TWI895228B - Glass substrate inspection system with detection of perforated waist - Google Patents

Abstract

The present invention provides a glass substrate inspection system suitable for inspecting glass substrates after a perforation process. By virtue of the technical features of the various sub-components disclosed in the glass substrate inspection system, inspection personnel can efficiently obtain the actual shape of the perforation waist of the glass substrate after the perforation process.

Description

Glass substrate inspection system with detection of perforated waist

This invention relates to glass inspection technology, and in particular to a system suitable for inspecting perforated glass substrates.

Currently, traditional microscopes are typically used to inspect glass substrates after TGV (Through Glass Via) processing. While this method can capture the actual appearance of each via in the glass substrate, it significantly reduces measurement reliability, impacting the yield of subsequent processes. Furthermore, traditional microscopes are significantly limited in their ability to inspect certain angles of the glass substrate, significantly inconvenient for inspectors.

Therefore, how to effectively improve the yield of glass substrates after the through-glass via (TGV) process is actually the urgent goal of this invention.

To address the issues described in prior art, the present invention provides a glass substrate inspection system suitable for inspecting glass substrates that have undergone a through-glass via (TGV) process. The technical features of the various sub-components disclosed in this glass substrate inspection system not only differentiate this system from conventional microscopes used in prior art, but also enable inspectors to more efficiently obtain the actual appearance of the perforated waist of a glass substrate after the perforation process.

To achieve the above-mentioned object, the present invention provides a glass substrate inspection system, which includes a microprocessor unit, a carrier unit, a first inspection device, and a second inspection device; wherein the microprocessor unit, the first inspection device, and the second inspection device are respectively assembled in the carrier unit, and the microprocessor unit is respectively electrically connected to and electrically controls the carrier unit, the first inspection device, and the second inspection device, so that the first inspection device and the second inspection device are respectively placed corresponding to An object to be tested is placed on the carrier unit; wherein the microprocessor unit comprises a unit area perforation compensation angle calculation logic and a perforation waist detection calculation logic. The unit area perforation compensation angle calculation logic is used to analyze and calculate the image recognition of the object to be tested placed on the carrier unit and generate unit area perforation compensation angle discrimination information. The perforation waist detection calculation logic is used to combine the calculation with the unit area perforation compensation angle calculation logic to generate perforation waist discrimination information.

The glass substrate inspection system disclosed in this invention utilizes the unit-area perforation compensation angle calculation logic, the perforation waist detection logic, the first inspection device, and the second inspection device. This system not only distinguishes itself from conventional microscopes used in prior art for inspecting glass substrates, but also allows inspectors to more efficiently obtain the actual perforation waist characteristics of glass substrates after the perforation process.

1: Glass substrate inspection system

2: Glass substrate

10: Microprocessor unit

13: Calculation Logic of Perforation Compensation Angle Per Unit Area

14: Perforated waist detection algorithm

20: Carrier unit

21: Carrier

212: Top

213: Bottom

214: Convex Wall

23: Carrier slide rail assembly

25: Support Arm

251: First slide rail assembly

253: Second slide rail assembly

255: Base

30: First detection device

31: Camera Module

40: Second detection device

41: Camera Module

50: Power supply module

2n, 2o, 2p, 2q: Perforation

θ1, θ2, θ3: Perforation compensation angles

B1, B2, B3: Perforated waistband

Figure 1 is a system architecture diagram of a preferred embodiment of the present invention, primarily illustrating a glass substrate inspection system suitable for inspecting glass substrates after a perforation process.

Figure 2 is a schematic three-dimensional diagram of some components of the glass substrate inspection system disclosed in Figure 1, primarily illustrating a glass substrate that has undergone a perforation process but has not yet been placed in the glass substrate inspection system.

Figure 3 is a schematic 3D diagram of some components similar to Figure 2, primarily showing the glass substrate after the perforation process being placed on a carrier unit of the glass substrate inspection system.

Figure 4 is a schematic three-dimensional diagram of some components similar to Figure 3, primarily showing the glass substrate after the perforation process and the carrier unit being advanced to a position to be inspected.

