TWI860063B - Thermal conductive device and handler using the same - Google Patents

Abstract

The present invention is a thermal conductive device, which includes a first flow path and a second flow path, and the first flow path and the second flow path are layered settings and non-connected. The second flow path is set near a workpiece. Good cooling or heat dissipation effects can be provided through the second flow path, and the temperature adjustment is provided through the first flow path. The heating effect is not affected, and it can avoid the temperature of the thermal conductive device too high or the instantaneous changes to damage the situation of the workpiece can be avoided. In addition, a handler of the present invention has the aforementioned thermal conductive device. By monitoring the temperature changes of the thermal conductive device, the flow, flow rate, or temperature of the fluid in the first second flow path and the second flow path can be regulated to reach the purpose of temperature control.

Description

Heat transfer device and sorting machine using the heat transfer device

The present invention relates to semiconductor testing technology, particularly to a heat transfer device and a sorting machine using the heat transfer device.

After manufacturing, semiconductor components such as semiconductor packages, integrated circuits (ICs) or chips must undergo many tests to ensure that the semiconductor components as products can operate normally when used. Among the aforementioned tests, a sorting machine is usually used for testing. During the testing process of semiconductor components, high heat will be generated. Therefore, the sorting machine needs to control the temperature of the semiconductor components.

Specifically, the classifier may include a carrier unit for carrying the semiconductor element to be tested, a driving unit disposed above the carrier unit, and a heat transfer unit disposed below the driving unit, wherein the heat transfer unit may include a body, a heating rod embedded in the body, and a heat exchanger disposed under the body and used to contact the semiconductor element. The heat transfer unit is driven by the driving unit to move relative to the semiconductor element, that is, During the test, the drive unit moves the heat transfer unit so that the bottom surface of the heat exchanger contacts the semiconductor element to be tested, thereby providing heat dissipation through its body. When the operating temperature of the semiconductor element does not meet the test requirements, the heating rod can be used to heat it up. Thus, the heat transfer unit provides a temperature that meets the test requirements to detect the performance of the semiconductor element during operation, thereby achieving the purpose of confirming the quality of the product.

However, the heat transfer unit of the known sorting machine uses the body for cooling and the heating rod in the body for heating. Therefore, it cannot provide the function of temperature regulation during the heating process, and may cause damage to the semiconductor components due to overheating. Although the cooling function of the body can be used to control the heating temperature, the heating effect may be suppressed, so that the heating rod needs to increase the heating power, resulting in power consumption problems and reducing the service life of the heating rod. In addition, since the heat transfer unit must be provided with a heat exchanger for contacting the semiconductor component, when providing cooling through the body, the temperature will inevitably be transferred through the heat exchanger, resulting in a considerable distance between the body that provides cooling and heating functions and the semiconductor component, which will affect the cooling and heating effects.

In view of the above problems, how to provide a structural device suitable for providing heat conduction, especially, how to simultaneously consider the heating and cooling requirements to achieve a good temperature control effect, will become the goal that people in this technical field are eager to pursue.

In order to solve the above-mentioned problems of the prior art, the present invention discloses a heat transfer device that contacts a workpiece and provides temperature regulation. The heat transfer device includes: a device body; a first flow channel disposed in the device body; and a second flow channel disposed in the device body and not connected to the first flow channel. The second flow channel is located below the first flow channel and close to the workpiece, so as to guide a fluid to regulate the temperature of the workpiece.

In one embodiment, the first flow channel is adapted to direct another fluid to provide temperature regulation of the device body.

In one embodiment, the temperature of the fluid and the other fluid is lower than the working temperature of the workpiece.

In a specific embodiment, the device body further includes a conducting body and a heat exchange body located under the conducting body and used to contact the workpiece, wherein the first flow channel is formed in the conducting body and includes a first water inlet and a first water outlet for the other fluid to enter and exit. In another specific embodiment, the second flow channel is formed in the heat exchange body or is partially formed in the conducting body and partially formed in the heat exchange body, and the second flow channel includes a second water inlet and a second water outlet for the fluid to enter and exit.

In one embodiment, the first water inlet, the first water outlet, the second water inlet and the second water outlet are substantially located on the same horizontal plane.

