TWI871678B - Heat dissipation module - Google Patents

Abstract

The present invention is a heat dissipation module, which is arranged between two circuit boards, and the two circuit boards respectively have high-power and low-power chips; a plurality of shielding covers are respectively covered on each chip; the heat dissipation module includes a heat pipe; a plurality of heat conductive sheets, one side of each heat conductive sheet is attached to each high-power and low-power chip, and the other side of each heat conductive sheet is attached to each shielding cover; a heat dissipation fin assembly is arranged at one end of the heat pipe; the heat pipe is directly contacted with the shielding cover located above each high-power chip, and the high heat can be directly and quickly transferred to the heat dissipation fin assembly for heat dissipation, while the low-power chip is farther away from the heat pipe. The heat dissipation performance can be improved by configuring the chips of different powers in an appropriate heat dissipation manner, and it has the advantage of reducing the overall volume and weight of the product.

Description

Heat dissipation module

The present invention relates to a heat dissipation device, in particular to a chip heat dissipation module provided with a shielding cover.

Nowadays, due to the advancement of wireless transmission technology, wireless networks have entered the WIFI 7 generation. In order to cope with the high-speed transmission rate, the chips used in the signal booster for WIFI 7 also have relatively high computing speeds, so the chips generate more heat. Please refer to FIG9, which shows a heat dissipation device provided for the signal booster of WIFI 7 in the prior art. The heat dissipation device mainly includes a copper plate 90 and a heat sink fin block 91. The shape of the copper plate 90 corresponds to the shape of the circuit board of the signal booster. The heat sink fin block 91 is provided on one side of the copper plate 90. The copper plate 90 is covered on the circuit board and attached to each chip to achieve the effect of heat dissipation.

However, the circuit board of the signal booster mainly includes a main board and a WIFI board. During assembly, the main board and the WIFI board are relatively combined and the heat sink is sandwiched therebetween. However, since the chip on the main board and the chip on the WIFI board are arranged at different positions and thicknesses, the contact surface between the chip and the copper plate 90 is easily uneven during the combination process, resulting in a reduction in the contact area and a decrease in the heat conduction efficiency, thereby increasing the thermal resistance and affecting the heat dissipation performance. In addition, since the copper plate 90 used has a large area, it will also increase the overall weight of the signal booster. Therefore, the overall structure of the heat sink of the prior art has the above-mentioned problems and shortcomings, which really need to be improved.

In view of the shortcomings of the prior art, the present invention provides a heat dissipation module, which achieves the purpose of improving heat dissipation performance and reducing costs by combining heat pipes with high-power chips and low-power chips on a circuit board.

In order to achieve the above-mentioned invention purpose, the technical means adopted by the present invention is to design a heat dissipation module, which is used to be arranged between a first circuit board and a second circuit board arranged at intervals, the first circuit board and the second circuit board are electrically connected, the first circuit board is provided with a plurality of first main chips and a plurality of first sub-chips, the second circuit board is provided with a plurality of second main chips and a plurality of second sub-chips, and further has a plurality of shielding covers, wherein the shielding covers are provided on one side of the first circuit board and are respectively covered and attached to each of the first main chips. The shielding cover is provided on one side of the second circuit board and covers and abuts on each of the second main chips and each of the second secondary chips respectively. The side of the first circuit board on which each of the first main chips and each of the first primary chips is provided and the side of the second circuit board on which each of the second main chips and each of the second secondary chips is provided are adjacent sides. The power of each of the first main chips is higher than the power of each of the first primary chips, and the power of each of the second main chips is higher than the power of each of the second secondary chips. The heat dissipation module comprises: A heat pipe, which is located between the first circuit board and the second circuit board and abuts on each of the shielding covers; A plurality of heat conducting sheets, each of which is provided between each of the first main chips, each of the first primary chips, each of the second main chips and each of the second secondary chips and each of the shielding covers; A heat dissipation fin assembly, which is provided at one end of the heat pipe.

Furthermore, in the heat dissipation module, the shape of the heat pipe bend corresponds to the arrangement position of each of the first main chips and each of the second main chips.

Furthermore, in the heat dissipation module, the heat dissipation fin assembly includes a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and forms a plurality of air guide ports.

