TWM665260U - Laser defect detection system - Google Patents
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Abstract
本創作提供一種雷射缺陷檢測系統,包括控制裝置、基座、多個雷射檢測裝置及多個光感測裝置。基座支撐待測物件。每一雷射檢測裝置包括雷射光源及雷射幫浦,雷射檢測裝置位於待測物件的一側,朝向待測物件的檢測部位發射第一雷射光束。每一光感測裝置包括光感測模組及影像模組,每一光感測裝置用以接收對應的第一雷射光束經待測物件的檢測部位反射的反射光,或是接收第一雷射光束穿過待測物件的檢測部位的穿透光,在每一感光感測裝置中,光感測模組傳送光訊號至影像模組,影像模組依據光訊號形成光學圖。The present invention provides a laser defect detection system, including a control device, a base, a plurality of laser detection devices and a plurality of light sensing devices. The base supports the object to be tested. Each laser detection device includes a laser light source and a laser pump. The laser detection device is located on one side of the object to be tested and emits a first laser beam toward the detection part of the object to be tested. Each light sensing device includes a light sensing module and an imaging module. Each light sensing device is used to receive the reflected light of the corresponding first laser beam reflected by the detection part of the object to be tested, or to receive the penetrating light of the first laser beam passing through the detection part of the object to be tested. In each light sensing device, the light sensing module transmits a light signal to the imaging module, and the imaging module forms an optical image according to the light signal.
Description
本創作涉及一種缺陷檢測的系統,特別是涉及一種雷射探測半導體缺陷檢測的系統。The invention relates to a defect detection system, and in particular to a laser detection semiconductor defect detection system.
科技日新月異,半導體製程愈來愈精密。電子裝置所使用的晶片及封裝結構的良率對電子裝置的效能影響巨大,因此,對於晶片或封裝結構的缺陷檢測顯得相當重要。對於現今晶片或封裝結構的尺寸精細且量多,檢測其是否具有缺陷有其困難度。Technology is advancing with each passing day, and semiconductor manufacturing processes are becoming more and more sophisticated. The yield of chips and packaging structures used in electronic devices has a huge impact on the performance of electronic devices. Therefore, defect detection of chips or packaging structures is very important. Given the small size and large quantity of today's chips or packaging structures, it is difficult to detect whether they have defects.
因此,如何通過檢測技術的改良,提升待測物件(如晶片、晶圓或晶粒)的檢測效果及效率,進一步改善製程的良率,已成為該項事業所欲解決的重要課題之一。Therefore, how to improve the detection effect and efficiency of the objects to be tested (such as chips, wafers or dies) through the improvement of detection technology and further improve the yield of the process has become one of the important issues that the industry wants to solve.
本創作提供一種雷射缺陷檢測系統,包括控制裝置、基座、多個雷射檢測裝置及多個光感測裝置。基座支撐待測物件。多個雷射檢測裝置電性連接控制裝置,每一雷射檢測裝置包括雷射光源及雷射幫浦,雷射檢測裝置位於待測物件的一側,朝向待測物件的檢測部位發射第一雷射光束。多個光感測裝置電性連接控制裝置,每一光感測裝置包括光感測模組及影像模組,每一光感測裝置用以接收對應的第一雷射光束經待測物件的檢測部位反射的反射光,或是接收第一雷射光束穿過待測物件的檢測部位的穿透光,在每一感光感測裝置中,光感測模組傳送光訊號至影像模組,影像模組依據光訊號形成光學圖。The present invention provides a laser defect detection system, including a control device, a base, a plurality of laser detection devices and a plurality of photosensitive devices. The base supports the object to be tested. The plurality of laser detection devices are electrically connected to the control device, each of which includes a laser light source and a laser pump. The laser detection device is located on one side of the object to be tested and emits a first laser beam toward a detection portion of the object to be tested. The plurality of photosensitive devices are electrically connected to the control device, each of which includes a photosensitive module and an imaging module. Each photosensitive device is used to receive reflected light of the corresponding first laser beam reflected by the detection portion of the object to be tested, or to receive penetrating light of the first laser beam passing through the detection portion of the object to be tested. In each photosensitive sensing device, the photosensitive module transmits a light signal to the imaging module, and the imaging module forms an optical image according to the light signal.
依據一可行的實施方案,多個光感測模組中,至少一者為光彈性感測器,對應的影像模組形成的光學圖為應力分布特徵圖。According to a feasible implementation scheme, at least one of the multiple light sensing modules is a photoelastic sensor, and the optical image formed by the corresponding image module is a stress distribution characteristic image.
