TWI791171B - Electronic component handler - Google Patents
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- TWI791171B TWI791171B TW109139025A TW109139025A TWI791171B TW I791171 B TWI791171 B TW I791171B TW 109139025 A TW109139025 A TW 109139025A TW 109139025 A TW109139025 A TW 109139025A TW I791171 B TWI791171 B TW I791171B
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- 239000000463 material Substances 0.000 claims description 128
- 238000001514 detection method Methods 0.000 claims description 9
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- 238000003825 pressing Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 description 23
- 230000032258 transport Effects 0.000 description 15
- 238000006073 displacement reaction Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000011345 viscous material Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
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Abstract
Description
本發明提供一種有效縮短移料位移行程,進而提高生產效能之電子元件作業設備。The invention provides an electronic component operating device which effectively shortens the displacement stroke of material shifting and further improves the production efficiency.
在現今,一具有複數個接點之電子元件,於歷經黏晶、焊線及封膠等製程後,再以切割成型製程切割為一獨立之電子元件;然為確保電子元件之品質,業者以測試作業設備對電子元件執行測試作業,以淘汰出不良品。目前測試作業設備於機台之前段部配置供料裝置,並於後段部配置測試裝置及預熱器,一輸送裝置以一移料器於機台前段部之供料裝置取出待測之電子元件,並移載至位於機台後段部之預熱器先行預熱升溫,移料器再將已預熱升溫之待測電子元件移載至一入料載台之容置槽,由入料載台將待測電子元件移載至測試裝置之側方,測試裝置之壓移器於入料載台取出待測電子元件,並移載至測試裝置而執行測試作業。Nowadays, an electronic component with a plurality of contacts is cut into an independent electronic component by a cutting process after going through processes such as die bonding, wire bonding, and sealing; however, in order to ensure the quality of electronic components, the industry uses Test operation equipment performs test operations on electronic components to eliminate defective products. At present, the test operation equipment is equipped with a feeding device in the front section of the machine, and a testing device and a preheater in the rear section. A conveying device and a shifter take out the electronic components to be tested from the feeding device in the front section of the machine. , and transferred to the preheater located at the back of the machine to preheat and heat up first, and the material transfer device then transfers the preheated electronic components to be tested to the storage tank of a loading platform, which is loaded by the loading The table transfers the electronic components to be tested to the side of the test device, and the pressure shifter of the test device takes out the electronic components to be tested from the loading platform, and transfers them to the test device to perform the test operation.
惟,輸送裝置之移料器必須在位於機台之前段部及後段部的供料裝置、預熱器及入料載台等多處往返移載電子元件,導致當另一空的入料載台位於另一入料位置時,必須空等移料器由機台後段部之一入料位置位移至機台前段部之供料裝置取出下一待測之電子元件,再由機台之前段部返回後段部之另一入料位置,方可將下一待測電子元件移入另一入料載台,不僅移料器之移載行程過長而增加移載作業時間,更無法提高生產效能。However, the material shifter of the conveying device must transfer electronic components back and forth between the feeding device, preheater, and loading platform located in the front and rear sections of the machine, resulting in another empty loading platform When it is at another feeding position, it must be empty and wait for the material shifter to move from one feeding position at the rear of the machine to the feeding device at the front of the machine to take out the next electronic component to be tested, and then from the front of the machine Only by returning to another feeding position in the rear section can the next electronic component to be tested be moved into another loading platform. Not only the transfer stroke of the material shifter is too long, which increases the transfer operation time, but also fails to improve production efficiency.
再者,入料載台於一移動座上裝配具複數個容置槽之治具,以供盛裝複數個電子元件,於載送不同尺寸或數量之電子元件時,即必須更換具不同尺寸或數量之容置槽的治具,以致測試設備廠商往往必須購置數量繁多之不同治具,不僅增加測試成本,更相當佔用倉儲空間。Furthermore, the feeding carrier is equipped with a jig with a plurality of accommodating slots on a movable seat to accommodate a plurality of electronic components. When carrying electronic components of different sizes or quantities, it must be replaced with different sizes or The number of jigs with accommodating slots makes it necessary for test equipment manufacturers to purchase a large number of different jigs, which not only increases the cost of testing, but also occupies a considerable amount of storage space.