In another embodiment, a plurality of microchannels are formed in the second flow channel.

In another embodiment, at least one heat sink having a plurality of fins is disposed in the second flow channel to form each of the micro-flow channels between each of the fins.

In another embodiment, the heat transfer device of the present invention further includes a plurality of heating elements disposed in the heat exchange body.

In another embodiment, the channel width of the first flow channel is greater than the channel width of each of the micro-flow channels. In a specific embodiment, the spacing between adjacent fins is less than 0.5 mm.

The present invention further discloses a sorting machine, comprising: a test carrier for carrying a workpiece; a moving device located above the test carrier; and a heat transfer device as described in any of the aforementioned embodiments, which is located below the moving device and is driven by the moving device to move relative to the test carrier.

In one embodiment, the sorting machine is connected to a cooling device, and the cooling device is connected to the first flow channel and the second flow channel.

In another embodiment, the sorting machine is connected to a control device, which is used to monitor the temperature change of the heat transfer device to control the cooling device according to the preset test temperature to adjust the temperature of the heat transfer device.

In another embodiment, the moving device is operated by a pneumatic cylinder, a hydraulic cylinder or a screw to move the heat transfer device.

As can be seen from the above, the heat transfer device of the present invention uses the first flow channel and the second flow channel arranged in layers to make the second flow channel for cooling close to the workpiece, so as to provide a good cooling or heat dissipation effect when the workpiece is tested. When the operating temperature of the workpiece does not meet the requirements and the heating element is used for heating, the temperature is adjusted through the first flow channel to adjust the heating effect. Thus, the temperature of the heat transfer device is prevented from being too high or the instantaneous change is too large, which may cause damage to the workpiece. In addition, the sorting machine of the present invention having the above-mentioned heat transfer device controls the flow rate, flow velocity or temperature of the fluid supplied to the first flow channel and the second flow channel by monitoring the temperature change of the heat transfer device, so as to achieve the purpose of temperature control.

1: Heat transfer device

1a: Device body

11: First flow channel

111: First water inlet

112: First water outlet

113: Heat sink fins

12: Second flow channel

121: Second water inlet

122: Second water outlet

123: Microfluidics

13: Conducting entity

131: First Space

132: First upper surface

133: First lower surface

134: The Third Space

14: Heat exchange body

141: Second Space

142: Second upper surface

143: Second lower surface

144: Spacer

15: Heating element

16: Heat sink

161: Fins

17: Cover plate

8: IC sorting equipment

81: Sorting machine

811: Test platform

812: Mobile device

8121:Connection part

813: Heat transfer device

814: Test base

82: Cooling device

83: Control device

84: Processing device

9: Workpiece

F1: First fluid

F2: Second fluid

Figure 1 is a three-dimensional structural diagram of the heat transfer device of the present invention.

Figure 2 is a cross-sectional view of the first flow channel of the heat transfer device of the present invention.

Figure 3 is a cross-sectional view of the second flow channel of the heat transfer device of the present invention.

Figure 4 is a schematic diagram of the test structure of the heat transfer device of the present invention.

Figure 5 is an exploded view of the heat transfer device of the present invention.

Figure 6 is an elevation view of the conductive body of the heat conduction device of the present invention.

Figure 7 is a schematic diagram of the structure of the S-shaped second flow channel in the heat transfer device of the present invention.

Figure 8 is a structural diagram of an IC sorting machine using the heat transfer device of the present invention.

Figure 9 is a schematic diagram of the structure of a sorting machine having the heat transfer device of the present invention.

Figures 10A-10B are schematic diagrams of the structure of other embodiments of the first flow channel of the heat transfer device of the present invention.

The following describes the technical content of the present invention through a specific concrete implementation form. People familiar with this technology can easily understand the advantages and effects of the present invention from the content disclosed in this manual. However, the present invention can also be implemented or applied through other different specific implementation forms.

