TWI879918B - Cutting device - Google Patents

Abstract

[Topic] Provide a cutting device that can easily load and unload multiple work clamps of different sizes on a worktable base. [Solution] The holding worktable of the cutting device has a holding surface, and the holding surface is formed with a cutter groove corresponding to the predetermined dividing line and a suction hole corresponding to the device, and can be selected from a first holding worktable corresponding to the first workpiece and a second holding worktable corresponding to the second workpiece. The worktable base includes: a supporting surface, which supports the lower surface of the holding worktable; a suction port, which opens at a position corresponding to the holding worktable and allows negative pressure to act from the suction hole of the holding worktable; and a fixing block, which is fixed to the supporting surface in a freely loadable and unloadable manner, and clamps the holding worktable supported by the supporting surface from the side.

Description

Cutting device

The present invention relates to a cutting device.

When a workpiece such as a resin package substrate molded with resin and having a plurality of device chips mounted on a frame substrate formed of metal or resin with wiring formed thereon is divided into individual chips, a cutting device having a cutting blade is used. A jig cutting machine is known, which is particularly used when processing a resin package substrate, and directly attracts and holds the workpiece on a holding surface of a work clamp having a cutter groove and a suction hole of the cutting blade, wherein the cutter groove of the cutting blade corresponds to a predetermined dividing line, and the suction hole corresponds to the individual chips after division (see patent document 1). Prior art documents Patent document

Patent document 1: Japanese Patent Application Publication No. 2015-093335

Invention Problems to be Solved

However, since the tool retraction groove and the suction hole must be matched with the size and design of the workpiece, it is formed as follows: the worktable base moving in the processing feed direction is loaded and unloaded for each workpiece of different types, so that they can be replaced.

However, since the table base is fixed to the moving axis, it cannot be easily replaced. In addition, when changing the work table according to the type of workpiece, the work table must be matched with the screw holes formed in the table base. As a result, there is a problem that it is difficult to make large changes in size or design because the size of the work table is limited to the screw holes of the table base.

Accordingly, the purpose of the present invention is to provide a cutting device that can easily load and unload multiple work clamps of different sizes on the work clamp base. Means for solving the problem

According to the present invention, a cutting device can be provided, the aforementioned cutting device comprises: A holding table for attracting and holding a plate-shaped workpiece, wherein the aforementioned plate-shaped workpiece is respectively formed with devices in the areas demarcated by a plurality of mutually intersecting predetermined dividing lines; A cutting unit, which has a cutting blade, wherein the aforementioned cutting blade cuts and divides the workpiece held on the holding table into a plurality of chips; and A table base, which fixes the holding table in a freely loadable and unloadable manner, The holding table has a holding surface, wherein the aforementioned holding surface is formed with a tool withdrawal groove corresponding to the predetermined dividing line and an attraction hole corresponding to the device, The holding table can be selected from a first holding table corresponding to a first workpiece and a second holding table corresponding to a second workpiece of a size different from the first workpiece, The table base has: A supporting surface, which supports the lower surface of the holding table; A suction port is opened at a position corresponding to the holding workbench, and negative pressure acts from the suction hole of the holding workbench; and a fixing block is fixed to the supporting surface in a detachable manner, and clamps the holding workbench supported by the supporting surface from the side. The position of the fixing block can be adjusted to fix either the first holding workbench or the second holding workbench to the supporting surface.

Preferably, the fixing block has an abutment block for abutting against the side edge of at least one corner of the holding workbench.

Preferably, the holding table includes a hard plate with ventilation, and a rubber plate fixed to the front side of the hard plate and having the knife-retracting groove and the suction hole. Effect of the invention

The invention of this application can make it easy to load and unload a plurality of work clamps of different sizes on the workbench base.

The form used to implement the invention

The following is a detailed description of the implementation forms of the present invention with reference to the drawings. The present invention is not limited by the contents described in the following implementation forms. Furthermore, the constituent elements described below include constituent elements that can be easily conceived by a person with ordinary knowledge in the relevant technical field, and substantially the same constituent elements. In addition, the structures described below can be appropriately combined. Furthermore, various omissions, substitutions or changes in the structure can be made without departing from the gist of the present invention.