依據一可行的實施方案,多個光感測模組中,至少一者為光波前感測器,對應的影像模組形成的光學圖為波形圖。According to a feasible implementation scheme, at least one of the multiple light sensing modules is a light wavefront sensor, and the optical image formed by the corresponding image module is a waveform image.
依據一可行的實施方案,雷射缺陷檢測系統還包括雷射加工裝置,待測物件為多個,雷射加工裝置對多個待測物件發射第二雷射光束,以連接或焊接多個待測物件,其中第二雷射光束發射的時點與第一雷射光束發射的時點相同。According to a feasible implementation scheme, the laser defect detection system also includes a laser processing device, there are multiple objects to be tested, the laser processing device emits a second laser beam to the multiple objects to be tested to connect or weld the multiple objects to be tested, wherein the time point of emitting the second laser beam is the same as the time point of emitting the first laser beam.
依據一可行的實施方案,雷射缺陷檢測系統還包括一雷射加工裝置,雷射加工裝置對待測物件發射一第二雷射光束,以切割待測物件,其中第二雷射光束發射的時點與第一雷射光束發射的時點相同。According to a feasible implementation scheme, the laser defect detection system further includes a laser processing device, which emits a second laser beam to the object to be tested to cut the object to be tested, wherein the time point of emitting the second laser beam is the same as the time point of emitting the first laser beam.
依據一可行的實施方案,雷射缺陷檢測系統還包括一雷射加工裝置,雷射加工裝置對待測物件發射一第二雷射光束,對待測物件進行表面改質,其中第二雷射光束發射的時點與第一雷射光束發射的時點相同。According to a feasible implementation scheme, the laser defect detection system further includes a laser processing device, which emits a second laser beam to the object to be tested to perform surface modification on the object to be tested, wherein the time point of emitting the second laser beam is the same as the time point of emitting the first laser beam.
依據一可行的實施方案,雷射缺陷檢測系統還包括影像擷取裝置,電性連接控制裝置,影像擷取裝置用以擷取待測物件的檢測部位的影像。According to a feasible implementation scheme, the laser defect detection system further includes an image capture device and an electrical connection control device, wherein the image capture device is used to capture an image of the detection part of the object to be detected.
依據一可行的實施方案,控制裝置包括分析模組,影像擷取裝置擷取檢測部位未接受每一第一雷射光束的一陰影部的多個圖像,分析模組接收多個圖像,依據多個圖像判斷及計算出陰影部具有的缺陷及機率;或是補償多個圖像,並判斷及計算出陰影部具有的缺陷及機率。According to a feasible implementation scheme, the control device includes an analysis module, an image capture device captures multiple images of a shadow portion of the detection part that does not receive each first laser beam, the analysis module receives the multiple images, judges and calculates the defects and probabilities of the shadow portion based on the multiple images; or compensates for the multiple images, and judges and calculates the defects and probabilities of the shadow portion.
依據一可行的實施方案,雷射缺陷檢測系統還包括多個雷射移動裝置及多個移載裝置。多個雷射移動裝置電性連接控制裝置及分別連接每一雷射檢測裝置,每一雷射移動裝置用以使對應的雷射檢測裝置於三維空間中移動。多個移載裝置電性連接控制裝置及分別連接多個光感測裝置,每一移載裝置用以使對應光感測裝置於三維空間中移動。According to a feasible implementation scheme, the laser defect detection system further includes a plurality of laser moving devices and a plurality of transfer devices. The plurality of laser moving devices are electrically connected to the control device and are respectively connected to each laser detection device, and each laser moving device is used to move the corresponding laser detection device in three-dimensional space. The plurality of transfer devices are electrically connected to the control device and are respectively connected to a plurality of light sensing devices, and each transfer device is used to move the corresponding light sensing device in three-dimensional space.
