出到 吐出埠34(放熱片10的入口突起12)。因而，藉著使壓電 振動子2 8正反連續而彈性變形（振動），以獲得泵浦作用， 液體從放熱片1 〇的循環流路1〗之流路始端1 1 c開始，在 受熱區A、B、C的吸熱往流路lie、吸熱折返流路Ilf、 以及吸熱復流路1 1 g流動而吸熱之後’到達散熱器流入端 llh而進入散熱器40。在散熱器40循環而放熱的液體， 則放出至散熱器吐出端1 1 i ’並回到流路終端1 1 d。 散熱器40係直接（不介由管體）與放熱片10的出口突 起（出口孔）1 4和入口突起（入口孔）1 5連接。該實施形態的 散熱器40如第7圖至第9圖所示，由被積層複數段的流 路單元41所構成。各流路單元41除了最上段的流路單元 41之外，其餘爲相同構造。 各流路單元4 1係藉由重合而結合的一對流路板42U 和4 2 L所構成。流路板4 2 U和4 2 L例如係由傳熱性佳的 200900909 金屬材料（brazing sheet ;釺焊板）的冲壓成形品所構成’ 設成與重合的面（積層面）相關的對稱形狀（相同的單體 形狀）。第10圖係表示流路板42U(42L)的單體形狀。流路 板42U(42L)係構成細長形狀，於平面U字狀的流路凹部 46之周緣具有平坦的接合面45。於平面U字狀的流路凹 部46之兩端部（U字狀折返部的相反側之端部），從該U 字狀流路凹部46部分突出至外側，而形成空間部47S和 4 8 S，於該空間部4 7 S和4 8 S穿設有入口孔4 7和出口孔 48。 以上的流路板42U和42L的方向設爲相反而重合’以 使流路凹部36朝向外側，例如藉由焊接接合接合面45之 間。然後，介由上下互相朝向相反方向突出的流路凹部46 ，形成扁平的U字狀之冷卻液流路1 1 X。又，使上下的流 路單元41之空間部47 S (48 S)之間抵接，使上下的流路單 元41之入口孔4 7之間、出口孔4 8之間分別連通。於已 重合的流路單元4 1之間形成有冷卻空氣通過空間S (第9 圖）。最上段的流路單元41之上方的流路板42U之空間部 47S(48S)，未穿設入口孔47(出口孔48)。 形成於傳熱性金屬板10U的出口突起（出口孔）14和] 入口突起（入口孔）15，係分別嵌合於最下方的流路單元41 之入口孔47和出口孔48，而形成從散熱器流入端llh至 散熱器吐出端1 1 i的複數層之散熱器流路。 放熱片10和散熱器40係全體構成平面c字狀’冷卻 扇50(西羅科扇（Sirocco Fan))係配置於該〔字狀的空間內 -10- 200900909 。冷卻扇50(西羅科扇（Sirocco Fan))的冷卻風之吹出方向 W(第1圖、第3圖），係朝向散熱器40的方向，冷卻風係 通過流路單元41之間的空間S，來冷卻在流路單元4 1內 流動的液體。藉由這種平面配置，可使來自冷卻扇5 0所 產生的風有效率地吹至液冷系統單元1 0 0，因此可謀求省 空間化。 上述構成的該液冷系統單元1〇〇，係於單一（由連續的 金屬材料所構成）的放熱片10上區劃成受熱區A、B、C， 於此等的受熱區上分別搭載有CPU101(散熱片101H)、 GPU102(散熱片102H)、以及晶片組1〇3(散熱片103H)。 又，放熱片10係結合壓電泵浦20及散熱器40，不使用軟 性的管體，而形成全部的循環流路。受熱區A、B、C由 於藉由對向縫隙（變形容易部）1 〇a來區劃，因此即使在 CPU101(散熱片101H)、GPU102(散熱片102H)、以及晶片 組1〇3(散熱片103H)之間有落差，亦可使各受熱區柔軟變 形，可追蹤其落差，可容易進行對於各發熱體平面的熱結 合。 從壓電泵浦2 0的吐出埠3 4所吐出之液體’係從傳熱 性金屬板10U的入口突起12進入循環流路11(流路始端 11c)，在受熱區A、B、C內的吸熱流路lie、Ilf、llg流 動，並從CPU 101、GPU 102、晶片組103吸熱之後，於流 入端llh流入至放熱片1〇的出口突起14。流至出口突起 14的液體，從散熱器40的各流路單元41之入口孔47進 入冷卻流路11 X，從出口孔4 8流出之後’從入口突起1 5 -11 - 200900909 放出至散熱器吐出端11 i ’回到流路終端11d °到 終端lid的液體從入口突起12再度返回壓電泵浦 反覆以下相同的循環。通過散熱器4〇內的冷卻流 之液體，可藉由來自冷卻扇50(西羅科扇（Sirocco 冷卻風充分冷卻。 在以上的實施形態中’雖然藉由對向縫隙（變 部）l〇a於放熱片10形成變形容易部，但亦可藉由 形成變形容易部。在圖示例中’與傳熱性金屬板 1 〇L雙方形成對向縫隙（變形容易部）1 0a，但亦可僅 形成對向縫隙（變形容易部）1 〇a ° 【圖式簡單說明】 第1圖係本發明之液冷系統的一實施形態的分 圖。 第2圖係第1圖的放熱片之分解斜視圖。 第3圖係該平面圖。 第4圖係第3圖的側面圖。 第5圖係壓電泵浦單體的平面圖。 第6圖係沿著第5圖的VI-VI剖面圖。 第7圖係散熱器單體的斜視圖。 第8圖係沿著第7圖的V111 - V111剖面圖。 第9圖係沿著第7圖的IX -1X剖面圖。 第1 0圖係構成散熱器的各流路單元的流路板 平面圖。 達流路 20內， 路1 1 X Fan))的 形容易 較薄部 10U和 於一方 解斜視 單體之 -12- 200900909 【主要元件符號說明】 1 〇 :放熱片 2 0 :壓電栗浦 40 :散熱器 5 0 :冷卻扇 1 0 0 :液冷系統單元The heat generation system of the liquid cooling system of the present invention is more effective when it includes the CPU 200900909 of the notebook computer and the GPU. One of the heat sinks is a plurality of flow path units having a buildup. Each of the flow path units includes an inlet hole, an outlet hole, and a cooling flow path connecting the inlet hole and the outlet port. Each of the flow path units is formed by combining one of the liquid flow paths that are bent at least once in a U shape to form a flow path plate, and the flow path plate of the pair is inserted through the inlet hole and the outlet hole. More specifically, the pair of flow path plates constituting each flow path unit constitute a plane symmetrical shape symmetrical with the overlapping surface, and form a flow path concave portion constituting a plane U-shape; and one end portion formed in the flow path concave portion And the above-described inlet and outlet holes formed at the other end. [Embodiment] The liquid cooling system unit 100 of the present embodiment has a heat releasing sheet 10, a piezoelectric pump 20, a radiator 40, and a cooling fan 50 (Sirocco fan) as shown in Figs. 1 to 4 (Sirocco Fan)) The main components are three heat sources that cool the CPU 101, the GPU 102, and the chip set 103. Since the heat radiating sheet 10 is composed of a pair of overlapping heat transfer metal plates 10U