TWI908065B - Bonding mechanism - Google Patents
Bonding mechanismInfo
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- TWI908065B TWI908065B TW113117295A TW113117295A TWI908065B TW I908065 B TWI908065 B TW I908065B TW 113117295 A TW113117295 A TW 113117295A TW 113117295 A TW113117295 A TW 113117295A TW I908065 B TWI908065 B TW I908065B
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Abstract
Description
本發明係關於一種壓合機構,特別是用於將按壓元件壓合至基板的壓合機構。This invention relates to a pressing mechanism, particularly a pressing mechanism for pressing pressing elements onto a substrate.
習知壓合機構一般都採用單一氣囊設計進行壓合,但由於氣囊為彈性體,雖可以克服高低差,但其彈性特性實施進行氣囊壓合時,容易造成施加於基板之力道不足,導致受壓物間接合未完全。Conventional pressing mechanisms typically employ a single airbag design for pressing. However, since the airbag is an elastic body, although it can overcome height differences, its elasticity can easily lead to insufficient force applied to the substrate during airbag pressing, resulting in incomplete bonding between the pressed objects.
再者,習知壓合機構的承載台邊緣並無設置承載體,對此,當實施進行氣囊壓合時,容易造成承載台邊緣壓力較重的現象,有可能造成層壓不良等相關問題。Furthermore, conventional compression mechanisms do not have a support structure at the edge of the loading platform. As a result, when airbag compression is performed, the edge of the loading platform may be subjected to heavy pressure, which may lead to problems such as poor lamination.
因此,需要發展一種可改善上述習知技術缺失的壓合機構,是本領域目前需要解決的問題之一。Therefore, developing a pressing mechanism that can improve upon the aforementioned deficiencies in conventional technology is one of the problems that needs to be solved in this field.
鑒於上述問題,本發明提供一種壓合機構,有助於解決現有壓合機構在單一氣囊或平板件在壓合基板時,因基板具有高低差之間隙,容易造成壓合不完全情況以及當實施進行氣囊壓合時,容易造成承載台邊緣壓力較重的問題。In view of the above problems, the present invention provides a pressing mechanism that helps to solve the problems of incomplete pressing when pressing a single airbag or flat plate onto a substrate due to the height difference gap of the substrate, and the problem of heavy pressure on the edge of the support platform when pressing airbags.
本發明所揭露之壓合機構包含一基座、一限位結構以及至少一升降結構。基座包含用於承載一基板的一承載台。限位結構可移動地設置於基座,且限位結構圍繞承載台。升降結構與基座對應設置。升降結構可相對限位結構的方向移動且具有一初始位置以及一受壓位置。於初始位置,限位結構的一上表面高於基板。於受壓位置,升降結構作動以調整限位結構的上表面與基板平齊。The pressing mechanism disclosed in this invention includes a base, a limiting structure, and at least one lifting structure. The base includes a support platform for supporting a substrate. The limiting structure is movably disposed on the base and surrounds the support platform. The lifting structure is correspondingly disposed on the base. The lifting structure is movable relative to the limiting structure and has an initial position and a pressed position. In the initial position, an upper surface of the limiting structure is higher than the substrate. In the pressed position, the lifting structure actuates to adjust the upper surface of the limiting structure to be flush with the substrate.
本發明另揭露之壓合機構包含一基座、一限位結構至少一彈性件以及一按壓元件。基座包含用於承載一基板的一承載台。限位結構可移動地設置於基座,且限位結構圍繞承載台。彈性件環繞間隔設置於基座與限位結構之間。按壓元件對應承載台設置,且按壓元件可由氣壓驅動或電力驅動。限位結構可相對按壓元件的方向移動且具有一初始位置以及一受壓位置。於初始位置,限位結構的一上表面高於基板。於受壓位置,按壓元件推壓限位結構,使限位結構的上表面平齊於基板。The pressing mechanism disclosed in this invention includes a base, a limiting structure, at least one elastic member, and a pressing element. The base includes a support platform for supporting a substrate. The limiting structure is movably disposed on the base and surrounds the support platform. The elastic member is spaced around the base and between the limiting structure. The pressing element is disposed corresponding to the support platform and can be pneumatically or electrically driven. The limiting structure is movable relative to the pressing element and has an initial position and a pressed position. In the initial position, an upper surface of the limiting structure is higher than the substrate. In the pressed position, the pressing element pushes the limiting structure, causing the upper surface of the limiting structure to be flush with the substrate.
