TWI832981B - Substrate support device, substrate processing device and substrate support method - Google Patents

Abstract

[Problem] To provide a substrate supporting device, a substrate processing device, and a substrate supporting method that can easily and reliably hold a substrate with warpage. [Solution] The substrate supporting device (2) is provided with: a substrate supporting platform (4), which is provided with a supporting surface (41) for supporting the substrate (100) on the top surface (4t); and a substrate pressing part ( 7), is set above the substrate support table (4), and moves forward and backward in the up and down direction to push the substrate (100) placed on the support surface (41) from above; and substrate adsorption The portion (6) is disposed so as to be able to enter and exit upward from the support surface (41), and adsorbs the lower surface (100b) of the substrate (100) placed on the support surface (41).

Description

Substrate support device, substrate processing device and substrate support method

The present invention relates to a substrate supporting device, a substrate processing device and a substrate supporting method.

In a substrate processing apparatus that performs a specific process on a substrate, a substrate supporting device is used that adsorbs the substrate via a substrate supporting surface and rotates the substrate during processing. In this substrate supporting device, when warpage occurs in the substrate adsorbed by the substrate supporting surface, a gap will be generated between the substrate and the substrate supporting surface, so the vacuum between the substrate and the substrate supporting surface will (negative pressure) is destroyed, and the adsorption of the substrate may become impossible. On the other hand, the following general structure has been proposed (for example, refer to Patent Document 1), which includes a suction portion, a concentric first groove portion provided on a substrate mounting surface, and a suction portion. The second groove portion intersecting the first groove portion and the air exhaust portion set the ratio of the suction force at the suction portion with respect to the mass of the substrate to a specific range, so that even if warpage occurs, Curved substrates can also be adsorbed.

[Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2011-82457

In the structure disclosed in Patent Document 1, even when the attraction force of the substrate is set, the warpage may not be eliminated depending on the stress generated in the substrate. As a result, the substrate and the substrate support The vacuum between the surfaces is destroyed, and there is a possibility that the substrate cannot be adsorbed. Furthermore, if a strong adsorption force is set to eliminate the warpage of the substrate, and the substrate is held on the substrate support surface in advance with the warpage of the substrate corrected, the substrate may be damaged.

An object of the present invention is to provide a substrate supporting device, a substrate processing device, and a substrate supporting method that can easily and reliably hold even a warped substrate.

According to an aspect of the present invention, a substrate supporting device is provided, which includes: a substrate supporting portion having a supporting surface for supporting the substrate on the top surface; and a substrate pressing portion provided on the substrate. above the support part, and moves forward and backward in the up and down direction to push the substrate placed on the support surface from above; and the substrate adsorption part is capable of emerging and retracting upward from the support surface. Set up and adsorb the lower surface of the aforementioned substrate placed on the aforementioned supporting surface, and the aforementioned substrate is adsorbed The part further includes: an adsorption pad, which is arranged in a state of being submerged in the support surface and can be elastically deformed; and a negative pressure supply part, which is provided to allow the adsorption pad to adsorb The negative pressure on the lower surface of the above-mentioned substrate, the above-mentioned adsorption pad, is adsorbed to the above-mentioned substrate by pushing the above-mentioned substrate downward and adhering to it, and by pushing the above-mentioned substrate The appended description states that the substrate warps and elastically deforms after release, whereby the substrate protrudes from the support surface while being adsorbed and held.

According to the first aspect of the present invention, there is provided a substrate supporting device including: a substrate supporting portion having a supporting surface for supporting the substrate on the top surface; and a substrate pressing portion provided on the top surface. The substrate support portion is positioned above the substrate support portion and moves forward and backward in the up and down direction to push the substrate placed on the support surface from above; and the substrate adsorption portion is capable of retracting and retracting upward from the support surface. It is arranged on the ground, and is adsorbed and placed on the lower surface of the aforementioned substrate on the aforementioned supporting surface.

According to a second aspect of the present invention, there is provided a substrate processing apparatus, which is provided with: the substrate supporting device of the first aspect; and a substrate processing unit for handling the substrate placed on the substrate supporting device. The substrate at the substrate support portion is processed.

According to an aspect of the present invention, a substrate supporting method is provided, which includes the steps of placing a warped substrate on a supporting surface of a substrate supporting portion and pushing it from above; and The step of adsorbing the elastically deformable adsorption pad that is immersed in the supporting surface to the lower surface of the substrate; and from above, The step of releasing the pressing force of the substrate, elastically deforming the adsorption pad in response to the warpage generated at the substrate, and protruding upward from the support surface while holding the substrate adsorbed. .

According to a third aspect of the present invention, a substrate supporting method is provided, which includes the steps of: pushing the substrate placed on the supporting surface of the substrate supporting portion from above; and The step of adsorbing the substrate adsorbing portion from below; and releasing the pressing force on the substrate from above and causing the substrate adsorbing portion to face upward from the supporting surface in response to the warpage generated at the substrate. Highlight the steps.

According to the aspect of the present invention, in a state where the substrate placed on the support surface is pressed from above by the substrate pressing part, the lower surface of the substrate is pressed by the substrate adsorbing part. After adsorption, when warpage occurs at the substrate, the substrate adsorption portion protrudes upward from the support surface in accordance with the amount of warpage of the substrate and maintains the state of being adsorbed to the lower surface of the substrate. Therefore, even if the substrate is warped, since the substrate adsorbing portion maintains the state of adsorbing the substrate, the substrate can be easily and reliably held.