and 10L, three heat-receiving regions having a rectangular shape are provided on the heat radiating film 10 by the opposing slit (deformation easy portion) 10a. A, B, c. The surface on the opposite side of the upper heat transfer metal plate 1 〇u of the lower heat transfer metal plate 10L is located in the heat receiving areas A, B, and C, and is mounted via the heat sinks ιοίΗ, 120H, and 103H' ( Contact) CPU 101, GPU 102, and chipset 103. -6- 200900909 The heat transfer metal plates 10U and 10L of the heat release sheet 10 are each made of a metal material containing sus, copper or aluminum as a main component, and the lower heat transfer metal plate 10 L is formed to constitute the circulation flow path 1 The flow path concave portion 1 1 a of 1. The depth of the flow path concave portion Ua is, for example, about mm5 mm. The flow path blocking protrusion 1 1 b b is formed in the (circulation flow path 11) of the flow path concave portion 11a. The flow path opening end 1 1 b constitutes the flow path start end 1 1 c and the flow path terminal 1 1 d. . The beginning of the flow path 1 1 c is in communication with the endothermic flow path 1 1 e flowing in the order of the heat receiving areas C, B, and A, and sequentially flows in the heat absorption return flow path 1 1 f and the heated areas A, B, and C. The endothermic reflow path is connected to the flow path terminal 1 1 d from the discharge end 1Π from the radiator 40 after flowing to the inflow end 11h opposite to the radiator 40. Although the flow path is briefly described, the length of the flow path can be lengthened and appropriately curved. The heat transfer metal plate 10 U corresponds to the flow path start end 1 1 C and the flow path end 1 1 d , and is formed with an inlet protrusion (inlet hole) 1 2 and an outlet protrusion (outlet hole) that communicate with the circulation flow path 11 . 1 3, corresponding to the radiator inflow end 1 1 h and the radiator discharge end Ui, an outlet protrusion (outlet hole) 14 and an inlet protrusion (inlet hole) 15 are formed. The inlet projection 12 and the outlet projection 13 are in communication with and engaged with the discharge port (hole) 34 and the suction port (hole) 35 of the piezoelectric pump 20, respectively. The piezoelectric pump 20 is disposed on the heat transfer substrate 10U above the heat release sheet 10. In other words, the piezoelectric pump 20 is placed on the front and back sides of the heat slug 10, and the CPU 101, the GPU 102, and the wafer set 103 are placed on the other side. According to this configuration, it is allowed to overlap with the plane of the cooling fan, and the cooling efficiency is improved, and the planar size of the entire liquid cooling system unit 1 can be suppressed. Further, in the first drawing 200900909, when the piezoelectric pump 20 and the heat sink 40 are disposed on the lower side, since the pumping structure can be flush with the heat source, the upper surface of the liquid cooling system unit 100 can be made flat, for example. An efficient liquid cooling system unit 100 can be disposed on the underside of the keyboard of the notebook. Although the present invention does not require the configuration of the pump 20 (pressure current) itself, the piezoelectric pump 20 of the embodiment of Figs. 5 and 6 will be described. The piezoelectric pump 20 has a bottom case 21 and an upper case 22 in this order from the bottom. The bottom casing 21 is perpendicular to the thickness plane of the casing, and the discharge port 34 and the suction port 35 are bored in parallel with each other. A piezoelectric vibrator (membrane) 28 is sandwiched between the bottom case 21 and the upper case 22 via a