Figure 5 is a schematic three-dimensional diagram of some components similar to Figure 4 , primarily illustrating a first inspection device and a second inspection device of the glass substrate inspection system moving downward and approaching the top of the glass substrate after the perforation process.

FIG6 is a front view schematic diagram similar to FIG5 , primarily illustrating the first and second inspection devices of the glass substrate inspection system being lifted and moved away from the perforated glass substrate.

Figure 7 is a schematic side view of Figure 6.

Figure 8 is a schematic diagram of the glass substrate inspection system shown in Figure 6 , after the first and second inspection devices capture image data of several perforations on a portion of the glass substrate after the perforation process, and the microprocessor unit executes a perforation compensation angle calculation per unit area and a perforation waist detection calculation.

Figure 9 is a schematic diagram of the side view detection status of Figure 8.

The applicant first clarifies that throughout this specification, including the embodiments described below and the various claims in the patent application, directional terms are based on the orientation of the various figures listed in the [Simplified Description of the Figures] of this application. Furthermore, in the embodiments and figures described below, identical component numbers represent identical or similar components or structural features. Furthermore, the detailed structure, features, assembly, use, and manufacturing methods of the present invention will be described in the subsequent detailed description of the embodiments. However, those skilled in the art will understand that such detailed description and the embodiments listed herein are intended solely to support and illustrate that the present invention can be implemented and are not intended to limit the scope of the patent application.

Please refer to FIG1 , which shows a glass substrate inspection system 1 for inspecting a glass substrate 2 after a through-glass via (TGV) process according to a preferred embodiment of the present invention. The glass substrate inspection system 1 includes a microprocessor unit 10, a carrier unit 20, a first inspection device 30, a second inspection device 40, and a power supply module 50. The microprocessor unit 10, the first inspection device 30, the second inspection device 40, and the power supply module 50 are respectively assembled on the carrier unit 20; and the microprocessor unit 10 is respectively electrically connected to and electrically controls the first inspection device 30, the second inspection device 40, and the power supply module 50. The carrier unit 20, the first detection device 30, and the second detection device 40 are configured such that the first detection device 30 and the second detection device 40 correspond to the object to be tested placed on the carrier unit 20, i.e., the glass substrate 2 after the perforation process in this embodiment. The power supply module 50 is electrically connected to and supplies the power required by the microprocessor 10, the carrier unit 20, the first detection device 30, and the second detection device 40.

Please refer to FIG1 again. The microprocessor 10 has a unit area perforation compensation angle calculation logic 13 and a perforation waist detection calculation logic 14. The unit area perforation compensation angle calculation logic 13 is basically used to analyze and calculate the image recognition calculation logic of the object to be tested placed on the carrier unit 20 to generate a unit area perforation compensation angle. The perforation waist detection logic 14 is used to combine and calculate the unit area perforation compensation angle calculation logic 13 to generate a perforation waist discrimination information. It is worth mentioning that the unit area perforation compensation angle calculation logic 13 of the microprocessor 10 of the preferred embodiment of the present invention is based on the dot product algorithm (dot product), cross product, or a combination thereof; it is also worth mentioning that the unit area perforation waist detection logic 14 of the microprocessor unit 10 of the preferred embodiment of the present invention includes but is not limited to the Fourier transform algorithm, sweep-line algorithm, kernel method, or a combination thereof.

Please refer to Figures 1 and 2 together. The supporting unit 20 includes a plate-shaped carrier 21, a carrier rail assembly 23, and a support arm 25 that is substantially vertical and adjacent to the carrier rail assembly 23. The plate-shaped carrier 21 has a top 212 and a bottom 213 corresponding to the top 212. The top 212 of the carrier 21 is used to support the glass after the perforation process. The glass substrate 2 is preferably provided on the top portion 212 of the carrier 21 with a plurality of spaced-apart ridges 214, so that the glass substrate 2 after the perforation process can be supported on the ridges 214. The bottom portion 213 of the carrier 21 is pivotally mounted on the carrier rail assembly 23, so that the carrier 21 and the glass substrate 2 can slide back and forth along the track of the carrier rail assembly 23. The support arm 25 includes a The support arm 25 comprises a first slide group 251, a second slide group 253 and a base 255. The first slide group 251 of the support arm 25 is arranged on the same side of the support arm 25 as the platform slide group 23, and the slide extension direction of the first slide group 251 is substantially the same as the slide extension direction of the platform slide group 23. The second slide group 253 of the support arm 25 is pivotally arranged on the first slide group 25. 1, and the second rail assembly 253 extends in a direction substantially intersecting the direction of extension of the first rail assembly 251. The base 255 is pivotally mounted on the second rail assembly 253 and can slide back and forth along the extension direction of the second rail assembly 253. Preferably, the second rail assembly 253 and the base 255 can slide back and forth along the extension direction of the first rail assembly 251.