1:Substrate cleaning device

2:Substrate support device

3: Substrate processing department

4: Substrate support table (substrate support part)

4t:Top surface

6:Substrate adsorption part

7:Substrate pressing part

9:Controller

41: Support surface

61:Gasket body

62: Flexible Department

63: Negative pressure supply department

64:Absorbent pad

74: Gasket (adsorption part)

93: Push instruction part

94: Adsorption indicator part

100:Substrate

100b: below

100c: central part

100e: The position of the complex number along the radiation direction

100g: outer edge

100t:top

101: Corner

[Fig. 1] is a perspective cross-sectional view showing one example of the substrate supporting device (substrate processing device) according to the embodiment.

[Fig. 2] is a front view showing the main parts of the substrate supporting device.

[Fig. 3] is a plan view showing the substrate supporting device.

[Fig. 4] is a cross-sectional view showing the schematic structure of the substrate lifting portion of the substrate supporting device.

[Fig. 5] is a cross-sectional view showing the schematic structure of the substrate adsorbing portion of the substrate supporting device.

[Fig. 6] is a graph showing the correlation between the degree of vacuum (negative pressure) provided to the adsorption pad and the adsorption force exerted on the adsorption pad.

[Fig. 7] is a cross-sectional view showing the structure of the substrate pressing portion.

[Fig. 8] is a cross-sectional view showing the substrate supporting device and the substrate processing unit.

[Fig. 9] is a diagram showing an example of the functional block structure of the controller.

FIG. 10 is a flowchart showing an example of a substrate processing method including the substrate supporting method according to the embodiment.

[Fig. 11] is a diagram showing a state in which the lift pin is protruded upward on the substrate support device.

[Fig. 12] is a diagram illustrating a state in which the substrate carried in from the previous process is received in the substrate supporting device on the upwardly protruding lift pin.

[Fig. 13] Fig. 13 is a diagram showing a state in which a substrate is placed on a lift pin protruding upward in the substrate support device.

[Fig. 14] This is for lowering the lifting pin at the substrate support device and The picture shows the state of the substrate placed on the support surface of the substrate support platform.

[Fig. 15] is a diagram illustrating a state in which a substrate placed on a substrate support table is pressed by a substrate pressing portion in the substrate supporting device.

[Fig. 16] is a diagram showing a state in which the substrate is adsorbed by an adsorption pad in the substrate support device with the substrate along the support surface of the substrate support stand.

[Fig. 17] is a diagram showing a state in which a substrate with its outer peripheral portion warped upward on a support surface of a substrate support table is adsorbed and held by an adsorption pad in the substrate support device.

[Fig. 18] is a diagram showing a state in which a substrate with its central portion warped upward on a support surface of a substrate support table is adsorbed and held by an adsorption pad in the substrate support device.

[Fig. 19] is a cross-section showing the state in which the support member laminated on the substrate is removed when the substrate that has been subjected to a specific process in the substrate processing method is moved to the next process. Figure.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to this embodiment. In addition, in the drawings, a part is enlarged or emphasized, or a part is simplified in order to make it easier to understand the components of the embodiments. However, there may be differences in the actual structure, shape, or scale. and other different situations.

Figure 1 shows a substrate supporting device according to the embodiment. A three-dimensional cross-sectional view showing an example of a substrate processing apparatus. FIG. 2 is a front view showing the main part of the substrate supporting device 2 . FIG. 3 is a plan view showing the substrate supporting device 2 . As shown in FIGS. 1 to 3 , the substrate cleaning device 1 mainly includes a substrate supporting device 2 , a substrate processing unit 3 (see FIG. 7 ), and a controller 9 (see FIG. 9 ). In this embodiment, the substrate processing apparatus 1 performs processing on the substrate 100 using, for example, laser light. In addition, the processing performed on the substrate 100 by the substrate processing apparatus 1 is not limited to the processing using laser light, and may also be other processing such as cleaning processing of the substrate 100 .

The substrate supporting device 2 mainly includes a substrate supporting table (substrate supporting part) 4, a substrate lifting part 5, a substrate adsorbing part 6, and a substrate pressing part 7. The substrate support 4 is rectangular in plan view and has a specific thickness in the up and down direction. As shown in FIGS. 1 and 3 , the substrate support 4 can be moved from two horizontal planes orthogonal to each other along the guide members 44X and 44Y provided below the substrate support 4 . It moves in the direction and is set. The substrate support table 4 is driven forward and backward along the respective guide members 44X and 44Y by a driving part (eg, a driving cylinder, etc.) not shown in the figure.

FIG. 4 is a cross-sectional view showing the schematic structure of the substrate lifting portion 5 of the substrate supporting device 2 . FIG. 5 is a cross-sectional view showing the schematic structure of the substrate adsorbing portion 6 of the substrate supporting device 2 . As shown in FIGS. 2 , 4 and 5 , the top surface 4t facing upward at the substrate support base 4 is used as a support surface 41 for supporting the substrate 100 . The substrate support 4 is formed with a plurality of pin holes 42 and a plurality of pads. Piece receiving hole 43. Each pin hole 42 and each gasket receiving hole 43 are circular in plan view, and penetrate the substrate support 4 in the up and down direction.