Ο-shaped ring, and a flow chamber is formed between the piezoelectric vibrator 28 and the bottom case 21. P. An air chamber A is formed between the piezoelectric vibrator 28 and the upper casing 22. The piezoelectric vibrator 28 is a unimorph type, and is a piezoelectric piece having a central portion of the spacer 28 a, and a piezoelectric layer formed on one surface of the surface of the spacer 28 8 (the upper surface of Fig. 6). Body 28b. The pump chamber P faces the gasket 28a and is in contact with the liquid. The spacer 28a is composed of a metal-formed thin plate formed of a conductive metal thin plate material such as stainless steel having a thickness of about 50 to 300 μm, or an alloy of 42 or the like. The piezoelectric body 28b is made of, for example, PZT (Pb(Zr, Ti)〇3) having a thickness of about 300 μm, and thus is subjected to polarization treatment in the front and back directions. Such piezoelectric vibrator systems are well known. The discharge port 34 and the suction port 35 of the bottom case 21 are provided with check valves (umbrella valves) 32 and 33, respectively. The check valve 32 allows the fluid flow from the suction port 35 to the flow chamber P, does not allow the opposite side of the fluid flow to the suction side check valve, and the check valve 3 3 allows the discharge from the flow chamber P to the discharge port 34. Fluid flow, -8 - 200900909 The discharge side check valve of the opposite fluid flow is not allowed. The check valves 32 and 33 have the same configuration, and the umbrellas 32b and 33b made of an elastic material are attached to the perforated substrates 32a and 33a which are fixed to the flow path. Such a check valve (umbrella valve) is known per se. When the piezoelectric vibrator 28 of the above-described piezoelectric pump 20 is being subjected to repulsive deformation (vibration), in the stroke of enlarging the volume of the flow chamber P, the discharge side check valve 3 is opened to close the discharge side. The valve 3 3 is stopped, so that the liquid flows into the flow chamber P from the suction port 35 (the outlet protrusion 13 of the heat radiating sheet 10). Further, in the stroke in which the volume of the flow chamber P is reduced, the suction side check valve 3 is closed by opening the discharge side check valve 3, so that the liquid flows out from the flow chamber P to the discharge port 34 (the heat release sheet 10) Entrance protrusion 12). Therefore, the piezoelectric vibrator 28 is elastically deformed (vibrated) by the forward and reverse directions to obtain a pumping action, and the liquid starts from the flow path start end 1 1 c of the circulation flow path 1 of the heat release sheet 1 ,, and is heated. The heat absorbing flow path lie, the heat absorbing return flow path Ilf, and the heat absorbing recirculation flow path 1 1 g of the areas A, B, and C flow and absorb heat, and then reach the radiator inflow end 11h and enter the heat sink 40. The liquid which is circulated and radiated by the radiator 40 is discharged to the radiator discharge end 1 1 i ' and returned to the flow path terminal 1 1 d. The heat sink 40 is directly (not via the pipe body) connected to the outlet protrusion (outlet hole) 14 and the inlet protrusion (inlet hole) 15 of the heat release sheet 10. The heat sink 40 of this embodiment is constituted by a flow path unit 41 which is laminated in a plurality of stages as shown in Figs. 7 to 9 . Each of the flow path units 41 has the same configuration except for the flow path unit 41 of the uppermost stage. Each of the flow path units 41 is composed of a pair of flow path plates 42U and 42L that are joined by overlapping. The flow path plates 4 2 U and 