本發明又另揭露之壓合機構包含一基座以及一按壓元件。基座包含用於承載一基板的一承載台。按壓元件包含一充氣氣囊以及一中介層。充氣氣囊對應承載台設置。中介層膠黏至充氣氣囊,且中介層透過充氣氣囊推壓基板。The present invention further discloses a pressing mechanism comprising a base and a pressing element. The base includes a support platform for supporting a substrate. The pressing element includes an inflatable bladder and an intermediate layer. The inflatable bladder is disposed corresponding to the support platform. The intermediate layer is adhesively bonded to the inflatable bladder, and the intermediate layer pushes the substrate through the inflatable bladder.
以上關於本發明內容之說明及以下實施方式之說明係用以示範與解釋本發明之原理,並提供本發明之專利申請範圍更進一步之解釋。The above description of the contents of this invention and the following description of the embodiments are intended to demonstrate and explain the principles of this invention and to provide a further explanation of the scope of the patent application of this invention.
於以下實施方式中詳細敘述本發明之詳細特徵及優點,其內容足以使任何熟習相關技藝者瞭解本發明之技術內容並據以實施,且根據本說明書所揭露的內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易理解本發明。以下實施例進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of this invention are described in detail in the following embodiments, the content of which is sufficient to enable anyone skilled in the art to understand the technical content of this invention and implement it accordingly. Furthermore, based on the content disclosed in this specification, the scope of the patent application, and the drawings, anyone skilled in the art can easily understand this invention. The following embodiments further illustrate the viewpoints of this invention in detail, but are not intended to limit the scope of this invention in any way.
請參照圖1至圖3,其中圖1為根據本發明一實施例之壓合機構的示意圖,圖2為圖1之壓合機構的限位結構的示意圖,且圖3為圖1之壓合機構的升降結構處於受壓位置的示意圖。在本實施例中,壓合機構1A包含基座10、限位結構20、彈性件30以及按壓元件40。Please refer to Figures 1 to 3, where Figure 1 is a schematic diagram of a pressing mechanism according to an embodiment of the present invention, Figure 2 is a schematic diagram of the limiting structure of the pressing mechanism of Figure 1, and Figure 3 is a schematic diagram of the lifting structure of the pressing mechanism of Figure 1 in the pressed position. In this embodiment, the pressing mechanism 1A includes a base 10, a limiting structure 20, an elastic element 30, and a pressing element 40.
基座10包含用於承載基板11的承載台110。承載台110的上表面111可設置有用以吸附基板11的負壓孔或夾取基板11的夾具(未繪示)。The base 10 includes a support stage 110 for supporting the substrate 11. The upper surface 111 of the support stage 110 may be provided with a negative pressure hole for adsorbing the substrate 11 or a clamp (not shown) for gripping the substrate 11.
限位結構20可移動地設置於基座10,且限位結構20圍繞基座10的承載台110。進一步來說,限位結構20可設置於基座10,從而圍繞承載台110,並且限位結構20可相對基座10上升或下降。The limiting structure 20 is movably disposed on the base 10 and surrounds the support platform 110 of the base 10. Furthermore, the limiting structure 20 can be disposed on the base 10, thereby surrounding the support platform 110, and the limiting structure 20 can rise or fall relative to the base 10.
彈性件30環繞間隔設置於基座10與限位結構20之間。進一步來說,彈性件30例如但不限於是壓縮彈簧或是能夠彈性變形的條狀物件,彈性件30其設置於基座10與限位結構20之間。在本實施例中,彈性件30的數量為多個,且這些彈性件30沿著承載台110的圓周方向間隔設置,但彈性件30的數量並非用以限制本發明。Elastic elements 30 are arranged at intervals around the base 10 and the limiting structure 20. Furthermore, the elastic elements 30 are, for example, but not limited to, compression springs or elastically deformable strip-shaped objects, and are arranged between the base 10 and the limiting structure 20. In this embodiment, there are multiple elastic elements 30, and these elastic elements 30 are arranged at intervals along the circumferential direction of the support platform 110, but the number of elastic elements 30 is not intended to limit the invention.