The cutting device 1 of the embodiment of the present invention is described with reference to the drawings. First, the overall structure of the cutting device 1 of the embodiment and the structure of the workpiece 100 to be processed are described. FIG. 1 is a three-dimensional diagram showing a structure example of the cutting device 1 of the present embodiment. FIG. 2 is a three-dimensional diagram showing an example of the workpiece 100 to be processed by the cutting device 1 shown in FIG. 1. FIG. 3 is a three-dimensional diagram showing the appearance of the workpiece 100 shown in FIG. 2 as viewed from another direction. In the following description, the X-axis direction is a direction on a horizontal plane. The Y-axis direction is a direction on a horizontal plane that is orthogonal to the X-axis direction. The Z-axis direction is a direction orthogonal to the X-axis direction and the Y-axis direction. The cutting device 1 of the embodiment has the following features: the machining feed direction is the X-axis direction, the indexing feed direction is the Y-axis direction, and the cutting feed direction is the Z-axis direction.

The cutting device 1 is a device for cutting a workpiece 100 held on a holding table 10. As shown in FIG2 , the workpiece 100 includes a metal substrate 110 as a substrate, a device wafer 120 (device) mounted on the metal substrate 110, and a mold resin 130 covering the device wafer 120.

The metal substrate 110 is made of metal and is formed into a flat plate with a rectangular plane shape. As shown in FIG2 , the metal substrate 110 is provided with a device region 111 and a non-device region 112 surrounding the device region 111. In the embodiment, although three device regions 111 are provided, the number of device regions 111 is not limited to three. As shown in FIG2 , the device region 111 has a predetermined dividing line 114 that divides it into a plurality of regions 113. The region 113 is provided with a device chip 120 on the other side of the metal substrate 110, that is, the back side 116 (shown in FIG3 , etc.).

The device 120 may be an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration). The electrode portion 117 connected to the device chip 120 mounted on the area 113 by a line not shown extends on the predetermined division line 114 and is arranged to cross the predetermined division line 114. The electrode portion 117 is arranged around the entire area 113 and is connected to the area 113 and the base material of the metal substrate 110 around the area 113. In the embodiment, the electrode portion 117 is cut in the middle of the length direction by cutting.

The mold resin 130 is made of a thermoplastic resin. The mold resin 130 is laminated on the back side 116 of the metal substrate 110, and seals (covers) the device chip 120 and the wire mounted on the back side 116 of the region 113. In the embodiment, as shown in FIG3, the mold resin 130 seals (covers) the entire device region 111 on the back side 116 of the metal substrate 110. In the embodiment, as shown in FIG2, on the front side 115 of the metal substrate 110, the mold resin 130 is sealed in the predetermined dividing line 114 in a state where the region 113 and the electrode portion 117 mounted with the device chip 120 are exposed.

Thus, in the embodiment, the workpiece 100 is a so-called QFN (quad flat non-leaded package) substrate in which a device chip 120 mounted on a metal substrate 110 is covered with a mold resin 130 and an electrode portion 117 is arranged on a predetermined dividing line 114 cut by cutting. In the embodiment, the workpiece 100 is a QFN substrate, but the present invention is not limited thereto and may be, for example, a CSP (chip scale package) substrate or a BGA (ball grid array package).

The workpiece 100 shown in FIG. 1 , FIG. 2 and FIG. 3 is processed by cutting the center of the length direction of the electrode portion 117 along each predetermined dividing line 114 of each device region 111. Each electrode portion 117 can be divided into two, and the workpiece 100 can be divided into individual chips 140. The chip 140 has a region 113 of a metal substrate 110, a plurality of electrode portions 117 connected to the region 113 at the end, a device chip 120 mounted on the back side 116 of the region 113 and connected to the electrode portion 117 by a wire, and a mold resin 130 laminated on the back side 116 of the region 113 and covering the device chip 120.

