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TWI791171B - Electronic component handler - Google Patents

Electronic component handler Download PDF

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Publication number
TWI791171B
TWI791171B TW109139025A TW109139025A TWI791171B TW I791171 B TWI791171 B TW I791171B TW 109139025 A TW109139025 A TW 109139025A TW 109139025 A TW109139025 A TW 109139025A TW I791171 B TWI791171 B TW I791171B
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Taiwan
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electronic components
conveyor
electronic component
carrier
material transfer
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TW109139025A
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Chinese (zh)
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TW202220540A (en
Inventor
蔡志欣
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鴻勁精密股份有限公司
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Priority to TW109139025A priority Critical patent/TWI791171B/en
Publication of TW202220540A publication Critical patent/TW202220540A/en
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Publication of TWI791171B publication Critical patent/TWI791171B/en

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Abstract

The present invention reveals an electronic component handler which has a base defined a first operating zone and a second operating zone thereon. Transporters are provided to transporting electronic component between the first operating zone and the second operating zone. A first moving unit is provided in the first operating zone for moving electronic component from a loader to the transporters. A second moving unit is provided in the second operating zone for moving electronic component from the transporters to a shuttle. The shuttle carries the electronic component to an operator for executing predetermined operation. By processing of the transporters, the first moving unit, and the second moving unit, the fluency of transportation of the electronic component is enhanced.

Description

電子元件作業設備Electronic component work equipment

本發明提供一種有效縮短移料位移行程,進而提高生產效能之電子元件作業設備。The invention provides an electronic component operating device which effectively shortens the displacement stroke of material shifting and further improves the production efficiency.

在現今,一具有複數個接點之電子元件,於歷經黏晶、焊線及封膠等製程後,再以切割成型製程切割為一獨立之電子元件;然為確保電子元件之品質,業者以測試作業設備對電子元件執行測試作業,以淘汰出不良品。目前測試作業設備於機台之前段部配置供料裝置,並於後段部配置測試裝置及預熱器,一輸送裝置以一移料器於機台前段部之供料裝置取出待測之電子元件,並移載至位於機台後段部之預熱器先行預熱升溫,移料器再將已預熱升溫之待測電子元件移載至一入料載台之容置槽,由入料載台將待測電子元件移載至測試裝置之側方,測試裝置之壓移器於入料載台取出待測電子元件,並移載至測試裝置而執行測試作業。Nowadays, an electronic component with a plurality of contacts is cut into an independent electronic component by a cutting process after going through processes such as die bonding, wire bonding, and sealing; however, in order to ensure the quality of electronic components, the industry uses Test operation equipment performs test operations on electronic components to eliminate defective products. At present, the test operation equipment is equipped with a feeding device in the front section of the machine, and a testing device and a preheater in the rear section. A conveying device and a shifter take out the electronic components to be tested from the feeding device in the front section of the machine. , and transferred to the preheater located at the back of the machine to preheat and heat up first, and the material transfer device then transfers the preheated electronic components to be tested to the storage tank of a loading platform, which is loaded by the loading The table transfers the electronic components to be tested to the side of the test device, and the pressure shifter of the test device takes out the electronic components to be tested from the loading platform, and transfers them to the test device to perform the test operation.

惟,輸送裝置之移料器必須在位於機台之前段部及後段部的供料裝置、預熱器及入料載台等多處往返移載電子元件,導致當另一空的入料載台位於另一入料位置時,必須空等移料器由機台後段部之一入料位置位移至機台前段部之供料裝置取出下一待測之電子元件,再由機台之前段部返回後段部之另一入料位置,方可將下一待測電子元件移入另一入料載台,不僅移料器之移載行程過長而增加移載作業時間,更無法提高生產效能。However, the material shifter of the conveying device must transfer electronic components back and forth between the feeding device, preheater, and loading platform located in the front and rear sections of the machine, resulting in another empty loading platform When it is at another feeding position, it must be empty and wait for the material shifter to move from one feeding position at the rear of the machine to the feeding device at the front of the machine to take out the next electronic component to be tested, and then from the front of the machine Only by returning to another feeding position in the rear section can the next electronic component to be tested be moved into another loading platform. Not only the transfer stroke of the material shifter is too long, which increases the transfer operation time, but also fails to improve production efficiency.

再者,入料載台於一移動座上裝配具複數個容置槽之治具,以供盛裝複數個電子元件,於載送不同尺寸或數量之電子元件時,即必須更換具不同尺寸或數量之容置槽的治具,以致測試設備廠商往往必須購置數量繁多之不同治具,不僅增加測試成本,更相當佔用倉儲空間。Furthermore, the feeding carrier is equipped with a jig with a plurality of accommodating slots on a movable seat to accommodate a plurality of electronic components. When carrying electronic components of different sizes or quantities, it must be replaced with different sizes or The number of jigs with accommodating slots makes it necessary for test equipment manufacturers to purchase a large number of different jigs, which not only increases the cost of testing, but also occupies a considerable amount of storage space.