FIG. 1 is a three-dimensional structural diagram of the heat transfer device of the present invention, FIG. 2 is a cross-sectional view of the first flow channel of the heat transfer device of the present invention, FIG. 3 is a cross-sectional view of the first flow channel of the heat transfer device of the present invention, and FIG. 4 is a schematic diagram of the test structure of the heat transfer device of the present invention. As shown in the figure, the heat transfer device 1 of the present invention includes a device body 1a and a first flow channel 11 and a second flow channel 12 arranged in the device body 1a. When the heat transfer device 1 of the present invention is used, as shown in FIG. 4, after its bottom contacts a workpiece 9 such as a semiconductor element, the temperature of the workpiece 9 is controlled by guiding fluid through the first flow channel 11 and the second flow channel 12. The heat transfer device 1 of the present invention can be applied to a liquid cooling system, and this is used as an example for explanation below. The detailed description of the heat transfer device 1 of the present invention is as follows.

The first flow channel 11 allows the first fluid F1 to flow through (as shown in FIG. 2 ), and the temperature of the first fluid F1 is used to adjust the temperature of the heat transfer device 1. The temperature adjustment can be controlled by adjusting the flow rate, flow rate (i.e., the flow rate flowing into the heat transfer device per unit time) or temperature of the first fluid F1, so that the overall temperature of the heat transfer device 1 meets the test temperature to be tested. That is, the first flow channel 11 can adjust the temperature of the heat transfer device 1 to the test temperature when the workpiece 9 is tested, or when the workpiece 9 is tested under high power operation, the heat in the heat transfer device 1 is conducted out to achieve a cooling effect. Accordingly, the present invention can control the temperature of the heat transfer device 1 through the first flow channel 11.

The second flow channel 12 can guide the second fluid F2 to flow through (as shown in FIG. 3 ) to cool or reduce the temperature of the workpiece 9, and provide a corresponding cooling or cooling effect by controlling the flow rate, flow velocity or liquid temperature of the second fluid F2 flowing through the second flow channel 12, for example, increasing the flow rate, flow velocity or reducing the liquid temperature can enhance the temperature reduction effect; further, the second flow channel 12 of the present invention is not connected to the first flow channel 11, and the second flow channel 12 is located below the first flow channel 11 and close to the workpiece 9. When the workpiece 9 generates high heat due to testing, the second flow channel 12 can provide cooling or cooling to the workpiece 9 through the heat transfer device 1. In one embodiment, the said non-connection means that the first fluid F1 in the first flow channel 11 and the second fluid F2 in the second flow channel 12 will not mix with each other.

In one embodiment, the temperature of the first fluid F1 and the second fluid F2 are both lower than the working temperature of the workpiece 9, so that when the workpiece 9 is in operation, the temperature of the workpiece can be regulated by the temperature of the first fluid F1 and the second fluid F2.

Accordingly, as shown in FIG. 4 , the heat transfer device 1 of the present invention is used in actual applications. The first flow channel 11 and the second flow channel 12 are independent of each other and arranged in layers. The second flow channel 12 is located close to the workpiece 9. When the second fluid enters the second flow channel 12, it can provide a good and rapid cooling or heat dissipation effect. When the working temperature of the workpiece 9 does not reach the test standard and is heated, the first fluid is allowed to enter the first flow channel 11 to provide a temperature adjustment function to avoid overheating or overheating. The heat transfer device 1 of the present invention can effectively cool the workpiece 9 by making the second flow channel 12 close to the workpiece 9, so that the temperature of the workpiece 9 can be controlled below 100°C even when the workpiece 9 is operated at a power of 2000 watts (W) or even above 2000W.

