[go: up one dir, main page]

TWI801234B - 電路結構、半導體元件及其製造方法 - Google Patents

電路結構、半導體元件及其製造方法 Download PDF

Info

Publication number
TWI801234B
TWI801234B TW111116897A TW111116897A TWI801234B TW I801234 B TWI801234 B TW I801234B TW 111116897 A TW111116897 A TW 111116897A TW 111116897 A TW111116897 A TW 111116897A TW I801234 B TWI801234 B TW I801234B
Authority
TW
Taiwan
Prior art keywords
fabricating
semiconductor device
same
circuit structure
circuit
Prior art date
Application number
TW111116897A
Other languages
English (en)
Other versions
TW202345359A (zh
Inventor
梁立言
Original Assignee
旺宏電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 旺宏電子股份有限公司 filed Critical 旺宏電子股份有限公司
Priority to TW111116897A priority Critical patent/TWI801234B/zh
Application granted granted Critical
Publication of TWI801234B publication Critical patent/TWI801234B/zh
Publication of TW202345359A publication Critical patent/TW202345359A/zh

Links

TW111116897A 2022-05-05 2022-05-05 電路結構、半導體元件及其製造方法 TWI801234B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW111116897A TWI801234B (zh) 2022-05-05 2022-05-05 電路結構、半導體元件及其製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111116897A TWI801234B (zh) 2022-05-05 2022-05-05 電路結構、半導體元件及其製造方法

Publications (2)

Publication Number Publication Date
TWI801234B true TWI801234B (zh) 2023-05-01
TW202345359A TW202345359A (zh) 2023-11-16

Family

ID=87424326

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111116897A TWI801234B (zh) 2022-05-05 2022-05-05 電路結構、半導體元件及其製造方法

Country Status (1)

Country Link
TW (1) TWI801234B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849885B (zh) * 2023-05-04 2024-07-21 旺宏電子股份有限公司 半導體元件及其製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI882693B (zh) * 2024-02-21 2025-05-01 旺宏電子股份有限公司 記憶體元件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180247953A1 (en) * 2016-05-23 2018-08-30 SK Hynix Inc. Semiconductor device and manufacturing method thereof
US20190019804A1 (en) * 2015-04-01 2019-01-17 Samsung Electronics Co., Ltd. Three-dimensional semiconductor devices
TW202147581A (zh) * 2020-04-17 2021-12-16 美商美光科技公司 在陣列區域及非陣列區域中包含支柱之電子裝置以及相關之系統及方法
TWI759015B (zh) * 2020-12-17 2022-03-21 旺宏電子股份有限公司 三維記憶體元件及其製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190019804A1 (en) * 2015-04-01 2019-01-17 Samsung Electronics Co., Ltd. Three-dimensional semiconductor devices
US20180247953A1 (en) * 2016-05-23 2018-08-30 SK Hynix Inc. Semiconductor device and manufacturing method thereof
TW202147581A (zh) * 2020-04-17 2021-12-16 美商美光科技公司 在陣列區域及非陣列區域中包含支柱之電子裝置以及相關之系統及方法
TWI759015B (zh) * 2020-12-17 2022-03-21 旺宏電子股份有限公司 三維記憶體元件及其製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI849885B (zh) * 2023-05-04 2024-07-21 旺宏電子股份有限公司 半導體元件及其製造方法

Also Published As

Publication number Publication date
TW202345359A (zh) 2023-11-16

Similar Documents

Publication Publication Date Title
EP4207269A4 (en) SEMICONDUCTOR PACKAGE STRUCTURE AND RELATED MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
EP4148792A4 (en) SEMI-CONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING IT
TWI800831B (zh) 半導體裝置和製造半導體裝置的方法
TWI800821B (zh) 半導體元件及其製造方法
TWI801234B (zh) 電路結構、半導體元件及其製造方法
TWI799777B (zh) 半導體裝置和其製造方法
TWI800378B (zh) 半導體裝置及其形成方法
TWI800175B (zh) 半導體元件及其製造方法
TWI800818B (zh) 積體電路元件及其製造方法
TWI800884B (zh) 半導體結構及其製造方法
TWI800879B (zh) 半導體元件及其製作方法
TWI801165B (zh) 半導體記憶體裝置及其製造方法
EP4199088A4 (en) SEMICONDUCTOR STRUCTURE AND METHOD FOR PRODUCING THEREOF
EP4213210A4 (en) SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURE THEREOF
AU2022297769A1 (en) Semiconductor structure, semiconductor device, and method
TWI914658B (zh) 半導體裝置結構及其形成方法
EP3958295A4 (en) Semiconductor device, fabrication method, and electronic device
TWI800797B (zh) 半導體裝置及其製造方法
TWI799775B (zh) 半導體元件及其製造方法
EP4195253A4 (en) METHOD FOR FORMING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
TWI800698B (zh) 半導體元件結構及其製造方法
TWI915252B (zh) 半導體元件及其製作方法
TWI914555B (zh) 半導體元件及其製作方法
TWI914579B (zh) 半導體結構及其製造方法
TWI914840B (zh) 半導體裝置及用於製造其之方法