按壓元件40對應基座10的承載台110設置,且按壓元件40可由氣壓驅動或電力驅動。進一步來說,按壓元件40例如但不限於包含由氣壓驅動的充氣氣囊或是由電力驅動的平板狀壓平件。在本實施例中,按壓元件40可包含充氣氣囊410以及中介層420。充氣氣囊410對應承載台110設置。中介層420膠黏至充氣氣囊410,且可透過充氣氣囊410使得中介層420能夠推壓放置於承載台110上的基板11。The pressing element 40 is disposed corresponding to the support platform 110 of the base 10, and the pressing element 40 can be pneumatically driven or electrically driven. Further, the pressing element 40 may include, for example, but not limited to, an inflatable airbag driven by pneumatics or a flat, electrically driven plate-shaped flattening member. In this embodiment, the pressing element 40 may include an inflatable airbag 410 and an interposer layer 420. The inflatable airbag 410 is disposed corresponding to the support platform 110. The interposer layer 420 is adhesively attached to the inflatable airbag 410, and the inflatable airbag 410 allows the interposer layer 420 to press against the substrate 11 placed on the support platform 110.
在本實施例中,按壓元件40的中介層420可為軟性材質或硬性材質。在本實施例中,中介層的至少一部分可由橡膠、矽膠、高分子和金屬材料至少其中一者製成。此外,充氣氣囊410的至少一部分可由矽膠和橡膠材質材料至少其中一者製成。此外,按壓元件40的中介層420可具有1公釐(mm)至200mm的厚度,且充氣氣囊410可具有1mm至10mm的厚度。In this embodiment, the intermediate layer 420 of the pressing element 40 can be a soft or rigid material. In this embodiment, at least a portion of the intermediate layer can be made of at least one of rubber, silicone, polymer, and metal. Furthermore, at least a portion of the inflatable airbag 410 can be made of at least one of silicone and rubber. Additionally, the intermediate layer 420 of the pressing element 40 can have a thickness of 1 mm to 200 mm, and the inflatable airbag 410 can have a thickness of 1 mm to 10 mm.
限位結構20可相對按壓元件40的方向移動,並且限位結構20具有初始位置以及受壓位置。圖1示例性繪出限位結構20處於初始位置,且圖3示例性繪出限位結構20處於受壓位置。更進一步來說,限位結構20可被按壓元件40的中介層420推壓而自初始位置移動到受壓位置。於初始位置,限位結構20的上表面210高於基板11。於受壓位置,限位結構20的上表面210平齊於基板11,且彈性件30被限位結構20壓縮而儲存彈性能。當按壓元件40不再推壓限位結構20時,彈性件30釋放彈性能,而使限位結構20自受壓位置復位到初始位置。The limiting structure 20 is movable relative to the pressing element 40 and has an initial position and a pressed position. FIG1 exemplarily illustrates the limiting structure 20 in the initial position, and FIG3 exemplarily illustrates the limiting structure 20 in the pressed position. Furthermore, the limiting structure 20 can be pushed by the interposer layer 420 of the pressing element 40 to move from the initial position to the pressed position. In the initial position, the upper surface 210 of the limiting structure 20 is higher than the substrate 11. In the pressed position, the upper surface 210 of the limiting structure 20 is flush with the substrate 11, and the elastic member 30 is compressed by the limiting structure 20 to store elasticity. When the pressing element 40 stops pushing the limiting structure 20, the elastic element 30 releases its elasticity, causing the limiting structure 20 to return to its initial position from the pressed position.
在本實施例中,壓合機構1A可進一步包含設置於限位結構20的下表面220的補強結構50。進一步來說,補強結構50設置於基座10與限位結構20之間。In this embodiment, the pressing mechanism 1A may further include a reinforcing structure 50 disposed on the lower surface 220 of the limiting structure 20. Furthermore, the reinforcing structure 50 is disposed between the base 10 and the limiting structure 20.
如圖3所示,基板11可置於承載台110上,基板11例如但不限於是矽晶圓、電路板、玻璃板或金屬板。As shown in Figure 3, the substrate 11 can be placed on the support stage 110. The substrate 11 is, for example, but not limited to, a silicon wafer, a circuit board, a glass plate or a metal plate.