As shown in FIG. 4 , the substrate lifting part 5 is provided at the substrate support base 4 . The substrate lifting part 5 is equipped with a plurality of lifting pins 51, brackets 52, and lifting cylinders (not shown). A plurality of lift pins 51 are arranged at intervals in the horizontal direction. Each lift pin 51 extends in the up and down direction. Each lifting pin 51 is inserted into the pin hole 42 of the substrate supporting platform 4 . A guide sleeve 55 is provided on the lower surface of the substrate support table 4 to support the lift pin 51 so as to be movable in the up and down direction.

The bracket 52 extends in the horizontal direction and integrally connects the lower ends of the plurality of lift pins 51 . The lifting cylinder (not shown) drives the bracket 52 up and down in the up and down direction. The plurality of lifting pins 51 are used to lift the bracket 52 in the up and down direction by using a lifting cylinder (not shown). The plurality of lift pins 51 are positioned so that the upper end 51t becomes a height below the support surface 41 of the substrate support base 4 without protruding upward from the support surface 41 (the recessed position). The position where the upper end 51t protrudes upward from the support surface 41 (protrusion position) is made to disappear.

As shown in FIGS. 1 to 3 , the substrate suction part 6 is provided on the substrate support 4 . A plurality of substrate suction units 6 are arranged on the substrate support base 4 . The plurality of substrate suction parts 6 are arranged corresponding to the substrate 100 placed on the substrate support 4 . Specifically, the plurality of substrate adsorbing portions 6 are disposed in relation to the substrate placed on the substrate. The board support 4 is at a position facing the lower surface 100b of the substrate 100 from below.

As shown in FIGS. 1 and 3 , a plurality of substrate suction portions 6 are arranged at the central portion 100 c and the outer peripheral portion 100 d of the substrate 100 placed on the substrate support 4 . The plurality of substrate suction portions 6 are arranged at specific intervals along the inside of the outer edge 100g of the rectangular substrate 100. The plurality of substrate suction portions 6 are arranged at a central portion 100c of the substrate 100 placed on the substrate support 4 and at a plurality of positions 100e along the radiation direction from the central portion 100c. The plurality of substrate suction portions 6 are respectively arranged at the central portion 100c of the substrate 100 placed on the substrate support 4 and at the four corner portions 101 of the substrate 100.

As shown in FIG. 5 , each substrate adsorbing portion 6 can be disposed upward from the supporting surface 41 to adsorb the lower surface 100 b of the substrate 100 placed on the supporting surface 41 . . The substrate suction part 6 includes a gasket body 61 , an elastic part 62 , and a negative pressure supply part 63 . The gasket body 61 extends in the up and down direction, and is inserted into the gasket receiving hole 43 of the substrate supporting platform 4 to be arranged. The gasket body 61 is fixed to the support bracket 66 provided on the lower surface of the substrate support base 4 by nuts 67A and 67B. The nuts 67A and 67B are provided so as to sandwich the support bracket 66 from the upper and lower directions.

An adsorption pad 64 that can be adsorbed to the lower surface 100b of the substrate 100 is provided at the upper end of the pad body 61 . The pad body 61 and the suction pad 64 are formed with through holes 61 h and 64 h penetrating in the up and down directions. The adsorption pad 64 is made of rubber-based material or the like. Made of elastic material. The adsorption pad 64 is provided with a bellows 65 as an elastic portion 62 that is expandable and contractible in the up-and-down direction. The suction pad 64 is provided with its front end 64s and the support surface 41 of the substrate support 4 at the same position in the up-down direction. The adsorption pad 64 is adsorbed to the lower surface 100b of the substrate 100.

As shown by the two-dot chain line in FIG. 5 , in a state where the adsorption pad 64 is adsorbed to the lower surface 100 b of the substrate 100 , if the lower surface 100 b of the substrate 100 is displaced upward from the support surface 41 , the adsorption pad 64 is adsorbed to the lower surface 100 b of the substrate 100 . The gasket 64 is elastically deformed to extend upward, and the front end 64s protrudes upward from the support surface 41 . In a state where the front end 64s of the adsorption pad 64 protrudes upward from the support surface 41, the adsorption pad 64 is provided with an elastic force downward by the bellows 65 as the elastic portion 62.

The negative pressure supply part 63 is a flow path for providing negative pressure for adsorbing the adsorption pad 64 to the lower surface of the substrate 100 . The negative pressure supply part 63 is composed of the gasket body 61 and the through holes 61h and 64h of the suction gasket 64. A negative pressure generating source (not shown) such as a vacuum pump is connected to the gasket body 61 via a piping (not shown). The negative pressure generated by the negative pressure generating source is imparted to the adsorption pad 64 via the pipe (not shown), the pad body 61 and the through holes 61 h and 64 h of the adsorption pad 64 . In a state where the suction pad 64 is pressed against the lower surface 100 b of the substrate 100 , the suction pad 64 holds the substrate 100 by applying negative pressure generated by the negative pressure generating source through the negative pressure supply part 63 . For adsorption and retention.

