TWM660799U - Pressing mechanism - Google Patents
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- TWM660799U TWM660799U TW113204760U TW113204760U TWM660799U TW M660799 U TWM660799 U TW M660799U TW 113204760 U TW113204760 U TW 113204760U TW 113204760 U TW113204760 U TW 113204760U TW M660799 U TWM660799 U TW M660799U
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- limiting structure
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- base
- pressing element
- intermediate layer
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- 230000007246 mechanism Effects 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 230000006835 compression Effects 0.000 claims description 22
- 238000007906 compression Methods 0.000 claims description 22
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 claims description 2
- 239000007779 soft material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 12
- 230000005611 electricity Effects 0.000 description 5
- 230000003014 reinforcing effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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Abstract
一種壓合機構,包含基座、限位結構以及至少一升降結構。基座包含用於承載基板的承載台。限位結構可移動地設置於基座,且限位結構圍繞承載台。升降結構與基座對應設置。升降結構可相對限位結構的方向移動且具有初始位置以及受壓位置。於初始位置,限位結構的上表面高於基板。於受壓位置,升降結構作動以調整限位結構的上表面與基板平齊。A pressing mechanism includes a base, a limiting structure and at least one lifting structure. The base includes a supporting platform for supporting a substrate. The limiting structure is movably arranged on the base, and the limiting structure surrounds the supporting platform. The lifting structure is arranged corresponding to the base. The lifting structure can move relative to the direction of the limiting structure and has an initial position and a compressed position. In the initial position, the upper surface of the limiting structure is higher than the substrate. In the compressed position, the lifting structure is actuated to adjust the upper surface of the limiting structure to be flush with the substrate.
Description
本新型係關於一種壓合機構,特別是用於將按壓元件壓合至基板的壓合機構。The invention relates to a pressing mechanism, in particular to a pressing mechanism for pressing a pressing element onto a substrate.
習知壓合機構一般都採用單一氣囊設計進行壓合,但由於氣囊為彈性體,雖可以克服高低差,但其彈性特性實施進行氣囊壓合時,容易造成施加於基板之力道不足,導致受壓物間接合未完全。Conventional press-fit mechanisms generally use a single airbag design for press-fitting. However, since the airbag is an elastic body, although it can overcome the height difference, its elastic characteristics can easily cause insufficient force applied to the substrate when the airbag is pressed, resulting in incomplete bonding between the pressed objects.
再者,習知壓合機構的承載台邊緣並無設置承載體,對此,當實施進行氣囊壓合時,容易造成承載台邊緣壓力較重的現象,有可能造成層壓不良等相關問題。Furthermore, the edge of the support platform of the conventional press-fitting mechanism is not provided with a support body. Therefore, when the airbag is pressed, it is easy to cause a heavy pressure on the edge of the support platform, which may cause related problems such as poor lamination.
因此,需要發展一種可改善上述習知技術缺失的壓合機構,是本領域目前需要解決的問題之一。Therefore, it is necessary to develop a compression mechanism that can improve the above-mentioned known technical deficiencies, which is one of the problems that need to be solved in this field.
鑒於上述問題,本新型提供一種壓合機構,有助於解決現有壓合機構在單一氣囊或平板件在壓合基板時,因基板具有高低差之間隙,容易造成壓合不完全情況以及當實施進行氣囊壓合時,容易造成承載台邊緣壓力較重的問題。In view of the above problems, the present invention provides a pressing mechanism that helps to solve the problem that when a single airbag or flat piece is pressed on a substrate by the existing pressing mechanism, the substrate has a height difference gap, which easily causes incomplete pressing and when the airbag is pressed, it is easy to cause heavy pressure on the edge of the support platform.
本新型所揭露之壓合機構包含一基座、一限位結構以及至少一升降結構。基座包含用於承載一基板的一承載台。限位結構可移動地設置於基座,且限位結構圍繞承載台。升降結構與基座對應設置。升降結構可相對限位結構的方向移動且具有一初始位置以及一受壓位置。於初始位置,限位結構的一上表面高於基板。於受壓位置,升降結構作動以調整限位結構的上表面與基板平齊。The compression mechanism disclosed in the present invention includes a base, a limiting structure and at least one lifting structure. The base includes a supporting platform for supporting a substrate. The limiting structure is movably arranged on the base, and the limiting structure surrounds the supporting platform. The lifting structure is arranged corresponding to the base. The lifting structure can move relative to the direction of the limiting structure and has an initial position and a compressed position. In the initial position, an upper surface of the limiting structure is higher than the substrate. In the compressed position, the lifting structure is actuated to adjust the upper surface of the limiting structure to be flush with the substrate.