充氣氣囊410膨脹使得中介層420推壓基板11和限位結構20。限位結構20由於被按壓元件40的中介層420推壓而處於受壓位置。此時,限位結構20的上表面210與基板11相差在±1mm內。更進一步來說,中介層420透過充氣氣囊410推壓基板11,使得限位結構20的上表面210與基板11的上表面100之間的相差在±1mm內。更具體來說,處於受壓位置的限位結構20的上表面210與基板11的上表面100實質上平齊。The inflation of the airbag 410 causes the intermediate layer 420 to press against the substrate 11 and the limiting structure 20. The limiting structure 20 is in a compressed position due to being pressed by the intermediate layer 420 of the pressing element 40. At this time, the upper surface 210 of the limiting structure 20 is within ±1 mm of the substrate 11. Furthermore, the intermediate layer 420, through the inflation of the airbag 410, presses against the substrate 11, so that the difference between the upper surface 210 of the limiting structure 20 and the upper surface 100 of the substrate 11 is within ±1 mm. More specifically, the upper surface 210 of the limiting structure 20 in the compressed position is substantially flush with the upper surface 100 of the substrate 11.
由於限位結構20支撐按壓元件40,限位結構20能夠支撐充氣氣囊410以及中介層420,使充氣氣囊410在推動中介層420時,更有效率覆蓋基板11,並填滿基板11具有高低差之間隙(未繪示)。Since the limiting structure 20 supports the pressing element 40, the limiting structure 20 can support the inflatable airbag 410 and the intermediate layer 420, so that when the inflatable airbag 410 pushes the intermediate layer 420, it can more efficiently cover the substrate 11 and fill the gap (not shown) where the substrate 11 has a height difference.
圖1至圖3揭露一種透過彈性件30和按壓元件40讓限位結構20能夠升降的壓合機構1A,但本發明不以此為限。請參照圖4至圖6,其中圖4為根據本發明另一實施例之壓合機構的示意圖,圖5為圖4之壓合機構的基座和限位結構的示意圖,且圖6為圖4之壓合機構的升降結構處於受壓位置的示意圖。在本實施例中,壓合機構1B包含基座10B、限位結構20、按壓元件40、升降結構60以及驅動裝置70。Figures 1 to 3 disclose a pressing mechanism 1A that allows the limiting structure 20 to rise and fall through the elastic element 30 and the pressing element 40, but the present invention is not limited thereto. Please refer to Figures 4 to 6, wherein Figure 4 is a schematic diagram of a pressing mechanism according to another embodiment of the present invention, Figure 5 is a schematic diagram of the base and limiting structure of the pressing mechanism of Figure 4, and Figure 6 is a schematic diagram of the lifting structure of the pressing mechanism of Figure 4 in the pressed position. In this embodiment, the pressing mechanism 1B includes a base 10B, a limiting structure 20, a pressing element 40, a lifting structure 60, and a driving device 70.
基座10B包含用於承載基板11的承載台110。進一步來說,基座10B可包含承載台110以及供承載台110設置的主體120B。承載台110的上表面111可設置有用以吸附基板11的負壓孔或夾取基板11的夾具(未繪示)。此外,基座10B還可包含形成於主體120B的多個開孔121,且這些開孔121沿著基座10B的方向間隔排列。承載台110的上表面111可設置有用以吸附基板11的負壓孔或夾取基板11的夾具(未繪示)。The base 10B includes a support stage 110 for supporting the substrate 11. Further, the base 10B may include the support stage 110 and a main body 120B for mounting the support stage 110. The upper surface 111 of the support stage 110 may be provided with negative pressure holes for adsorbing the substrate 11 or a clamp (not shown) for gripping the substrate 11. In addition, the base 10B may also include a plurality of openings 121 formed in the main body 120B, and these openings 121 are spaced apart along the direction of the base 10B. The upper surface 111 of the support stage 110 may be provided with negative pressure holes for adsorbing the substrate 11 or a clamp (not shown) for gripping the substrate 11.