依據一可行的實施方案,每一移動裝置包括轉向模組,用以改變雷射檢測裝置發射第一雷射光束的發射角度。According to a feasible implementation scheme, each moving device includes a steering module for changing the emission angle of the first laser beam emitted by the laser detection device.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,其能通過「多個雷射檢測裝置電性連接控制裝置,每一雷射檢測裝置包括雷射光源及雷射幫浦,雷射檢測裝置位於待測物件的一側,朝向待測物件的檢測部位發射第一雷射光束」以及「多個光感測裝置電性連接控制裝置,每一光感測裝置包括光感測模組及影像模組,每一光感測裝置用以接收對應的第一雷射光束經待測物件的檢測部位反射的反射光,或是接收第一雷射光束穿過待測物件的檢測部位的穿透光,在每一感光感測裝置中,光感測模組傳送光訊號至影像模組,影像模組依據光訊號形成光學圖」的技術方案,使多個光感測模組分別接受經待測物件的反射光或穿過待測物件的穿透光,最終形成多個光學圖以判斷待測物件的各種缺陷,如此,可以確實掌握待測物件所具有的缺陷,以提升缺陷檢測的精準度。One of the beneficial effects of the invention is that the laser defect detection system provided by the invention can be realized by "a plurality of laser detection devices electrically connected to the control device, each laser detection device including a laser light source and a laser pump, the laser detection device being located at one side of the object to be detected and emitting a first laser beam toward the detection part of the object to be detected" and "a plurality of light sensing devices electrically connected to the control device, each light sensing device including a light sensing module and an imaging module, each light sensing device being used to receive the corresponding first laser beam through the object to be detected The technical scheme of "receiving the reflected light reflected by the detection part of the object to be tested, or receiving the penetrating light of the first laser beam passing through the detection part of the object to be tested, in each photosensitizing device, the photosensing module transmits the light signal to the imaging module, and the imaging module forms an optical map according to the light signal" enables multiple photosensing modules to respectively receive the reflected light from the object to be tested or the penetrating light passing through the object to be tested, and finally form multiple optical maps to judge various defects of the object to be tested. In this way, the defects of the object to be tested can be accurately grasped to improve the accuracy of defect detection.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,多個光感測模組中,至少一者為光彈性感測器,對應的影像模組形成的光學圖為應力分布特徵圖。在一些實施例,至少一者為光波前感測器,對應的影像模組形成的光學圖為波形圖,如此,使用者可通過不同的光學原理的感測模組,檢測待測物件的各個部位,全面的檢測待測物所具有的缺陷,以提升缺陷檢測的精準度。One of the beneficial effects of the invention is that, in the laser defect detection system provided by the invention, at least one of the multiple light sensing modules is a photoelastic sensor, and the optical image formed by the corresponding imaging module is a stress distribution characteristic image. In some embodiments, at least one is an optical wavefront sensor, and the optical image formed by the corresponding imaging module is a waveform image. In this way, the user can detect various parts of the object to be tested through sensing modules with different optical principles, and comprehensively detect the defects of the object to be tested, so as to improve the accuracy of defect detection.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,其能通過「雷射缺陷檢測系統還包括雷射加工裝置,待測物件為多個或至少一個,雷射加工裝置對待測物件發射第二雷射光束進行加工,如焊接、切割或表面改質」以及「第二雷射光束發射的時點與第一雷射光束發射的時點相同」的技術方案,如此,雷射缺陷檢測系統可一邊對待測物件進行加工,同時進行缺陷檢測,可同時兼顧製程及檢測的效率。One of the beneficial effects of the present invention is that the laser defect detection system provided by the present invention can achieve the following technical solutions: "the laser defect detection system further includes a laser processing device, there are multiple or at least one object to be detected, and the laser processing device emits a second laser beam to the object to be detected for processing, such as welding, cutting or surface modification" and "the time of emission of the second laser beam is the same as the time of emission of the first laser beam". In this way, the laser defect detection system can process the object to be detected while performing defect detection, and can take into account the efficiency of both the process and the detection.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,經由「影像擷取裝置電性連接控制裝置,影像擷取裝置用以擷取待測物件的檢測部位的影像」的技術方案,在檢測過程中,還可實時監控待測物件檢測部位受檢測的狀況。One of the beneficial effects of the present invention is that the laser defect detection system provided by the present invention can monitor the detection status of the detection part of the object to be detected in real time during the detection process through the technical solution of "the image capture device is electrically connected to the control device, and the image capture device is used to capture the image of the detection part of the object to be detected".
