TWM658698U - Lower fixture device with heating and cooling functions - Google Patents

Abstract

The lower fixture device with heating and cooling functions is arranged on a carrier of a pressing device, and includes a lifting mechanism, a lower fixture assembly and a heat conducting plate. The lifting mechanism includes a base, a movable seat and a driving assembly. The base is arranged on the carrier, the driving assembly is arranged on the base and can drive the movable seat to move up and down, the lower fixture assembly is arranged on the movable seat, and the heat conducting plate is arranged on the top side of the carrier. During the pressing process, the driving assembly drives the movable seat to rise so that the lower fixture assembly being heated is away from the heat conducting plate. After the process is completed, the lower fixture assembly stops heating and descends to contact the heat conducting plate. The heat is dissipated and cooled through heat conduction on the heat conducting plate, shortening the cooling time of the lower fixture assembly for the next pressing process, thereby shortening the overall operation time, improving operation efficiency and reducing operation costs.

Description

Lower fixture device with heating and cooling functions

The invention relates to a lower fixture device with heating and cooling functions, and is particularly suitable for use in a pressing device for a semiconductor process, wherein the lower fixture can be heated and cooled quickly.

The pressing process is a process in which the workpiece is pressurized and heated by the upper and lower fixtures of a pressing device so that the substrate and components in the workpiece are tightly bonded through adhesive. For example, electronic parts in the semiconductor industry often need to be processed using the pressing process.

Among them, due to the different materials of the components or adhesives in the workpieces, some workpieces need to go through a certain period of time and temperature control process to reach the target temperature during pressing so that the bonding quality meets the requirements. Therefore, while the workpiece is pressed by the upper and lower fixtures, it will be heated from an initial temperature to a target temperature, and after maintaining the target temperature for a certain period of time, the substrate and components of the workpiece are bonded. When the pressing equipment completes the pressing process of a workpiece, it is necessary to wait for the temperature of the lower fixture to cool from the target temperature to the initial temperature before the pressing equipment can press the next workpiece.

However, whether cooling is performed by natural cooling or by blowing compressed air, it takes a long time to cool the lower fixture, which results in a longer total working time of the pressing equipment for each workpiece, so the overall operation efficiency is low and more resources are consumed, increasing the overall operation cost, and there is still room for improvement.

The main purpose of the present invention is to provide a lower fixture device with heating and cooling functions, hoping to improve the current problem that the lower fixture needs to spend more time to cool down, resulting in longer overall operation time, lower operation efficiency and more resource consumption, resulting in increased overall operation cost.

To achieve the above-mentioned purpose, the lower fixture device with heating and cooling functions is arranged on a carrier of a pressing device and is controlled by the pressing device. The lower fixture device includes: A lifting mechanism, which includes a base, a movable seat and a driving assembly. The base is arranged on the bottom side of the carrier, and the movable seat is arranged on the base and is located on the top side of the carrier so as to be movable up and down. The driving assembly is arranged on the base and connected to the movable seat, and can drive the movable seat to move up and down; A lower fixture assembly, which is arranged on the movable seat and can be heated; and A heat conducting plate is arranged on the top side of the carrier and below the lower fixture assembly. When the movable seat rises, the lower fixture assembly moves away from the heat conducting plate, and the pressing device controls the lower fixture assembly to heat up. When the movable seat descends, the pressing device controls the lower fixture assembly to stop heating, and the lower fixture assembly contacts the heat conducting plate to dissipate heat and cool down.

The lower fixture device with heating and cooling functions is used in the pressing device and can quickly cool the lower fixture assembly. During the pressing operation, a workpiece is introduced and placed on the heated lower fixture assembly. The driving assembly of the lifting mechanism causes the movable seat to rise, so that the workpiece is pressed and heated by the lower fixture assembly and the upper fixture of the pressing device. At the same time, the lower fixture assembly is far away from the heat conducting plate, so the heat conducting plate will not transmit heat. The heat of the lower fixture assembly is dispersed through the heat conduction plate. When the pressing process is completed, the lower fixture assembly stops heating, and the driving assembly simultaneously lowers the movable seat. The lower fixture assembly will contact the heat conduction plate and dissipate heat through the heat conduction of the heat conduction plate, so that the lower fixture assembly can be cooled down quickly, effectively shortening the cooling time for the next workpiece processing, thereby shortening the overall operation time, improving the operation efficiency and reducing the overall operation cost.

Please refer to Figures 1 to 3, which are a preferred embodiment of the new lower fixture device with heating and cooling functions. It is arranged on a carrier 70 of a pressing device and is controlled by the pressing device. The lower fixture device with heating and cooling functions includes a lifting mechanism 10, a lower fixture assembly 20 and a heat conducting plate 30.