Please refer to Figures 1 to 7 together. The first detection device 30 and the second detection device 40 are respectively installed on the base 255 of the support arm 25 of the carrier unit 20. In this way, the first detection device 30 and the second detection device 40 can be reciprocated according to the extension direction of the track of the first slide group 251 of the support arm 25 of the carrier unit 20, or can be reciprocated according to the extension direction of the track of the second slide group 253 of the support arm 25 of the carrier unit 20; and the first detection device 3 System 0 includes a camera module 31, which is electrically connected to and controlled by the microprocessor unit 10. The camera module 31 is substantially perpendicular to and oriented in relation to the direction of the stage rail assembly 23 of the carrier unit 20. The second detection device 40 includes a camera module 41, which is electrically connected to and controlled by the microprocessor unit 10. The camera module 41 is substantially tilted at a predetermined angle relative to the direction of the stage rail assembly 23 of the carrier unit 20. It is worth mentioning that the camera module 31 of the first detection device 30 and the camera module 41 of the second detection device 40 are basically an industrial camera (its model includes but is not limited to MBS2041POE [5m 5472 x 3648 pixels, 5.5fps], GigE [6M black and white 1/1.8"/5m 3072 x 2048 pixels], etc.) and an industrial camera lens (models including but not limited to FA lenses [LM12FC24M] and 1X telecentric lenses). The aforementioned technical features are readily apparent to those skilled in the art after considering the preferred embodiments of the present invention, and may simply involve simple substitutions and variations in model, quantity, or size. Therefore, they are not intended to limit the technical features claimed by the present invention and should be noted in advance.

The above describes the technical features of the glass substrate inspection system 1 and its various subcomponents disclosed in a preferred embodiment of the present invention. The following describes how the glass substrate inspection system 1 can be used to inspect glass substrates 2 that have undergone a through-glass via (TGV) process, thereby performing inspections that differ from conventional microscope inspections used in prior art. The intended benefits are:

First, please refer to Figures 1 to 4. First, before the glass substrate detection system 1 is about to perform a detection operation, the microprocessor 10 of the glass substrate detection system 1 first generates an initial signal and transmits it electrically to the carrier unit 20, the first detection device 30, and the second detection device 40. In this way, the carrier slide rail assembly 23 of the carrier unit 20 can push the carrier 21 forward according to the initial signal. When the support arm 25 reaches a predetermined horizontal initial position, the first rail assembly 251 of the support arm 25 of the carrier unit 20 will, based on the initial signal, simultaneously lift the second rail assembly 253, the base 255, the first detection device 30, and the second detection device 40 to a predetermined vertical initial position away from the carrier rail assembly 23. This allows the inspector to achieve a preliminary reset of the mechanism before conducting an inspection.

Secondly, please refer to Figures 1 to 5. Then, when the glass substrate 2 (TGV, Through Glass Via) is stably placed on the protrusions 214 of the top 212 of the carrier 21 of the supporting unit 20, at this time, the microprocessor unit 10 of the glass substrate detection system 1 generates a signal to be tested and transmits it electrically to the supporting unit 20, the first detection device 30 and the second detection device 40 respectively. In this way, the carrier slide rail assembly 23 of the supporting unit 20 can slide the carrier 21 and the glass substrate 2 placed on the protrusions 214 of the carrier 21 steadily from the predetermined horizontal initial position to a predetermined position to be tested near the bottom of the support arm 25 according to the signal to be tested. At the same time, the first slide rail assembly 23 of the support arm 25 of the supporting unit 20 can also slide the carrier 21 and the glass substrate 2 placed on the protrusions 214 of the carrier 21 steadily from the predetermined horizontal initial position to a predetermined position to be tested near the bottom of the support arm 25. Based on the test signal, the second slide rail assembly 253, the base 255, the first inspection device 30, and the second inspection device 40 are simultaneously lowered from the predetermined vertical initial position to a predetermined test height from the glass substrate 2 placed on the ridges 214 of the stage 21. Preferably, the predetermined vertical distance between the camera lens of the imaging module 31 of the first inspection device 30 and the glass substrate 2 is between 10 mm and 220 mm, and the predetermined vertical distance between the camera lens of the imaging module 41 of the second inspection device 40 and the glass substrate 2 is between 10 mm and 220 mm. This allows the entire glass substrate inspection system 1 to achieve pre-test mechanism alignment.