本發明之目的一,提供一種電子元件作業設備,其機台界定第一作業區及第二作業區,一輸送裝置之運料單元設置第一運料器及第二運料器,以於第一作業區與第二作業區交替運送電子元件,輸送裝置於第一作業區設置第一移料單元,以於供料裝置與第一運料器或第二運料器移載電子元件,另於第二作業區設置第二移料單元,以於第一載台與第一運料器或第二運料器移載電子元件,第一載台載送電子元件至作業裝置,以供作業裝置對電子元件執行預設作業;藉以第一、二移料單元搭配運料單元而於第一、二作業區作分段式移料作動時序,以縮短移料位移行程,進而提高生產效能。The first object of the present invention is to provide a kind of electronic component operation equipment, the machine table defines the first operation area and the second operation area, and the first operation device and the second operation device are set in the material conveying unit of a conveying device, so that the first operation area and the second operation area The first operation area and the second operation area alternately transport electronic components, and the conveying device is provided with a first material transfer unit in the first operation area, so as to transfer electronic components between the feeding device and the first conveyor or the second conveyor. Set up a second material transfer unit in the second operation area to transfer electronic components between the first carrier and the first conveyor or the second conveyor, and the first carrier carries the electronic components to the operating device for operation The device performs preset operations on electronic components; the first and second material moving units cooperate with the material conveying unit to perform segmented material moving sequence in the first and second operation areas, so as to shorten the material moving distance and improve production efficiency.

本發明之目的二,提供一種電子元件作業設備,其輸送裝置之第一載台設有平面式第一承載部以供承置電子元件,並以第一定位結構定位第一承載部所承置之電子元件,使第一載台毋須配置治具,而可因應承載不同尺寸或數量之電子元件,進而節省成本及利於倉儲配置。The second object of the present invention is to provide a kind of electronic component operation equipment. The first carrier of the conveying device is provided with a planar first bearing part for bearing electronic components, and the first positioning structure is used to position the bearing part of the first bearing part. Electronic components, so that the first stage does not need to be equipped with jigs, and can carry electronic components of different sizes or quantities, thereby saving costs and facilitating storage and configuration.

本發明之目的三,提供一種電子元件作業設備,更包含輸送裝置之運料單元與第一載台間配置檢知裝置,檢知裝置設置至少一取像器,以取像第二移料單元移載之電子元件,而供調整電子元件之擺置位置及角度,使第一載台承載正確擺置之電子元件至作業裝置,進而提高作業精準性及作業品質。The third object of the present invention is to provide an electronic component operation equipment, which further includes a detection device arranged between the material transport unit of the conveying device and the first carrier, and the detection device is provided with at least one image picker to take images of the second material transfer unit The transferred electronic components are used to adjust the placement position and angle of the electronic components, so that the first stage carries the correctly placed electronic components to the operating device, thereby improving the accuracy and quality of the operation.

本發明之目的四,提供一種電子元件作業設備,其輸送裝置之運料單元配置至少一溫控器,以於運送電子元件之行程中,利用溫控器預溫電子元件,以縮短作業裝置之作業時間,進而有效提高作業產能。The fourth object of the present invention is to provide a kind of electronic component operation equipment. The material conveying unit of the conveying device is equipped with at least one temperature controller, so that the temperature controller can be used to pre-heat the electronic components during the transportation of electronic components, so as to shorten the working time of the operation device. Operating time, thereby effectively increasing operating productivity.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your review committee members have a further understanding of the present invention, hereby give a preferred embodiment and cooperate with the drawings, as follows in detail:

請參閱圖1,本發明作業設備包含機台10、供料裝置20、作業裝置30、輸送裝置40及中央控制裝置(圖未示出),中央控制裝置以供控制及整合各裝置作動,而執行自動化作業。更進一步,作業設備更配置有檢知裝置50及收料裝置60。Please refer to Fig. 1, the operating equipment of the present invention comprises a machine platform 10, a feeding device 20, an operating device 30, a conveying device 40 and a central control device (not shown), the central control device is used for controlling and integrating the various devices, and Execute automated jobs. Furthermore, the operating equipment is further equipped with a detection device 50 and a receiving device 60 .

機台10界定第一作業區11及第二作業區12,於本實施例,機台10於前段部界定第一作業區11,並於後段部界定第二作業區12,第一作業區11與第二作業區12位於同一側。The machine 10 defines the first operating area 11 and the second operating area 12. In this embodiment, the machine 10 defines the first operating area 11 at the front section, and defines the second operating area 12 at the rear section. The first operating area 11 It is located on the same side as the second working area 12 .

供料裝置20配置於機台10,並設有至少一供料承置器21,以承置至少一待作業之電子元件;於本實施例,供料裝置20配置於機台10之第一作業區11。The feeding device 20 is arranged on the machine table 10, and is provided with at least one feeding holder 21 to hold at least one electronic component to be operated; in this embodiment, the feeding device 20 is arranged on the first of the machine table 10 Work area 11.

