TWM649241U - Heat dissipation module of multi-heat sources - Google Patents

Abstract

The new model is a multi-heat source heat dissipation module, which is used to be arranged between two circuit boards. The two circuit boards have high-power and low-power chips respectively. The multi-heat source heat dissipation module includes a heat pipe, which is used to be close to each A high-power chip; a plurality of heat sinks, which are respectively fixed on the heat pipe and used to abut each low-power chip; a heat dissipation fin group, which is set at one end of the heat pipe; the heat pipe is used to contact the higher power chip, which can directly and Quickly conduct high heat to the heat sink fin set for heat dissipation, use the heat sink to contact the lower power chip, indirectly transfer the low heat to the heat pipe and then transfer it to the heat sink fin set for heat dissipation, using appropriate heat dissipation methods for chips with different powers. Configuration can also improve heat dissipation performance, and has the advantage of reducing the overall volume and weight of the product.

Description

Multi-heat source cooling module

The present invention relates to a heat dissipation device, in particular to a multi-heat source heat dissipation module for heat dissipation chips.

Nowadays, due to the advancement of wireless transmission technology, wireless networks have reached the WIFI 7 generation. In order to cope with the high-speed transmission rate, the signal booster used in WIFI 7 uses chips that have relatively high computing speeds. Therefore, the chip generates more heat. Please refer to Figure 11, which is a heat dissipation device provided for a signal booster of WIFI 7 in the prior art. It mainly includes a copper plate 90 and a heat dissipation fin block 91. The copper plate The shape of 90 corresponds to the shape of the circuit board of the signal booster. The heat dissipation fin block 91 is provided on one side of the copper plate 90. The copper plate 90 is covered on the circuit board and pressed against each chip to conduct heat and achieve heat dissipation. The effect.

However, the circuit board of the signal booster mainly includes a motherboard and a WIFI board. During assembly, the motherboard and the WIFI board are relatively combined and the heat sink is sandwiched between them. However, due to the placement of the chips on the motherboard and the chips on the WIFI board, and thickness are different, the contact surface between the chip and the copper plate 90 is likely to be uneven during the bonding process, resulting in a reduction in the contact area and a reduction in thermal conductivity efficiency, thereby increasing thermal resistance and affecting the heat dissipation efficiency. Moreover, due to the large area of the copper plate 90 used, It will also increase the overall weight of the signal booster; therefore, the overall structure of the heat dissipation device in the prior art has the aforementioned problems and shortcomings and needs to be improved.

In view of the shortcomings of the existing technology, the present invention provides a multi-heat source cooling module, which achieves the purpose of improving heat dissipation efficiency and reducing costs by combining heat pipes and heat sinks with high-power chips and low-power chips on the circuit board.

In order to achieve the above-mentioned purpose, the technical means used in the present invention is to design a multi-heat source cooling module, which is arranged between a first circuit board and a second circuit board that are spaced apart. The first circuit board and A second circuit board is electrically connected. The first circuit board is provided with a plurality of first main chips and a plurality of primary chips. The second circuit board is provided with a plurality of second main chips and a plurality of second chips. The first circuit board is provided with a plurality of second main chips and a plurality of second chips. The side of the circuit board provided with each of the first main chips and each of the first wafers is adjacent to the side of the second circuit board provided with each of the second main wafers and each of the second wafers. The power of the first main chip is higher than the power of each first chip, and the power of each second main chip is higher than the power of each second chip. The multi-heat source cooling module includes: A heat pipe used to abut each of the first main chip and each of the second main chip; A plurality of heat sinks, each of which is fixed on the heat pipe, and each of which is used to abut against each of the first chip and each of the second chip; A heat dissipation fin group is provided at one end of the heat pipe.

Furthermore, in the multi-heat source heat dissipation module, the heat pipe is a flat tube with a top surface and a bottom surface, and each heat sink has a first connecting section, a second connecting section and a turning section. , the turning section is located between the first connecting section and the second connecting section, and each heat sink is fixed on the heat pipe through the second connecting section.

Furthermore, in the multi-heat source heat dissipation module, the bending shape of the heat pipe corresponds to the connection shape formed by connecting the positions of each first main chip and each second main chip.

Furthermore, in the multi-heat source heat dissipation module, the heat dissipation fin group includes a plurality of heat dissipation fins, each of the heat dissipation fins is arranged at intervals and is formed with a plurality of air guides, and the heat dissipation fin group is arranged on the heat pipe. One end.