本新型另揭露之壓合機構包含一基座、一限位結構至少一彈性件以及一按壓元件。基座包含用於承載一基板的一承載台。限位結構可移動地設置於基座,且限位結構圍繞承載台。彈性件環繞間隔設置於基座與限位結構之間。按壓元件對應承載台設置,且按壓元件可由氣壓驅動或電力驅動。限位結構可相對按壓元件的方向移動且具有一初始位置以及一受壓位置。於初始位置,限位結構的一上表面高於基板。於受壓位置,按壓元件推壓限位結構,使限位結構的上表面平齊於基板。The new type also discloses a pressing mechanism including a base, a limiting structure, at least one elastic member and a pressing element. The base includes a supporting platform for supporting a substrate. The limiting structure is movably disposed on the base, and the limiting structure surrounds the supporting platform. The elastic member is disposed between the base and the limiting structure at intervals. The pressing element is disposed corresponding to the supporting platform, and the pressing element can be driven by air pressure or electricity. The limiting structure can move relative to the direction of the pressing element and has an initial position and a pressed position. In the initial position, an upper surface of the limiting structure is higher than the substrate. In the pressed position, the pressing element pushes the limiting structure so that the upper surface of the limiting structure is flush with the substrate.
本新型又另揭露之壓合機構包含一基座以及一按壓元件。基座包含用於承載一基板的一承載台。按壓元件包含一充氣氣囊以及一中介層。充氣氣囊對應承載台設置。中介層膠黏至充氣氣囊,且中介層透過充氣氣囊推壓基板。The pressing mechanism disclosed in the present invention further comprises a base and a pressing element. The base comprises a support platform for supporting a substrate. The pressing element comprises an inflatable airbag and an intermediate layer. The inflatable airbag is arranged corresponding to the support platform. The intermediate layer is glued to the inflatable airbag, and the intermediate layer pushes the substrate through the inflatable airbag.
以上關於本新型內容之說明及以下實施方式之說明係用以示範與解釋本新型之原理,並提供本新型之專利申請範圍更進一步之解釋。The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of patent application of the present invention.
於以下實施方式中詳細敘述本新型之詳細特徵及優點,其內容足以使任何熟習相關技藝者瞭解本新型之技術內容並據以實施,且根據本說明書所揭露的內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易理解本新型。以下實施例進一步詳細說明本新型之觀點,但非以任何觀點限制本新型之範疇。The detailed features and advantages of the new invention are described in detail in the following implementation modes, and the content is sufficient for anyone familiar with the relevant technology to understand the technical content of the new invention and implement it accordingly. According to the content disclosed in this specification, the scope of the patent application and the drawings, anyone familiar with the relevant technology can easily understand the new invention. The following embodiments further illustrate the viewpoints of the new invention in detail, but do not limit the scope of the new invention by any viewpoint.
請參照圖1至圖3,其中圖1為根據本新型一實施例之壓合機構的示意圖,圖2為圖1之壓合機構的限位結構的示意圖,且圖3為圖1之壓合機構的升降結構處於受壓位置的示意圖。在本實施例中,壓合機構1A包含基座10、限位結構20、彈性件30以及按壓元件40。Please refer to Figures 1 to 3, wherein Figure 1 is a schematic diagram of a compression mechanism according to an embodiment of the present invention, Figure 2 is a schematic diagram of a limiting structure of the compression mechanism of Figure 1, and Figure 3 is a schematic diagram of a lifting structure of the compression mechanism of Figure 1 in a compressed position. In this embodiment, the