As shown in Figures 2 and 3, the lifting mechanism 10 includes a base 11, a movable seat 12 and a driving assembly 13. The base 11 is arranged on the bottom side of the carrier 70, the movable seat 12 is arranged on the base 11 and is located on the top side of the carrier 70 so as to be movable up and down. The driving assembly 13 is arranged on the base 11 and connected to the movable seat 12, and can drive the movable seat 12 to move.

As shown in FIG. 1 and FIG. 3 , the lower fixture assembly 20 is disposed on the movable seat 12 and can be heated.

As shown in Figures 1, 3, 7 and 8, the heat conductive plate 30 is disposed on the top side of the carrier 70 and is located below the lower fixture assembly 20. When the movable seat 12 rises, the lower fixture assembly 20 moves away from the heat conductive plate 30, and the pressing device controls the lower fixture assembly 20 to heat up. When the movable seat 12 descends, the pressing device controls the lower fixture assembly 20 to stop heating, and the lower fixture assembly 20 contacts the heat conductive plate 30 to dissipate heat and cool down.

As shown in FIG. 7 , the novel lower jig device with heating and cooling functions is used in the pressing device, and is a lower jig device capable of quickly cooling the lower jig assembly 20. During the pressing operation, a workpiece is introduced and placed on the lower jig assembly 20, and the driving assembly 13 of the lifting mechanism 10 causes the movable seat 12 to rise, so that the workpiece is pressed and heated by the lower jig assembly 20 and the upper jig of the pressing device. At the same time, the lower jig assembly 20 is far away from the heat conducting plate 30, so the heat conducting plate 30 will not conduct and disperse the heat of the lower jig assembly 20.

As shown in FIG8 , after the pressing process is completed, the driving assembly 13 causes the movable seat 12 to descend, and the lower fixture assembly 20 will contact the heat conducting plate 30 and dissipate heat through heat conduction of the heat conducting plate 30, so that the lower fixture assembly 20 can be cooled quickly, effectively shortening the cooling time of the lower fixture assembly 20. When the lower fixture assembly 20 cools to the preset cooling temperature, the lifting mechanism 10 will be actuated to move the lower fixture assembly 20 away from the heat conducting plate 30 for use in the next workpiece processing, thereby shortening the overall operation time, improving the operation efficiency and reducing the overall operation cost.

As shown in FIG. 4 , the heat conducting plate 30 includes a heat conducting body 31 and a plurality of elastic parts 32. The plurality of elastic parts 32 are disposed on the bottom side of the heat conducting body 31 and abut against the carrier 70, so that a gap is formed between the heat conducting body 31 and the carrier 70. When the lower fixture assembly 20 contacts the heat conducting body 31, the plurality of elastic parts 32 push the heat conducting body 31, so that the heat conducting body 31 abuts against the lower fixture assembly 20. The plurality of elastic parts 32 are preferably springs, and the heat conducting body 31 is preferably made of a metal material with a high thermal conductivity coefficient and a large specific heat, which can enhance the cooling ability and cooling speed of the heat conducting plate 30.

As shown in FIG9 and FIG10, when the movable seat 12 drives the lower fixture assembly 20 to descend and contact the heat-conducting body 31, the plurality of elastic members 32 will be compressed and push against the heat-conducting body 31, so that the heat-conducting body 31 and the lower fixture assembly 20 are closely fitted, thereby improving the heat conduction and heat dissipation effect. Preferably, the area of the upper surface of the heat-conducting body 31 is larger than the area of the lower fixture assembly 20, and the heat conduction and heat dissipation effect is improved by maximizing the contact area between the heat-conducting body 31 and the lower fixture assembly 20.

In addition, as shown in FIG. 3 , FIG. 5 and FIG. 6 , the lower fixture device with heating and cooling functions includes a heat dissipation structure 40, which is disposed on the bottom side of the heat conducting plate 30 and has a plurality of heat dissipation fins 41, which are arranged at intervals and extend downward. The heat of the heat conducting plate 30 can be transferred to the heat dissipation structure 40, and the heat dissipation of the heat conducting plate 30 can be enhanced through the heat dissipation fins 41 of the heat dissipation structure 40, and the heat dissipation process of the heat conducting plate 30 can be accelerated, thereby reducing the cooling time of the lower fixture assembly 20.