Third, please refer to Figures 1 to 9 together. When the microprocessor 10 of the glass substrate detection system 1 generates a compensation angle signal and transmits it electrically to the support unit 20, the first detection device 30 and the second detection device 40, the first slide rail group 251 and the second slide rail group 253 of the support arm 25 of the support unit 20 are both based on The compensation angle signal moves the first detection device 30 again until the vertical detection distance between the camera lens of the camera module 31 of the first detection device 30 and the camera lens of the camera module 41 of the second detection device 40 and the glass substrate 2 is between 30mm and 200mm, wherein the camera module of the second detection device 40 A predetermined detection angle is formed between the camera lens 41 and the glass substrate 2, which is between 20 degrees and 70 degrees. At this time, the camera lens 31 of the first detection device 30 and the camera lens 41 of the second detection device 40 respectively capture a plurality of perforated image data (in this embodiment, the data The data is basically composed of text, images, multimedia videos or a combination thereof) and is electrically transmitted to the microprocessor 10, so that the microprocessor 10 executes the unit area perforation compensation angle calculation logic 13. In this way, the unit area perforation compensation angle calculation logic 13 of the microprocessor 10 can be based on the first detection. The camera lens of the camera module 31 of the device 30 and the camera lens of the camera module 41 of the second detection device 40 perform logical operations on the plurality of perforation image data on the glass substrate 2, thereby generating a unit area perforation compensation angle discrimination information (including but not limited to any actual perforation on the glass substrate 2 matching any imaginary vertical through hole). A perforation compensation angle is formed between an imaginary compensation line L passing through the glass substrate 2, wherein the perforation compensation angle is based on information such as whether the imaginary compensation line L is between 0 degrees and 50 degrees and is displayed by an external display device electrically connected. As shown in Figures 8 and 9, the local perforations 2n, 2o, 2p, and 2q on the glass substrate 2 are formed by passing through the glass substrate 2. After executing the unit area perforation compensation angle calculation logic 13, the microprocessor 10 of the glass substrate detection system 1 can obtain the following related judgment information: (a) the perforations 2n, 2o, and 2p are established, and the perforation 2n has the best penetration through the glass substrate 2; (b) the perforation 2q is determined to be not perforated; (c) the perforation 2o is based on the hypothetical The perforation compensation angle θ1 of the compensation line L is approximately greater than or equal to 1 degree and less than 10 degrees, the perforation compensation angle θ2 of the perforation 2p based on the imaginary compensation line L is approximately greater than or equal to 10 degrees and less than 30 degrees, and the perforation compensation angle θ3 of the perforation 2q based on the imaginary compensation line L is approximately greater than or equal to 30 degrees and less than 50 degrees. In summary, the glass substrate inspection system 1 not only distinguishes itself from conventional microscopes used in prior art for inspecting glass substrates, but also effectively overcomes the significant limitations of conventional microscopes in inspecting certain angles of the glass substrates. This allows the system to accurately measure the perforation compensation angle between each perforation per unit area of the glass substrate 2 after the perforation process.

