TW201801227A - Vacuum suction device prevents vacuum pressure loss in the process of grinding molding protection layer of semiconductor stripes or semiconductor wafers - Google Patents

Abstract

The invention relates to a vacuum suction device including a main body disposed by way of moving toward a lateral direction, and a suction part disposed on an upper surface of the main body, wherein the suction part sucks and fixes the object by forming vacuum after placing the object to be sucked thereon. A vacuum forming space for forming vacuum is disposed to the suction part. A plurality of suction inlets, along the upper and lower directions, is formed to the main body by way of communicating with the vacuum forming space so as to increase the suction area of using the vacuum-sucked semiconductor stripes, thereby obtaining the effect of stably sucking and fixing the semiconductor stripes or semiconductor wafers.

Description

Vacuum adsorption device

The present invention relates to a vacuum adsorption device, and more specifically, to a vacuum adsorption device that uses vacuum to adsorb objects to be adsorbed.

Generally, a semiconductor package is manufactured by a process in which a semiconductor wafer having a high-performance integrated circuit such as a transistor and a capacitor is manufactured on a semiconductor substrate made of a silicon material, and then it is attached to a lead frame or After a tape material such as a printed circuit board is electrically connected with a metal wire or the like in order to energize the semiconductor wafer and the tape material with each other, the semiconductor wafer is molded with epoxy resin in order to protect the semiconductor wafer from the outside.

This semiconductor package is packaged into a strip material in a matrix arrangement. Each package in the strip material is individually separated after being cut. In the manner described above, a plurality of packages that are individually separated in a manner according to a preset After being selected by quality standards, they are transferred to subsequent steps by loading on a tray or the like.

The form in which the molding step is completed is called a semiconductor strip or a semiconductor material, and the semiconductor strip includes a plurality of semiconductor packages. A dicing step is performed in order to separate individual semiconductor packages in a semiconductor strip or a semiconductor material.

After the dicing step, the plurality of semiconductor packages are subjected to subsequent steps such as cleaning and drying, and then moved to the turntable for vision inspection, and then sorted by a sort selector.

For example, the following Patent Documents 1 and 2 disclose the structure of an adsorption unit of a semiconductor strip and a semiconductor manufacturing apparatus.

Patent Document 1 describes a structure of a substrate strip, that is, the substrate strip includes: a rectangular bottom substrate; a plurality of unit substrates formed by dividing the bottom substrate; and a mold gate formed on the bottom substrate. Part of a plurality of unit substrates of the side; and a model, which is formed by dividing the bottom substrate to form two short sides facing each other on the bottom substrate.

Patent Document 2 describes a structure of an adsorption unit for a semiconductor manufacturing device, that is, the adsorption unit includes a body, and the body includes an adsorption pad for adsorbing a semiconductor strip or a plurality of semiconductor packages, and an adsorption container. The adsorption pad storage portion of the pad is formed on the adsorption pad storage portion after being formed in a manner corresponding to the edge size of the adsorption pad storage portion.

In addition, the applicant of this case disclosed the semiconductor tape grinder technology in Patent Document 3 below, and obtained authorization after application.

Patent Document 3 describes a semiconductor tape grinder structure in which at least one semiconductor wafer is mounted on the upper surface of a bottom substrate to obtain a plurality of unit substrates that are packaged, and the plurality of unit substrates face left and right and front and rear. The molded protective layer of the semiconductor stripes arranged in the direction is ground to reduce the thickness of the semiconductor stripes.

For example, FIG. 1 is a perspective view of a prior art workbench.

As shown in FIG. 1, the workbench 1 of the prior art has a substantially rectangular plate shape corresponding to the shape of the semiconductor strip. The upper surface of the worktable 1 is formed by an adsorption surface 2 that is adsorbed by vacuum by placing a semiconductor strip. A plurality of suction ports 3 are formed on the table 1 along the up-down direction to form a vacuum state by sucking air.

[Prior technical literature] [Patent Literature]

Patent Document 1: Korean Patent Grant Gazette No. 10-0872129 (published on December 8, 2008).

Patent Document 2: Korean Patent Publication No. 10-2014-0024627 (published on March 3, 2014).

Patent Document 3: Korean Patent Grant No. 10-153182 (published on June 24, 2015).

However, in the process in which the stage 1 applied to the semiconductor strip grinding machine of the prior art is adsorbing a semiconductor strip, a fine space may be formed between the lower surface of the semiconductor strip and the adsorption surface 2.