The size of the workpiece 100, the number of the predetermined dividing lines 114, the intervals between the predetermined dividing lines 114, and the number of device chips 120 are not limited by the embodiment. That is, the workpieces 100 with different product numbers are different from each other in at least one of the size, the number of the predetermined dividing lines 114, the intervals between the predetermined dividing lines 114, and the number of device chips 120.

As shown in FIG1 , the cutting device 1 includes a holding table 10, a table base 40, a cutting unit 50, a water supply unit 54, a photographing unit 60, an X-axis moving unit 71, a Y-axis moving unit 72, a Z-axis moving unit 73, and a rotation moving unit 74. The cutting device 1 is a dual-spindle dicer having two cutting units 50, that is, a so-called facing dual-spindle type cutting device. The cutting device 1 may also be further equipped with a cleaning unit, a cassette loading table, and a conveying unit, etc. The cleaning unit cleans the workpiece 100 after cutting, the cassette loading table is used to hold the cassette for accommodating the workpiece 100 before and after cutting, and the conveying unit conveys the workpiece 100 between the cassette loaded on the cassette loading table, the holding table 10, and the cleaning unit. Each component of the cutting device 1 is controlled by a computer, i.e., a control unit, not shown.

The holding table 10 holds the workpiece 100 by suction on the holding surface 31 (see FIG. 4 ). The holding table 10 does not hold the workpiece 100 by suction through a tape or the like, but directly holds the workpiece 100 by suction on the holding surface 31, and also holds the individual wafers 140 separated from the workpiece 100 by suction. The detailed structure of the holding table 10 will be described later.

The worktable base 40 can fix and hold the worktable 10. In the embodiment, the worktable base 40 is arranged on the X-axis moving base 4, and the aforementioned X-axis moving base 4 covers the processing area below the cutting unit 50 and the area away from the bottom of the cutting unit 50 and the area where the workpiece 100 can be moved in and out by the X-axis moving unit 71, and can move freely in the X-axis direction. In the embodiment, the worktable base 40 is supported by the rotation moving unit 74 so as to be rotatable around an axis parallel to the Z-axis direction, and the aforementioned rotation moving unit 74 is arranged in a manner that it can move freely in the X-axis direction by the X-axis moving unit 71. In addition, the upper surface of the X-axis moving base 4 is formed flat along the horizontal direction. The detailed structure of the workbench base 40 will be described later.

The cutting unit 50 is a cutting mechanism on which a cutting blade 51 is detachably mounted. The cutting blade 51 cuts and divides the workpiece 100 held on the holding table 10 into a plurality of wafers 140. The cutting unit 50 on one side is provided on a column portion on one side of a gate-shaped support frame 3 vertically provided from the device body 2 through a Y-axis moving unit 72 and a Z-axis moving unit 73. The cutting unit 50 on the other side is provided on a column portion on the other side of the support frame 3 through a Y-axis moving unit 72 and a Z-axis moving unit 73. Furthermore, the support frame 3 is formed by connecting the upper ends of a pair of columns to each other through a horizontal beam. Each cutting unit 50 is movable in the Y-axis direction by the Y-axis moving unit 72 relative to the workpiece 100 held by the holding table 10, and is movable in the Z-axis direction by the Z-axis moving unit 73. The cutting unit 50 can position the cutting blade 51 at any position of the holding surface 31 (refer to FIG. 4 ) of the holding table 10 by the Y-axis moving unit 72 and the Z-axis moving unit 73. The cutting unit 50 includes a cutting blade 51, a spindle housing 52, and a spindle 53.

The cutting blade 51 is an extremely thin cutting grindstone having a roughly annular shape. In the embodiment, the cutting blade 51 is a so-called hub-type blade, and has an annular circular base that can be mounted on the spindle 53, and an annular cutting edge of a predetermined thickness arranged on the outer periphery of the circular base. The circular base is made of conductive metal. The cutting edge is formed by abrasive grains such as diamond or CBN (cubic boron nitride), and a binder (bonding material) such as metal or resin.