更進一步的,依據一實施例,控制裝置包括分析模組,影像擷取裝置擷取檢測部位未接受每一第一雷射光束的一陰影部的多個圖像,分析模組接收多個圖像,依據多個圖像判斷及計算出陰影部具有的缺陷及機率;或是補償多個圖像,並判斷及計算出陰影部具有的缺陷及機率。如此,可以補償待測物件未接受第一雷射光束的檢測部位的影像,更進一步的判斷該檢測部位可能存在的缺陷或問題,讓使用者掌握檢測過程的缺失或問題。Furthermore, according to an embodiment, the control device includes an analysis module, and the image capture device captures multiple images of a shadow portion of the detection portion that does not receive each first laser beam. The analysis module receives the multiple images and determines and calculates the defects and probabilities of the shadow portion based on the multiple images; or compensates the multiple images and determines and calculates the defects and probabilities of the shadow portion. In this way, the image of the detection portion of the object to be detected that does not receive the first laser beam can be compensated, and the defects or problems that may exist in the detection portion can be further determined, so that the user can grasp the defects or problems in the detection process.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,經由「雷射缺陷檢測系統還包括多個雷射移動裝置及多個移載裝置。多個雷射移動裝置電性連接控制裝置及分別連接每一雷射檢測裝置,每一雷射移動裝置用以使對應的雷射檢測裝置於三維空間中移動。多個移載裝置電性連接控制裝置及分別連接多個光感測裝置,每一移載裝置用以使對應光感測裝置於三維空間中移動」的技術方案,對應於待測物件,雷射檢測裝置可通過移動全面對待測物件投射第一雷射光束,光感測裝置可通過移動的方式,全面接收各反射光或穿透光,如此,可全面掌握待測物件所具有的缺陷問題,提升檢測的準確度。One of the beneficial effects of the present invention is that the laser defect detection system provided by the present invention, through the technical solution of "the laser defect detection system also includes multiple laser moving devices and multiple transfer devices. The multiple laser moving devices are electrically connected to the control device and are respectively connected to each laser detection device, and each laser moving device is used to move the corresponding laser detection device in three-dimensional space. The multiple transfer devices are electrically connected to the control device and are respectively connected to the multiple light sensing devices, and each transfer device is used to move the corresponding light sensing device in three-dimensional space", corresponding to the object to be tested, the laser detection device can project a first laser beam to the object to be tested by moving, and the light sensing device can receive each reflected light or transmitted light by moving, so that the defect problem of the object to be tested can be fully grasped and the accuracy of detection can be improved.
更進一步的,依據一實施例,移動裝置包括轉向模組,用以改變雷射檢測裝置發射第一雷射光束的發射角度,如此,雷射檢測裝置還可以針對待測物件的特定部位(特定位置),移動(雷射頭轉向)或改變投射第一雷射光束的角度,以確實使系統獲得待測物件該部位所具有的缺陷的資訊,提升缺陷檢測的精準度。Furthermore, according to one embodiment, the moving device includes a steering module for changing the emission angle of the first laser beam emitted by the laser detection device. In this way, the laser detection device can also move (rotate the laser head) or change the angle of projecting the first laser beam with respect to a specific part (specific position) of the object to be tested, so as to ensure that the system obtains information about defects in that part of the object to be tested, thereby improving the accuracy of defect detection.
為使能更進一步瞭解本創作的特徵及技術內容,請參閱以下有關本創作的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本創作加以限制。In order to further understand the features and technical content of this work, please refer to the following detailed description and diagrams of this work. However, the diagrams provided are only used for reference and explanation and are not used to limit this work.
以下是通過特定的具體實施例來說明本創作所公開有關“雷射缺陷檢測系統”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本創作的優點與效果。本創作可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不背離本創作的構思下進行各種修改與變更。另外,本創作的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本創作的相關技術內容,但所公開的內容並非用以限制本創作的保護範圍。The following is an explanation of the implementation of the "laser defect detection system" disclosed in this creation through specific concrete embodiments. Technical personnel in this field can understand the advantages and effects of this creation from the content disclosed in this manual. This creation can be implemented or applied through other different specific embodiments, and the details in this manual can also be modified and changed based on different viewpoints and applications without departing from the concept of this creation. In addition, the drawings of this creation are only for simple schematic illustrations and are not depicted based on actual dimensions. Please note in advance. The following implementation will further explain the relevant technical content of this creation in detail, but the disclosed content is not intended to limit the scope of protection of this creation.