Furthermore, in the multi-heat source heat dissipation module, the first circuit board and the second circuit board are disposed in a casing, a fan is disposed in the casing, and the air outlet of the fan is aligned with the heat dissipation fin group. Each should have an air outlet.

The advantage of this new model is that by the heat pipe contacting each first main chip and each second main chip with higher power or lower temperature limit, high heat can be directly and quickly conducted to the heat dissipation fin group for heat dissipation. Contact the first chip and the second chip with lower power or higher temperature limit, and indirectly transfer the low heat guide heat pipe to the heat dissipation fin set for heat dissipation. The chips with different powers are configured in an appropriate heat dissipation method. In addition to improving heat dissipation performance, it also has the advantage of reducing the overall volume and weight of the product, and can have a complete contact state for chips placed at different heights, thereby reducing thermal resistance and improving thermal conduction efficiency.

The technical means adopted by the present invention to achieve the predetermined new purpose will be further described below with reference to the drawings and preferred embodiments of the present invention.

Please refer to FIG. 1 and FIG. 6 . The multi-heat source cooling module of the present invention is used to be disposed between a first circuit board 40 and a second circuit board 50 that are spaced apart. Two circuit boards 50 are electrically connected. The first circuit board 40 is provided with a plurality of first main chips 41 and a plurality of primary chips 42. The second circuit board 50 is provided with a plurality of second main chips 51 and a plurality of second sub-chips 52. , the side surface of the first circuit board 40 provided with each first main chip 41 and each first sub-wafer 42 is adjacent to the side surface of the second circuit board 50 provided with each second main chip 51 and each second sub-wafer 52 On the side, the power of the aforementioned first main chip 41 is higher than the power of the first chip 42, and the power of the second main chip 51 is higher than the power of the second chip 52. The multi-heat source cooling module includes a heat pipe 10, a plurality of The heat sink 20 and a heat sink fin set 30.

Please refer to Figures 2, 3 and 6. The heat pipe 10 is a bent flat tube body with a top surface 11 and a bottom surface 12. The top surface 11 and the bottom surface 12 are two opposite sides. The heat pipe 10 The bent shape corresponds to the arrangement position of each first main chip 41 and each second main chip 51, but is not limited thereto. The shape of the heat pipe 10 can be changed according to the user's needs.

Please refer to FIGS. 3 to 6 . Each heat sink 20 is fixed on the heat pipe 10 respectively. In this embodiment, each heat sink 20 is a single piece and can be made using bending processing technology. It has a first connection. section 21, a second connecting section 22 and a turning section 23. The turning section 23 is located between the first connecting section 21 and the second connecting section 22. The first connecting section 21 and the second connecting section 22 are spaced apart and located at different positions. In the plane position, each heat sink 20 is fixed on the bottom surface 12 of the heat pipe 10 with a second connecting section 22. The first connecting section 21 of each heat sink 20 is adjacent to one side of the top surface 11 of the heat pipe 10 and the top surface of the heat pipe 10 11 are flush, so that when the heat pipe 10 and each heat sink 20 come into contact with the corresponding chips of the same height, they can be completely attached. However, this is not a limitation. The shape, material and fixing method of each heat sink 20 can be determined by the user. Demand changes.

The heat dissipation fin group 30 is a block structure composed of a plurality of heat dissipation fins 31. Each heat dissipation fin 31 is arranged at intervals and formed with a plurality of air guides 32. The heat dissipation fin group 30 is arranged on the top surface 11 of one end of the heat pipe 10. , but is not limited to this, the form of the heat dissipation fin set 30 can be changed according to the user's needs, or the heat dissipation fin set 30 may not be provided.

When assembling this new model, please refer to Figures 7 to 10, which are applied to a signal booster as an example, but are not limited to this. The signal booster has a shell (not shown in the drawings). The body is surrounded to form an internal space. The first circuit board 40 and the second circuit board 50 are spaced up and down in the casing. The first circuit board 40 is a motherboard, and the second circuit board 50 is a WIFI board. The present invention is provided on the first circuit board. Between the board 40 and the second circuit board 50, the heat pipe 10 is close to each first main chip 41 and each second main chip 51, and each heat sink 20 is close to each primary chip 42 and each second secondary chip 52. , a fan 60 is fixedly installed in the casing and the air outlet is aligned with each air guide opening 32 of the heat dissipation fin group 30, but is not limited to this. The installation position of the fan 60 can be changed according to the user's needs, such as being directly installed on the third The fan 60 may not be provided on the first circuit board 40 or the second circuit board 50 .