作業裝置30配置於機台10,並設有至少一作業器,以對電子元件執行預設作業;於本實施例,作業器為測試器,測試器包含電性連接之電路板31及測試座32,測試座32具有複數個探針,以供承置及測試電子元件,作業裝置30另設有至少一壓移器33,以於測試座32與輸送裝置40間移載待測電子元件及已測電子元件。The operating device 30 is arranged on the machine platform 10, and is provided with at least one operating device to perform preset operations on electronic components; in this embodiment, the operating device is a tester, and the tester includes an electrically connected circuit board 31 and a test socket 32, the test seat 32 has a plurality of probes for bearing and testing electronic components, and the operating device 30 is also provided with at least one pressure shifter 33 to transfer the electronic components to be tested between the test seat 32 and the conveying device 40 and Electronic components tested.

輸送裝置40配置於機台10,包含運料單元、第一移料單元、第二移料單元及第一載台,運料單元設置至少一運料器,以於第一作業區11與第二作業區12間交替運送電子元件,第一移料單元配置於機台10之第一作業區11,並設有第一移料器,以於供料裝置20與運料器移載電子元件,第二移料單元配置於機台10之第二作業區12,並設有第二移料器,以於第一載台與運料器移載電子元件。The conveying device 40 is arranged on the machine platform 10 and includes a material transport unit, a first material transfer unit, a second material transfer unit and a first platform. The electronic components are alternately transported between the two working areas 12. The first material transfer unit is arranged in the first operating area 11 of the machine 10, and a first material transfer device is provided to transfer electronic components between the feeding device 20 and the conveyor. , the second material transfer unit is arranged in the second working area 12 of the machine 10, and is provided with a second material transfer device for transferring electronic components on the first carrier and the carrier device.

更進一步,運料器可為輸送帶或移動式運料台,以循環式或往復式運送電子元件,以將電子元件由第一作業區11運送至第二作業區12,若運料器為移動式運料台,利用運料驅動器驅動作至少一方向位移,運料驅動器包含一線性驅動源(如皮帶輪組)及導槽,或包含二線性驅動源(如皮帶輪組及壓缸)。又運料器可具有平面式承料部或具容置槽之治具,若為平面式承料部,承料部可具有硬式承置面或微軟式承置面,並設置運料定位結構,以供定位承料部承置之電子元件,運料定位結構可為抽氣孔、微黏層或抵壓件,例如於運料器之承料部設置複數個抽氣孔,以抽吸定位電子元件,例如於運料器之承料部塗覆微黏性材質之微黏層,其黏性可供第一移料單元或第二移料單元取出電子元件 ,依作業需求而配置,不受限於本實施例。 Furthermore, the conveyor can be a conveyor belt or a mobile conveyor table, which can transport electronic components in a circular or reciprocating manner, so as to transport the electronic components from the first operation area 11 to the second operation area 12, if the conveyor is The mobile material transport table is driven by a material transport driver for displacement in at least one direction. The material transport drive includes a linear drive source (such as a pulley set) and a guide groove, or includes two linear drive sources (such as a pulley set and a pressure cylinder). In addition, the conveyor can have a flat material receiving part or a jig with a holding tank. If it is a flat material receiving part, the material receiving part can have a hard or soft bearing surface, and a positioning structure for the material is provided. , for positioning the electronic components carried by the material receiving part. The material positioning structure can be an air suction hole, a micro-adhesive layer or a pressure member. Components, for example, a micro-adhesive layer coated with a slightly viscous material on the material receiving part of the conveyor, whose viscosity can be used for the first material transfer unit or the second material transfer unit to take out electronic components , configured according to job requirements, and is not limited to this embodiment.

另,輸送裝置40於運料單元之運料器配置至少一溫控器,以於運料器運送電子元件之行程中,利用溫控器預溫電子元件,溫控器可為加熱件、致冷晶片或具流體之台座,以供預冷或預熱運料器所承載之電子元件。In addition, the conveying device 40 is equipped with at least one thermostat on the conveyor of the conveyor unit, so as to use the thermostat to preheat the electronic components during the journey of the conveyor transporting the electronic components. The thermostat can be a heating element, a Cold chip or platform with fluid for pre-cooling or pre-heating the electronic components carried by the carrier.

於本實施例,運料單元配置第一運料器411及第二運料器412,第一運料器411設有具複數個第一容置槽4111之治具,以承置電子元件,第一運料器411並由第一運料驅動器421驅動作Y-Z方向位移,第二運料器412設有具複數個第二容置槽4121之治具,以承置電子元件,第二運料器412並由第二運料驅動器422驅動作Y-Z方向位移,第一運料驅動器421及第二運料驅動器422可驅動第一運料器411及第二運料器412作交替式位移於第一作業區11及第二作業區12。In this embodiment, the feeding unit is configured with a first feeder 411 and a second feeder 412, and the first feeder 411 is provided with a plurality of jigs with a plurality of first accommodation slots 4111 to accommodate electronic components. The first feeder 411 is driven by the first feeder driver 421 to move in the Y-Z direction. The second feeder 412 is provided with a plurality of second accommodating grooves 4121 for holding electronic components. The feeder 412 is driven by the second feeder driver 422 for displacement in the Y-Z direction, and the first feeder driver 421 and the second feeder driver 422 can drive the first feeder 411 and the second feeder 412 to alternately move between The first working area 11 and the second working area 12 .