The spindle housing 52 is installed on a Z-axis moving base 6 that is movable in the Z-axis direction by a Z-axis moving unit 73 described later. The spindle housing 52 of the cutting unit 50 on one side is supported on the column side of one side of the gate-shaped support frame 3 vertically installed from the device body 2 through the Y-axis moving unit 72 and the Z-axis moving unit 73. The spindle housing 52 of the cutting unit 50 on the other side is supported on the column side of the support frame 3 on the other side through the Y-axis moving unit 72 and the Z-axis moving unit 73. Each spindle housing 52 is movable in the Y-axis direction by the Y-axis moving unit 72 and in the Z-axis direction by the Z-axis moving unit 73 relative to the workpiece 100 held by the holding table 10 .

The spindle 53 is rotatably arranged around an axis in the spindle housing 52. The spindle 53 is driven and rotated by a spindle motor (not shown). The cutting blade 51 may be installed at the front end of the spindle 53. In the embodiment, the axis of the spindle 53 and the cutting blade 51 of the cutting unit 50 is set in a direction parallel to the Y-axis direction.

The water supply unit 54 supplies processing water to the workpiece 100 and the cutting blade 51 during the cutting process performed by the cutting unit 50. The water supply unit 54 includes a water supply source (not shown) and a water supply nozzle 55. The water supply source includes, for example, a tank for storing processing water and a pump for supplying the processing water in the tank to the water supply nozzle 55. The water supply nozzle 55 is fixed to the cutting unit 50 in such a manner that it moves integrally with the cutting unit 50. The water supply nozzle 55 supplies the processing water supplied from the water supply source to the workpiece 100 and the cutting blade 51.

The photographing unit 60 is fixed to the cutting unit 50 on one side in such a manner that it moves integrally with the cutting unit 50 on one side. The photographing unit 60 includes a photographing element for photographing a predetermined area of the front side 115 of the workpiece 100 held on the holding table 10. The photographing element may be, for example, a CCD (Charge-Coupled Device) photographing element or a CMOS (Complementary Metal Oxide Semiconductor, Complementary MOS) photographing element. The photographing unit 60, for example, photographs images for completing calibration, etc., and outputs the obtained photographed images to a control unit, etc., wherein the aforementioned calibration is performed to align the workpiece 100 held on the holding table 10 with the cutting blade 51.

The X-axis moving unit 71 is a unit that moves the holding table 10 and the cutting unit 50 relative to each other in the processing feed direction, that is, the X-axis direction. In the embodiment, the X-axis moving unit 71 moves the table base 40 to which the holding table 10 is fixed and the rotation moving unit 74 in the X-axis direction through the X-axis moving base 4. The X-axis moving unit 71 has, for example: a known ball screw that is rotatably arranged around an axis parallel to the X-axis direction; a known motor that rotates the ball screw around the axis; and a known guide rail that supports the X-axis moving base 4 on which the table base 40 is arranged so that it can move freely in the X-axis direction. In the embodiment, the guide rail of the X-axis moving unit 71 is set on the device body 2 of the cutting device 1.

The Y-axis moving unit 72 is a unit that moves the holding table 10 and the cutting unit 50 relative to each other in the indexing feed direction, i.e., the Y-axis direction. In the embodiment, the Y-axis moving unit 72 moves the cutting unit 50 and the Z-axis moving unit 73 in the Y-axis direction. The Y-axis moving unit 72 includes, for example, a known ball screw that is rotatably arranged around an axis parallel to the Y-axis direction; a known motor that rotates the ball screw around the axis; and a known guide rail that supports the Y-axis moving base 5 so that it can move freely in the Y-axis direction. In the embodiment, the guide rail of the Y-axis moving unit 72 is arranged on a horizontal beam connecting the upper ends of a pair of columns of the support frame 3 of the cutting device 1 to each other.