Furthermore, in the heat dissipation module, the first circuit board and the second circuit board are disposed in a casing, a fan is disposed in the casing, and the air outlet of the fan is aligned with each of the air guide ports of the heat dissipation fin assembly.

Furthermore, in the heat dissipation module, each of the heat conductive sheets is a silicone heat conductive sheet.

The advantage of the present invention is that, by contacting the shielding cover above each first main chip and each second main chip with higher power or lower temperature limit with the heat pipe, high heat can be directly and quickly transferred to the heat sink fin assembly for heat dissipation, and the first chip and the second chip with lower power or higher temperature limit can indirectly transfer low heat to the heat pipe and then to the heat sink fin assembly for heat dissipation. In addition to the advantage of reducing the overall volume and weight of the product, the heat dissipation performance can be improved by configuring the chips of different power in an appropriate heat dissipation manner, and the chips set at different heights can all have a complete abutment state to reduce thermal resistance and improve thermal conduction efficiency.

The following is a combination of drawings and preferred embodiments of the present invention to further illustrate the technical means adopted by the present invention to achieve the intended purpose of the invention.

Please refer to FIG. 1 and FIG. 7 , the heat dissipation module of the present invention is used to be arranged between a first circuit board 60 and a second circuit board 70 arranged at intervals. The first circuit board 60 and the second circuit board 70 are electrically connected. The first circuit board 60 is provided with a plurality of first main chips 61 and a plurality of first sub-chips 62, and the second circuit board 70 is provided with a plurality of second main chips 71 and a plurality of second sub-chips 72. It also has a plurality of shielding covers 80, wherein the shielding cover 80 is provided on one side of the first circuit board 60 and is respectively covered on each of the first main chips 61 and each of the first sub-chips 62. The shielding cover 80 may also be provided on the other side of the first circuit board 60. A shielding cover 80 is provided on one side of the second circuit board 70 and covers each second main chip 71 and each second secondary chip 72 respectively. A shielding cover 80 may also be provided on the other side of the second circuit board 70. The side of the first circuit board 60 provided with each first main chip 61 and each first secondary chip 62 and the side of the second circuit board 70 provided with each second main chip 71 and each second secondary chip 72 are adjacent sides. The power of each first main chip 61 is higher than the power of each first secondary chip 62, and the power of each second main chip 71 is higher than the power of each second secondary chip 72. The heat dissipation module includes a heat pipe 10, a plurality of heat conducting sheets 30 and a heat dissipation fin assembly 40.

Please refer to Figures 2, 3 and 7. The heat pipe 10 is a flat tube in a bent shape, which has a top surface 11 and a bottom surface 12. The top surface 11 and the bottom surface 12 are two side surfaces that are opposite to each other. The bent shape of the heat pipe 10 corresponds to the arrangement position of each first main chip 61 and each second main chip 71, but is not limited to this. The shape of the heat pipe 10 can be changed according to user needs.

Each thermal pad 30 is a silicone thermal pad 30 (Thermal Pad), which is respectively disposed between each first main chip 61, each first sub-chip 62, each second main chip 71, each second sub-chip 72 and each shielding cover 80, but is not limited thereto and may not be disposed.

The heat sink fin assembly 40 is a block structure composed of a plurality of heat sink fins 41. The heat sink fins 41 are arranged at intervals and form a plurality of air guide ports 42. The heat sink fin assembly 40 is disposed on the top surface 11 of one end of the heat pipe 10, but is not limited thereto. The form of the heat sink fin assembly 40 can be changed according to user needs, and the heat sink fin assembly 40 may not be disposed.

When the present invention is assembled, please refer to FIG. 6 to FIG. 8, which is used in a signal booster as an example, but not limited thereto. The signal booster has a housing 81, and the housing 81 surrounds an internal space. The first circuit board 60 and the second circuit board 70 are arranged in the housing 81 with a vertical interval. The first circuit board 60 is a mainboard, and the second circuit board 70 is a WIFI board. The first main chips 61 and the first sub-chips 62 of the first circuit board 60, and the second main chips 71 and the second sub-chips 72 of the second circuit board 70 are arranged in the housing 81. 2 are shielded by a shielding cover 80 to prevent electromagnetic interference. The present invention is disposed between the first circuit board 60 and the second circuit board 70. The heat pipe 10 and the heat conductive sheets 30 are stacked to form a layered structure. The heat conductive sheets 30 are attached to the shielding covers 80. A fan 50 is fixed in the housing 81 and the air outlet is aligned with the air guide ports 42 of the heat dissipation fin assembly 40. However, the present invention is not limited thereto. The installation position of the fan 50 can be changed according to user needs, such as being directly installed on the first circuit board 60 or the second circuit board 70, or not installing the fan 50.