Here, FIG. 6 is a diagram for the adsorption pad 64 provided with A graph showing the correlation between the degree of vacuum (negative pressure) and the adsorption force exerted on the adsorption pad 64. As shown in FIG. 6 , the higher the degree of vacuum provided to the adsorption pad 64 via the negative pressure supply unit 63 , the higher the adsorption force of the substrate 100 exerted on the adsorption pad 64 will be. . In addition, the graph shown in FIG. 6 shows an example of the correlation between the degree of vacuum and the adsorption force. For example, the slope may change depending on the shape of the adsorption pad 64 and the like.

As shown in FIGS. 1 and 2 , the substrate pressing part 7 is provided above the substrate support 4 . The substrate pressing portion 7 is provided so as to be able to move forward and backward (lift up and down) in the up and down direction. The substrate pressing part 7 operates to press the substrate 100 placed on the supporting surface 41 from above. The substrate pressing part 7 presses the substrate 100 placed on the supporting surface 41 at a plurality of places. The substrate pressing part 7 includes a frame 71 , a plurality of pressing members 72 , and an actuator 73 .

FIG. 7 is a cross-sectional view showing the structure of the substrate pressing portion 7 . As shown in FIG. 7 , the frame 71 is rectangular in plan view and has a size approximately the same as the substrate support 4 . The plurality of pressing members 72 are fixed to the frame 71 by nuts 75A and 75B. The plurality of pressing members 72 are provided with a gasket (adsorption part) 74 at the lower end of each. The gasket 74 is connected to a negative pressure source (not shown) and can be adsorbed at a position 100t above the substrate 100 (laminated body 103).

The substrate pressing part 7 presses the substrate 100 by causing the pads 74 of the plurality of pressing members 72 to press and contact the upper surface 100t of the substrate 100 from above, and to push the substrate 100 along the substrate support 4 On the support surface 41. In addition, the substrate pressing part 7 is a state in which the pads 74 of the plurality of pressing members 72 are pressed and contacted at 100t on the upper surface of the substrate 100, and the negative pressure is applied by a negative pressure source not shown in the figure. Acting on the gasket 74, the upper surface 100t of the substrate 100 is adsorbed and held at a plurality of places.

The actuator 73 moves the frame 71 at least in the up and down direction. The actuator 73 transports the substrate 100 by moving the frame 71 at least in the up-down direction while the substrate 100 is attracted and held by the plurality of pressing members 72 . The substrate pressing part 7 carries the substrate 100 into or out of the support surface 41 of the substrate support table 4 .

FIG. 8 is a cross-sectional view showing the substrate supporting device 2 and the substrate processing unit 3 . The substrate processing unit 3 applies specific processing to the substrate 100 placed on the supporting surface 41 of the substrate supporting table 4 . In this embodiment, the substrate processing unit 3 irradiates the substrate 100 with laser light. The substrate processing unit 3 is equipped with an irradiation nozzle 31 that irradiates laser light to the substrate 100, a laser light source (not shown) that emits the laser light, and guides the laser light from the laser light source to the irradiation nozzle 31. The laser optical system not shown in the figure.

The substrate processing apparatus 1 irradiates the substrate 100 on the supporting surface 41 of the substrate supporting table 4 with laser light from the irradiation nozzle 31 through the substrate processing unit 3 while moving the substrate supporting table 4 along the guide members 44X and 44Y. (See FIG. 1 ) By moving in two mutually orthogonal directions in a horizontal plane, specific laser processing is applied to the substrate 100 (laminated body 103 ).

In this embodiment, at the substrate 100, there is For example, a plate-shaped supporting member 102 made of glass is laminated on the upper surface. The support member 102 is provided to cover the upper surface 100t of the substrate 100. The upper surface 100t of the substrate 100 and the supporting member 102 are bonded by a film of a bonding material (not shown). The film (layer) of the joining material may also be called a reaction layer or a separation layer. The substrate processing unit 3 irradiates the laminate 103 of the substrate 100 and the supporting member 102 with laser light to release the bonding caused by the bonding material (not shown). In addition, the processing performed on the substrate 100 by the substrate processing unit 3 may be other processing than the above-mentioned processing. For example, the processing performed by the substrate processing unit 3 may be a cleaning process for the substrate 100 .

FIG. 9 is a diagram showing an example of the functional block structure of the controller 9 . As shown in FIG. 9 , the controller 9 controls the substrate pressing part 7 , the substrate lifting part 5 , the substrate suction part 6 and the substrate processing part 3 . The controller 9 is, for example, a computer equipped with a CPU, a main memory, a storage device, a communication device, etc., and is a computer that performs various information processing, information storage, information input and output, information communication (sending and receiving information), etc. system. The controller 9 is equipped with a carry-in acceptance part 91, a lift instruction part 92, a push instruction part 93, an adsorption instruction part 94, a processing instruction part 95, and a carry-out instruction part 96.

The load-in acceptance unit 91 accepts the load-in of the substrate 100 (laminated body 103) transferred from the previous process of the substrate processing apparatus 1. The carry-in acceptance unit 91 accepts the fact that the substrate 100 has been transported from the previous process based on a signal output from the previous process or a signal from a sensor installed in the transfer process area from the previous process. .