The Z-axis moving unit 73 is a unit that enables the holding table 10 and the cutting unit 50 to move relative to each other in the cutting feed direction, that is, the Z-axis direction. In the embodiment, two Z-axis moving units 73 are provided corresponding to each cutting unit 50. In the embodiment, each Z-axis moving unit 73 enables each Z-axis moving base 6 supporting each cutting unit 50 to move in the Z-axis direction. The Z-axis moving unit 73 includes, for example: a known ball screw that is rotatably arranged around an axis; a known motor that rotates the ball screw around the axis; and a known guide rail that supports the cutting unit 50 so that it can move freely in the Z-axis direction. In the embodiment, the guide rail of the Z-axis moving unit 73 is set on the Y-axis moving base 5.

The rotational movement unit 74 is a unit that rotates the holding table 10 around an axis parallel to the Z-axis direction. In the embodiment, the rotational movement unit 74 rotates the holding table 10 around an axis parallel to the Z-axis direction via the table base 40. The rotational movement unit 74 can perform processing and feeding in the X-axis direction together with the X-axis movement base 4 provided with the table base 40.

Next, the detailed structure of the holding table 10 and the table base 40 of the embodiment will be described. FIG. 4 is an exploded perspective view showing a structure example of the holding table 10 and the table base 40 of the cutting device 1 shown in FIG. 1 . FIG. 5 is a plan view of the table base 40 shown in FIG. 4 . FIG. 6 is a plan view showing a state where the first holding table 10-1 is fixed to the table base 40 shown in FIG. 4 . FIG. 7 is a plan view showing a state where the second holding table 10-2 is fixed to the table base 40 shown in FIG. 4 .

As shown in FIG4 , the holding table 10 is freely loadable and removable to the table base 40. In the embodiment, the holding table 10 can be selected from the first holding table 10-1 and the second holding table 10-2. The first holding table 10-1 corresponds to the first workpiece 100-1. The second holding table 10-2 corresponds to the second workpiece 100-2 of a different size from the first workpiece 100-1. The holding table 10 has a hard plate 20 and a rubber plate 30.

The hard plate 20 is a rectangular plate that is larger than the outer shape of the workpiece 100. The hard plate 20 is breathable. The hard plate 20 may be, for example, a breathable hard resin or porous ceramic. The breathable hard resin is a resin having continuous bubbles with a connected cell structure and low dust emission, such as the following materials: foamed polyurethane, foamed polyethylene (PE: Polyethylene), foamed polypropylene (PP: Polypropylene), etc. The hard plate 20 may also be a hard resin to which fillers are added to suppress thermal shrinkage.

The rubber plate 30 is a rectangular plate having almost the same shape as the hard plate 20. The rubber plate 30 is laminated and fixed to the front side of the hard plate 20 through a bonding material or the like. The rubber plate 30 is a resin such as non-breathable polyurethane rubber. The rubber plate 30 has a holding surface 31, a tool-escape groove 32, and a suction hole 33. The holding surface 31 is a surface on the front side of the rubber plate 30 that holds the workpiece 100. The tool-escape groove 32 is a groove for the cutting blade 51 so as not to damage the holding surface 31 when the cutting blade 51 of the cutting unit 50 cuts the workpiece 100. The tool-escape groove 32 is formed in a plurality in a grid-like manner and crosses the holding surface 31 of the rubber plate 30. The tool-relief groove 32 corresponds to the predetermined dividing line 114 of the workpiece 100 supported by the holding surface 31. The suction hole 33 is a through hole formed in the area demarcated by the tool-relief groove 32.

The holding table 10 can be manufactured by, for example, attaching the rubber plate 30 to the hard plate 20 with a bonding material, and then forming the knife-relief groove 32 and the suction hole 33 on the rubber plate 30. The holding table 10 can also be manufactured by forming the knife-relief groove 32 and the suction hole 33 on the rubber plate 30, and then attaching the rubber plate 30 formed with the knife-relief groove 32 and the suction hole 33 to the hard plate 20 with a bonding material.