輸送裝置40於第一運料器411配置第一溫控器431,第一溫控器431為加熱件,以供預熱第一運料器411所承載之電子元件,另於第二運料器412配置第二溫控器432,第二溫控器432亦為加熱件,以供預熱第二運料器412所承載之電子元件。The conveying device 40 is equipped with a first temperature controller 431 on the first material conveyor 411, and the first temperature controller 431 is a heating element for preheating the electronic components carried by the first material conveyor 411. The container 412 is equipped with a second temperature controller 432 , and the second temperature controller 432 is also a heating element for preheating the electronic components carried by the second material conveyor 412 .

第一移料單元配置於機台10之第一作業區11,並設有具複數個吸嘴之第一移料器441,第一移料器441由第一移料驅動器442驅動作X-Y-Z方向位移,以供作短距離移料行程,於供料裝置20之供料承置器21取出待作業之電子元件,而迅速將待作業之電子元件移入第一運料器411或第二運料器412。The first material transfer unit is arranged in the first working area 11 of the machine 10, and is equipped with a first material transfer device 441 with a plurality of suction nozzles, and the first material transfer device 441 is driven by the first material transfer driver 442 in the direction of X-Y-Z Displacement, for short-distance material transfer stroke, take out the electronic components to be operated from the material supply holder 21 of the material supply device 20, and quickly move the electronic components to be operated into the first material conveyor 411 or the second material conveyor device 412.

第二移料單元配置於機台10之第二作業區12,並設有具複數個吸嘴之第二移料器451,第二移料器451由第二移料驅動器452驅動作X-Y-Z方向位移,以供作短距離移料行程,於第一運料器411或第二運料器412取出待作業之電子元件,並迅速將待作業之電子元件移入第一載台。The second material transfer unit is arranged in the second working area 12 of the machine 10, and is equipped with a second material transfer device 451 with a plurality of suction nozzles, and the second material transfer device 451 is driven by the second material transfer driver 452 in the direction of X-Y-Z Displacement, for short-distance material transfer stroke, take out the electronic components to be operated on the first conveyor 411 or the second conveyor 412, and quickly move the electronic components to be operated into the first carrier.

藉以運料單元之第一運料器411及第二運料器412作交替位移於機台10之第一作業區11與第二作業區12,並搭配第一移料單元及第二移料單元作分段式移料作動時序,以縮短移料位移行程,進而提高生產效能。The first conveyor 411 and the second conveyor 412 of the conveyor unit are alternately displaced in the first operation area 11 and the second operation area 12 of the machine 10, and are matched with the first material transfer unit and the second material transfer The unit performs segmented material moving sequence to shorten the material moving distance and improve production efficiency.

第一載台461設有至少一第一承載部,以供第二移料器451移入待作業之電子元件;第一載台461具有平面式第一承載部,第一承載部可具有硬式承置面或微軟式承置面,第一載台461並於第一承載部設有第一定位結構,以供定位第一承載部承置之電子元件,使第一載台461毋須配置治具,而可承載不同尺寸或數量之電子元件,進而節省成本及利於倉儲配置。第一定位結構可為抽氣孔、微黏層或抵壓件,例如於第一載台461之第一承載部設置複數個抽氣孔,以抽吸定位電子元件,例如於第一載台461之第一承載部塗覆微黏性材質之微黏層,其黏性可供作業裝置30之壓移器33取出電子元件,依作業需求而配置,不受限於本實施例。於本實施例,第一載台461設有平面式之第一承載部4611,並於第一承載部4611設有具複數個第一抽氣孔4612之第一定位結構,以複數個第一抽氣孔4612抽吸定位電子元件,第一載台461並由載送驅動器462驅動作X方向位移,以於第二作業區12供第二移料器451移入待作業之電子元件,並載送至作業裝置30之側方,以供壓移器33取出待作業之電子元件。The first carrier 461 is provided with at least one first bearing portion, for the second material shifter 451 to move into the electronic components to be operated; the first carrier 461 has a planar first bearing portion, and the first bearing portion can have a hard bearing The first carrier 461 is equipped with a first positioning structure on the first carrier to position the electronic components carried by the first carrier, so that the first carrier 461 does not need to be equipped with jigs , and can carry electronic components of different sizes or quantities, thereby saving costs and facilitating storage configuration. The first positioning structure can be an air suction hole, a micro-adhesive layer or a pressing member. For example, a plurality of air suction holes are provided on the first carrier part of the first carrier 461 to suction and position electronic components, such as on the first carrier 461. The first carrying part is coated with a slightly viscous layer of a slightly viscous material, and its viscousness can be used by the pressure shifter 33 of the operation device 30 to take out the electronic components, and the arrangement is based on the operation requirements, and is not limited to this embodiment. In this embodiment, the first carrier 461 is provided with a planar first bearing part 4611, and a first positioning structure with a plurality of first air suction holes 4612 is provided on the first bearing part 4611, and the plurality of first air suction holes 4612 The air holes 4612 suction and position the electronic components, and the first stage 461 is driven by the carrier driver 462 to move in the X direction, so that the second material shifter 451 can move the electronic components to be operated in the second operation area 12, and carry them to The side of the operating device 30 is used for the pressure shifter 33 to take out the electronic components to be operated.