請參閱圖1,為本創作一實施例的雷射缺陷檢測系統架構示意圖。雷射缺陷檢測系統Z1包括控制裝置2、基座4、多個雷射檢測裝置6及多個光感測裝置8。基座4支撐待測物件(圖未繪示)。多個雷射檢測裝置6電性連接控制裝置2,每一雷射檢測裝置6包括雷射光源61及雷射幫浦62,雷射檢測裝置6位於待測物件的一側,朝向待測物件的檢測部位發射第一雷射光束。多個光感測裝置8電性連接控制裝置2,每一光感測裝置8包括光感測模組81及影像模組82,每一光感測裝置8用以接收對應的第一雷射光束經待測物件的檢測部位反射的反射光,或是接收第一雷射光束穿過待測物件的檢測部位的穿透光,在每一感光感測裝置8中,光感測模組81傳送光訊號至影像模組82,影像模組82依據光訊號形成光學圖。Please refer to FIG. 1, which is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention. The laser defect detection system Z1 includes a
控制裝置2例如電腦主機。依據一些實施例,基座4為具有驅動馬達的移動座。另依據一些實施例,基座4包括輸送帶,輸送帶上承載多個待測物件。依據一些實施例,對應待測物件,基座4具有簍空部位,或是為透光材質的支撐架或底座。透明材質例如玻璃或藍寶石。The
在一些實施例中,多個光感測模組81中,至少一者為光彈性感測器,對應的影像模組82形成的光學圖為應力分布特徵圖。而在一些實施例中,多個光感測模組81中,至少一者為光波前感測器,對應的影像模組82形成的光學圖為波形圖。換言之,使用者可以通過檢測目的,分別設置不同光學偵測原理的光感測模組81,以獲取待測物件更全面性的檢測資訊。In some embodiments, at least one of the multiple
依據一些實施例,待測物件例如晶圓、晶片或晶粒。另依據一些實施例,待測物件可以是封裝體(成品或半成品)。另依據一些實施例,待測物件1是位於基板(例如電路板)上,由基座4承載基板。所述檢測部位例如表面、孔洞、穿孔(via)或是焊接結構(焊接的面積),本創作並無此限制。通過光學圖(如應力分布特徵圖或波形圖),使用者可以檢視所述檢測部位的應力分布情形,判斷待測物件是否為良品,例如將該等「應力分布」區分為良品區、應力產生區及NG區。NG區可能有例如裂縫、凹凸表面或焊接結構脫離等缺陷,如此,即可依據應力分布的狀況,針對缺陷的部位找出解決的問題。According to some embodiments, the object to be tested is, for example, a wafer, a chip, or a die. According to some other embodiments, the object to be tested may be a package (finished product or semi-finished product). According to some other embodiments, the object to be tested 1 is located on a substrate (such as a circuit board), and the substrate is supported by a
以穿孔(TGV或TSV)為例,其常見的缺陷有其內壁面產生毛刺,凹凸不平,穿孔的孔道偏移、孔道與基板的夾角錯誤、穿孔未貫穿基板、尺寸或形狀不正確等,藉由應力分布的表現區分可能為上述哪一類別的缺陷,針對該缺陷在製程上找出解決的問題。Taking vias (TGV or TSV) as an example, common defects include burrs on the inner wall, unevenness, deviation of the via hole, wrong angle between the via hole and the substrate, the via hole not penetrating the substrate, incorrect size or shape, etc. The stress distribution can be used to distinguish which of the above defects it may be, and find a solution to the problem in the process.