Furthermore, as shown in Figures 5 and 6, a plurality of air ducts 42 are formed inside the heat dissipation structure 40, each of the air ducts 42 is wound around the inside of the heat dissipation structure 40, and two air inlet and outlet ends 421 are formed on the surface of the heat dissipation structure 40. As shown in Figure 3, the lower fixture device with heating and cooling functions includes at least one cooling fluid supply module 50, and the at least one cooling fluid supply module 50 is connected to the air inlet and outlet ends 421 of the plurality of air ducts 42, and supplies fluid, such as gas, liquid, or a refrigerant with a gas-liquid phase change, to the plurality of air ducts 42.

Among them, the at least one cooling fluid supply module 50 supplies gas to the air duct 42 of the heat dissipation structure 40, so that the gas enters the interior of the heat dissipation structure 40 through one of the air inlet and outlet ends 421 of the plurality of air ducts 42, and is discharged from another air inlet and outlet end 421 after passing through a circuitous path. The heat of the heat dissipation structure 40 is taken out by the continuously flowing gas, so that the heat dissipation structure 40 is cooled, which can improve the cooling efficiency.

In addition, the at least one cooling fluid supply module 50 can be connected to an air pressure switching valve and then connected to the two air inlet and outlet ends 421. The two air inlet and outlet ends 421 can both serve as inlets and outlets for introducing gas into or out of the heat dissipation structure 40, so that the heat dissipation structure 40 can dissipate heat evenly, thereby making the temperatures at different positions of the heat conducting plate 30 similar, avoiding uneven heat dissipation.

Preferably, the at least one cooling fluid supply module 50 is a vortex tube, and the cold end of the vortex tube is connected to the air inlet and outlet ends 421 of the plurality of air ducts 42, so that the at least one cooling fluid supply module 50 can provide low-temperature gas to the heat dissipation structure 40, further cooling the heat dissipation structure 40 to improve the cooling efficiency, and by supplying cooling gas through the vortex tube, the lower fixture device with heating and cooling functions does not need to be cooled by water or coolant, which is more environmentally friendly and can prevent water from causing equipment abnormalities.

Furthermore, as shown in FIG. 2 and FIG. 3 , the lower fixture device with heating and cooling functions includes at least one heat dissipation fan 60, which is disposed below the heat conducting plate 30. The at least one heat dissipation fan 60 can blow air toward the heat conducting plate 30 or blow air in a direction away from the heat conducting plate 30, and can forcibly remove the heat around the heat conducting plate 30 and the heat dissipation structure 40, take away the heat of the heat dissipation fins 41 of the heat dissipation structure 40, and enhance the heat dissipation effect of the heat conducting plate 30. The at least one heat dissipation fan 60 can also be disposed on the bottom side of the heat dissipation structure 40.

When the lower fixture assembly 20 cools to a preset cooling temperature and is away from the heat conducting plate 30, the at least one heat dissipation fan 60 can continue to operate, so that the temperature of the heat conducting plate 30 and the heat dissipation structure 40 is cooled in advance and lowered to room temperature. When the lower fixture assembly 20 is still in an ascending state and is still pressing the workpiece, according to the process requirements, a few minutes before the end of the pressing, the at least one heat dissipation fan 60 can be operated continuously to cool the temperature of the heat conducting plate 30 and the heat dissipation structure 40 in advance and lower to room temperature. The lack of a cooling fluid supply module 50 can further cool down the heat conductive plate 30 and the heat dissipation structure 40 in advance. Therefore, when the lower fixture assembly 20 descends and contacts the heat conductive plate 30, there is already a large temperature difference between the lower fixture assembly 20 and the heat conductive plate 30, and the lower fixture assembly 20 can be cooled down more quickly, shortening the cooling time of the lower fixture assembly 20.

In addition, as shown in Figures 2 and 3, the driving assembly 13 of the lifting mechanism 10 includes a driving member 131 and a screw 132. The driving member 131 is arranged on the base 11 and connected to the screw 132, and can rotate the screw 132. The screw 132 is arranged vertically. The movable seat 12 includes a plurality of guide rods 121 and a nut 122. The plurality of guide rods 121 pass through the base 11 vertically respectively. The nut 122 is arranged on the screw 132. The driving member 131 is preferably a motor. When the driving member 131 drives the screw rod 132 to rotate, the nut 122 can rise or fall along the screw rod 132 , and the plurality of guide rods 121 can improve the movement stability of the movable seat 12 .

In addition, as shown in Figures 3 and 4, the lower fixture assembly 20 includes a heating element 21 and a lower fixture element 22. The heating element 21 is disposed on the movable seat 12 and can contact the heat conductive plate 30 when the movable seat 12 descends. The lower fixture element 22 is disposed on the top side of the heating element 21 and is heated by the heating element 21. When the lower fixture assembly 20 is cooled, the heating element 21 will stop heating and be cooled together with the lower fixture element 22 by the heat conductive plate 30, the heat dissipation structure 40 and the at least one heat dissipation fan 60, so that the entire lower fixture assembly 20 can be lowered to a preset cooling temperature together.