另,輸送裝置40依作業需求,而配置第二載台463,以供承置且輸出已作業之電子元件;更進一步,第二載台463亦具有平面式第二承載部,第二承載部可具有硬式承置面或微軟式承置面,第二載台463並於第二承載部設有第二定位結構,以供定位第二承載部承置之電子元件,使第二載台463毋須配置治具,而可承載不同尺寸或數量之電子元件,進而節省成本及利於倉儲配置。第二定位結構可為抽氣孔、微黏層或抵壓件,例如於第二載台463之第二承載部設置複數個抽氣孔,以抽吸定位電子元件,例如於第二載台463之第二承載部塗覆微黏性材質之微黏層,其黏性可供輸送裝置30之第三移料單元取出已作業電子元件,依作業需求而配置,不受限於本實施例。於本實施例,第二載台463設有平面式之第二承載部4631,並於第二承載部4631設有具複數個第二抽氣孔4632之第二定位結構,以複數個第二抽氣孔4632抽吸定位電子元件,第二載台463並由載送驅動器462驅動作X方向位移,以於作業裝置30之側方供壓移器33移入已測之電子元件,並供第三移料單元取出已測電子元件。In addition, the conveying device 40 is configured with a second carrier 463 according to the operation requirements for carrying and outputting the electronic components that have been operated; furthermore, the second carrier 463 also has a planar second carrier, and the second carrier It can have a hard bearing surface or a soft bearing surface, and the second carrier 463 is provided with a second positioning structure on the second bearing part for positioning the electronic components carried by the second bearing part, so that the second carrier 463 There is no need to configure fixtures, and it can carry electronic components of different sizes or quantities, which saves costs and facilitates storage and configuration. The second positioning structure can be an air suction hole, a micro-adhesive layer or a pressing member. For example, a plurality of air suction holes are provided on the second carrier part of the second carrier 463 to suction and position electronic components, such as on the second carrier 463. The second carrying part is coated with a slightly viscous layer of a slightly viscous material, and its viscosity can be used by the third material transfer unit of the conveying device 30 to take out the electronic components that have been operated. It can be configured according to the operation requirements and is not limited to this embodiment. In this embodiment, the second carrier 463 is provided with a planar second bearing part 4631, and a second positioning structure with a plurality of second air suction holes 4632 is provided on the second bearing part 4631, and a plurality of second air extraction holes 4632 are provided. The air holes 4632 suction and position the electronic components, and the second carrier 463 is driven by the carrier driver 462 to move in the X direction, so that the pressure shifter 33 can move the measured electronic components into the side of the working device 30, and the third moving The material unit takes out the tested electronic components.

又,輸送裝置40於機台10配置第三移料單元,第三移料單元設有第三移料器471,以於第二載台463取出已作業電子元件;於本實施例,第三移料器471具有複數個吸嘴,以拾取電子元件,並由第三移料驅動器472驅動作X-Y-Z方向位移,以於第二載台463取出已測電子元件,並將已測電子元件移入收料裝置60收置。Also, the conveying device 40 is equipped with a third material-moving unit on the machine platform 10, and the third material-moving unit is provided with a third material-moving device 471 to take out the operated electronic components on the second carrier 463; in this embodiment, the third material-moving unit The material shifter 471 has a plurality of suction nozzles to pick up the electronic components, and is driven by the third material transfer driver 472 to move in the X-Y-Z direction, so as to take out the tested electronic components on the second stage 463 and move the tested electronic components into the storage. The feeding device 60 is housed.

檢知裝置50配置於輸送裝置40之運料單元與第一載台461間,並設有至少一取像器51,以取像第二移料單元移載之電子元件,而供調整電子元件之擺置位置及角度,使第一載台461承載正確擺置之電子元件至作業裝置30,進而提高作業精準性及作業品質;於本實施例,檢知裝置50配置於機台10之第二作業區12,並設有一為CCD之取像器51。The detecting device 50 is disposed between the transport unit of the conveying device 40 and the first stage 461, and is provided with at least one image picker 51 to capture the electronic components transferred by the second material transfer unit for adjusting the electronic components The position and angle of the arrangement make the first stage 461 carry the correctly placed electronic components to the operating device 30, thereby improving the accuracy and quality of the operation; in this embodiment, the detection device 50 is arranged on the second Two working areas 12 are provided with a CCD image picker 51.

收料裝置60配置於機台10,並設有至少一收料承置器61,以承置至少一已作業之電子元件;於本實施例,收料裝置60配置於機台10之前段部,且位於遠離第一作業區11之另一側。The material receiving device 60 is arranged on the machine platform 10, and at least one receiving material holder 61 is provided to hold at least one electronic component that has been operated; in this embodiment, the material receiving device 60 is arranged on the front section of the machine platform 10 , and is located on the other side away from the first working area 11 .