As a result, as the pressure generated for forming the vacuum in the table 1 of the prior art is lost, when the semiconductor wafer is being ground in a state where it is not stably fixed, the flatness of the ground surface is reduced. The problem.

Therefore, the workbench 1 of the prior art has a problem in that the number of defective products increases due to damage or breakage of the grinding surface of the semiconductor strip during the grinding work, thereby reducing the profitability of the product.

Even if the diameter of the suction port 3 is increased or the vacuum pressure is increased in order to solve such a problem, there is a limitation in completely preventing pressure loss due to the limitation in the contact area between the table 1 and the semiconductor strip.

In order to solve the problems described above, an object of the present invention is to provide a vacuum adsorption device that can stably fix an object by adsorbing the object to be adsorbed by using a vacuum.

It is still another object of the present invention to provide a vacuum adsorption device capable of preventing pressure loss by increasing an area to be adsorbed by an object.

Another object of the present invention is to provide a vacuum adsorption device that can stably fix an object by adsorbing the object regardless of the shape and size of the object to be adsorbed.

In order to achieve the above-mentioned object, the vacuum adsorption device of the present invention includes: a main body provided in a manner capable of being moved to one side; and an adsorption portion provided on an upper surface of the main body, where the adsorption portion places an object to be adsorbed After the object is vacuum-formed, the object is adsorbed and fixed. A vacuum-forming space for forming a vacuum is provided in the adsorption portion, and a plurality of suction ports are formed in the main body in a vertical direction so as to communicate with the vacuum-forming space.

As described above, according to the vacuum adsorption device of the present invention, the effect of stably adsorbing and fixing a semiconductor strip or a semiconductor wafer is obtained by increasing an adsorption area of a vacuum adsorption object.

In addition, according to the present invention, the shape and area of the main body and the adsorption portion are changed according to the shape and size of the object to be adsorbed, thereby obtaining the effect of stably adsorbing objects of various shapes and sizes.

Thus, the present invention achieves the following effects: in the process of grinding the molded protective layer of a semiconductor strip or a semiconductor wafer, a vacuum pressure loss is prevented, and occurrence due to the flow of the semiconductor strip or the semiconductor wafer can be prevented in advance. bad.

1‧‧‧Workbench

2‧‧‧ adsorption surface

3‧‧‧ Suction port

10, 11, 12, 13‧‧‧ vacuum adsorption device

20‧‧‧ Subject

21‧‧‧inclined surface

22‧‧‧ Fastening hole

23‧‧‧Pressure loss prevention parts

24‧‧‧Combination slot

25‧‧‧Suction port

30‧‧‧ Adsorption Department

31‧‧‧Vacuum forming space

32‧‧‧ support block

FIG. 1 is a perspective view of a prior art workbench.

FIG. 2 is a perspective view of a vacuum adsorption device according to a first embodiment of the present invention.

FIG. 3 is a plan view of the vacuum adsorption device shown in FIG. 2.

Fig. 4 is a sectional perspective view taken along a line A-A 'shown in Fig. 2.

FIG. 5 is an exemplary diagram of a vacuum adsorption device according to a second embodiment of the present invention.

FIG. 6 is a perspective view of a vacuum adsorption device according to a third embodiment of the present invention.

FIG. 7 is a plan view of the vacuum adsorption device shown in FIG. 6.

Fig. 8 is a sectional perspective view taken along a line B-B 'shown in Fig. 6.

FIG. 9 is an exemplary diagram of a vacuum adsorption device according to a fourth embodiment of the present invention.

Hereinafter, a vacuum adsorption device according to a preferred embodiment of the present invention will be described in detail with reference to the drawings.

In this embodiment, the workbench of the vacuum chuck unit is described, and it is applicable to a semiconductor tape grinder for removing a molded protective layer formed on an upper surface of a semiconductor tape.

Of course, the present invention is not limited to this. It should be noted that the present invention can be applied to various technical methods for fixing by adsorbing objects to be adsorbed. Domain and structure of vacuum adsorption device.

Hereinafter, terms for indicating directions such as "left", "right", "front", "rear", "above", and "below" are defined as directions indicated based on states shown in the drawings. .

Example 1

FIG. 2 is a perspective view of a vacuum adsorption device according to a first embodiment of the present invention.

As shown in FIG. 2, the vacuum adsorption device 10 according to the first embodiment of the present invention may include: a main body 20 having a rectangular plate shape corresponding to an object to be adsorbed, that is, a semiconductor strip; and an adsorption portion 30 Is provided on the upper part of the main body 20, and a semiconductor strip is adsorbed by forming a vacuum.