The lift instruction unit 92 outputs an instruction signal for causing the lift pin 51 to protrude upward to the substrate lift unit 5 when the transfer acceptance unit 91 accepts that the substrate 100 has been transported from the previous process. The lift instruction part 92 causes the substrate lift part 5 to perform "raising the bracket 52 by a lift cylinder (not shown) and causing the upper ends 51t of the plurality of lift pins 51 to lift from the support surface 41 based on the instruction signal. "Get up and protrude to the top" action.

The lift instruction part 92 is for the substrate lift part 5 when the substrate 100 transported from the previous process is placed on a plurality of lift pins 51 protruding upward from the support surface 41 An instruction signal for lowering the lift pin 51 is output. The lifting instruction part 92 causes the substrate lifting part 5 to lower the bracket 52 by a lifting cylinder (not shown) and make the upper ends 51t of the plurality of lifting pins 51 become the supporting surface 41 of the substrate supporting platform 4 The height below is such that it does not protrude upward from the support surface 41." By this operation, the substrate 100 (laminated body 103) placed on the plurality of lift pins 51 is placed on the supporting surface 41 of the substrate supporting table 4.

When the substrate 100 (laminated body 103 ) is placed on the support surface 41 , the pressing instruction unit 93 outputs an instruction signal to the substrate pressing unit 7 to push the substrate 100 from above. The pressing instruction part 93 causes the substrate pressing part 7 to lower the frame 71 with the actuator 73 and press the plurality of pressing members 72 from above to the substrate 100 (laminated body 103) on the supporting surface 41 ) above 100t to perform the action of "pushing and contacting". By this action, the substrate 100 on the supporting surface 41 is pressed from above by the plurality of pressing members 72 .

The adsorption indicator part 94 is attached to the substrate 100 on the supporting surface 41 In a state of being pressed from above by the substrate pressing part 7, an instruction signal is output to the substrate adsorbing part 6 to adsorb the lower surface 100b of the substrate 100. The adsorption instruction unit 94 causes the substrate adsorption unit 6 to use the negative pressure generated by a negative pressure source (not shown) to apply the negative pressure generated by the negative pressure supply unit 63 to the adsorption pad 64 that abuts the lower surface 100b of the substrate 100. The action of "giving". By this operation, each of the adsorption pads 64 adsorbs and holds the substrate 100 .

The processing instruction unit 95 instructs the substrate processing unit 3 so that the substrate processing unit 3 performs a specific process on the substrate 100 (laminated body 103 ) that is suctioned and held by the substrate suction unit 6 . Output instruction signal. The processing instruction unit 95 causes the substrate processing unit 3 to irradiate the substrate 100 on the supporting surface 41 of the substrate supporting platform 4 with laser light from the irradiation nozzle 31 while moving the substrate supporting platform 4 along the guide members 44X and 44Y. It is an action of moving in two mutually orthogonal directions in a horizontal plane, thereby applying specific laser processing to the substrate 100 (laminated body 103).

The unloading instruction unit 96 outputs an instruction signal to the substrate pressing unit 7 so that the substrate 100 subjected to a specific process by the substrate processing unit 3 is unloaded toward the next process. The unloading instruction part 96 causes the substrate pressing part 7 to lower the frame 71 with the actuator 73 and press the upper surface 100t of the substrate 100 on the supporting surface 41 with the plurality of pressing members 72 from above. contact" action. Furthermore, the unloading instruction unit 96 performs an operation of sucking the lower surface 100 b of the substrate 100 through the plurality of suction pads 64 at the substrate suction unit 6 and performs an operation at the substrate pressing unit 7 by The plurality of pressing members 72 absorb the movement of the supporting member 102 of the laminated body 103.

Furthermore, the carry-out instruction part 96 causes the substrate pressing part 7 to perform the operation of "raising the frame 71 by the actuator 73". By these actions, the support member 102 adsorbed by the plurality of pressing members 72 is pulled away from the substrate 100 on the support surface 41 . That is, by causing the support member 102 to be attracted and raised by the plurality of pressing members 72 , the support member 102 is separated from the substrate 100 adsorbed by the substrate adsorbing unit 6 .

Next, a method of processing the substrate 100 in the above-described general substrate processing apparatus 1 will be described. The processing method of the substrate 100 described below includes a method of supporting the substrate 100 by the substrate supporting device 2 . FIG. 10 is a flowchart showing an example of a substrate processing method including the substrate supporting method according to the embodiment.

As shown in FIG. 10 , in the processing method of the substrate 100 in this embodiment, the following steps S1 to S8 are performed. First, in step S1, the load-in acceptance unit 91 of the substrate processing apparatus 1 accepts the load-in of the substrate 100 (laminated body 103) transported from the previous process of the substrate processing apparatus 1. The carry-in acceptance unit 91 accepts the fact that the substrate 100 has been transported from the previous process based on a signal output from the previous process or a signal from a sensor installed in the transfer process area from the previous process. .

FIG. 11 is a diagram showing a state in which the lift pin 51 is protruded upward on the substrate support device 2 . In step S2 , the lift instruction unit 92 outputs an instruction signal to the substrate lift unit 5 to cause the lift pin 51 to protrude upward. As shown in FIG. 11 , when the substrate lifting part 5 receives the instruction signal output from the lifting instruction part 92 , it raises the bracket 52 by a lifting cylinder (not shown), and moves the bracket 52 up. The upper ends 51t of the lift pins 51 protrude upward from the support surface 41 .