Furthermore, the device body 1a of the heat transfer device 1 includes a transfer body 13 and a heat exchange body 14 located under the transfer body 13, and the heat transfer device 1 contacts the workpiece 9 through the heat exchange body 14 (as shown in FIG. 4 ). Specifically, the first flow channel 11 is formed in the transfer body 13, and the second flow channel 12 can be formed in the heat exchange body 14, for example, embedded in the heat exchange body 14, or partially formed in the transfer body 13 and partially formed in the heat exchange body 14, that is, the second flow channel 12 has a portion embedded in the heat exchange body 14 and another portion extending to the transfer body 13. Furthermore, the first flow channel 11 includes a first water inlet 111 and a first water outlet 112, and the second flow channel 12 includes a second water inlet 121 and a second water outlet 122. In a specific embodiment, the first water inlet 111, the first water outlet 112, the second water inlet 121 and the second water outlet 122 can be located on the same horizontal plane, but not limited to this, that is, the positions of the first water inlet 111, the first water outlet 112, the second water inlet 121 and the second water outlet 122 can be changed according to needs. Accordingly, the first flow channel 11 and the second flow channel 12 are connected to the outside through the first water inlet 111, the first water outlet 112, the second water inlet 121 and the second water outlet 122, that is, the first water inlet 111, the first water outlet 112, the second water inlet 121 and the second water outlet 122 are respectively connected to the first water inlet pipe, the first water outlet pipe, the second water inlet pipe and the second water outlet pipe (not shown) of the outside to guide the first fluid and the second fluid in and out.

In one embodiment, as shown in FIG. 3 , the present invention can form a plurality of microchannels 123 in the second channel 12, wherein the channel width of each microchannel 123 is smaller than the channel width of the first channel 11. Specifically, the second channel 12 can be provided with at least one heat sink 16 having a plurality of fins 161 to form each microchannel 123 between each fin 161. In a specific embodiment, the interval between two adjacent fins is less than 0.5 millimeters (mm). In other words, the channel width of each microchannel 123 is less than 0.5 mm. Based on this, the present invention can increase the heat dissipation area by providing a heat sink 16 and forming a plurality of microchannels, thereby achieving the purpose of improving the cooling effect.

FIG5 is an exploded view of the heat transfer device of the present invention. As shown in the figure, the conductive body 13 may form an S-shaped first space 131 inside to form the first flow channel. In a specific embodiment, the conductive body 13 may have a first upper surface 132 and a first lower surface 133 opposite to each other, and the S-shaped first space 131 is recessed at the first upper surface 132, and the first space 131 is sealed with a cover plate 17 to form the first flow channel. In another embodiment, a heat dissipation structure having a plurality of fins (not shown) may be provided in the first space 131 to enhance the temperature regulation effect.

As shown in FIG. 5 , the heat exchange body 14 has a second upper surface 142 and a second lower surface 143 opposite to each other, and a second space 141 recessed inwardly is formed on the second upper surface 142. In a specific embodiment, when the heat exchange body 14 is bonded to the conductive body 13 with the second upper surface 142, the first lower surface 133 is bonded to the second upper surface 142 to seal the second space 141, thereby forming a second flow channel. That is, in this embodiment, the second flow channel is formed only in the heat exchange body 14.

The heat transfer device 1 of the present invention can be provided with a plurality of heating elements 15, so that when the working piece does not reach the desired test temperature during the test process, the heating element 15 can heat the working piece to reach the desired test temperature. The heating element 15 can be a heating rod, specifically, it can be arranged at the bottom of the heat sink 16, or at the bottom of the heat exchange body 14, so as to be close to the working piece. As shown in FIG. 5, a plurality of installation holes can be opened at the bottom of the heat sink 16, so that each of the heating elements 15 can be embedded in each of the installation holes. The heat transfer device 1 of the present invention heats the heat exchange body 14 through each of the heating elements 15, so that the working piece 9 reaches the test temperature. In addition, the heat exchange body 14 can be placed below or on the side of the second flow channel as required, and can also provide cooling and heating effects.

FIG6 is an elevation view of the conductive body of the present invention, please refer to FIG5 together. In one embodiment, the first lower surface 133 of the conductive body 13 can correspond to the second space 141 to form a third space 134 that is recessed inward, so that when the conductive body 13 and the heat exchange body 14 are combined, the second space 141 and the third space 134 are connected to form the second flow channel, that is, in this embodiment, the second flow channel is partially located in the conductive body 13 and partially located in the heat exchange body 14 to form a larger second flow channel, so that the flow rate of the second fluid can be increased, thereby achieving the purpose of improving the cooling effect.

FIG7 is a schematic diagram of the structure of the S-shaped second flow channel in the heat transfer device of the present invention. As shown in the figure, the second flow channel can be a flow channel that meanders in an S shape. Specifically, a plurality of spacers 144 are arranged in the second space 141 of the heat exchange body 14 to separate the S-shaped second flow channel in the second space 141, and a plurality of heat sinks 16 are arranged in the second flow channel so that the second fluid can flow through each of the heat sinks 16 evenly.