本發明之目的一,提供一種電子元件作業設備,其機台界定第一作業區及第二作業區,一輸送裝置之運料單元設置第一運料器及第二運料器,以於第一作業區與第二作業區交替運送電子元件,輸送裝置於第一作業區設置第一移料單元,以於供料裝置與第一運料器或第二運料器移載電子元件,另於第二作業區設置第二移料單元,以於第一載台與第一運料器或第二運料器移載電子元件,第一載台載送電子元件至作業裝置,以供作業裝置對電子元件執行預設作業;藉以第一、二移料單元搭配運料單元而於第一、二作業區作分段式移料作動時序,以縮短移料位移行程,進而提高生產效能。The first object of the present invention is to provide a kind of electronic component operation equipment, the machine table defines the first operation area and the second operation area, and the first operation device and the second operation device are set in the material conveying unit of a conveying device, so that the first operation area and the second operation area The first operation area and the second operation area alternately transport electronic components, and the conveying device is provided with a first material transfer unit in the first operation area, so as to transfer electronic components between the feeding device and the first conveyor or the second conveyor. Set up a second material transfer unit in the second operation area to transfer electronic components between the first carrier and the first conveyor or the second conveyor, and the first carrier carries the electronic components to the operating device for operation The device performs preset operations on electronic components; the first and second material moving units cooperate with the material conveying unit to perform segmented material moving sequence in the first and second operation areas, so as to shorten the material moving distance and improve production efficiency.
本發明之目的二,提供一種電子元件作業設備,其輸送裝置之第一載台設有平面式第一承載部以供承置電子元件,並以第一定位結構定位第一承載部所承置之電子元件,使第一載台毋須配置治具,而可因應承載不同尺寸或數量之電子元件,進而節省成本及利於倉儲配置。The second object of the present invention is to provide a kind of electronic component operation equipment. The first carrier of the conveying device is provided with a planar first bearing part for bearing electronic components, and the first positioning structure is used to position the bearing part of the first bearing part. Electronic components, so that the first stage does not need to be equipped with jigs, and can carry electronic components of different sizes or quantities, thereby saving costs and facilitating storage and configuration.
本發明之目的三,提供一種電子元件作業設備,更包含輸送裝置之運料單元與第一載台間配置檢知裝置,檢知裝置設置至少一取像器,以取像第二移料單元移載之電子元件,而供調整電子元件之擺置位置及角度,使第一載台承載正確擺置之電子元件至作業裝置,進而提高作業精準性及作業品質。The third object of the present invention is to provide an electronic component operation equipment, which further includes a detection device arranged between the material transport unit of the conveying device and the first carrier, and the detection device is provided with at least one image picker to take images of the second material transfer unit The transferred electronic components are used to adjust the placement position and angle of the electronic components, so that the first stage carries the correctly placed electronic components to the operating device, thereby improving the accuracy and quality of the operation.
本發明之目的四,提供一種電子元件作業設備,其輸送裝置之運料單元配置至少一溫控器,以於運送電子元件之行程中,利用溫控器預溫電子元件,以縮短作業裝置之作業時間,進而有效提高作業產能。The fourth object of the present invention is to provide a kind of electronic component operation equipment. The material conveying unit of the conveying device is equipped with at least one temperature controller, so that the temperature controller can be used to pre-heat the electronic components during the transportation of electronic components, so as to shorten the working time of the operation device. Operating time, thereby effectively increasing operating productivity.