The number of the backing grooves 32 of the rubber sheet 30, the intervals between the backing grooves 32, and the number of the suction holes 33, etc., must be formed in accordance with the number of the predetermined dividing lines 114 of the corresponding workpiece 100, the intervals between the predetermined dividing lines 114, and the number of device wafers 120, etc. That is, the size of the rubber sheet 30 of the first holding table 10-1, the number of the backing grooves 32, the intervals between the backing grooves 32, and the number of the suction holes 33, etc., will correspond to the size of the first workpiece 100-1, the number of the predetermined dividing lines 114, the intervals between the predetermined dividing lines 114, and the number of device wafers 120, etc. The size of the rubber plate 30 of the second holding workbench 10-2, the number of the tool retracting grooves 32, the spacing between the tool retracting grooves 32, and the number of the suction holes 33, etc., will correspond to the size of the second workpiece 100-2, the number of the predetermined splitting lines 114, the spacing between the predetermined splitting lines 114, and the number of device chips 120, etc.

The workbench base 40 can fix the workbench 10. The workbench base 40 can select any one of the first holding workbench 10-1 and the second holding workbench 10-2 for fixing. The workbench base 40 has a supporting surface 41, a negative pressure transmission chamber 42, a suction port 43 and a fixing block 44. The supporting surface 41 supports the lower surface of the holding workbench 10. More specifically, the supporting surface 41 supports the lower surface of the hard plate 20.

The negative pressure transmission chamber 42 is formed in a concave shape downward from the support surface 41. The negative pressure transmission chamber 42 is a rectangular chamber formed to include at least a region corresponding to the region where the suction hole 33 of the rubber plate 30 is formed. The negative pressure transmission chamber 42 is sealed by supporting the holding table 10 on the support surface 41.

The suction port 43 is opened at a position on the bottom surface of the negative pressure transfer chamber 42 corresponding to the holding workbench 10. In the embodiment, although the suction port 43 is formed in a circular shape at the center of the bottom surface of the negative pressure transfer chamber 42, the present invention is not limited to this. The suction port 43 is connected to a suction source not shown in the figure. The suction port 43 allows negative pressure to act from the suction hole 33 of the holding workbench 10. In more detail, the holding workbench 10 allows the negative pressure of the negative pressure transfer chamber 42 of the workbench base 40 generated by the suction of the suction source to be transmitted to the suction hole 33 of the rubber plate 30 through the air-permeable hard plate 20, thereby sucking and holding the workpiece 100.

The fixing block 44 is fixed to the supporting surface 41 in a removable manner. The fixing block 44 is a holding table 10 supported by the supporting surface 41 and clamped from the side. In the embodiment, the fixing block 44 is four L-shaped blocks along each corner of the workpiece 100. The fixing block 44 can also be fixed to the supporting surface 41, for example, by a magnet, or can be fixed by a screw. At this time, by aligning the predetermined dividing line 114 of the workpiece 100 and the backing groove 32 of the rubber sheet 30, when the cutting unit 50 cuts the workpiece 100, it is possible to suppress the cutting blade 51 from cutting the rubber sheet 30.

In this way, when the fixing block 44 is fixed to the supporting surface 41, the relative position of the fixing block 44 to the supporting surface 41 can be freely changed. Specifically, when fixing to the supporting surface 41 by means of a magnet, a permanent magnet or an electromagnetic magnet is provided on one of the fixing block 44 and the supporting surface 41. By changing the position of the fixing block 44 that is magnetically attracted to the supporting surface 41, the relative position of the fixing block 44 to the supporting surface 41 can be freely changed when the fixing block 44 is fixed to the supporting surface 41. Furthermore, when fixing to the supporting surface 41 by means of screws, screw holes for screwing the screws are provided at predetermined intervals on the supporting surface 41. By appropriately selecting the screw holes for screwing the screws passing through the fixing block 44, the relative position of the fixing block 44 to the supporting surface 41 can be freely changed when the fixing block 44 is fixed to the supporting surface 41.

The holding table 10 is detachable from the table base 40, and the fixing block 44 is detachable from the support surface 41. Thus, the table base 40 can fix any one of the first holding table 10-1 and the second holding table 10-2 to the support surface 41 by adjusting the position of the fixing block 44. That is, the table base 40 can fix the first holding table 10-1 and the second holding table 10-2 of different sizes corresponding to each of the first workpiece 100-1 and the second workpiece 100-2 of different sizes, respectively, by adjusting the position of the fixing block 44.