升降結構60與基座10B對應設置。進一步來說,升降結構60可為連桿,並且連桿穿過基座10B的開孔121。驅動裝置70例如但不限於是伺服馬達,其與升降結構60連接,並用以帶動升降結構60上升或下降。在本實施例中,升降結構60的數量可為多個,即有多根連桿分別對應基座10B的多個開孔121,但本發明不以此為限。The lifting structure 60 is correspondingly disposed with respect to the base 10B. Further, the lifting structure 60 may be a linkage, and the linkage passes through the opening 121 of the base 10B. The drive device 70, for example but not limited to, a servo motor, is connected to the lifting structure 60 and is used to drive the lifting structure 60 to rise or fall. In this embodiment, the number of lifting structures 60 may be multiple, i.e., multiple linkages corresponding to multiple openings 121 of the base 10B, but the invention is not limited to this.
限位結構20可移動地設置於升降結構60,且限位結構20圍繞基座10的承載台110。進一步來說,驅動裝置70可帶動升降結構60與限位結構20一併相對基座10上升或下降。The limiting structure 20 is movably disposed on the lifting structure 60, and the limiting structure 20 surrounds the support platform 110 of the base 10. Furthermore, the driving device 70 can drive the lifting structure 60 and the limiting structure 20 to rise or fall relative to the base 10 together.
按壓元件40對應基座10的承載台110設置,且按壓元件40可由氣壓驅動或電力驅動。進一步來說,按壓元件40例如但不限於包含由氣壓驅動的充氣氣囊或是由電力驅動的平板狀壓平件。在本實施例中,按壓元件40可包含充氣氣囊410以及中介層420。關於按壓元件40的具體描述可參考對應圖1至圖3的先前內容,此處不再贅述。The pressing element 40 is disposed corresponding to the support platform 110 of the base 10, and the pressing element 40 can be pneumatically driven or electrically driven. Furthermore, the pressing element 40 may include, for example, but not limited to, an inflatable airbag driven by pneumatic pressure or a flat, plate-shaped flattening member driven by electricity. In this embodiment, the pressing element 40 may include an inflatable airbag 410 and an intermediate layer 420. A detailed description of the pressing element 40 can be found in the preceding content corresponding to Figures 1 to 3, and will not be repeated here.
升降結構60可相對限位結構20的方向移動,且升降結構60具有初始位置以及受壓位置。圖4示例性繪出升降結構60處於初始位置,且圖6示例性繪出升降結構60處於受壓位置。更進一步來說,升降結構60可被驅動裝置70驅動而自初始位置移動到受壓位置,或是自受壓位置復位至初始位置。於初始位置,限位結構20的上表面210高於基板11。於受壓位置,升降結構60作動使得限位結構20的上表面210平齊於基板11。The lifting structure 60 is movable relative to the limiting structure 20, and has an initial position and a pressed position. Figure 4 illustrates the lifting structure 60 in the initial position, and Figure 6 illustrates the lifting structure 60 in the pressed position. Furthermore, the lifting structure 60 can be driven by the driving device 70 to move from the initial position to the pressed position, or to return from the pressed position to the initial position. In the initial position, the upper surface 210 of the limiting structure 20 is higher than the substrate 11. In the pressed position, the lifting structure 60 actuates such that the upper surface 210 of the limiting structure 20 is flush with the substrate 11.
如圖6所示,基板11可置於承載台110上,當驅動裝置70驅動升降結構60下降到受壓位置,充氣氣囊410膨脹使得中介層420推壓基板11和限位結構20,。此時,由於升降結構60的作動,限位結構20的上表面210被調整成為基板11相差在±1mm內。更進一步來說,限位結構20的上表面210與基板11的上表面100之間的相差在±1mm內。更具體來說,當升降結構60處於受壓位置,限位結構20的上表面210與基板11的上表面100實質上平齊。As shown in Figure 6, the substrate 11 can be placed on the support platform 110. When the driving device 70 drives the lifting structure 60 to descend to the pressure position, the inflatable airbag 410 expands, causing the intermediary layer 420 to push against the substrate 11 and the limiting structure 20. At this time, due to the operation of the lifting structure 60, the upper surface 210 of the limiting structure 20 is adjusted so that it is within ±1 mm of the substrate 11. More specifically, the difference between the upper surface 210 of the limiting structure 20 and the upper surface 100 of the substrate 11 is within ±1 mm. More specifically, when the lifting structure 60 is in the pressure position, the upper surface 210 of the limiting structure 20 and the upper surface 100 of the substrate 11 are substantially flush.