By utilizing the heat pipe 10 to contact the shielding cover 80 located above each first main chip 61 and each second main chip 71 with higher power or lower temperature limit, high heat can be directly and quickly transferred to the heat sink fin assembly 40 for heat dissipation, and the shielding cover 80 outside the setting position of the heat pipe 10 can contact the first chip 62 and the second chip 72 with lower power or higher temperature limit, so that low heat can be transferred to the heat pipe 10 with a longer transfer distance and then transferred to the heat sink fin assembly 40 for heat dissipation. Compared with the existing technology, in addition to reducing the overall volume and weight of the product, the heat dissipation performance can be improved by configuring the chips of different power in an appropriate heat dissipation manner, and the chips set at different heights can all have a complete abutment state to reduce thermal resistance and improve thermal conduction efficiency.

The above is only the best embodiment of the present invention and does not constitute any form of limitation on the present invention. Although the present invention has been disclosed as the best embodiment as above, it is not used to limit the present invention. Any person with ordinary knowledge in the relevant technical field can make some changes or modifications to the technical contents disclosed above as equivalent embodiments within the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention are still within the scope of the technical solution of the present invention.

10: Heat pipe 11: Top surface 12: Bottom surface 30: Heat conducting sheet 40: Heat sink fin assembly 41: Heat sink fin 42: Air duct 50: Fan 60: First circuit board 61: First main chip 62: First chip 70: Second circuit board 71: Second main chip 72: Second chip 80: Shielding cover 81: Casing 90: Copper plate 91: Heat sink fin block

Figure 1 is a three-dimensional appearance diagram of the present invention. Figure 2 is an exploded view of the main components of the present invention. Figure 3 is an exploded view of the main components of the present invention from another angle. Figure 4 is a side view of the present invention. Figure 5 is another side view of the present invention. Figure 6 is a cross-sectional view of the present invention in use. Figure 7 is a schematic diagram of the assembly of the first circuit board and the second circuit board of the present invention. Figure 8 is a schematic diagram of the configuration of the present invention. Figure 9 is a schematic diagram of the prior art.

10: Heat pipe 40: Heat sink fin assembly 50: Fan 80: Shield cover

Claims (4)

A heat dissipation module is provided between a first circuit board and a second circuit board which are arranged at intervals. The first circuit board and the second circuit board are electrically connected. The first circuit board is provided with a plurality of first main chips and a plurality of first sub-chips. The second circuit board is provided with a plurality of second main chips and a plurality of second sub-chips. The heat dissipation module also has a plurality of shielding covers. The shielding covers are provided on one side of the first circuit board and cover the first main chips and the first sub-chips respectively. The shielding covers are provided on one side of the second circuit board and cover the second main chips and the second sub-chips respectively. The side of the first circuit board provided with the first main chips and the first sub-chips is connected to the shielding covers. The second circuit board is provided with the side surfaces of each second main chip and each second secondary chip as adjacent sides, the power of each first main chip is higher than the power of each first primary chip, and the power of each second main chip is higher than the power of each second secondary chip. The heat dissipation module includes: a heat pipe, which is located between the first circuit board and the second circuit board and is attached to each shielding cover, and the bending shape of the heat pipe corresponds to the arrangement position of each first main chip and each second main chip; a plurality of heat conducting sheets, each of which is arranged between each first main chip, each first primary chip, each second main chip and each second secondary chip and each shielding cover; a heat dissipation fin assembly, which is arranged at one end of the heat pipe. The heat dissipation module as described in claim 1, wherein the heat dissipation fin assembly includes a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and has a plurality of air guide ports. The heat dissipation module as described in claim 1 or 2, wherein the first circuit board and the second circuit board are disposed in a housing, a fan is disposed in the housing, and the air outlet of the fan is aligned with each of the air guide ports of the heat dissipation fin assembly. The heat dissipation module as described in claim 3, wherein each of the heat conductive sheets is a silicone heat conductive sheet.

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