This vacuum suction device 10 is suitable for a vacuum chuck unit (not shown in the drawings) provided in a semiconductor tape grinder. The vacuum chuck unit fixes a semiconductor tape to the semiconductor tape to the grinding unit (not shown). (Shown in the drawing) moves the lower portion, thereby performing a function of moving the semiconductor strip in a predetermined direction and a predetermined interval when performing a grinding operation, a cleaning operation, and a thickness inspection operation.

To this end, the above-mentioned vacuum chuck unit may include a Y-axis robot for moving the semiconductor tape in a direction such as an X-axis direction and a right-angle direction as shown in FIG. Move in the Y-axis direction; a vacuum pump connected to the vacuum adsorption device 10 for forming a vacuum to generate a suction force; and a washing water pump (not shown in the drawing) for supplying washing water to the vacuum adsorption device 10.

Next, the structure of the vacuum adsorption device will be described in detail with reference to FIGS. 2 to 4.

Fig. 3 is a plan view of the vacuum adsorption device shown in Fig. 2, and Fig. 4 is a sectional perspective view taken along the line A-A 'shown in Fig. 2.

As shown in FIGS. 2 to 4, the lateral and longitudinal lengths of the main body 20 are greater than the lateral and longitudinal lengths of the semiconductor strips. The outer ends of the upper surface of the main body 20, that is, the front and rear ends, the left and right ends, and each The suction portions 30 are formed as inclined surfaces 21 that are inclined downward toward the outside.

In order to fix to the vacuum chuck unit, a plurality of fastening holes 22 for fastening a fixing bolt may be formed in an edge portion of the inclined surface 21.

Further, a pressure loss preventing member 23 for preventing a vacuum pressure loss occurring between the semiconductor strip and the suction section 30 may be provided on the upper surface of the main body 20 along the periphery of the suction section 30.

The pressure loss preventing member 23 may be provided as a rubber pad made of a rubber material to have elasticity and airtightness.

Such a pressure loss preventing member 23 may have a box shape having the same horizontal and vertical lengths as the size of the semiconductor strip so as to be in close contact with the lower surface of the semiconductor strip.

On the other hand, a coupling groove 24 may be formed on the upper surface of the main body 20 in a recessed manner along the edge of the suction portion 30 to be combined with a pressure loss prevention member.

Thereby, the pressure loss preventing member 23 is inserted into the coupling groove 24 formed along the edge of the suction portion 30 in an inserted manner, and the upper end of the pressure loss preventing member 23 projects upward with respect to the main body 20 and the upper portion of the suction portion 30. Corresponds to a preset height.

Such a main body 20 can be supplied by driving of the above-mentioned washing water pump. The semiconductor wafers that have been subjected to the grinding work are cleaned with a washing water.

To this end, the suction pipe connected to the vacuum pump and the washing water supply pipe receiving the washing water may be connected to one side of the main body 20.

Further, the main body 20 may be provided with various cleaning units (not shown in the drawings) for cleaning the upper surface and the lower surface of the semiconductor strip with cleaning water.

On the other hand, a plurality of suction ports 25 are formed in the main body 20 along the up-down direction so as to communicate with the vacuum-forming space 31 of the suction unit 30 described below.

The suction port 25 is connected to the vacuum pump through a pipe (not shown in the drawing). In order to attract the semiconductor strip, the suction port 25 performs the suction of the air filled in the vacuum forming space 31 by the drive of the vacuum pump to form the vacuum forming space 31. The function of forming vacuum pressure.

The area of the adsorption portion 30 may be the same as or slightly smaller than the area of the lower surface of the semiconductor strip to be adsorbed, so as to correspond to the area of the lower surface of the semiconductor strip to be adsorbed.

A vacuum forming space 31 for forming a vacuum is provided in the suction section 30. A plurality of support blocks 32 may be arranged in the vacuum forming space 31 to support a lower surface of a semiconductor strip placed on the suction section 30.

The support block 32 may have a hexahedron shape having a substantially quadrangular cross section.

Of course, the present invention is not limited to this. In addition to the hexahedron shape, the shape of the support block 32 may be changed to a cylindrical shape having a circular cross section or a polygonal three-dimensional shape such as a triangular or pentagonal cross section. .

Among them, the size and number of the suction port 25 and the support block 32, the interval between each suction port 25, and the interval between each support block 32 can be determined according to conditions such as the size, thickness, and vacuum pressure of the semiconductor strip to be adsorbed. Make multiple changes.