請參閱圖2,電子元件作業設備為一測試設備,供料裝置20之供料承置器21承置複數個待測之電子元件71,由於供料裝置20與輸送裝置40之第一移料器441位於機台10之第一作業區11,且輸送裝置40之承料位置A位於第一作業區11,第一移料驅動器442驅動第一移料器441作X-Y-Z方向位移,並作短距離移料行程,於供料承置器21取出待測電子元件71,而迅速將待測電子元件71移載至承料位置A,且移入於第一運料器411的複數個第一容置槽4111。Please refer to Fig. 2, the electronic component operation equipment is a test equipment, and the material supply holder 21 of the material supply device 20 bears a plurality of electronic components 71 to be tested. The device 441 is located in the first operation area 11 of the machine 10, and the material receiving position A of the conveying device 40 is located in the first operation area 11. The first material transfer driver 442 drives the first material transfer device 441 to move in the X-Y-Z direction and make short From the material transfer stroke, the electronic component 71 to be tested is taken out from the material supply holder 21, and the electronic component 71 to be tested is quickly transferred to the material receiving position A, and moved into the plurality of first containers of the first material carrier 411. Set slot 4111.

請參閱圖2、3,運料單元之第一運料驅動器421驅動第一運料器411作Y-Z方向位移,第一運料器411運送待測電子元件71由機台10之第一作業區11位移至第二作業區12,並位於卸料位置B,第一運料器411於運料行程中,並利用第一溫控器431預熱第一運料器411所承載之待測電子元件71;由於第二移料單元配置於機台10之第二作業區12,即以第二移料驅動器452驅動第二移料器451作X-Y-Z方向短距離移料行程至卸料位置B,以於第一運料器411取出待測電子元件71;另運料單元之第二運料驅動器422驅動第二運料器412作Y-Z方向位移 ,空的第二運料器412由機台10之第二作業區12位移至第一作業區11,並位於承料位置A,以與第一運料器411交替接續承載下一批次待測電子元件71A。 Please refer to Figures 2 and 3, the first material delivery driver 421 of the material delivery unit drives the first material delivery device 411 to move in the Y-Z direction, and the first material delivery device 411 transports the electronic component 71 to be tested from the first working area of the machine 10 11 is moved to the second working area 12, and is located at the unloading position B. The first conveyor 411 is in the transportation process, and the first temperature controller 431 is used to preheat the electrons to be tested carried by the first conveyor 411. Component 71; since the second material transfer unit is arranged in the second working area 12 of the machine 10, the second material transfer driver 452 is used to drive the second material transfer device 451 to make a short-distance material transfer stroke in the X-Y-Z direction to the discharge position B, To take out the electronic component 71 to be tested from the first conveyor 411; the second conveyor driver 422 of the conveyor unit drives the second conveyor 412 for displacement in the Y-Z direction , the empty second conveyor 412 is displaced from the second operation area 12 of the machine 10 to the first operation area 11, and is located at the material receiving position A, so as to carry the next batch alternately with the first conveyor 411. Test electronics 71A.

請參閱圖2、4,由於第一運料器411、第二移料器451及第一載台461均位於機台10之第二作業區12,第二移料驅動器452即驅動第二移料器451作X-Y-Z方向短距離移料行程,將第一運料器411上之待測電子元件71迅速移載至第一載台461;由於檢知裝置50配置於運料單元與第一載台461之間,於第二移料器451之移料作動行程中,可先將待測電子元件71移載至檢知裝置50之取像器51,以取像待測電子元件71,並將取像資料傳輸至中央控制裝置以供分析,於中央控制裝置控制第二移料器451調整待測電子元件71之擺置位置及角度後,第二移料器451將待測電子元件71移置第一載台461,於第一載台461之第一抽氣孔4612抽吸定位電子元件71後,第二移料器451釋放待測電子元件71,使第一載台461承載正確擺置之電子元件;此時,作業裝置30之壓移器33於測試座32取出已測之電子元件71B,並移載至第二載台463。2 and 4, since the first conveyor 411, the second shifter 451 and the first carrier 461 are all located in the second operating area 12 of the machine 10, the second shifter 452 drives the second shifter. The feeder 451 makes a short-distance transfer stroke in the X-Y-Z direction, and quickly transfers the electronic component 71 to be tested on the first feeder 411 to the first carrier 461; Between the tables 461, during the material transfer stroke of the second material transfer device 451, the electronic component 71 to be tested can be transferred to the image picker 51 of the detection device 50 to take an image of the electronic component 71 to be tested, and then The image data is transmitted to the central control device for analysis. After the central control device controls the second material shifter 451 to adjust the placement position and angle of the electronic component 71 to be tested, the second material shifter 451 moves the electronic component 71 to be tested. The first stage 461 is displaced, and after the first suction hole 4612 of the first stage 461 suctions and positions the electronic component 71, the second material shifter 451 releases the electronic component 71 to be tested, so that the first stage 461 carries the correct swing. Place the electronic components; at this time, the pressure shifter 33 of the operating device 30 takes out the tested electronic components 71B from the test base 32, and transfers them to the second stage 463.