Fourthly, please refer to Figures 1 to 9 together. When the microprocessor unit 10 of the glass substrate detection system 1 generates a perforated waist detection signal and transmits it electrically to the carrier unit 20, the first detection device 30 and the second detection device 40, the first slide rail group 251 and the second slide rail group 253 of the support arm 25 of the carrier unit 20 both move the first detection device 30 again according to the perforated waist detection signal until the vertical detection distance between the camera lens of the camera module 31 of the first detection device 30 and the camera lens of the camera module 41 of the second detection device 40 and the glass substrate 2 is between 30 mm and 20 mm. 0 mm, wherein a predetermined detection angle is formed between the camera lens of the camera module 41 of the second detection device 40 and the glass substrate 2, which is between 20 and 70 degrees. At this time, the camera lens of the camera module 31 of the first detection device 30 and the camera lens of the camera module 41 of the second detection device 40 respectively transmit a plurality of perforation image data on the glass substrate 2 (in this embodiment, the data is basically composed of text, images, multimedia video, or a combination thereof) to the microprocessor 10, so that the microprocessor 10 executes the unit area perforation compensation angle calculation logic 13 and the perforation compensation angle calculation logic 13 simultaneously. The technical features of the hole waist detection calculation logic 14 are such that the perforation waist detection calculation logic 14 of the microprocessor unit 10 performs a logical operation based on the plurality of perforation image data captured from the glass substrate 2 by the camera lens of the camera module 31 of the first detection device 30 and the camera lens of the camera module 41 of the second detection device 40, and then generates a perforation waist discrimination information (including but not limited to information such as whether any actual perforation waist on the glass substrate 2 is smaller than or equal to the aperture of any actual perforation) and displays it by the display device electrically connected to the outside, that is, as shown in Figures 8 and 9, the local perforation waist on the glass substrate 2 is Among the perforations 2n, 2o, 2p and 2q, the microprocessor 10 of the glass substrate detection system 1 executes the unit area perforation compensation angle calculation logic 13 and the perforation waist detection calculation logic 14 simultaneously, and the subsequent relevant judgment information can be obtained: (a) the perforations 2n, 2o, and 2p are established, among which the penetration degree of the perforation 2n through the glass substrate 2 is the best; (b) the perforation 2q is determined to be unperforated; (c) the perforation waist B1 of the perforation 2n is smaller than or equal to the aperture of the perforation 2n, the perforation waist B2 of the perforation 2o is slightly smaller than the aperture of the perforation 2o, and the perforation waist B3 of the perforation 2q is smaller than the aperture of the perforation 2q. In summary, the glass substrate inspection system 1 not only distinguishes itself from conventional microscopes used in prior art for inspecting glass substrates, but also effectively overcomes the significant limitations of conventional microscopes in inspecting certain angles of the glass substrate. This allows the system to determine whether each perforation per unit area of the glass substrate 2 has effectively penetrated the glass substrate 2 after the perforation process.

Fifth, please refer to Figures 1 to 7 together. Finally, when the glass substrate detection system 1 completes the aforementioned detection operations, the microprocessor 10 of the glass substrate detection system 1 first generates a reset signal and transmits it electrically to the carrier unit 20, the first detection device 30, and the second detection device 40. In this way, the carrier slide rail assembly 23 of the carrier unit 20 can move the carrier 21 according to the reset signal. Once the support arm 25 is advanced again to the predetermined horizontal initial position, the first rail assembly 251 of the support arm 25 of the carrier unit 20 will, in response to the reset signal, simultaneously lift the second rail assembly 253, the base 255, the first detection device 30, and the second detection device 40 to the predetermined vertical initial position away from the carrier rail assembly 23, thereby allowing the inspection personnel to achieve the mechanism reset after performing the inspection.

1: Glass substrate inspection system

10: Microprocessor unit

13: Calculation Logic of Perforation Compensation Angle Per Unit Area

14: Perforated waist detection algorithm

20: Carrier unit

30: First detection device

40: Second detection device

50: Power supply module

Claims (10)