FIG. 12 is a diagram showing a state in which the substrate 100 carried in from the previous process is received in the substrate support device 2 on the upwardly protruding lift pin 51 . FIG. 13 is a diagram showing a state in which the substrate 100 is placed on the upwardly protruding lift pin 51 in the substrate support device 2 . In step S3, the substrate processing apparatus 1 receives the substrate 100 transported from the previous process. As shown in FIG. 12 , the substrate 100 (laminated body 103 ) is supported on, for example, a plurality of support arms 201 of a transfer device 200 provided outside the substrate processing apparatus 1 and is carried in. As shown in FIG. 13 , the substrate 100 (laminated body 103 ) is placed on a plurality of lift pins 51 protruding upward from the support surface 41 .

FIG. 14 is a diagram showing a state in which the lifting pin 51 is lowered in the substrate supporting device 2 and the substrate 100 is placed on the supporting surface 41 of the substrate supporting platform 4 . In step S4 , the lift instruction unit 92 outputs an instruction signal for lowering the lift pin 51 to the substrate lift unit 5 . As shown in FIG. 14 , when the substrate lifting part 5 receives the instruction signal output from the lifting instruction part 92 , the bracket 52 is lowered by a lifting cylinder (not shown), and a plurality of The upper end 51t of the lifting pin 51 is at a height below the supporting surface 41 of the substrate supporting platform 4, and does not protrude from the supporting surface 41 to above. By this operation, the substrate 100 (laminated body 103) placed on the plurality of lift pins 51 is placed on the supporting surface 41 of the substrate supporting table 4.

FIG. 15 is a diagram showing a state in which the substrate 100 placed on the substrate support table 4 is pressed by the substrate pressing part 7 in the substrate supporting device 2 . In step S5, the pressing instruction unit 93 outputs an instruction signal to the substrate pressing unit 7 to press the substrate 100 (laminated body 103) from above. As shown in FIG. 15 , when the substrate pressing portion 7 receives an instruction signal from the pressing instruction portion 93 , the actuator 73 lowers the frame 71 and moves the plurality of pressing members. The gasket 74 of 72 presses and contacts the supporting member 102 of the laminated body 103 on the supporting surface 41 from above.

By this action, the substrate 100 on the supporting surface 41 is pressed from above by the plurality of pressing members 72 . At this time, the plurality of pressing members 72 may be configured to press the supporting member 102 of the laminated body 103 from above without adsorbing it, or may be configured to adhere to the laminated body 103 while pressing. While on the supporting member 102, the upper surface 100t of the substrate 100 is adsorbed and held by the spacer 74 in such a manner that the position of the substrate 100 will not be displaced. Furthermore, in step S5 , the warped substrate 100 can be pressed by the plurality of pressing members 72 in such a manner that it is in close contact or slightly close contact with the support surface 41 , or it can be pressed in such a manner that it is in close contact or slightly close contact with the support surface 41 . A part of the substrate 100 is pushed to the extent that a specific gap is created between the substrate 100 and the support surface 41 .

In step S5, when a specific pressure is generated between a part of the substrate 100 and the supporting surface 41 by the plurality of pressing members 72, When pressing is based on the degree of the gap, a specific gap, for example, when adsorption is started by the substrate adsorption part 6 in the next step S6, the pad can be adsorbed by the force of suction. 64 has been directed upward and extended to the lower surface 100b of the substrate 100 for a general adsorption distance, so there is no need to make the substrate 100 closely adhere to the support surface 41 or slightly adhere to it.

In step S6, an instruction signal is output to the substrate adsorbing portion 6 to adsorb the lower surface 100b of the substrate 100. When the substrate suction unit 6 receives the instruction signal from the suction instruction unit 94 , the negative pressure generated by a negative pressure source (not shown) is applied to the lower surface of the substrate 100 through the negative pressure supply unit 63 . The adsorption pad 64 at 100b is provided. By this operation, the substrate 100 on the support surface 41 which is pressed from above by the substrate pressing part 7 is adsorbed and held by each of the plurality of adsorption pads 64 .

FIG. 16 is a diagram showing a state in which the substrate 100 is adsorbed by the adsorption pad 64 in the substrate support device 2 with the substrate 100 along the support surface 41 of the substrate support table 4 . As shown in FIG. 16 , if warpage does not occur in the substrate 100 (laminated body 103 ), the entire lower surface 100 b of the substrate 100 is in close contact or slightly close contact with the support surface 41 In this state, it is adsorbed and held at a plurality of adsorption pads 64 . In addition, when warpage occurs in the substrate 100 (laminated body 103), the stress generated in the substrate 100 due to the correction of the warpage (returning to the original warped state) If the force) is smaller than the downward elastic force caused by the adsorption pad 64, the lower surface 100b of the substrate 100 is adsorbed in a state where the entire surface is in close contact with the support surface 41. It is held on a plurality of adsorption pads 64.

17 shows a state in which the substrate 100 with the outer peripheral portion 100d warped upward on the support surface 41 of the substrate support table 4 is adsorbed and held by the adsorption pad 64 in the substrate support device 2 Picture for display. 18 shows a state in which the substrate 100 with the central portion 100c warped upward on the support surface 41 of the substrate support table 4 is adsorbed and held by the adsorption pad 64 in the substrate support device 2 Picture for display.