For example, the diameter of the suction port 25 and the horizontal and vertical length of the support block 32 may be set to about 2 mm, and the interval between the suction ports 25 and the support block 32 may be set to about 2 mm to 2.5, respectively. mm.

Among them, the magnitude of the vacuum pressure formed in the vacuum forming space 31 may be affected by the capacity of the vacuum pump described above, the diameter of the suction port 25 and the cross-sectional area of the upper end of the support block 32.

Therefore, in the present invention, when a vacuum pump having the same capacity as the vacuum pump applicable to the prior art is used, the vacuum action can be increased by increasing the diameter of the suction port 25 or minimizing the cross-sectional area of the upper end of the support block 32. The vacuum pressure of the space 31 is formed.

In particular, in the present invention, even if the diameter of the suction port 25 is formed in the same manner as the diameter of the suction port 3 applied to the table 1 of the prior art, the suction is increased by minimizing the cross-sectional area of the upper end of the support block 32 for adsorption. The adsorption area of the semiconductor strips can increase the vacuum pressure acting on the vacuum forming space 31.

Further, in the present invention, a pressure loss preventing member 23 is provided along the edge of the suction portion 30 to make the semiconductor strip closely adhere to the upper surface of the pressure loss preventing member 23, thereby preventing a vacuum pressure loss, thereby stably adsorbing and Fix the semiconductor strip.

By structuring the prior art workbench 1 and in the manner described above The vacuum adsorption device 10 of this embodiment is applied to each vacuum chuck unit to carry out experimental results. When a 5 horsepower vacuum pump is applied to the prior art workbench, the total area of the adsorption surface 2 can be maximized in About 30% of the area forms the suction port 3, so that the adsorption area affected by the vacuum pressure also shows a level of about 30%.

In contrast, even if the same vacuum pump is used and the same diameter of the suction port 25 is used, the vacuum adsorption device 10 of this embodiment can utilize at least about 75% of the total area of the adsorption portion 30 according to the upper cross-sectional area of the support block 32. Is the adsorption area.

Therefore, in the present invention, by increasing the adsorption area where a vacuum pressure is formed on the lower surface of the semiconductor strip placed in the vacuum adsorption device, the semiconductor strip can be stably adsorbed and fixed.

On the other hand, in this embodiment, the vacuum suction device 10 for fixing a semiconductor strip manufactured in a rectangular plate shape has been described, but the present invention is not limited to this.

That is, the present invention is also applicable to a vacuum suction device for fixing a semiconductor wafer manufactured into a circular plate shape.

Example 2

FIG. 5 is an exemplary diagram of a vacuum adsorption device according to a second embodiment of the present invention.

As shown in FIG. 5, the structure of the vacuum suction device 11 according to the second embodiment of the present invention is similar to that of the vacuum suction device 10 shown in FIG. 2 described above. However, the cross section of the suction part 30 The shape corresponds to a substantially circular shape.

Among them, the diameter of the adsorption portion 30 is slightly smaller than the diameter of the semiconductor wafer, The pressure loss preventing member 23 provided on the edge of the suction portion 30 may have a ring shape having the same diameter as that of the semiconductor wafer.

On the other hand, in the embodiment described above, the main body has a rectangular shape as an example, but the shape of the main body 20 of the present invention may be changed to a circular plate shape.

Example 3

FIG. 6 is a perspective view of a vacuum adsorption device according to a third embodiment of the present invention. 7 is a plan view of the vacuum adsorption device shown in FIG. 6, and FIG. 8 is a cross-sectional perspective view cut along a line B-B 'shown in FIG. 6.

As shown in FIG. 6 to FIG. 8, the vacuum adsorption device 12 according to the third embodiment of the present invention may include: a main body 20 for placing an object to be adsorbed; and an adsorption part 30 provided on an upper part of the main body 20. 30 By forming a vacuum, an object to be adsorbed is adsorbed, that is, a semiconductor strip is adsorbed.

The main body 20 is substantially in the shape of a circular plate having a diameter larger than the lateral and longitudinal lengths of the semiconductor strips. The outer peripheral surface of the upper surface of the main body 20 and the suction portion 30 can be formed as an inclined surface 21 that is inclined downward and outward.

In order to fix to the vacuum chuck unit, a plurality of fastening holes 22 for fastening a fixing bolt may be formed in an edge portion of the inclined surface 21.