基座10包含用於承載基板11的承載台110。承載台110的上表面111可設置有用以吸附基板11的負壓孔或夾取基板11的夾具(未繪示)。The
限位結構20可移動地設置於基座10,且限位結構20圍繞基座10的承載台110。進一步來說,限位結構20可設置於基座10,從而圍繞承載台110,並且限位結構20可相對基座10上升或下降。The
彈性件30環繞間隔設置於基座10與限位結構20之間。進一步來說,彈性件30例如但不限於是壓縮彈簧或是能夠彈性變形的條狀物件,彈性件30其設置於基座10與限位結構20之間。在本實施例中,彈性件30的數量為多個,且這些彈性件30沿著承載台110的圓周方向間隔設置,但彈性件30的數量並非用以限制本新型。The
按壓元件40對應基座10的承載台110設置,且按壓元件40可由氣壓驅動或電力驅動。進一步來說,按壓元件40例如但不限於包含由氣壓驅動的充氣氣囊或是由電力驅動的平板狀壓平件。在本實施例中,按壓元件40可包含充氣氣囊410以及中介層420。充氣氣囊410對應承載台110設置。中介層420膠黏至充氣氣囊410,且可透過充氣氣囊410使得中介層420能夠推壓放置於承載台110上的基板11。The
在本實施例中,按壓元件40的中介層420可為軟性材質或硬性材質。在本實施例中,中介層的至少一部分可由橡膠、矽膠、高分子和金屬材料至少其中一者製成。此外,充氣氣囊410的至少一部分可由矽膠和橡膠材質材料至少其中一者製成。此外,按壓元件40的中介層420可具有1公釐(mm)至200mm的厚度,且充氣氣囊410可具有1mm至10mm的厚度。In the present embodiment, the
限位結構20可相對按壓元件40的方向移動,並且限位結構20具有初始位置以及受壓位置。圖1示例性繪出限位結構20處於初始位置,且圖3示例性繪出限位結構20處於受壓位置。更進一步來說,限位結構20可被按壓元件40的中介層420推壓而自初始位置移動到受壓位置。於初始位置,限位結構20的上表面210高於基板11。於受壓位置,限位結構20的上表面210平齊於基板11,且彈性件30被限位結構20壓縮而儲存彈性能。當按壓元件40不再推壓限位結構20時,彈性件30釋放彈性能,而使限位結構20自受壓位置復位到初始位置。The
在本實施例中,壓合機構1A可進一步包含設置於限位結構20的下表面220的補強結構50。進一步來說,補強結構50設置於基座10與限位結構20之間。In this embodiment, the
如圖3所示,基板11可置於承載台110上,基板11例如但不限於是矽晶圓、電路板、玻璃板或金屬板。As shown in FIG. 3 , a
充氣氣囊410膨脹使得中介層420推壓基板11和限位結構20。限位結構20由於被按壓元件40的中介層420推壓而處於受壓位置。此時,限位結構20的上表面210與基板11相差在±1mm內。更進一步來說,中介層420透過充氣氣囊410推壓基板11,使得限位結構20的上表面210與基板11的上表面100之間的相差在±1mm內。更具體來說,處於受壓位置的限位結構20的上表面210與基板11的上表面100實質上平齊。The inflated
由於限位結構20支撐按壓元件40,限位結構20能夠支撐充氣氣囊410以及中介層420,使充氣氣囊410在推動中介層420時,更有效率覆蓋基板11,並填滿基板11具有高低差之間隙(未繪示)。Since the limiting
圖1至圖3揭露一種透過彈性件30和按壓元件40讓限位結構20能夠升降的壓合機構1A,但本新型不以此為限。請參照圖4至圖6,其中圖4為根據本新型另一實施例之壓合機構的示意圖,圖5為圖4之壓合機構的基座和限位結構的示意圖,且圖6為圖4之壓合機構的升降結構處於受壓位置的示意圖。在本實施例中,壓合機構1B包含基座10B、限位結構20、按壓元件40、升降結構60以及驅動裝置70。FIG. 1 to FIG. 3 disclose a
基座10B包含用於承載基板11的承載台110。進一步來說,基座10B可包含承載台110以及供承載台110設置的主體120B。承載台110的上表面111可設置有用以吸附基板11的負壓孔或夾取基板11的夾具(未繪示)。此外,基座10B還可包含形成於主體120B的多個開孔121,且這些開孔121沿著基座10B的方向間隔排列。承載台110的上表面111可設置有用以吸附基板11的負壓孔或夾取基板11的夾具(未繪示)。The
升降結構60與基座10B對應設置。進一步來說,升降結構60可為連桿,並且連桿穿過基座10B的開孔121。驅動裝置70例如但不限於是伺服馬達,其與升降結構60連接,並用以帶動升降結構60上升或下降。在本實施例中,升降結構60的數量可為多個,即有多根連桿分別對應基座10B的多個開孔121,但本新型不以此為限。The lifting
限位結構20可移動地設置於升降結構60,且限位結構20圍繞基座10的承載台110。進一步來說,驅動裝置70可帶動升降結構60與限位結構20一併相對基座10上升或下降。The limiting
按壓元件40對應基座10的承載台110設置,且按壓元件40可由氣壓驅動或電力驅動。進一步來說,按壓元件40例如但不限於包含由氣壓驅動的充氣氣囊或是由電力驅動的平板狀壓平件。在本實施例中,按壓元件40可包含充氣氣囊410以及中介層420。關於按壓元件40的具體描述可參考對應圖1至圖3的先前內容,此處不再贅述。The
升降結構60可相對限位結構20的方向移動,且升降結構60具有初始位置以及受壓位置。圖4示例性繪出升降結構60處於初始位置,且圖6示例性繪出升降結構60處於受壓位置。更進一步來說,升降結構60可被驅動裝置70驅動而自初始位置移動到受壓位置,或是自受壓位置復位至初始位置。於初始位置,限位結構20的上表面210高於基板11。於受壓位置,升降結構60作動使得限位結構20的上表面210平齊於基板11。The lifting
如圖6所示,基板11可置於承載台110上,當驅動裝置70驅動升降結構60下降到受壓位置,充氣氣囊410膨脹使得中介層420推壓基板11和限位結構20,。此時,由於升降結構60的作動,限位結構20的上表面210被調整成為基板11相差在±1mm內。更進一步來說,限位結構20的上表面210與基板11的上表面100之間的相差在±1mm內。更具體來說,當升降結構60處於受壓位置,限位結構20的上表面210與基板11的上表面100實質上平齊。As shown in FIG6 , the