請參閱圖2,為本創作一實施例的雷射缺陷檢測系統架構示意圖。在此實施例中,雷射缺陷檢測系統Z2還包括雷射加工裝置7(具有雷射光源71及雷射幫浦72)。待測物件可為多個或一個,當待測物件為多個時,雷射加工裝置7對待測物件發射第二雷射光束,以連接或焊接多個待測物件。第二雷射光束發射的時點與第一雷射光束發射的時點相同。在一些實施例中,雷射加工裝置7是對多個或一個待測物件發射第二雷射光束,以對待測物件進行表面改質。在另一實施例中,雷射加工裝置7對待測物件發射第二雷射光束以切割待測物件。換言之,本創作的雷射檢測裝置6及雷射加工裝置7可同步進行運作,一方面對待測物件進行加工,另一方便同時檢測待測物件,如此,可提升製程及檢測的效率。Please refer to Figure 2, which is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention. In this embodiment, the laser defect detection system Z2 also includes a laser processing device 7 (having a laser light source 71 and a laser pump 72). The objects to be tested may be multiple or one. When there are multiple objects to be tested, the
請參閱圖3,為本創作一實施例的雷射缺陷檢測系統架構示意圖。在此實施例中,雷射缺陷檢測系統Z3還包括影像擷取裝置9,電性連接控制裝置2,影像擷取裝置9用以擷取待測物件的檢測部位的影像。影像擷取裝置9例如相機或是攝錄器,通過架設影像擷取裝置9,可以在檢測過程中,實時監控待測物件檢測部位受檢測的狀況。Please refer to FIG. 3, which is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention. In this embodiment, the laser defect detection system Z3 further includes an image capture device 9, which is electrically connected to the
依據圖3所示的實施例,控制裝置2包括分析模組21,影像擷取裝置9擷取檢測部位未接受第一雷射光束的陰影部的多個圖像,分析模組21接收多個圖像,依據多個圖像判斷及計算出陰影部具有的缺陷及機率;或是補償多個圖像,並判斷及計算出陰影部具有的缺陷及機率。影像擷取裝置9擷取待測物件的檢測部位中陰影的部分,尤其是指無法接收第一雷射光束的部位。分析模組21可通過深度學習判斷出陰影部可能具有的缺陷及該缺陷發生的機率。分析模組21或是通過補償影像,進一步判斷及計算出陰影部具有的缺陷及機率。如此,可提升缺陷檢測的精準度。According to the embodiment shown in FIG3 , the
請參閱圖4,為本創作一實施例的雷射缺陷檢測系統架構示意圖。在此實施例中,雷射缺陷檢測系統Z4還包括多個移動裝置102及多個移載裝置104。多個移動裝置102電性連接控制裝置2及分別連接每一雷射檢測裝置6,每一移動裝置102用以使對應的雷射檢測裝置6於三維空間中移動。多個移載裝置104電性連接控制裝置2及分別連接多個光感測裝置8,每一移載裝置104用以使對應光感測裝置8於三維空間中移動。通過移動裝置102,雷射檢測裝置6可移動於三維空間中,如此可針對待測物件中特定的檢測部位發射第一雷射光束。另一方面,由於移載模組可帶動光感測裝置8於三維空間中移動,光感測裝置8可移動於第一雷射光束經待測物件的檢測部位反射的反射光的位置,或是穿過待測物件的檢測部位的穿透光的位置,接收該等光束後確切產生光訊號,使影像模組82產生的光學圖完整呈現待測物件所具有的缺陷,以此提升缺陷檢測的精準度。Please refer to FIG. 4 , which is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention. In this embodiment, the laser defect detection system Z4 further includes a plurality of moving
另依據圖4所示的實施例,每一移動裝置102包括轉向模組1021,用以改變雷射檢測裝置6發射第一雷射光束的發射角度。通過轉向模組1021,使用者可改變雷射檢測裝置6的投射第一雷射光束角度,例如改變雷射頭面對待測物件的方向。如此則可對待測物件的特定部位投射第一雷射光束。According to the embodiment shown in FIG. 4 , each
需特別說明的是,本創作的雷射檢測裝置6所發射的第一雷射光束,其波長可視檢測距離(雷射檢測裝置6與待測物件之間的距離)、所需檢測部位的特徵(如上述裂縫、孔洞、穿孔、鍵結、凹凸表面等)而調整,本創作並無限制。本創作的雷射檢測裝置6所發射的第一雷射光束,其波長亦可視待測物件的材質不同而調整。It should be noted that the wavelength of the first laser beam emitted by the
[實施例的有益效果][Beneficial Effects of Embodiments]
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,其能通過「多個雷射檢測裝置電性連接控制裝置,每一雷射檢測裝置包括雷射光源及雷射幫浦,雷射檢測裝置位於待測物件的一側,朝向待測物件的檢測部位發射第一雷射光束」以及「多個光感測裝置電性連接控制裝置,每一光感測裝置包括光感測模組及影像模組,每一光感測裝置用以接收對應的第一雷射光束經待測物件的檢測部位反射的反射光,或是接收第一雷射光束穿過待測物件的檢測部位的穿透光,在每一感光感測裝置中,光感測模組傳送光訊號至影像模組,影像模組依據光訊號形成光學圖」的技術方案,使多個光感測模組分別接受經待測物件的反射光或穿過待測物件的穿透光,最終形成多個光學圖以判斷待測物件的各種缺陷,如此,可以確實掌握待測物件所具有的缺陷,以提升缺陷檢測的精準度。One of the beneficial effects of the invention is that the laser defect detection system provided by the invention can be realized by "a plurality of laser detection devices electrically connected to the control device, each laser detection device including a laser light source and a laser pump, the laser detection device being located at one side of the object to be detected and emitting a first laser beam toward the detection part of the object to be detected" and "a plurality of light sensing devices electrically connected to the control device, each light sensing device including a light sensing module and an imaging module, each light sensing device being used to receive the corresponding first laser beam through the object to be detected The technical scheme of "receiving the reflected light reflected by the detection part of the object to be tested, or receiving the penetrating light of the first laser beam passing through the detection part of the object to be tested, in each photosensitizing device, the photosensing module transmits the light signal to the imaging module, and the imaging module forms an optical map according to the light signal" enables multiple photosensing modules to respectively receive the reflected light from the object to be tested or the penetrating light passing through the object to be tested, and finally form multiple optical maps to judge various defects of the object to be tested. In this way, the defects of the object to be tested can be accurately grasped to improve the accuracy of defect detection.