As shown in FIGS. 17 and 18 , when warpage occurs in the substrate 100 (laminated body 103 ), if the stress generated in the substrate 100 due to the correction of the warpage is relatively large, If the downward elastic force caused by the adsorption pad 64 is greater, the lower surface 100b floats up from the support surface 41 at the portion where the warpage of the substrate 100 is corrected. At the portion where the lower surface 100 b floats up from the support surface 41 , the suction pad 64 is extended to protrude upward from the support surface 41 while being adsorbed to the lower surface 100 b.

Specifically, for example, as shown in FIG. 17 , if the lower surface 100 b of the outer peripheral portion 100 d of the substrate 100 rises from the support surface 41 due to warpage, the position of the substrate supporting base 4 will be at the outer peripheral portion 100 d. The suction pad 64 is extended to protrude upward from the support surface 41 while maintaining the adsorption state at the lower surface 100 b. In this case, the front end 64s of the adsorption pad 64 located at the center of the substrate support 4 does not protrude upward from the support surface 41, and adsorbs the lower surface 100b.

The plurality of adsorption pads 64 of the substrate adsorption portion 6 are arranged at the outer peripheral portion 100d of the substrate 100, a plurality of positions 100e along the radiation direction from the central portion 100c, four corner portions 101 of the substrate 100, and a rectangular shape. The inner edge 100g of the outer edge of the substrate 100. Therefore, when the outer peripheral portion 100d of the substrate 100 floats, the suction pad 64 located at the lifted portion protrudes upward while maintaining suction. That is, even when the outer peripheral portion 100d of the substrate 100 floats, the adsorption by the plurality of adsorption pads 64 is maintained. Therefore, the substrate 100 can be reliably adsorbed and held.

Furthermore, as shown in FIG. 18 , if the central portion 100 c of the substrate 100 floats up from the supporting surface 41 due to warping, the adsorption pad 64 located in the central portion of the substrate supporting base 4 becomes a flat surface. The front end 64s is extended to protrude upward from the support surface 41 while maintaining the adsorbed state at the lower surface 100b. That is, even when the central portion 100 c of the substrate 100 floats, the adsorption by the plurality of adsorption pads 64 is maintained. Therefore, the substrate 100 can be reliably adsorbed and held.

In step S7 , the processing instruction unit 95 outputs an output to the substrate processing unit 3 such that the substrate processing unit 3 performs a specific process on the substrate 100 that is suctioned and held by the substrate suction unit 6 . Instruction signal. As shown in FIG. 8 , when the substrate processing unit 3 receives an instruction signal from the processing instruction unit 95 , the substrate 100 on the supporting surface 41 of the substrate supporting table 4 is irradiated with laser from the irradiation nozzle 31 . While emitting light, the substrate support 4 is moved along the guide members 44X and 44Y (see FIGS. 1 and 44Y). 3) Comes from movement in two directions that are orthogonal to each other in the horizontal plane. By this operation, the bonding by the bonding material (not shown) in the laminated body 103 of the substrate 100 and the supporting member 102 is released.

FIG. 19 shows a diagram in which the support member 102 stacked on the substrate 100 is removed when the substrate 100 that has been subjected to a specific process in the substrate processing method of the embodiment is carried out to the next process. Cross-sectional view showing the state.

In step S8, the unloading instruction unit 96 instructs the substrate pressing unit so that the substrate 100 (laminated body 103) subjected to a specific process by the substrate processing unit 3 is unloaded toward the next process. 7 Output instruction signal. As shown in FIG. 15 , when the substrate pressing unit 7 receives an instruction signal from the unloading instruction unit 96 , the actuator 73 lowers the frame 71 and moves the plurality of pressing members 72 from above. The supporting member 102 is pressed against the laminated body 103 on the supporting surface 41 .

Next, the lower surface 100 b of the substrate 100 is adsorbed by the plurality of adsorption pads 64 at the substrate adsorption part 6 , and is adsorbed by the plurality of pads 74 of the pressing member 72 at the substrate pressing part 7 The support member 102 of the laminated body 103. In this state, as shown in FIG. 19 , the frame 71 is raised by the actuator 73 . As a result, the support member 102 adsorbed by the plurality of pressing members 72 is pulled away from the substrate 100 on the support surface 41 . Thereafter, the supporting member 102 adsorbed and held by the substrate pressing part 7 is carried out to a specific position. Furthermore, the substrate 100 on the supporting surface 41 is held by the substrate pressing part 7 or other substrate transport mechanisms, and is transferred from the substrate processing apparatus toward the next process. 1 (Substrate support device 2) is carried out.

In this way, according to the substrate supporting device 2 and the substrate processing device 1 of this embodiment, the substrate 100 to be placed on the supporting surface 41 of the substrate supporting table 4 is pressed from the substrate 100 by the substrate pressing part 7 . In a state where the upper surface is pressed, the lower surface of the substrate 100 is attracted by the substrate adsorbing portion 6 . Therefore, the substrate 100 is adsorbed and held by the substrate adsorbing portion 6 . Furthermore, when warpage occurs in the substrate 100 , the substrate adsorbing portion 6 protrudes upward from the support surface 41 while adsorbing the lower surface of the substrate 100 in accordance with the amount of warpage of the substrate 100 . As a result, even if the warpage of the substrate 100 is not forcedly corrected, the substrate 100 can be adsorbed and held in a warped state. Therefore, according to this embodiment, the substrate 100 with warpage can be easily and reliably held.