FIG8 is a structural diagram of an IC sorting machine using the heat transfer device of the present invention, and FIG9 is a structural schematic diagram of a sorting machine having the heat transfer device of the present invention. As shown in the figure, the IC sorting machine 8 includes a sorting machine 81, a cooling device 82, a control device 83, and a processing device 84, wherein the sorting machine 81 has a heat transfer device 813 and is respectively connected to the cooling device 82 and the control device 83, and the processing device 84 is connected to the control device 83.

The cooling device 82 is connected to the first flow channel and the second flow channel of the heat transfer device 813 respectively to provide the first fluid and the second fluid respectively, wherein the first fluid and the second fluid may be water, but not limited thereto; in addition, when the first fluid and the second fluid flow through the first flow channel and the second flow channel, they may have the same or different flow rates, flow rates or temperatures to provide the required test temperature. In a specific embodiment, the cooling device 82 may be a chilled water host using a low-temperature fluid; in addition, the control device 83 It is used to monitor the temperature change of the heat transfer device 813, and control the cooling device 82 to provide the required fluid (such as the first fluid and the second fluid) according to the preset test temperature to cool down or adjust the temperature of the heat transfer device 813; in addition, the processing device 84 connected to the control device 83 can be an electronic device such as a computer or a mobile device, which can request the control device 83 to perform operations (temperature control operations), and can receive data monitored by the control device 83 or set the control device 83.

As shown in FIG. 9 , the sorting machine 81 includes a test carrier 811, a moving device 812 located above the test carrier 811, and a heat conduction device 813 located below the moving device 812, wherein the test carrier 811 is used to carry a workpiece 9 to provide a test environment for the workpiece 9. In one embodiment, the workpiece 9 is disposed on a test base (Socket) 814, and the test base 814 has a plurality of probes to transmit a test signal for testing the workpiece 9; furthermore, the moving device 812 is used to move the heat conduction device 813 located below (at the bottom) thereof. In a specific embodiment, the moving device 812 is operated by a pneumatic cylinder, a hydraulic cylinder, or a screw to move the heat conduction device 813; in addition, the moving device 812 is used to move the heat conduction device 813 located below (at the bottom) thereof. The bottom of the device 812 may further include a connecting portion 8121, and at least one fastener is disposed on the side of the connecting portion 8121. Specifically, for example, the fasteners are disposed on two opposite sides of the connecting portion 8121, and hooks are disposed on the heat conducting device 813 corresponding to each fastener. Each fastener holds the corresponding hook to fix the heat conducting device 813. In addition, the connecting portion 8121 may include a connecting portion 8121 having a connecting portion 8121 disposed on the connecting portion 8121. 21 can have multiple guides, and the heat conduction device 813 has guide holes corresponding to each of the guides. Accordingly, when the heat conduction device 813 is coupled to the connection part 8121, the heat conduction device 813 can be guided to the coupling position of the connection part 8121 through each of the guides corresponding to each of the guide holes, and then the heat conduction device 813 can be fixed through each of the fasteners to perform coupling.

As can be seen from the above, the heat conduction device 813 is located between the moving device 812 and the test platform 811. The moving device 812 drives the heat conduction device 813 to move relative to the workpiece 9. That is, during the test, the heat conduction device 813 is driven by the moving device 812 to contact the workpiece 9. The temperature control effect of the heat conduction device 813 is used to adjust the temperature of the workpiece 9 during the test process.

