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TWI801173B - 半導體裝置及製造半導體裝置的方法 - Google Patents

半導體裝置及製造半導體裝置的方法 Download PDF

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Publication number
TWI801173B
TWI801173B TW111110474A TW111110474A TWI801173B TW I801173 B TWI801173 B TW I801173B TW 111110474 A TW111110474 A TW 111110474A TW 111110474 A TW111110474 A TW 111110474A TW I801173 B TWI801173 B TW I801173B
Authority
TW
Taiwan
Prior art keywords
semiconductor device
manufacturing
manufacturing semiconductor
semiconductor
Prior art date
Application number
TW111110474A
Other languages
English (en)
Other versions
TW202339258A (zh
Inventor
劉原良
李宜蓁
陳彥彰
Original Assignee
漢磊科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 漢磊科技股份有限公司 filed Critical 漢磊科技股份有限公司
Priority to TW111110474A priority Critical patent/TWI801173B/zh
Priority to CN202211551161.0A priority patent/CN116799043A/zh
Priority to US18/098,205 priority patent/US12426302B2/en
Application granted granted Critical
Publication of TWI801173B publication Critical patent/TWI801173B/zh
Publication of TW202339258A publication Critical patent/TW202339258A/zh
Priority to US19/308,923 priority patent/US20250380449A1/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/252Source or drain electrodes for field-effect devices for vertical or pseudo-vertical devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/64Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66Vertical DMOS [VDMOS] FETs
    • H10D30/665Vertical DMOS [VDMOS] FETs having edge termination structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01Manufacture or treatment
    • H10D12/031Manufacture or treatment of IGBTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/63Vertical IGFETs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325Silicon carbide
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/23Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
    • H10D64/251Source or drain electrodes for field-effect devices
    • H10D64/256Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
TW111110474A 2022-03-22 2022-03-22 半導體裝置及製造半導體裝置的方法 TWI801173B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW111110474A TWI801173B (zh) 2022-03-22 2022-03-22 半導體裝置及製造半導體裝置的方法
CN202211551161.0A CN116799043A (zh) 2022-03-22 2022-12-05 半导体装置及制造半导体装置的方法
US18/098,205 US12426302B2 (en) 2022-03-22 2023-01-18 Semiconductor devices and methods of manufacturing semiconductor device
US19/308,923 US20250380449A1 (en) 2022-03-22 2025-08-25 Semiconductor devices and methods of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW111110474A TWI801173B (zh) 2022-03-22 2022-03-22 半導體裝置及製造半導體裝置的方法

Publications (2)

Publication Number Publication Date
TWI801173B true TWI801173B (zh) 2023-05-01
TW202339258A TW202339258A (zh) 2023-10-01

Family

ID=87424252

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111110474A TWI801173B (zh) 2022-03-22 2022-03-22 半導體裝置及製造半導體裝置的方法

Country Status (3)

Country Link
US (2) US12426302B2 (zh)
CN (1) CN116799043A (zh)
TW (1) TWI801173B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI848809B (zh) * 2023-09-01 2024-07-11 漢磊科技股份有限公司 半導體裝置及製造半導體裝置的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170012108A1 (en) * 2014-01-24 2017-01-12 Denso Corporation Method for manufacturing semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170012108A1 (en) * 2014-01-24 2017-01-12 Denso Corporation Method for manufacturing semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI848809B (zh) * 2023-09-01 2024-07-11 漢磊科技股份有限公司 半導體裝置及製造半導體裝置的方法

Also Published As

Publication number Publication date
CN116799043A (zh) 2023-09-22
US12426302B2 (en) 2025-09-23
TW202339258A (zh) 2023-10-01
US20230307497A1 (en) 2023-09-28
US20250380449A1 (en) 2025-12-11

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