The embodiments have been described above. However, the present invention is not limited to the above description, and various changes can be made without departing from the gist of the present invention. For example, in the above-mentioned embodiment, the adsorption pad 64 has been described as having a bellows 65 that can expand and contract in the up-and-down direction as the elastic portion 62. However, this is not the case. is limited to this configuration. As long as a downward elastic force is provided to the gasket body, for example, a coil spring or the like may be used as the elastic portion.

In addition, in the above-mentioned embodiment, although the structure provided with the substrate lifting part 5 in the substrate support base 4 was demonstrated as an example, it is not limited to this structure. For example, the system can also be The substrate lifting part 5 is omitted. In this case, it is appropriate to use a device that carries the substrate 100 into the substrate support table 4 or a device that carries the substrate 100 out from the substrate support table 4 . The structure of this loading and unloading device is arbitrary.

In addition, in the above-described embodiment, the structure in which the laminate 103 in which the supporting member 102 is laminated on the substrate 100 is used as the processing target in the substrate supporting device 2 or the substrate processing device 1 is exemplified. Although explained, the system is not limited to this configuration. For example, the substrate 100 alone may be used as a processing target in the substrate supporting device 2 or the substrate processing device 1 without providing the supporting member 102 (not as the laminated body 103 ).

1:Substrate cleaning device

2:Substrate support device

4: Substrate support table (substrate support part)

4t:Top surface

5:Substrate lifting part

6:Substrate adsorption part

7:Substrate pressing part

41: Support surface

42: Pin hole

43: Gasket receiving hole

44X, 44Y: Guide components

71:Frame

72:Push member

74: Gasket (adsorption part)

100:Substrate

100c: central part

100d: Peripheral part

100e: The position of the complex number along the radiation direction

100g: outer edge

101: Corner

103: Laminated body

Claims (11)

A substrate supporting device is provided with: a substrate supporting part having a supporting surface for supporting the substrate on the top surface; and a substrate pressing part being provided above the substrate supporting part and moving forward and backward in the up and down direction The substrate placed on the supporting surface is pushed from above; and the substrate adsorbing portion is disposed to be able to move upward from the supporting surface, and is adsorbed and placed on the supporting surface. On the lower surface of the above-mentioned substrate, the above-mentioned substrate adsorption part further includes: an adsorption pad, which is arranged in a state of being submerged in the above-mentioned support surface and can be elastically deformed; and a negative pressure supply part, Negative pressure is provided to cause the adsorption pad to be adsorbed to the lower surface of the substrate. The adsorption pad is adsorbed to the substrate by pushing the substrate downward before having warpage. , and by elastically deforming the pressing force of the substrate caused by the warping of the substrate after release, the substrate protrudes from the supporting surface while being adsorbed and held. . The substrate supporting device according to claim 1, wherein the substrate adsorbing portions are arranged in plural numbers. The substrate supporting device as described in claim 2, wherein , the plurality of substrate adsorbing portions are arranged corresponding to the substrate placed on the substrate supporting portion. The substrate supporting device according to claim 3, wherein the plurality of substrate adsorbing portions are arranged at a central portion of the substrate placed on the substrate supporting portion and along the radiation direction from the central portion. The location of the plural number of direction. The substrate supporting device according to Claim 3, wherein the substrate is in a rectangular shape, and the plurality of substrate adsorbing parts are respectively arranged at a central portion of the substrate placed on the substrate supporting part, and at the At the four corners of the base plate. The substrate supporting device according to claim 5, wherein the plurality of substrate adsorbing portions are arranged at specific intervals along the inside of the outer edge of the rectangular substrate. The substrate supporting device according to any one of claims 1 to 6, wherein the substrate pressing portion presses the substrate placed on the substrate supporting portion at a plurality of places. The substrate supporting device as described in any one of claims 1 to 6, wherein, The substrate pressing part is provided with an adsorbing part capable of adsorbing the upper surface of the substrate. By adsorbing the substrate with the adsorbing part, the substrate is carried in or out of the substrate supporting part. The substrate supporting device according to any one of Claims 1 to 6, wherein the controller is provided with a controller for controlling the substrate pressing part and the substrate adsorbing part, and the controller is provided with: The pressing instruction part instructs the substrate pressing part to push the substrate placed on the supporting surface from above; and the adsorption instructing part instructs the substrate adsorbing part to push the substrate from above. There are adsorption instructions on the bottom of the aforementioned substrate. A substrate processing apparatus, which is provided with: the substrate supporting device as described in any one of claims 1 to 9; and a substrate processing unit for the substrate supporting portion placed on the substrate supporting device. The aforementioned substrate is processed. A substrate supporting method includes the steps of placing a warped substrate on a supporting surface of a substrate supporting portion and pushing it from above; and making the substrate submerged in the supporting surface. The step of arranging an elastically deformable adsorption pad to be adsorbed on the lower surface of the above-mentioned substrate; and releasing the pressing force on the above-mentioned substrate from above, and causing the above-mentioned adsorption pad to respond to the warpage generated at the above-mentioned substrate. elastic deformation and protruding upward from the supporting surface while the substrate is adsorbed and held.

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