Further, a pressure loss preventing member 23 for preventing a vacuum pressure loss occurring between the semiconductor strip and the suction section 30 may be provided on the upper surface of the main body 20 along the periphery of the suction section 30.

The pressure loss preventing member 23 may be provided as a rubber pad made of a rubber material to have elasticity and airtightness.

Such a pressure loss preventing member 23 may have a box shape having the same horizontal and vertical lengths as the size of the semiconductor strip so as to be in close contact with the lower surface of the semiconductor strip.

On the other hand, a coupling groove 24 may be formed on the upper surface of the main body 20 in a recessed manner along the edge of the suction portion 30 to be combined with the pressure loss prevention member 23.

Thereby, the pressure loss preventing member 23 is inserted into the coupling groove 24 formed along the edge of the suction portion 30 in an inserted manner, and the upper end of the pressure loss preventing member 23 projects upward with respect to the main body 20 and the upper portion of the suction portion 30. Corresponds to a preset height.

Such a main body 20 can clean the semiconductor strips that have been subjected to the grinding operation by using the cleaning water supplied by the driving of the cleaning water pump.

To this end, the suction pipe connected to the vacuum pump and the washing water supply pipe receiving the washing water may be connected to one side of the main body 20.

In addition, the main body 20 may be provided with various cleaning units (not shown in the drawings) for cleaning the upper surface and the lower surface of the semiconductor strip with washing water.

On the other hand, a plurality of suction ports 25 are formed in the main body 20 along the up-down direction so as to communicate with the vacuum-forming space 31 of the suction unit 30 described below.

The suction port 25 is connected to the vacuum pump through a pipe (not shown in the drawing). In order to attract the semiconductor strip, the suction port 25 performs the suction of the air filled in the vacuum forming space 31 by the drive of the vacuum pump to form the vacuum forming space 31. The function of forming vacuum pressure.

The area of the adsorption portion 30 may be the same as or slightly smaller than the area of the lower surface of the semiconductor strip to be adsorbed, so as to correspond to the area of the lower surface of the semiconductor strip to be adsorbed.

Among them, the number of adsorption portions 30 corresponding to the number of semiconductor stripes to be adsorbed may be provided.

That is, two suction sections 30 are shown in FIG. 6. However, the present invention is not limited to this, and one or more grinding units provided on the upper part of the vacuum chuck unit can be used to simultaneously or sequentially mold the The number of the semiconductor strips to which the protective layer has been ground is provided, and one or more suction portions 30 are provided.

A vacuum forming space 31 for forming a vacuum is provided in the suction section 30. A plurality of support blocks 32 may be arranged in the vacuum forming space 31 to support a lower surface of a semiconductor strip placed on the suction section 30.

The support block 32 may have a hexahedron shape having a substantially quadrangular cross section.

Of course, the present invention is not limited to this. In addition to the hexahedron shape, the shape of the support block 32 may be changed to a cylindrical shape having a circular cross section or a polygonal three-dimensional shape such as a triangular or pentagonal cross section. .

Among them, the size and number of the suction port 25 and the support block 32, the interval between each suction port 25, and the interval between each support block 32 can be determined according to conditions such as the size, thickness, and vacuum pressure of the semiconductor strip to be adsorbed. Make multiple changes.

For example, the diameter of the suction port 25 and the horizontal and vertical length of the support block 32 may be set to about 2 mm, and the interval between the suction ports 25 and the support block 32 may be set to about 2 mm to 2.5, respectively. mm.

Among them, the magnitude of the vacuum pressure formed in the vacuum forming space 31 may be affected by the capacity of the vacuum pump described above, the diameter of the suction port 25 and the cross-sectional area of the upper end of the support block 32.

Therefore, in the present invention, when a vacuum pump having the same capacity as the vacuum pump applicable to the prior art is used, the vacuum action can be increased by increasing the diameter of the suction port 25 or minimizing the upper end cross-sectional area of the support block 32. The vacuum pressure of the space 31 is formed.

In particular, in the present invention, even if the diameter of the suction port 25 is formed in the same manner as the diameter of the suction port 3 applied to the table 1 of the prior art, the suction is increased by minimizing the cross-sectional area of the upper end of the support block 32 for adsorption. The adsorption area of the semiconductor strips can increase the vacuum pressure acting on the vacuum forming space 31.

Further, in the present invention, a pressure loss preventing member 23 is provided along the edge of the suction portion 30 to make the semiconductor strip closely adhere to the upper surface of the pressure loss preventing member 23, thereby preventing a vacuum pressure loss, thereby stably adsorbing and Fix the semiconductor strip.

