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TWI913651B - 積體電路晶片與電子元件結構 - Google Patents

積體電路晶片與電子元件結構

Info

Publication number
TWI913651B
TWI913651B TW113103809A TW113103809A TWI913651B TW I913651 B TWI913651 B TW I913651B TW 113103809 A TW113103809 A TW 113103809A TW 113103809 A TW113103809 A TW 113103809A TW I913651 B TWI913651 B TW I913651B
Authority
TW
Taiwan
Prior art keywords
electronic device
integrated circuit
device structure
circuit chip
chip
Prior art date
Application number
TW113103809A
Other languages
English (en)
Other versions
TW202524693A (zh
Inventor
鄭詠世
黃文社
Original Assignee
台灣積體電路製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US18/531,189 external-priority patent/US20250191988A1/en
Application filed by 台灣積體電路製造股份有限公司 filed Critical 台灣積體電路製造股份有限公司
Publication of TW202524693A publication Critical patent/TW202524693A/zh
Application granted granted Critical
Publication of TWI913651B publication Critical patent/TWI913651B/zh

Links

TW113103809A 2023-12-06 2024-01-31 積體電路晶片與電子元件結構 TWI913651B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18/531,189 US20250191988A1 (en) 2023-12-06 2023-12-06 Heat dissipation through seal rings
US18/531,189 2023-12-06

Publications (2)

Publication Number Publication Date
TW202524693A TW202524693A (zh) 2025-06-16
TWI913651B true TWI913651B (zh) 2026-02-01

Family

ID=

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201926408A (zh) 2017-11-30 2019-07-01 台灣積體電路製造股份有限公司 半導體結構
TW202115889A (zh) 2019-10-01 2021-04-16 台灣積體電路製造股份有限公司 半導體元件、結構及其形成方法
TW202207388A (zh) 2020-08-14 2022-02-16 台灣積體電路製造股份有限公司 先進密封環結構及其製造方法
TW202238745A (zh) 2021-03-26 2022-10-01 台灣積體電路製造股份有限公司 半導體裝置的製造方法
TW202306167A (zh) 2021-07-22 2023-02-01 台灣積體電路製造股份有限公司 半導體結構及其形成方法
TW202320248A (zh) 2021-07-22 2023-05-16 台灣積體電路製造股份有限公司 積體電路晶片
TW202326939A (zh) 2021-11-17 2023-07-01 台灣積體電路製造股份有限公司 具有雙側密封環的半導體結構
US20230361056A1 (en) 2020-12-28 2023-11-09 Hunan San’An Semiconductor Co., Ltd. Semiconductor device and method of making the same and seal ring structure
US20230369245A1 (en) 2021-05-19 2023-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. Crack stop ring trench to prevent epitaxy crack propagation

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201926408A (zh) 2017-11-30 2019-07-01 台灣積體電路製造股份有限公司 半導體結構
TW202115889A (zh) 2019-10-01 2021-04-16 台灣積體電路製造股份有限公司 半導體元件、結構及其形成方法
TW202207388A (zh) 2020-08-14 2022-02-16 台灣積體電路製造股份有限公司 先進密封環結構及其製造方法
US20230361056A1 (en) 2020-12-28 2023-11-09 Hunan San’An Semiconductor Co., Ltd. Semiconductor device and method of making the same and seal ring structure
TW202238745A (zh) 2021-03-26 2022-10-01 台灣積體電路製造股份有限公司 半導體裝置的製造方法
US20230369245A1 (en) 2021-05-19 2023-11-16 Taiwan Semiconductor Manufacturing Company, Ltd. Crack stop ring trench to prevent epitaxy crack propagation
TW202306167A (zh) 2021-07-22 2023-02-01 台灣積體電路製造股份有限公司 半導體結構及其形成方法
TW202320248A (zh) 2021-07-22 2023-05-16 台灣積體電路製造股份有限公司 積體電路晶片
TW202326939A (zh) 2021-11-17 2023-07-01 台灣積體電路製造股份有限公司 具有雙側密封環的半導體結構

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