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,多個光感測模組中,至少一者為光彈性感測器,對應的影像模組形成的光學圖為應力分布特徵圖。在一些實施例,至少一者為光波前感測器,對應的影像模組形成的光學圖為波形圖,如此,使用者可通過不同的光學原理的感測模組,檢測待測物件的各個部位,全面的檢測待測物所具有的缺陷,以提升缺陷檢測的精準度。One of the beneficial effects of the invention is that, in the laser defect detection system provided by the invention, at least one of the multiple light sensing modules is a photoelastic sensor, and the optical image formed by the corresponding imaging module is a stress distribution characteristic image. In some embodiments, at least one is an optical wavefront sensor, and the optical image formed by the corresponding imaging module is a waveform image. In this way, the user can detect various parts of the object to be tested through sensing modules with different optical principles, and comprehensively detect the defects of the object to be tested, so as to improve the accuracy of defect detection.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,其能通過「雷射缺陷檢測系統還包括雷射加工裝置,待測物件為多個或至少一個,雷射加工裝置對待測物件發射第二雷射光束進行加工,如焊接、切割或表面改質」以及「第二雷射光束發射的時點與第一雷射光束發射的時點相同」的技術方案,如此,雷射缺陷檢測系統可一邊對待測物件進行加工,同時進行缺陷檢測,可同時兼顧製程及檢測的效率。One of the beneficial effects of the present invention is that the laser defect detection system provided by the present invention can achieve the following technical solutions: "the laser defect detection system further includes a laser processing device, there are multiple or at least one object to be detected, and the laser processing device emits a second laser beam to the object to be detected for processing, such as welding, cutting or surface modification" and "the time of emission of the second laser beam is the same as the time of emission of the first laser beam". In this way, the laser defect detection system can process the object to be detected while performing defect detection, and can take into account the efficiency of both the process and the detection.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,經由「影像擷取裝置電性連接控制裝置,影像擷取裝置用以擷取待測物件的檢測部位的影像」的技術方案,在檢測過程中,還可實時監控待測物件檢測部位受檢測的狀況。One of the beneficial effects of the present invention is that the laser defect detection system provided by the present invention can monitor the detection status of the detection part of the object to be detected in real time during the detection process through the technical solution of "the image capture device is electrically connected to the control device, and the image capture device is used to capture the image of the detection part of the object to be detected".
更進一步的,依據一實施例,控制裝置包括分析模組,影像擷取裝置擷取檢測部位未接受每一第一雷射光束的一陰影部的多個圖像,分析模組接收多個圖像,依據多個圖像判斷及計算出陰影部具有的缺陷及機率;或是補償多個圖像,並判斷及計算出陰影部具有的缺陷及機率。如此,可以補償待測物件未接受第一雷射光束的檢測部位的影像,更進一步的判斷該檢測部位可能存在的缺陷或問題,讓使用者掌握檢測過程的缺失或問題。Furthermore, according to an embodiment, the control device includes an analysis module, and the image capture device captures multiple images of a shadow portion of the detection portion that does not receive each first laser beam. The analysis module receives the multiple images and determines and calculates the defects and probabilities of the shadow portion based on the multiple images; or compensates the multiple images and determines and calculates the defects and probabilities of the shadow portion. In this way, the image of the detection portion of the object to be detected that does not receive the first laser beam can be compensated, and the defects or problems that may exist in the detection portion can be further determined, so that the user can grasp the defects or problems in the detection process.