綜上所述,根據本發明揭露之壓合機構,由於限位結構支撐按壓元件,限位結構能夠支撐充氣氣囊以及中介層,使充氣氣囊在推動中介層時,更有效率覆蓋基板高低差之間隙。並且,按壓元件包含充氣氣囊以及中介層,不僅改善對應高低差之基板,並有效將高低差基板之間間隙填滿,且達到改善按壓元件使用次數。,In summary, according to the pressing mechanism disclosed in this invention, the limiting structure supports the pressing element, and this limiting structure can support the inflatable airbag and the intermediate layer, allowing the inflatable airbag to more efficiently cover the gaps between the substrate height differences when pushing the intermediate layer. Furthermore, the pressing element, including the inflatable airbag and the intermediate layer, not only improves the handling of substrates with varying heights but also effectively fills the gaps between the substrates with different heights, thereby increasing the number of times the pressing element can be used.
本發明之實施例揭露雖如上所述,然並非用以限定本發明,任何熟習相關技藝者,在不脫離本發明之精神和範圍內,舉凡依本發明申請範圍所述之形狀、構造、特徵及精神當可做些許之變更,因此本發明之專利保護範圍需視本說明書所附之申請專利範圍所界定者為準。The embodiments of this invention disclosed as described above are not intended to limit this invention. Anyone skilled in the art may make some changes to the shape, structure, features and spirit described in the claims without departing from the spirit and scope of this invention. Therefore, the scope of protection of this invention shall be determined by the scope of the claims attached to this specification.
1A、1B:壓合機構 11:基板 100:上表面 10、10B:基座 110:承載台 111:上表面 120B:主體 121:開孔 20:限位結構 210:上表面 220:下表面 30:彈性件 40:按壓元件 410:充氣氣囊 420:中介層 50:補強結構 60:升降結構 70:驅動裝置 1A, 1B: Pressing mechanism 11: Substrate 100: Upper surface 10, 10B: Base 110: Support platform 111: Upper surface 120B: Main body 121: Opening 20: Limiting structure 210: Upper surface 220: Lower surface 30: Elastic component 40: Pressing element 410: Inflatable airbag 420: Intermediate layer 50: Reinforcing structure 60: Lifting structure 70: Drive device
圖1為根據本發明一實施例之壓合機構的示意圖。 圖2為圖1之壓合機構的限位結構的示意圖。 圖3為圖1之壓合機構的升降結構處於受壓位置的示意圖。 圖4為根據本發明另一實施例之壓合機構的示意圖。 圖5為圖4之壓合機構的基座和限位結構的示意圖。 圖6為圖4之壓合機構的升降結構處於受壓位置的示意圖。 Figure 1 is a schematic diagram of a pressing mechanism according to one embodiment of the present invention. Figure 2 is a schematic diagram of the limiting structure of the pressing mechanism of Figure 1. Figure 3 is a schematic diagram of the lifting structure of the pressing mechanism of Figure 1 in the pressed position. Figure 4 is a schematic diagram of a pressing mechanism according to another embodiment of the present invention. Figure 5 is a schematic diagram of the base and limiting structure of the pressing mechanism of Figure 4. Figure 6 is a schematic diagram of the lifting structure of the pressing mechanism of Figure 4 in the pressed position.
1A:壓合機構 10:基座 110:承載台 111:上表面 20:限位結構 210:上表面 220:下表面 30:彈性件 40:按壓元件 410:充氣氣囊 420:中介層 1A: Pressing Mechanism 10: Base 110: Support Platform 111: Upper Surface 20: Limiting Structure 210: Upper Surface 220: Lower Surface 30: Elastic Component 40: Pressing Element 410: Inflatable Airbag 420: Intermediate Layer
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| US20210298173A1 (en) | 2017-07-24 | 2021-09-23 | Sensor Holdings Limited | Interconnecting circuit board to stretchable wires |
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| US20210298173A1 (en) | 2017-07-24 | 2021-09-23 | Sensor Holdings Limited | Interconnecting circuit board to stretchable wires |
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