In actual testing, when the workpiece 9 is operated at high power, the control device 83 can be used to control the cooling device 82 to provide a second fluid to the second flow channel. The second fluid can be low-temperature ice water or other fluid that can provide cooling, so as to cool the workpiece 9. In addition, the cooling device 82 can stop or reduce the supply of the first fluid during the aforementioned test, or can simultaneously provide the first fluid for cooling. The fluid is supplied to the first flow channel, and the temperature is cooled by the dual flow channels, which can provide a larger flow rate and flow rate at the same time, and cool the temperature at full speed to achieve the purpose of effective cooling or heat dissipation; when the operating efficiency of the working piece 9 is reduced and fails to reach the test temperature, the heating element 15 (as shown in FIG. 5) heats the heat transfer device 813. At this time, the control device 83 monitors the temperature rise of the heat transfer device 813 and controls the temperature accordingly. The cooling device 82 provides the first fluid to the first flow channel. Specifically, the control device 83 controls the cooling device 82 by controlling, for example, a fluid valve, based on the temperature of the heat transfer device 813 and the preset required temperature, thereby changing the flow rate or unit flow rate of the first fluid flowing through the first flow channel. The temperature of the first fluid can also be directly changed to control the temperature of the heat transfer device 813. , to avoid the heating temperature of the heating element 15 being too high or the instantaneous heating temperature changing too fast to damage the workpiece 9. In one embodiment, when heating the workpiece 9, the supply of the second fluid can be stopped or reduced at the same time, that is, the second flow channel does not cool down to avoid the second flow channel affecting the heating effect of the heating element. It also makes it unnecessary for the heating element to continue heating, which can avoid reducing the service life of the heating element 15.

In summary, whether it is cooling or temperature control, it is related to the effect of the heat transfer device on the thermal resistance. In the heat transfer device, the total thermal resistance of the heat transfer includes the thermal convection resistance and the thermal conduction resistance. Specifically, in order to reduce the effect of various thermal resistances, the following formulas can be considered. The first formula is "thermal convection resistance = 1/(thermal convection coefficient × heat transfer area)", where the thermal convection coefficient is related to the flow rate. In this case, it is expected that the greater the flow rate, the larger the heat transfer area, and the lower the water temperature, the lower the thermal resistance is expected to be. In addition, the second formula is "thermal conduction resistance = conduction path length / (material heat transfer coefficient × heat transfer contact area)". In this case, it is expected that the larger the heat transfer coefficient, the larger the contact area, and the smaller the conduction path, the more conducive to reducing thermal resistance. In other words, the present invention can increase the flow rate of the fluid, provide low-temperature fluid, increase the heat transfer area and heat transfer contact area, and shorten the conduction path through the design of the first flow channel and the second flow channel in the above-mentioned heat transfer device, thereby achieving the effect of reducing thermal resistance.

In addition, in order to further reduce the thermal resistance of the heat transfer device of the present invention, as shown in Figures 10A-10B, it is a schematic diagram of the structure of other embodiments of the first flow channel of the present invention. As shown in Figure 10A, the first flow channel 11 of the present invention can adopt a large-area flow channel and be provided with a heat sink fin 113 to increase the heat transfer area; in addition, as shown in Figure 10B, the present invention can be provided with a plurality of first flow channels 11, and the figure shows two first flow channels 11, and each first flow channel 11 has a corresponding water inlet and outlet, and is provided with a heat sink fin 113, thereby increasing the flow rate of the fluid, thereby increasing the flow rate flowing through the heat transfer device of the present invention per unit time.

In addition, the second flow channel of the present invention can be designed to have multiple sub-flow channels, wherein each sub-flow channel is independent of each other and has its own water inlet and outlet, thereby increasing the flow rate and flow rate of the fluid; furthermore, the present invention can add a third flow channel or more other flow channels independent of the first flow channel and the second flow channel according to demand, that is, the cooling and temperature control effects can be achieved through multiple independent flow channels without limiting the number of flow channels. Accordingly, it will help to improve the temperature control effect of the heat transfer device of the present invention and achieve the purpose of coping with workpieces with higher operating temperatures.

In addition, the temperature control provided by the first flow channel in the heat transfer device of the present invention can also be achieved in other ways. For example, the area of the first flow channel may not provide fluid, but only use the second flow channel embedded in the heat exchange body to shorten the heat transfer path. Since the second flow channel is close to the workpiece, a better cooling effect can also be achieved. At the same time, the area of the first flow channel in the heat transfer device adopts air cooling to dissipate heat, which also has the ability to regulate temperature. In other words, the first flow channel of the present invention can have different design options according to needs.