4 2 L are formed, for example, by a press-formed product of a 200900909 metal material (brazing sheet) which is excellent in heat transfer, and is formed in a symmetrical shape associated with a superimposed surface (product layer). (same monomer shape). Fig. 10 shows the single shape of the flow path plate 42U (42L). The flow path plate 42U (42L) has an elongated shape and has a flat joint surface 45 on the periphery of the planar U-shaped flow path concave portion 46. Both end portions of the channel U-shaped flow path concave portion 46 (end portions on the opposite sides of the U-shaped folded portion) protrude from the U-shaped flow path concave portion 46 to the outside to form the space portions 47S and 48. S, an inlet hole 47 and an outlet hole 48 are bored in the space portions 4 7 S and 4 8 S. The directions of the above flow path plates 42U and 42L are reversed and overlapped so that the flow path concave portion 36 faces outward, for example, by welding between the joint faces 45. Then, a flat U-shaped coolant flow path 1 1 X is formed through the flow path concave portion 46 which protrudes upward and downward in the opposite direction. Further, the space portions 47 S (48 S) of the upper and lower flow path units 41 are brought into contact with each other, and the inlet holes 47 and the outlet holes 48 of the upper and lower flow path units 41 are communicated with each other. A cooling air passage space S is formed between the superposed flow path units 41 (Fig. 9). The space portion 47S (48S) of the flow path plate 42U above the uppermost flow path unit 41 is not provided with an inlet hole 47 (outlet hole 48). An outlet protrusion (outlet hole) 14 and an inlet protrusion (inlet hole) 15 formed in the heat transfer metal plate 10U are fitted to the inlet hole 47 and the outlet hole 48 of the flow path unit 41 at the lowermost position, respectively, to form a slave. The heat sink inflow end 11h to the heat sink flow path of the plurality of layers of the heat sink discharge end 1 1 i. The heat radiating fin 10 and the heat sink 40 are all formed in a planar c-shape. The cooling fan 50 (Sirocco Fan) is disposed in the space of the word - -10-200900909. The cooling fan blowing direction W (the first drawing and the third drawing) of the cooling fan 50 (Sirocco Fan) is directed toward the radiator 40, and the cooling air is passed through the space between the flow path units 41. S, to cool the liquid flowing in the flow path unit 41. With such a planar arrangement, the wind generated from the cooling fan 50 can be efficiently blown to the liquid cooling system unit 100, so that space can be saved. The liquid cooling system unit 1 configured as described above is divided into a heat receiving area A, B, and C by a single heat radiating sheet 10 (consisting of a continuous metal material), and the CPU 101 is mounted on each of the heat receiving areas. (heat sink 101H), GPU 102 (heat sink 102H), and wafer set 1〇3 (heat sink 103H). Further, the heat release sheet 10 is combined with the piezoelectric pump 20 and the heat sink 40, and all the circulation paths are formed without using a flexible tube. Since the heat receiving areas A, B, and C are partitioned by the opposing slits (deformation easy portions) 1 〇 a, even in the CPU 101 (heat sink 101H), the GPU 102 (heat sink 102H), and the wafer set 1〇3 (heat sink) There is a drop between 103H), and each heated zone can be softly deformed, and the drop can be traced, and the thermal bonding to the plane of each heating body can be easily performed. The liquid ejected from the discharge port 34 of the piezoelectric pump 20 enters the circulation flow path 11 (flow path start end 11c) from