When the second workpiece 100-2 is smaller than the first workpiece 100-1, the second holding table 10-2 will be smaller than the first holding table 10-1. Therefore, compared with the case of fixing the first holding table 10-1 shown in FIG6, in the case of fixing the second holding table 10-2 shown in FIG7, the position where the fixing block 44 is fixed to the supporting surface 41 will become closer to the center of the supporting surface 41.

As described above, the cutting device 1 of the embodiment fixes the holding table 10 to the table base 40 by means of the fixing block 44 which can be freely attached and detached to the support surface 41 of the table base 40 and can be adjusted in position. In this way, the first holding table 10-1 and the second holding table 10-2 of different sizes can be selectively fixed to the table base 40. Therefore, since the size and design freedom of the holding table 10 can be improved, the following effects can be achieved: the holding table 10 suitable for the workpiece 100 or the holding table 10 of a size that is easy to manufacture can be used.

Furthermore, not only the holding table 10 that can be fixed at the screw holes formed on the outer peripheral portion of the holding surface but also the holding table 10 having only the holding surface 31 without the outer peripheral portion can be fixed.

Furthermore, the present invention is not limited to the above-mentioned embodiments. In other words, various modifications can be made within the scope of the gist of the present invention.

For example, the fixing block may not be L-shaped. Fig. 8 is a plan view showing a state where the first holding table 10-1 is fixed to the table base 40-2 of the first modification. Fig. 9 is a plan view showing a state where the second holding table 10-2 is fixed to the table base 40-2 of the first modification.

The table base 40-2 of the first modified example has two I-shaped long side fixing blocks 45-1 and two I-shaped short side fixing blocks 45-2, instead of the four L-shaped fixing blocks 44 of the table base 40 of the embodiment.

The workbench base 40-2 is fixed by two long side fixing blocks 45-1 and two short side fixing blocks 45-2 in a manner of surrounding the side of the first holding workbench 10-1 or the second holding workbench 10-2. More specifically, one end of the long side fixing block 45-1 abuts against the side of the short side fixing block 45-2 in the length direction. One end of the short side fixing block 45-2 abuts against the side of the long side fixing block 45-1 in the length direction.

The other end of the long side fixing block 45-1 in the length direction protrudes further outward than the side surface of the short side fixing block 45-2. Compared with the case of fixing the first holding workbench 10-1 shown in FIG8 , in the case of fixing the second holding workbench 10-2 shown in FIG9 , the protruding portion of the other end of the long side fixing block 45-1 becomes longer.

The other end of the short side fixing block 45-2 in the length direction protrudes further outward than the side surface of the long side fixing block 45-1. Compared with the case of fixing the first holding workbench 10-1 shown in FIG8, the protruding portion of the other end of the short side fixing block 45-2 becomes longer in the case of fixing the second holding workbench 10-2 shown in FIG9.

In this way, the workbench base 40-2 of the first modified example can selectively fix the first holding workbench 10-1 and the second holding workbench 10-2 of different sizes by adjusting the length of the protruding portion of the long side fixing block 45-1 and the short side fixing block 45-2. In addition, since the workbench base 40-2 of the first modified example covers the entire circumference to hold the side of the holding workbench 10, the sealing of the negative pressure transmission chamber 42 can be improved.

In addition, one fixing block may be fixed in a non-detachable manner. FIG. 10 is a plan view showing a configuration example of the holding table 10 and the table base 40-3 of the second modification. The table base 40-3 of the second modification has abutment blocks 46 and a plurality of optional I-shaped fixing blocks 47-1, 47-2, 47-3, 47-4 to replace the four L-shaped fixing blocks 44 of the table base 40 of the embodiment.

The abutment block 46 is fixed to the supporting surface 41 of the table base 40. The abutment block 46 supports and holds the table 10 by abutting and holding one side surface of the table 10 and a corner portion of one end of the side surface.