為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:In order to make your review committee members have a further understanding of the present invention, hereby give a preferred embodiment and cooperate with the drawings, as follows in detail:
請參閱圖1,本發明作業設備包含機台10、供料裝置20、作業裝置30、輸送裝置40及中央控制裝置(圖未示出),中央控制裝置以供控制及整合各裝置作動,而執行自動化作業。更進一步,作業設備更配置有檢知裝置50及收料裝置60。Please refer to Fig. 1, the operating equipment of the present invention comprises a
機台10界定第一作業區11及第二作業區12,於本實施例,機台10於前段部界定第一作業區11,並於後段部界定第二作業區12,第一作業區11與第二作業區12位於同一側。The
供料裝置20配置於機台10,並設有至少一供料承置器21,以承置至少一待作業之電子元件;於本實施例,供料裝置20配置於機台10之第一作業區11。The
作業裝置30配置於機台10,並設有至少一作業器,以對電子元件執行預設作業;於本實施例,作業器為測試器,測試器包含電性連接之電路板31及測試座32,測試座32具有複數個探針,以供承置及測試電子元件,作業裝置30另設有至少一壓移器33,以於測試座32與輸送裝置40間移載待測電子元件及已測電子元件。The
輸送裝置40配置於機台10,包含運料單元、第一移料單元、第二移料單元及第一載台,運料單元設置至少一運料器,以於第一作業區11與第二作業區12間交替運送電子元件,第一移料單元配置於機台10之第一作業區11,並設有第一移料器,以於供料裝置20與運料器移載電子元件,第二移料單元配置於機台10之第二作業區12,並設有第二移料器,以於第一載台與運料器移載電子元件。The
更進一步,運料器可為輸送帶或移動式運料台,以循環式或往復式運送電子元件,以將電子元件由第一作業區11運送至第二作業區12,若運料器為移動式運料台,利用運料驅動器驅動作至少一方向位移,運料驅動器包含一線性驅動源(如皮帶輪組)及導槽,或包含二線性驅動源(如皮帶輪組及壓缸)。又運料器可具有平面式承料部或具容置槽之治具,若為平面式承料部,承料部可具有硬式承置面或微軟式承置面,並設置運料定位結構,以供定位承料部承置之電子元件,運料定位結構可為抽氣孔、微黏層或抵壓件,例如於運料器之承料部設置複數個抽氣孔,以抽吸定位電子元件,例如於運料器之承料部塗覆微黏性材質之微黏層,其黏性可供第一移料單元或第二移料單元取出電子元件
,依作業需求而配置,不受限於本實施例。
Furthermore, the conveyor can be a conveyor belt or a mobile conveyor table, which can transport electronic components in a circular or reciprocating manner, so as to transport the electronic components from the
另,輸送裝置40於運料單元之運料器配置至少一溫控器,以於運料器運送電子元件之行程中,利用溫控器預溫電子元件,溫控器可為加熱件、致冷晶片或具流體之台座,以供預冷或預熱運料器所承載之電子元件。In addition, the
於本實施例,運料單元配置第一運料器411及第二運料器412,第一運料器411設有具複數個第一容置槽4111之治具,以承置電子元件,第一運料器411並由第一運料驅動器421驅動作Y-Z方向位移,第二運料器412設有具複數個第二容置槽4121之治具,以承置電子元件,第二運料器412並由第二運料驅動器422驅動作Y-Z方向位移,第一運料驅動器421及第二運料驅動器422可驅動第一運料器411及第二運料器412作交替式位移於第一作業區11及第二作業區12。In this embodiment, the feeding unit is configured with a
輸送裝置40於第一運料器411配置第一溫控器431,第一溫控器431為加熱件,以供預熱第一運料器411所承載之電子元件,另於第二運料器412配置第二溫控器432,第二溫控器432亦為加熱件,以供預熱第二運料器412所承載之電子元件。The
第一移料單元配置於機台10之第一作業區11,並設有具複數個吸嘴之第一移料器441,第一移料器441由第一移料驅動器442驅動作X-Y-Z方向位移,以供作短距離移料行程,於供料裝置20之供料承置器21取出待作業之電子元件,而迅速將待作業之電子元件移入第一運料器411或第二運料器412。The first material transfer unit is arranged in the
第二移料單元配置於機台10之第二作業區12,並設有具複數個吸嘴之第二移料器451,第二移料器451由第二移料驅動器452驅動作X-Y-Z方向位移,以供作短距離移料行程,於第一運料器411或第二運料器412取出待作業之電子元件,並迅速將待作業之電子元件移入第一載台。The second material transfer unit is arranged in the
藉以運料單元之第一運料器411及第二運料器412作交替位移於機台10之第一作業區11與第二作業區12,並搭配第一移料單元及第二移料單元作分段式移料作動時序,以縮短移料位移行程,進而提高生產效能。The