A glass substrate detection system comprises: a microprocessing unit (10), a carrier unit (20), a first detection device (30) and a second detection device (40); wherein the microprocessing unit (10), the first detection device (30) and the second detection device (40) are respectively assembled on the carrier unit (20), and the microprocessing unit (10) is respectively electrically connected to and electrically controls the carrier unit (20), the first detection device (30) and the second detection device (40), so that the first detection device (30) and the second detection device (40) are respectively electrically connected to and electrically controlled by the carrier unit (20). Each corresponds to an object to be tested placed on the carrier unit (20); wherein the microprocessor unit (10) has a unit area perforation compensation angle calculation logic (13) and a perforation waist detection calculation logic (14), the perforation compensation angle calculation logic (13) is used to analyze and calculate the image recognition generated by the object to be tested placed on the carrier unit (20) and generate unit area perforation compensation angle judgment information, and the perforation waist detection calculation logic (14) is used to combine and calculate the unit area perforation compensation angle calculation logic (13) and generate perforation waist judgment information. A glass substrate inspection system as described in claim 1, wherein the supporting unit (20) includes a plate-shaped carrier (21), a carrier slide assembly (23), and a support arm (25) vertically adjacent to the carrier slide assembly (23), and the carrier (21) is pivoted on the carrier slide assembly (23) so that the object to be inspected placed on the carrier (21) can slide back and forth according to the track direction of the carrier slide assembly (23). A glass substrate inspection system as described in claim 2, wherein the carrier (21) of the supporting unit (20) has a top (212) and a bottom (213) corresponding to the top (212); wherein the top (212) of the carrier (21) is provided with a plurality of spaced-apart protrusions (214) so that the object to be tested can be carried on the protrusions (214); and the bottom (213) of the carrier (21) is used to pivot on the carrier slide assembly (23) so that the object to be tested placed on the carrier (21) can slide back and forth according to the track direction of the carrier slide assembly (23). A glass substrate inspection system as described in claim 3, wherein the support arm (25) of the supporting unit (20) comprises a first slide rail group (251), a second slide rail group (253) and a base (255), wherein the first slide rail group (251) is arranged on the same side of the support arm (25) as the carrier slide rail group (23), the second slide rail group (253) is pivotally mounted on the first slide rail group (251), and the slide rail extension direction of the second slide rail group (253) is arranged crosswise with the first slide rail group (251), and the base (255) is pivotally mounted on the second slide rail group (253); wherein, The second slide rail assembly (253) and the base (255) can perform reciprocating sliding motion according to the track extension direction of the first slide rail assembly (251). A glass substrate inspection system as described in claim 4, wherein the first inspection device (30) and the second inspection device (40) are respectively installed on the base (255) of the supporting arm (25) of the supporting unit (20). A glass substrate inspection system as described in claim 2, wherein the support arm (25) of the supporting unit (20) comprises a first slide rail group (251), a second slide rail group (253) and a base (255), wherein the first slide rail group (251) is arranged on the same side of the support arm (25) as the carrier slide rail group (23), the second slide rail group (253) is pivotally mounted on the first slide rail group (251), and the slide rail extension direction of the second slide rail group (253) is arranged crosswise with the first slide rail group (251), and the base (255) is pivotally mounted on the second slide rail group (253); wherein, The second slide rail assembly (253) and the base (255) can perform reciprocating sliding motion according to the track extension direction of the first slide rail assembly (251). A glass substrate inspection system as described in claim 6, wherein the first inspection device (30) and the second inspection device (40) are respectively installed on the base (255) of the supporting arm (25) of the supporting unit (20). A glass substrate inspection system as described in any one of claims 1 to 7, wherein the first inspection device (30) includes a camera module (31) electrically connected to and electrically controlled by the microprocessor unit (10), and the camera module (31) is vertical and corresponds to the object to be inspected placed on the carrier unit (20); wherein the second inspection device (40) includes a camera module (41) electrically connected to and electrically controlled by the microprocessor unit (10), and the camera module (41) is arranged at a predetermined tilt angle with respect to the object to be inspected placed on the carrier unit (20). A glass substrate inspection system as described in claim 8, wherein the unit area perforation compensation angle discrimination information generated by the unit area perforation compensation angle calculation logic (13) of the microprocessor unit (10) includes a perforation compensation angle formed between any actual perforation and its matching imaginary compensation line (L), wherein the perforation compensation angle is between 0 degrees and 50 degrees based on the imaginary compensation line (L). A glass substrate detection system as described in claim 9, wherein the perforation waist identification information generated by the perforation waist detection algorithm (14) of the microprocessor unit (10) includes that any actual perforation waist is smaller than or equal to the aperture of any actual perforation.