The heating element 21 is provided with a plurality of heating rods 211, and the plurality of heating rods 211 are controlled by the pressing device to heat the lower fixture 22. Since the heating element 21 is heated by the plurality of heating rods 211, it has the advantage of convenient assembly and replacement.

In addition, as shown in Figures 3, 7 and 8, the lower fixture device with heating and cooling functions also includes a plurality of temperature sensors TS. At least one temperature sensor TS is respectively arranged on the heating element 21, the lower fixture element 22, the heat conducting plate 30 and the heat dissipation structure 40. The temperature sensor TS can respectively sense the temperature of the corresponding component to which it is arranged, so as to accurately control the heating and cooling of each component. For example, if the lower fixture 22 needs to be heated to a preset target temperature of 100 degrees Celsius, the heating element 21 needs to be set to a temperature higher than the preset target temperature of the lower fixture 22, such as 110 degrees Celsius, and the temperature is measured by the temperature sensors TS respectively disposed on the heating element 21 and the lower fixture 22 to ensure that the lower fixture 22 can be heated to its preset target temperature. When the heat conducting plate 30 is cooled in advance, if the preset target temperature of the heat conducting plate 30 is 40 degrees Celsius, the temperature of the heat dissipation structure 40 cooled by the at least one cooling fluid supply module 50 must be lower than the preset target temperature of the heat conducting plate 30, such as 30 degrees Celsius, and the temperature is measured by the temperature sensors TS respectively arranged on the heat conducting plate 30 and the heat dissipation structure 40 to ensure that the heat conducting plate 30 can be cooled to its preset target temperature.

Please refer to Figure 11, which is a relationship diagram between the temperature change and time of the lower fixture component 22 of the lower fixture device with heating and cooling functions of the present invention and the lower fixture component 80 through compressed air cooling. The time for the workpiece to maintain the preset target temperature and perform the pressing process is T1. After the process is completed, the time for the lower fixture component 22 of the lower fixture device with heating and cooling functions of the present invention to cool to the preset cooling temperature is T2, and the time for the lower fixture component 80 to cool to the preset cooling temperature through compressed air is T3. It is obvious that the lower fixture device with heating and cooling functions of the present invention can indeed effectively shorten the cooling time of the lower fixture assembly 20.

In summary, after the pressing process of the lower fixture assembly 20 of the lower fixture device with heating and cooling functions is completed, the lifting mechanism 10 makes the lower fixture assembly 20 descend and contact the heat conducting plate 30, and dissipates heat through the heat conduction of the heat conducting plate 30, so that the lower fixture assembly 20 can be cooled quickly, effectively shortening the cooling time for the next workpiece processing, thereby shortening the overall operation time, improving the operation efficiency and reducing the overall operation cost. The heat dissipation structure 40, the at least one cooling fluid supply module 50 and the at least one heat dissipation fan 60 can further improve the heat dissipation efficiency and shorten the cooling time.

10: Lifting mechanism 11: Base 12: Movable seat 121: Guide rod 122: Nut 13: Driving assembly 131: Driving part 132: Screw 20: Lower fixture assembly 21: Heating element 211: Heating rod 22: Lower fixture 30: Heat conducting plate 31: Heat conducting body 32: Elastic element 40: Heat dissipation structure 41: Heat dissipation fin 42: Air duct 421: Air inlet and outlet 50: Cooling fluid supply module 60: Cooling fan 70: Carrier 80: Lower fixture TS: Temperature sensor T1, T2, T3: Time

Figure 1: A three-dimensional schematic diagram of a preferred embodiment of the lower fixture device with heating and cooling functions of the present invention. Figure 2: A three-dimensional schematic diagram of another preferred embodiment of the lower fixture device with heating and cooling functions of the present invention. Figure 3: A front view plane schematic diagram of the lower fixture device with heating and cooling functions of the present invention. Figure 4: A partial front view cross-sectional schematic diagram of the lower fixture device with heating and cooling functions of the present invention. Figure 5: A three-dimensional schematic diagram of the heat dissipation structure of the lower fixture device with heating and cooling functions of the present invention. Figure 6: A top view cross-sectional schematic diagram of the heat dissipation structure of the lower fixture device with heating and cooling functions of the present invention. Figure 7: A front view plane schematic diagram of the movable seat and the lower fixture assembly of the lower fixture device with heating and cooling functions of the present invention. Figure 8: A schematic diagram of the movable seat of the lower fixture device with heating and cooling functions and the lower fixture assembly descending from the front view plane. Figure 9: A schematic diagram of the elastic part of the heat conducting plate of the lower fixture device with heating and cooling functions when the lower fixture assembly rises from the front view plane. Figure 10: A schematic diagram of the elastic part of the heat conducting plate of the lower fixture device with heating and cooling functions when the lower fixture assembly descends from the front view plane. Figure 11: A diagram showing the relationship between the lower fixture cooling of the lower fixture of the lower fixture device with heating and cooling functions and the temperature change of the lower fixture through compressed air cooling and time.