請參閱圖5、6,第一載台461及第二載台463由載送驅動器462驅動作X方向同步位移,令第一載台461載送待測電子元件71至作業裝置30之側方 ,以供壓移器33取出待測電子元件71,壓移器33作Y-Z方向位移將待測電子元件71移入測試座32而接續執行測試作業,第二載台463則輸出已測之電子元件71B ;此時,運料單元之第一運料驅動器421及第二運料驅動器422各別驅動第一運料器411及第二運料器412作交替式位移於第一作業區11及第二作業區12,以接續載送待測之電子元件,而供第一移料器441及第二移料器451分別以短行程位移迅速執行移料作業,以有效縮短移料作業時間,進而提高測試產能。再者,第三移料單元以第三移料驅動器472驅動第三移料器471作X-Y-Z方向位移,於第二載台463取出已測電子元件71B,並依測試結果,將已測電子元件71B移入收料裝置60之收料承置器61收置。 Please refer to Figures 5 and 6, the first stage 461 and the second stage 463 are driven by the carrying driver 462 to move synchronously in the X direction, so that the first stage 461 carries the electronic component 71 to be tested to the side of the operating device 30 , for the pressure shifter 33 to take out the electronic component 71 to be tested, and the pressure shifter 33 moves the electronic component 71 to be tested into the test seat 32 for displacement in the Y-Z direction to continue the test operation, and the second stage 463 outputs the electronic component that has been tested 71B ; At this time, the first conveyor driver 421 and the second conveyor driver 422 of the conveyor unit respectively drive the first conveyor 411 and the second conveyor 412 to alternately move between the first operating area 11 and the second The operation area 12 is used to continuously carry and transport the electronic components to be tested, and for the first material transfer device 441 and the second material transfer device 451 to quickly perform the material transfer operation with a short stroke displacement, so as to effectively shorten the material transfer operation time, thereby improving Test capacity. Moreover, the third material transfer unit uses the third material transfer driver 472 to drive the third material transfer device 471 to move in the X-Y-Z direction, and takes out the tested electronic component 71B on the second stage 463, and according to the test result, the tested electronic component 71B is moved into the material receiving holder 61 of the material receiving device 60 for storage.

10:機台 11:第一作業區 12:第二作業區 20:供料裝置 21:供料承置器 30:作業裝置 31:電路板 32:測試座 33:壓移器 40:輸送裝置 411:第一運料器 4111:第一容置槽 412:第二運料器 4121:第二容置槽 421:第一運料驅動器 422:第二運料驅動器 431:第一溫控器 432:第二溫控器 441:第一移料器 442:第一移料驅動器 451:第二移料器 452:第二移料驅動器 461:第一載台 4611:第一承載部 4612:第一抽氣孔 462:載送驅動器 463:第二載台 4631:第二承載部 4632:第二抽氣孔 471:第三移料器 472:第三移料驅動器 50:檢知裝置 51:取像器 60:收料裝置 61:收料承置器 71、71A、71B:電子元件 A:承料位置 B:卸料位置 10: machine 11: The first operation area 12: The second work area 20: Feeding device 21: Feed holder 30: operating device 31: circuit board 32: Test seat 33: Pressure shifter 40: Conveyor 411: The first conveyor 4111: The first holding tank 412: Second conveyor 4121:Second Storage Tank 421: The first transport drive 422: The second transport drive 431: The first thermostat 432: Second thermostat 441: The first material shifter 442: The first material transfer driver 451: Second shifter 452: The second material transfer driver 461: The first stage 4611: the first bearing part 4612: The first air hole 462: Carrying drive 463:Second platform 4631: the second bearing part 4632: Second air hole 471: The third shifter 472: The third material transfer driver 50: detection device 51: image picker 60: Receiving device 61: Receiver 71, 71A, 71B: electronic components A: Material receiving position B: unloading position

圖1:本發明作業設備之配置圖。 圖2:本發明作業設備之使用示意圖(一)。 圖3:本發明作業設備之使用示意圖(二)。 圖4:本發明作業設備之使用示意圖(三)。 圖5:本發明作業設備之使用示意圖(四)。 圖6:本發明作業設備之使用示意圖(五)。 Fig. 1: Configuration diagram of the operation equipment of the present invention. Figure 2: Schematic diagram of the use of the operating equipment of the present invention (1). Figure 3: Schematic diagram of the use of the operating equipment of the present invention (2). Figure 4: Schematic diagram of the use of the operating equipment of the present invention (3). Figure 5: Schematic diagram of the use of the operating equipment of the present invention (4). Figure 6: Schematic diagram of the use of the operating equipment of the present invention (5).

10:機台 10: machine

11:第一作業區 11: The first operation area

12:第二作業區 12: The second work area

20:供料裝置 20: Feeding device

21:供料承置器 21: Feed holder

30:作業裝置 30: operating device

31:電路板 31: circuit board

32:測試座 32: Test seat

33:壓移器 33: Pressure shifter

40:輸送裝置 40: Conveyor

411:第一運料器 411: The first conveyor

4111:第一容置槽 4111: The first holding tank

412:第二運料器 412: Second conveyor

4121:第二容置槽 4121:Second Storage Tank

421:第一運料驅動器 421: The first transport drive

422:第二運料驅動器 422: The second transport drive

431:第一溫控器 431: The first thermostat

432:第二溫控器 432: Second thermostat

441:第一移料器 441: The first material shifter

442:第一移料驅動器 442: The first material transfer driver

451:第二移料器 451: Second shifter

452:第二移料驅動器 452: The second material transfer driver

461:第一載台 461: The first stage

4611:第一承載部 4611: the first bearing part

4612:第一抽氣孔 4612: The first air hole

462:載送驅動器 462: Carrying drive

463:第二載台 463:Second platform

4631:第二承載部 4631: the second bearing part

4632:第二抽氣孔 4632: Second air hole

471:第三移料器 471: The third shifter

472:第三移料驅動器 472: The third material transfer driver

50:檢知裝置 50: detection device

51:取像器 51: image picker

60:收料裝置 60: Receiving device

61:收料承置器 61: Receiver

Claims (9)