On the other hand, in this embodiment, the vacuum suction device 10 for fixing a semiconductor strip manufactured in a rectangular plate shape has been described, but the present invention is not limited to this.

That is, the present invention is also applicable to a vacuum suction device for fixing a semiconductor wafer manufactured into a circular plate shape.

Example 4

FIG. 9 is an exemplary diagram of a vacuum adsorption device according to a fourth embodiment of the present invention.

As shown in FIG. 9, a vacuum adsorption device 13 according to a fourth embodiment of the present invention The structure of the vacuum suction device 12 is similar to that of the vacuum suction device 12 shown in FIG. 6 described above, but the cross section of the suction portion 30 can be substantially circular in a manner corresponding to the shape of each semiconductor wafer.

The diameter of the main body 20 is larger than the diameter of the semiconductor wafer, the diameter of the suction portion 30 is slightly smaller than the diameter of the semiconductor wafer, and the pressure loss preventing member 23 provided on the edge of the suction portion 30 may have a ring shape having the same diameter as the diameter of the semiconductor wafer.

The process of the present invention increases the adsorption area of the vacuum-adsorbed semiconductor strip through the process as described above, so that the semiconductor strip or semiconductor wafer can be stably adsorbed and fixed.

In addition, according to the present invention, the shape and area of the adsorption portion are changed according to the shape and size of the object to be adsorbed, so that objects of various shapes and sizes can be adsorbed stably.

Therefore, the present invention can prevent the loss of vacuum pressure during the grinding of the mold protective layer of the semiconductor strip or the semiconductor wafer, and can prevent the defects caused by the flow of the semiconductor strip or the semiconductor wafer in advance.

As mentioned above, the invention realized by the present inventors has been specifically described based on the above embodiments, but the invention is not limited to the above embodiments, and various changes can be made to the invention without departing from the spirit thereof.

That is, in the above embodiment, the table of the vacuum chuck unit is described, and it is applicable to a semiconductor tape grinder for removing a molded protective layer formed on the upper surface of a semiconductor tape, but the present invention is not Limited to this, the present invention can be modified to be applicable to a variety of technical fields and structures for adsorbing and fixing objects to be adsorbed.

The present invention is applicable to a vacuum adsorption device technology for stably adsorbing and fixing a semiconductor strip or a semiconductor wafer by increasing an adsorption area of a vacuum adsorption object.

10‧‧‧Vacuum adsorption device

20‧‧‧ Subject

Claims (8)

A vacuum adsorption device includes a main body provided in a manner capable of moving to one side, and an adsorption portion provided on an upper surface of the main body. After the object to be adsorbed is placed on the adsorption portion, a vacuum is formed to adsorb and The object is fixed; a vacuum forming space for forming a vacuum is provided in the suction part; a plurality of suction ports are formed in the main body in a vertical direction so as to communicate with the vacuum forming space. The vacuum adsorption device according to claim 1, wherein the main body is in the shape of a circular plate having a diameter larger than the lateral length and the longitudinal length or diameter of the object; the adsorption portion has a shape corresponding to the shape and size of the object and The size is one or more of the suction parts corresponding to the number of objects to be ground simultaneously or sequentially. The vacuum adsorption device according to claim 1 or 2, wherein a plurality of support blocks for supporting an object placed on the upper surface are arranged in the adsorption section. The vacuum adsorption device according to claim 3, wherein the upper surface of the support block is formed with a preset cross-sectional area to increase the adsorption area acting on the object. The vacuum adsorption device according to claim 3, wherein The edge of the part is provided with a pressure loss prevention member which is in close contact with an object placed on the upper surface to prevent pressure loss; a coupling groove combined with the pressure loss prevention member is recessed on the upper surface of the body along the edge of the adsorption portion Into. The vacuum adsorption device according to claim 3, wherein the upper surface of the main body is formed as an inclined surface that slopes downward toward the outside; an suction pipe connected to the vacuum pump and a washing water supply pipe for receiving washing water are connected to the main body. Connected on one side. The vacuum adsorption device according to claim 3, wherein, when the object to be adsorbed is a semiconductor strip, a cross section of the adsorption portion has a quadrangular shape corresponding to the semiconductor strip. The vacuum adsorption device according to claim 3, wherein when the object to be adsorbed is a semiconductor wafer, a cross section of the adsorption portion has a circular shape corresponding to the semiconductor wafer.