本創作的其中一有益效果在於,本創作所提供的雷射缺陷檢測系統,經由「雷射缺陷檢測系統還包括多個雷射移動裝置及多個移載裝置。多個雷射移動裝置電性連接控制裝置及分別連接每一雷射檢測裝置,每一雷射移動裝置用以使對應的雷射檢測裝置於三維空間中移動。多個移載裝置電性連接控制裝置及分別連接多個光感測裝置,每一移載裝置用以使對應光感測裝置於三維空間中移動」的技術方案,對應於待測物件,雷射檢測裝置可通過移動全面對待測物件投射第一雷射光束,光感測裝置可通過移動的方式,全面接收各反射光或穿透光,如此,可全面掌握待測物件所具有的缺陷問題,提升檢測的準確度。One of the beneficial effects of the present invention is that the laser defect detection system provided by the present invention, through the technical solution of "the laser defect detection system also includes multiple laser moving devices and multiple transfer devices. The multiple laser moving devices are electrically connected to the control device and are respectively connected to each laser detection device, and each laser moving device is used to move the corresponding laser detection device in three-dimensional space. The multiple transfer devices are electrically connected to the control device and are respectively connected to the multiple light sensing devices, and each transfer device is used to move the corresponding light sensing device in three-dimensional space", corresponding to the object to be tested, the laser detection device can project a first laser beam to the object to be tested by moving, and the light sensing device can receive each reflected light or transmitted light by moving, so that the defect problem of the object to be tested can be fully grasped and the accuracy of detection can be improved.
更進一步的,依據一實施例,移動裝置包括轉向模組,用以改變雷射檢測裝置發射第一雷射光束的發射角度,如此,雷射檢測裝置還可以針對待測物件的特定部位(特定位置),移動(雷射頭轉向)或改變投射第一雷射光束的角度,以確實使系統獲得待測物件該部位所具有的缺陷的資訊,提升缺陷檢測的精準度。Furthermore, according to one embodiment, the moving device includes a steering module for changing the emission angle of the first laser beam emitted by the laser detection device. In this way, the laser detection device can also move (rotate the laser head) or change the angle of projecting the first laser beam with respect to a specific part (specific position) of the object to be tested, so as to ensure that the system obtains information about defects in that part of the object to be tested, thereby improving the accuracy of defect detection.
以上所公開的內容僅為本創作的優選可行實施例,並非因此侷限本創作的申請專利範圍,所以凡是運用本創作說明書及圖式內容所做的等效技術變化,均包含於本創作的申請專利範圍內。The above disclosed contents are only the preferred feasible embodiments of the present invention and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the instructions and diagrams of the present invention are included in the scope of the patent application of the present invention.
Z1-Z4:雷射缺陷檢測系統 2:控制裝置 21:分析模組 4:基座 6:雷射檢測裝置 61:雷射光源 62:雷射幫浦 7:雷射加工裝置 71:雷射光源 72:雷射幫浦 8:光感測裝置 81:光感測模組 82:影像模組 9:影像擷取裝置 102:移動裝置 1021:轉向模組 104:移載裝置 Z1-Z4: Laser defect detection system 2: Control device 21: Analysis module 4: Base 6: Laser detection device 61: Laser light source 62: Laser pump 7: Laser processing device 71: Laser light source 72: Laser pump 8: Photosensitive device 81: Photosensitive module 82: Image module 9: Image capture device 102: Moving device 1021: Turning module 104: Transfer device
圖1為本創作一實施例的雷射缺陷檢測系統架構示意圖。FIG1 is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention.
圖2為本創作一實施例的雷射缺陷檢測系統架構示意圖。FIG. 2 is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention.
圖3為本創作一實施例的雷射缺陷檢測系統架構示意圖。FIG3 is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention.
圖4為本創作一實施例的雷射缺陷檢測系統架構示意圖。FIG4 is a schematic diagram of the laser defect detection system architecture of an embodiment of the present invention.
Z1:雷射缺陷檢測系統 Z1: Laser defect detection system
2:控制裝置 2: Control device
4:基座 4: Base
6:雷射檢測裝置 6: Laser detection device
61:雷射光源 61:Laser light source
62:雷射幫浦 62: Laser Pump
8:光感測裝置 8: Light sensing device
81:光感測模組 81: Light sensing module
82:影像模組 82: Image module
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI895228B (en) * | 2025-04-01 | 2025-08-21 | 尹鑽科技有限公司 | Glass substrate inspection system with detection of perforated waist |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI895228B (en) * | 2025-04-01 | 2025-08-21 | 尹鑽科技有限公司 | Glass substrate inspection system with detection of perforated waist |
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