the inlet protrusion 12 of the heat transfer metal plate 10U, and is in the heat receiving areas A, B, and C. The heat absorbing channels lie, Ilf, and llg flow, and absorb heat from the CPU 101, the GPU 102, and the wafer group 103, and then flow into the outlet protrusions 14 of the heat radiation fins 1 at the inflow end 11h. The liquid flowing to the outlet protrusion 14 enters the cooling flow path 11 X from the inlet hole 47 of each flow path unit 41 of the radiator 40, and flows out from the outlet hole 48, and then is discharged from the inlet protrusion 1 5 -11 - 200900909 to the radiator. The discharge end 11 i ' returns to the flow path terminal 11d ° to the liquid of the terminal lid l from the inlet protrusion 12 and returns to the same cycle as the piezoelectric pump. The liquid passing through the cooling flow in the radiator 4 can be cooled by the cooling fan 50 (Sirocco cooling air is sufficiently cooled. In the above embodiment, although by the opposing slit (variable portion) a forming a deformable portion in the heat radiating sheet 10, but forming a deformable portion. In the example of the drawing, 'the opposing gap (deformation easy portion) 10a is formed with both of the heat conductive metal sheets 1 ,L, but also Only the opposing slit (deformation easy portion) can be formed. 1 〇a ° [Simplified description of the drawings] Fig. 1 is a partial view showing an embodiment of the liquid cooling system of the present invention. Fig. 2 is a heat releasing sheet of Fig. 1. Fig. 3 is a side view of Fig. 3. Fig. 5 is a plan view of a piezoelectric pumping unit. Fig. 6 is a sectional view taken along line VI-VI of Fig. 5. Fig. 7 is a perspective view of a heat sink unit. Fig. 8 is a cross-sectional view taken along line V111-V111 of Fig. 7. Fig. 9 is a sectional view taken along line IX-1X of Fig. 7. Fig. 10 A plan view of the flow path plate of each flow path unit constituting the heat sink. In the flow path 20, the shape of the road 1 1 X Fan)) is easy to be thinner than the thin portion 10U and The monomer solution -12-200900909 perspective The main element REFERENCE NUMERALS 1 ○: radiation fin 20: Li piezoelectric pump 40: heat sink 50: cooling fan 100: liquid cooling system unit
101 ： CPU101 : CPU
102 ： GPU 1 〇 3 :晶片組 1 0 U、1 0 L :傳熱性金屬板 l〇a :對向縫隙 A、B、C :受熱區 101H、 102H、 103H:散熱片 I 1 :循環流路 II a :流路凹部 1 1 b :流路遮斷突部 1 1 c :流路始端 Π d :流路終端 1 1 e :吸熱往流路 I 1 f :吸熱折返流路 II g :吸熱復流路 1 1 h :流入端 1 1 i :吐出端 12、1 5 :入口突起 -13- 200900909 1 3、1 4 :出口突起 3 4 :吐出埠 3 5 :吸入埠 21 :底殻體 22 :上殼體 2 8 :壓電振動子 29 : Ο型環 28a :墊片 28b :壓電體 P :栗浦室 32、33 :逆止弁 3 2 a、3 3 a :開孔基板 3 2 b、3 3 b :傘狀物 4 1 :流路單元 4 2 U、4 2 L :流路板 36、46 :流路凹部 47 :入口孔102 : GPU 1 〇 3 : chip set 1 0 U, 10 L : heat transfer metal plate l〇a : opposite slit A, B, C: heat receiving zone 101H, 102H, 103H: heat sink I 1 : circulating flow Road II a : flow path recess 1 1 b : flow path blocking protrusion 1 1 c : flow path start point d : flow path terminal 1 1 e : endothermic flow path I 1 f : endothermic return flow path II g : endothermic Recirculation path 1 1 h : Inflow end 1 1 i : Discharge end 12, 1 5 : Entrance protrusion-13- 200900909 1 3, 1 4 : Exit protrusion 3 4 : Discharge 埠 3 5 : Suction 埠 21 : Bottom casing 22 : Upper housing 2 8 : Piezoelectric vibrator 29 : Ο-shaped ring 28 a : spacer 28 b : piezoelectric body P : chestnut chamber 32 , 33 : reverse 弁 3 2 a, 3 3 a : apertured substrate 3 2 b, 3 3 b : umbrella 4 1 : flow path unit 4 2 U, 4 2 L : flow path plates 36, 46 : flow path concave portion 47 : inlet hole
48 :出口孑L 4 7 S、4 8 S :空間部 4 5 :接合面 1 1 X :冷卻液流路 5 :冷卻空氣通過空間48: outlet 孑L 4 7 S, 4 8 S : space portion 4 5 : joint surface 1 1 X : coolant flow path 5 : cooling air passage space