一種電子元件作業設備,包含:機台:界定第一作業區及第二作業區;供料裝置:配置於該機台,並設有至少一供料承置器,以承置至少一待作業之電子元件;作業裝置:配置於該機台,並設有至少一作業器,以對電子元件執行預設作業;輸送裝置:配置於該機台,包含運料單元、第一移料單元、第二移料單元及第一載台,該運料單元設置第一運料器及第二運料器,以於該第一作業區與該第二作業區之間交替運送電子元件,該第一移料單元配置於該第一作業區,並設有第一移料器,以供於該供料裝置與該第一運料器或該第二運料器移載電子元件,該第二移料單元配置於該第二作業區,並設有第二移料器,以於該第一載台與該第一運料器或該第二運料器移載電子元件,該第一載台以供載送電子元件至該作業裝置;中央控制裝置:以供控制及整合各裝置作動。 An electronic component operation equipment, comprising: a machine platform: defining a first operation area and a second operation area; a feeding device: arranged on the machine platform, and is provided with at least one material supply holder to hold at least one to-be-operated Electronic components; operating device: configured on the machine platform, and is equipped with at least one operating device to perform preset operations on electronic components; conveying device: configured on the machine platform, including the transport unit, the first material transfer unit, The second material transfer unit and the first carrier, the material transport unit is provided with a first material conveyor and a second material conveyor, so as to alternately transport electronic components between the first operation area and the second operation area, the first operation area A material transfer unit is arranged in the first operation area, and is provided with a first material transfer device for transferring electronic components between the feeding device and the first material conveyor or the second material conveyor. The material transfer unit is arranged in the second operation area, and a second material transfer device is provided to transfer electronic components between the first carrier and the first material carrier or the second material carrier, and the first carrier The platform is used to carry electronic components to the operation device; the central control device is used to control and integrate the actions of various devices. 如請求項1所述之電子元件作業設備,其該輸送裝置之該運料單元的該第一運料器或該第二運料器為輸送帶或移動式運料台。 The electronic component processing equipment as described in claim 1, wherein the first conveyor or the second conveyor of the conveyor unit of the conveying device is a conveyor belt or a mobile conveyor table. 如請求項2所述之電子元件作業設備,其該第一運料器或該第二運料器具有平面式承料部,並設置運料定位結構,以供定位該承料部承置之電子元件。 The electronic component processing equipment as described in claim 2, the first feeder or the second feeder has a planar material receiving part, and a material feeding positioning structure is provided for positioning the material receiving part. Electronic component. 如請求項1所述之電子元件作業設備,其該輸送裝置之該第一載台設有平面式之第一承載部,並於該第一承載部設有第一定位結構,以供定位該第一承載部承置之電子元件。 The electronic component processing equipment as described in claim 1, the first carrier of the conveying device is provided with a planar first bearing part, and a first positioning structure is provided on the first bearing part for positioning the Electronic components carried by the first carrying portion. 如請求項4所述之電子元件作業設備,其該第一定位結構為抽氣孔、微黏層或抵壓件。 According to claim 4, the electronic component operation equipment, the first positioning structure is an air suction hole, a micro-adhesive layer or a pressing member. 如請求項1所述之電子元件作業設備,其該輸送裝置配置第二載台及第三移料單元,該第二載台以供載送電子元件,該第三移料單元設有第三移料器,以供於該第二載台移載電子元件。 The electronic component processing equipment as described in claim 1, the conveying device is equipped with a second carrier and a third material transfer unit, the second carrier is used to carry electronic components, and the third material transfer unit is equipped with a third The material transfer device is used for transferring electronic components on the second carrier. 如請求項1至6中任一項所述之電子元件作業設備,其該機台之該第一作業區及該第二作業區位於同一側,該第一作業區設有承料位置,該第二作業區設有卸料位置。 As for the electronic component operation equipment described in any one of claims 1 to 6, the first operation area and the second operation area of the machine are located on the same side, the first operation area is provided with a material receiving position, and the The second working area has a discharge position. 如請求項1至6中任一項所述之電子元件作業設備,其該輸送裝置之該第一運料器及該第二運料器配置至少一溫控器。 The electronic component processing equipment according to any one of claims 1 to 6, wherein the first conveyor and the second conveyor of the conveying device are equipped with at least one temperature controller. 如請求項1至6中任一項所述之電子元件作業設備,更包含檢知裝置,該檢知裝置配置於該輸送裝置之該運料單元與該第一載台間,並設有至少一取像器,以取像該第二移料單元移載之電子元件。 The electronic component processing equipment as described in any one of claims 1 to 6, further comprising a detection device, the detection device is arranged between the conveying unit and the first carrier of the conveying device, and is equipped with at least An image picker is used to take an image of the electronic components transferred by the second material transfer unit.
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