第一載台461設有至少一第一承載部,以供第二移料器451移入待作業之電子元件;第一載台461具有平面式第一承載部,第一承載部可具有硬式承置面或微軟式承置面,第一載台461並於第一承載部設有第一定位結構,以供定位第一承載部承置之電子元件,使第一載台461毋須配置治具,而可承載不同尺寸或數量之電子元件,進而節省成本及利於倉儲配置。第一定位結構可為抽氣孔、微黏層或抵壓件,例如於第一載台461之第一承載部設置複數個抽氣孔,以抽吸定位電子元件,例如於第一載台461之第一承載部塗覆微黏性材質之微黏層,其黏性可供作業裝置30之壓移器33取出電子元件,依作業需求而配置,不受限於本實施例。於本實施例,第一載台461設有平面式之第一承載部4611,並於第一承載部4611設有具複數個第一抽氣孔4612之第一定位結構,以複數個第一抽氣孔4612抽吸定位電子元件,第一載台461並由載送驅動器462驅動作X方向位移,以於第二作業區12供第二移料器451移入待作業之電子元件,並載送至作業裝置30之側方,以供壓移器33取出待作業之電子元件。The
另,輸送裝置40依作業需求,而配置第二載台463,以供承置且輸出已作業之電子元件;更進一步,第二載台463亦具有平面式第二承載部,第二承載部可具有硬式承置面或微軟式承置面,第二載台463並於第二承載部設有第二定位結構,以供定位第二承載部承置之電子元件,使第二載台463毋須配置治具,而可承載不同尺寸或數量之電子元件,進而節省成本及利於倉儲配置。第二定位結構可為抽氣孔、微黏層或抵壓件,例如於第二載台463之第二承載部設置複數個抽氣孔,以抽吸定位電子元件,例如於第二載台463之第二承載部塗覆微黏性材質之微黏層,其黏性可供輸送裝置30之第三移料單元取出已作業電子元件,依作業需求而配置,不受限於本實施例。於本實施例,第二載台463設有平面式之第二承載部4631,並於第二承載部4631設有具複數個第二抽氣孔4632之第二定位結構,以複數個第二抽氣孔4632抽吸定位電子元件,第二載台463並由載送驅動器462驅動作X方向位移,以於作業裝置30之側方供壓移器33移入已測之電子元件,並供第三移料單元取出已測電子元件。In addition, the
又,輸送裝置40於機台10配置第三移料單元,第三移料單元設有第三移料器471,以於第二載台463取出已作業電子元件;於本實施例,第三移料器471具有複數個吸嘴,以拾取電子元件,並由第三移料驅動器472驅動作X-Y-Z方向位移,以於第二載台463取出已測電子元件,並將已測電子元件移入收料裝置60收置。Also, the
檢知裝置50配置於輸送裝置40之運料單元與第一載台461間,並設有至少一取像器51,以取像第二移料單元移載之電子元件,而供調整電子元件之擺置位置及角度,使第一載台461承載正確擺置之電子元件至作業裝置30,進而提高作業精準性及作業品質;於本實施例,檢知裝置50配置於機台10之第二作業區12,並設有一為CCD之取像器51。The detecting
收料裝置60配置於機台10,並設有至少一收料承置器61,以承置至少一已作業之電子元件;於本實施例,收料裝置60配置於機台10之前段部,且位於遠離第一作業區11之另一側。The
請參閱圖2,電子元件作業設備為一測試設備,供料裝置20之供料承置器21承置複數個待測之電子元件71,由於供料裝置20與輸送裝置40之第一移料器441位於機台10之第一作業區11,且輸送裝置40之承料位置A位於第一作業區11,第一移料驅動器442驅動第一移料器441作X-Y-Z方向位移,並作短距離移料行程,於供料承置器21取出待測電子元件71,而迅速將待測電子元件71移載至承料位置A,且移入於第一運料器411的複數個第一容置槽4111。Please refer to Fig. 2, the electronic component operation equipment is a test equipment, and the
請參閱圖2、3,運料單元之第一運料驅動器421驅動第一運料器411作Y-Z方向位移,第一運料器411運送待測電子元件71由機台10之第一作業區11位移至第二作業區12,並位於卸料位置B,第一運料器411於運料行程中,並利用第一溫控器431預熱第一運料器411所承載之待測電子元件71;由於第二移料單元配置於機台10之第二作業區12,即以第二移料驅動器452驅動第二移料器451作X-Y-Z方向短距離移料行程至卸料位置B,以於第一運料器411取出待測電子元件71;另運料單元之第二運料驅動器422驅動第二運料器412作Y-Z方向位移
,空的第二運料器412由機台10之第二作業區12位移至第一作業區11,並位於承料位置A,以與第一運料器411交替接續承載下一批次待測電子元件71A。
Please refer to Figures 2 and 3, the first
請參閱圖2、4,由於第一運料器411、第二移料器451及第一載台461均位於機台10之第二作業區12,第二移料驅動器452即驅動第二移料器451作X-Y-Z方向短距離移料行程,將第一運料器411上之待測電子元件71迅速移載至第一載台461;由於檢知裝置50配置於運料單元與第一載台461之間,於第二移料器451之移料作動行程中,可先將待測電子元件71移載至檢知裝置50之取像器51,以取像待測電子元件71,並將取像資料傳輸至中央控制裝置以供分析,於中央控制裝置控制第二移料器451調整待測電子元件71之擺置位置及角度後,第二移料器451將待測電子元件71移置第一載台461,於第一載台461之第一抽氣孔4612抽吸定位電子元件71後,第二移料器451釋放待測電子元件71,使第一載台461承載正確擺置之電子元件;此時,作業裝置30之壓移器33於測試座32取出已測之電子元件71B,並移載至第二載台463。2 and 4, since the
請參閱圖5、6,第一載台461及第二載台463由載送驅動器462驅動作X方向同步位移,令第一載台461載送待測電子元件71至作業裝置30之側方
,以供壓移器33取出待測電子元件71,壓移器33作Y-Z方向位移將待測電子元件71移入測試座32而接續執行測試作業,第二載台463則輸出已測之電子元件71B