In the second modification, four I-shaped fixing blocks 47-1, 47-2, 47-3, and 47-4 are provided. The fixing blocks 47-1 and 47-2 are configured to hold the workbench 10 from the side of one side that does not abut against the abutment block 46. The fixing blocks 47-1 and 47-2 can be used selectively. The fixing blocks 47-3 and 47-4 are configured to hold the workbench 10 from the side of the other side that does not abut against the abutment block 46. The fixing blocks 47-3 and 47-4 can be used selectively.

1: Cutting device 2: Device body 3: Support frame 4: X-axis moving base 5: Y-axis moving base 6: Z-axis moving base 10: Holding table 10-1: 1st holding table 10-2: 2nd holding table 20: Hard plate 30: Rubber plate 31: Holding surface 32: Retracting groove 33: Suction hole 40: Table base 40-2: 1st variant table base 40-3: 2nd variant table base 41: Support surface 42: Negative pressure transmission chamber 43: Suction port 44, 47-1, 47-2, 47-3, 47-4: Fixed block 45-1: Fixing block for long side 45-2: Fixing block for short side 46: Abutment block 50: Cutting unit 51: Cutting blade 52: Spindle housing 53: Spindle 54: Water supply unit 55: Water supply nozzle 60: Shooting unit 71: X-axis moving unit 72: Y-axis moving unit 73: Z-axis moving unit 74: Rotation moving unit 100: Workpiece 100-1: First workpiece 100-2: Second workpiece 110: Metal substrate 111: Device area 112: Non-device area 113: Area 114: Predetermined dividing line 115: Front side 116: Back side 117: Electrode part 120: Device chip (device) 130: Molding resin 140: Chip X, Y, Z: Direction

FIG. 1 is a perspective view showing a configuration example of a cutting device of an embodiment of the present invention. FIG. 2 is a plan view showing an example of a workpiece to be processed by the cutting device shown in FIG. 1. FIG. 3 is a back view showing the workpiece shown in FIG. 2. FIG. 4 is an exploded perspective view showing a configuration example of a holding table and a table base of the cutting device shown in FIG. 1. FIG. 5 is a plan view of the table base shown in FIG. 4. FIG. 6 is a plan view showing a state where the first holding table is fixed to the table base shown in FIG. 4. FIG. 7 is a plan view showing a state where the second holding table is fixed to the table base shown in FIG. 4. FIG. 8 is a plan view showing a state where the first holding table is fixed to the table base of the first variant. FIG. 9 is a plan view showing a state where the second holding table is fixed to the table base of the first variant. FIG. 10 is a plan view showing a configuration example of the holding table and the table base of the second variant.

10-1: No. 1 holding workbench

10-2: Second holding table

20:Hard board

30: Rubber sheet

31: Keep the face

32: Retraction groove

33: Suction hole

40: Workbench base

41: Support surface

42: Negative pressure transmission room

43: Suction port

44:Fixed block

Claims (2)

A cutting device comprises: A holding table for holding a plate-shaped workpiece by suction, wherein the plate-shaped workpiece has devices formed in areas demarcated by a plurality of mutually intersecting predetermined dividing lines; A cutting unit having a cutting blade, wherein the cutting blade cuts and divides the workpiece held on the holding table into a plurality of chips; and A table base for fixing the holding table in a removable manner, The holding table has a holding surface, wherein the holding surface is formed with a tool withdrawal groove corresponding to the predetermined dividing line and a suction hole corresponding to the device, The holding table can be selected from a first holding table corresponding to a first workpiece and a second holding table corresponding to a second workpiece of a size different from the first workpiece, The table base has: A supporting surface for supporting the lower surface of the holding table; A suction port is opened at a position corresponding to the holding workbench, and a negative pressure acts from the suction hole of the holding workbench; and a fixing block is fixed to the supporting surface in a detachable manner, and clamps the holding workbench supported by the supporting surface from the side. The position of the fixing block can be adjusted to fix either the first holding workbench or the second holding workbench to the supporting surface. The fixing block has an abutment block for abutting the side of at least one corner of the holding workbench. A cutting device as claimed in claim 1, wherein the holding workbench includes a breathable hard plate, and a rubber plate fixed to the front side of the hard plate and having the tool retraction groove and the suction hole.