綜上所述,根據本新型揭露之壓合機構,由於限位結構支撐按壓元件,限位結構能夠支撐充氣氣囊以及中介層,使充氣氣囊在推動中介層時,更有效率覆蓋基板高低差之間隙。並且,按壓元件包含充氣氣囊以及中介層,不僅改善對應高低差之基板,並有效將高低差基板之間間隙填滿,且達到改善按壓元件使用次數。,In summary, according to the compression mechanism disclosed in the present invention, since the limiting structure supports the pressing element, the limiting structure can support the inflatable airbag and the intermediate layer, so that the inflatable airbag can more efficiently cover the gap between the height differences of the substrates when pushing the intermediate layer. In addition, the pressing element includes the inflatable airbag and the intermediate layer, which not only improves the substrate corresponding to the height difference, but also effectively fills the gap between the height difference substrates, and improves the number of times the pressing element can be used.
本新型之實施例揭露雖如上所述,然並非用以限定本新型,任何熟習相關技藝者,在不脫離本新型之精神和範圍內,舉凡依本新型申請範圍所述之形狀、構造、特徵及精神當可做些許之變更,因此本新型之專利保護範圍需視本說明書所附之申請專利範圍所界定者為準。Although the embodiments of the present invention are disclosed as described above, they are not intended to limit the present invention. Anyone skilled in the relevant art may make some changes to the shape, structure, features and spirit described in the scope of application of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.
1A、1B:壓合機構
11:基板
100:上表面
10、10B:基座
110:承載台
111:上表面
120B:主體
121:開孔
20:限位結構
210:上表面
220:下表面
30:彈性件
40:按壓元件
410:充氣氣囊
420:中介層
50:補強結構
60:升降結構
70:驅動裝置1A, 1B: Pressing mechanism
11: Base plate
100:
圖1為根據本新型一實施例之壓合機構的示意圖。 圖2為圖1之壓合機構的限位結構的示意圖。 圖3為圖1之壓合機構的升降結構處於受壓位置的示意圖。 圖4為根據本新型另一實施例之壓合機構的示意圖。 圖5為圖4之壓合機構的基座和限位結構的示意圖。 圖6為圖4之壓合機構的升降結構處於受壓位置的示意圖。 FIG. 1 is a schematic diagram of a compression mechanism according to an embodiment of the present invention. FIG. 2 is a schematic diagram of a limiting structure of the compression mechanism of FIG. 1. FIG. 3 is a schematic diagram of the lifting structure of the compression mechanism of FIG. 1 in a compression position. FIG. 4 is a schematic diagram of a compression mechanism according to another embodiment of the present invention. FIG. 5 is a schematic diagram of a base and a limiting structure of the compression mechanism of FIG. 4. FIG. 6 is a schematic diagram of the lifting structure of the compression mechanism of FIG. 4 in a compression position.
1A:壓合機構 1A: Pressing mechanism
10:基座 10: Base
110:承載台 110: Carrier platform
111:上表面 111: Upper surface
20:限位結構 20: Limiting structure
210:上表面 210: Upper surface
220:下表面 220: Lower surface
30:彈性件 30: Elastic parts
40:按壓元件 40: Pressing element
410:充氣氣囊 410: Inflatable airbag
420:中介層 420: Intermediary layer
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113204760U TWM660799U (en) | 2024-05-10 | 2024-05-10 | Pressing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW113204760U TWM660799U (en) | 2024-05-10 | 2024-05-10 | Pressing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM660799U true TWM660799U (en) | 2024-09-21 |
Family
ID=93610725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW113204760U TWM660799U (en) | 2024-05-10 | 2024-05-10 | Pressing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM660799U (en) |
-
2024
- 2024-05-10 TW TW113204760U patent/TWM660799U/en unknown
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