10: Lifting mechanism

11: Base

12: Movable seat

121: Guide rod

122: Nut

13: Drive assembly

131:Driver

132: Screw

20: Lower fixture assembly

21: Heating element

211: Heating rod

22: Lower fixture

30: Heat conducting plate

31: Heat conducting body

40: Heat dissipation structure

50: Cooling fluid supply module

60: Cooling fan

70: Carrier

TS: Temperature sensor

Claims (10)

A lower fixture device with heating and cooling functions, which is arranged on a carrier of a pressing device and is controlled by the pressing device, and the lower fixture device comprises: A lifting mechanism, which comprises a base, a movable seat and a driving assembly, the base is arranged on the bottom side of the carrier, the movable seat is arranged on the base and is movable up and down and is located on the top side of the carrier, the driving assembly is arranged on the base and connected to the movable seat, and can drive the movable seat to move up and down; A lower fixture assembly, which is arranged on the movable seat and can be heated; and A heat conducting plate is arranged on the top side of the carrier and below the lower fixture assembly. When the movable seat rises, the lower fixture assembly moves away from the heat conducting plate, and the pressing device controls the lower fixture assembly to heat up. When the movable seat descends, the pressing device controls the lower fixture assembly to stop heating, and the lower fixture assembly contacts the heat conducting plate to dissipate heat and cool down. A lower fixture device with heating and cooling functions as described in claim 1, wherein the heat conductive plate comprises a heat conductive body and a plurality of elastic parts, the plurality of elastic parts are arranged on the bottom side of the heat conductive body and abut against the carrier, so that a gap is formed between the heat conductive body and the carrier, and when the lower fixture assembly contacts the heat conductive body, the plurality of elastic parts push the heat conductive body, so that the heat conductive body abuts against the lower fixture assembly. A lower fixture device with heating and cooling functions as described in claim 2, wherein the area of the upper surface of the heat conductive body is larger than the area of the lower fixture assembly. A lower fixture device with heating and cooling functions as described in claim 1, wherein the lower fixture device with heating and cooling functions includes a heat dissipation structure, which is arranged on the bottom side of the heat conductive plate and has a plurality of heat dissipation fins, which are arranged at intervals and extend downward. The lower fixture device with heating and cooling functions as described in claim 1, wherein the lower fixture device with heating and cooling functions comprises at least one heat dissipation fan, and the at least one heat dissipation fan is arranged below the heat conductive plate. A lower fixture device with heating and cooling functions as described in claim 4, wherein the lower fixture device with heating and cooling functions comprises at least one heat dissipation fan, and the at least one heat dissipation fan is arranged below the heat conductive plate and on the bottom side of the heat dissipation structure. A lower fixture device with heating and cooling functions as described in claim 4 or 6, wherein a plurality of air ducts are formed inside the heat dissipation structure, each of the air ducts winds around inside the heat dissipation structure and forms two air inlet and outlet ends on the surface of the heat dissipation structure, and the lower fixture device with heating and cooling functions includes at least one cooling fluid supply module, which is connected to the air inlet and outlet ends of the plurality of air ducts and supplies gas to the plurality of air ducts. A lower fixture device with heating and cooling functions as described in claim 7, wherein the at least one cooling fluid supply module is a vortex tube, and the cold end of the vortex tube is connected to the air inlet and outlet ends of the plurality of air ducts. A lower fixture device with heating and cooling functions as described in any one of claims 1 to 6, wherein the lower fixture assembly includes a heating element and a lower fixture element, the heating element is arranged on the movable seat and can contact the heat conductive plate when the movable seat descends, and the lower fixture element is arranged on the top side of the heating element and is heated by the heating element. A lower fixture device with heating and cooling functions as described in any one of claims 1 to 6, wherein the driving assembly of the lifting mechanism includes a driving member and a screw, the driving member is arranged on the base and connected to the screw, and can rotate the screw, the screw is arranged vertically, and the movable seat includes a plurality of guide rods and a nut, the plurality of guide rods respectively pass through the base vertically, and the nut is arranged on the screw.

Images