In this way, the heat pipe 10 is used to contact the first main chips 41 and the second main chips 51 with higher power or lower temperature limit, and high heat can be directly and quickly conducted to the heat dissipation fin set 30 for heat dissipation. Contacting the first chip 42 and the second chip 52 with lower power or higher temperature limit, the low heat guide heat pipe 10 is transferred to the heat dissipation fin set 30 for heat dissipation in an indirect manner. Compared with the prior art, it has the advantages of reducing In addition to the advantages of the overall size and weight of the product, configuring chips with different powers in appropriate heat dissipation methods can also improve heat dissipation performance, and chips placed at different heights can be fully attached to reduce thermal resistance and improve heat conduction. efficiency.

The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Any technical field that has A person with ordinary knowledge, without departing from the scope of the technical solution of this invention, can use the technical content disclosed above to make some changes or modifications as equivalent embodiments of equivalent changes. However, any content that does not deviate from the technical solution of this invention shall be based on this invention Technical Essence of Creation Any simple modifications, equivalent changes, and modifications made to the above embodiments still fall within the scope of the technical solution of this creation.

10:Heat pipe 11:Top surface 12: Bottom surface 20:Heat sink 21: First connection section 22: The second connecting section 23: Turning section 30: Cooling fin set 31: Cooling fins 32: Air guide 40:First circuit board 41:The first main chip 42:First chip 50: Second circuit board 51: Second main chip 52:Second chip 60:Fan 90: Copper plate 91: Cooling fin block

Figure 1 is a three-dimensional appearance view of the new model. Figure 2 is an exploded view of the main components of the present invention. Figure 3 is an exploded view of the main components of the present invention from another angle. Figure 4 is a partial side view of the new model. Figure 5 is a partial cross-sectional view of the new type. Figure 6 is an appearance view of the first circuit board and the second circuit board of the present invention. Figure 7 is a schematic diagram of the appearance of this new model in use. Figure 8 is a schematic diagram of the configuration of this new model. Figure 9 is a schematic side view of the use of this new model. Figure 10 is another schematic side view of the present invention. Figure 11 is a schematic diagram of the prior art.

10:Heat pipe

11:Top surface

12: Bottom surface

20:Heat sink

21: First connection section

22: The second connecting section

23: Turning section

30: Cooling fin set

60:Fan

Claims (5)

A multi-heat source heat dissipation module, which is used to be disposed between a first circuit board and a second circuit board that are spaced apart. The first circuit board and the second circuit board are electrically connected, and the first circuit board is provided with There are a plurality of first main chips and a plurality of first chips. The second circuit board is provided with a plurality of second main chips and a plurality of second chips. The first circuit board is provided with each of the first main chips and each of the first chips. The side of the secondary chip and the second circuit board are provided with the second main chip and the side of each second sub-chip are adjacent sides, and the power of each first main chip is higher than that of each first chip. The power of each second main chip is higher than the power of each second chip. The multi-heat source cooling module includes: A heat pipe used to abut each of the first main chip and each of the second main chip; A plurality of heat sinks, each of which is fixed on the heat pipe, and each of which is used to abut against each of the first chip and each of the second chip; A heat dissipation fin group is provided at one end of the heat pipe. The multi-heat source cooling module of claim 1, wherein the heat pipe is a flat tube with a top surface and a bottom surface, and each of the heat sinks has a first connecting section, a second connecting section and a turning section. , the turning section is located between the first connecting section and the second connecting section, and each heat sink is fixed on the heat pipe through the second connecting section. The multi-heat source heat dissipation module according to claim 1 or 2, wherein the bending shape of the heat pipe corresponds to the connection shape formed by connecting the positions of each of the first main chips and each of the second main chips. The multi-heat source heat dissipation module as claimed in claim 3, wherein the heat dissipation fin group includes a plurality of heat dissipation fins, and each of the heat dissipation fins is arranged at intervals and formed with a plurality of air guides. The multi-heat source cooling module of claim 4, wherein the first circuit board and the second circuit board are disposed in a casing, a fan is disposed in the casing, and the air outlet of the fan is aligned with the heat dissipation fin group Each should have an air outlet.

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