The heat transfer device of the present invention has the following advantages. First, the heat transfer device of the present invention has a layered design with a first flow channel and a second flow channel. By making the second flow channel providing a cooling function close to the workpiece, or even by forming a part or all of the second flow channel in the heat exchange body, the distance between the second flow channel and the workpiece is greatly reduced, thereby providing a good cooling effect. Second, the present invention provides temperature control of the heat transfer device through the setting of the first flow channel, that is, when the workpiece is subjected to When cooling, it can provide additional cooling effect, or when heating the workpiece, it can avoid the temperature of the heat transfer device being too high or the temperature change being too large due to instantaneous heating without affecting the heating effect of the heating element, thereby causing damage to the workpiece; thirdly, the present invention can achieve the purpose of providing a test environment suitable for the needs by setting up dual flow channels and adjusting the fluid state in each flow channel (such as the flow rate, flow rate or temperature of the fluid).

The above embodiments are only illustrative and not intended to limit the present invention. Anyone familiar with this technology may modify and change the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application attached to the present invention. As long as it does not affect the effect and implementation purpose of the present invention, it should be covered by this public technical content.

1: Heat transfer device

1a: Device body

11: First flow channel

111: First water inlet

112: First water outlet

12: Second flow channel

121: Second water inlet

122: Second water outlet

13: Conducting entity

14: Heat exchange body

Claims (16)

A heat transfer device is in contact with a workpiece and provides temperature regulation. The heat transfer device includes: a device body; a first flow channel, which is arranged in the device body; and a second flow channel, which is arranged in the device body and is not connected to the first flow channel. The second flow channel is located below the first flow channel and above the workpiece, and the first flow channel extends to the two end surfaces of the second flow channel. The second flow channel is suitable for guiding a fluid to regulate the temperature of the workpiece. A heat transfer device as described in claim 1, wherein the first flow channel is suitable for guiding another fluid to provide temperature regulation of the device body. A heat transfer device as described in claim 2, wherein the temperature of the fluid and the other fluid is lower than the working temperature of the workpiece. A heat transfer device as described in claim 2, wherein the device body further comprises a transfer body and a heat exchange body located under the transfer body and used to contact the workpiece, wherein the second flow channel is formed in the heat exchange body or partially formed in the transfer body and partially formed in the heat exchange body, and the second flow channel includes a second water inlet and a second water outlet for the fluid to enter and exit. A heat transfer device as described in claim 4, wherein the first flow channel is formed in the transfer body and includes a first water inlet and a first water outlet for the other fluid to enter and exit. The heat transfer device as described in claim 5, wherein the first water inlet, the first water outlet, the second water inlet and the second water outlet are located on the same horizontal plane. A heat transfer device as described in claim 1, wherein a plurality of microchannels are formed in the second channel. The heat transfer device as described in claim 7, wherein at least one heat sink having a plurality of fins is provided in the second flow channel to form each of the micro-flow channels between each of the fins. The heat transfer device as described in claim 8 further includes a heating element disposed at the bottom of the heat sink. A heat transfer device as described in claim 7, wherein the channel width of the first flow channel is greater than the channel width of each of the micro-flow channels. A heat transfer device as described in claim 8, wherein the spacing between adjacent fins is less than 0.5 mm. The heat transfer device as described in claim 1, wherein the device body further includes a transfer body and a heat exchange body located under the transfer body and used to contact the workpiece, and the second flow channel is partially formed in the transfer body and partially formed in the heat exchange body. A sorting machine includes: a test carrier for carrying a workpiece; a moving device located above the test carrier; and a heat transfer device as described in any one of claims 1-12, which is located below the moving device and is driven by the moving device to move relative to the test carrier. The sorting machine as described in claim 13 is connected to a cooling device, and the cooling device is connected to the first flow channel and the second flow channel. The sorting machine as described in claim 14 is connected to a control device, which is used to monitor the temperature change of the heat transfer device so as to control the cooling device according to the preset test temperature to adjust the temperature of the heat transfer device. The sorting machine as described in claim 13, wherein the moving device is operated by a pneumatic cylinder, a hydraulic cylinder or a screw to move the heat transfer device.

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