;此時,運料單元之第一運料驅動器421及第二運料驅動器422各別驅動第一運料器411及第二運料器412作交替式位移於第一作業區11及第二作業區12,以接續載送待測之電子元件,而供第一移料器441及第二移料器451分別以短行程位移迅速執行移料作業,以有效縮短移料作業時間,進而提高測試產能。再者,第三移料單元以第三移料驅動器472驅動第三移料器471作X-Y-Z方向位移,於第二載台463取出已測電子元件71B,並依測試結果,將已測電子元件71B移入收料裝置60之收料承置器61收置。
Please refer to Figures 5 and 6, the
10:機台
11:第一作業區
12:第二作業區
20:供料裝置
21:供料承置器
30:作業裝置
31:電路板
32:測試座
33:壓移器
40:輸送裝置
411:第一運料器
4111:第一容置槽
412:第二運料器
4121:第二容置槽
421:第一運料驅動器
422:第二運料驅動器
431:第一溫控器
432:第二溫控器
441:第一移料器
442:第一移料驅動器
451:第二移料器
452:第二移料驅動器
461:第一載台
4611:第一承載部
4612:第一抽氣孔
462:載送驅動器
463:第二載台
4631:第二承載部
4632:第二抽氣孔
471:第三移料器
472:第三移料驅動器
50:檢知裝置
51:取像器
60:收料裝置
61:收料承置器
71、71A、71B:電子元件
A:承料位置
B:卸料位置
10: machine
11: The first operation area
12: The second work area
20: Feeding device
21: Feed holder
30: operating device
31: circuit board
32: Test seat
33: Pressure shifter
40: Conveyor
411: The first conveyor
4111: The first holding tank
412: Second conveyor
4121:Second Storage Tank
421: The first transport drive
422: The second transport drive
431: The first thermostat
432: Second thermostat
441: The first material shifter
442: The first material transfer driver
451: Second shifter
452: The second material transfer driver
461: The first stage
4611: the first bearing part
4612: The first air hole
462: Carrying drive
463:Second platform
4631: the second bearing part
4632: Second air hole
471: The third shifter
472: The third material transfer driver
50: detection device
51: image picker
60: Receiving device
61:
圖1:本發明作業設備之配置圖。 圖2:本發明作業設備之使用示意圖(一)。 圖3:本發明作業設備之使用示意圖(二)。 圖4:本發明作業設備之使用示意圖(三)。 圖5:本發明作業設備之使用示意圖(四)。 圖6:本發明作業設備之使用示意圖(五)。 Fig. 1: Configuration diagram of the operation equipment of the present invention. Figure 2: Schematic diagram of the use of the operating equipment of the present invention (1). Figure 3: Schematic diagram of the use of the operating equipment of the present invention (2). Figure 4: Schematic diagram of the use of the operating equipment of the present invention (3). Figure 5: Schematic diagram of the use of the operating equipment of the present invention (4). Figure 6: Schematic diagram of the use of the operating equipment of the present invention (5).
10:機台 10: machine
11:第一作業區 11: The first operation area
12:第二作業區 12: The second work area
20:供料裝置 20: Feeding device
21:供料承置器 21: Feed holder
30:作業裝置 30: operating device
31:電路板 31: circuit board
32:測試座 32: Test seat
33:壓移器 33: Pressure shifter
40:輸送裝置 40: Conveyor
411:第一運料器 411: The first conveyor
4111:第一容置槽 4111: The first holding tank
412:第二運料器 412: Second conveyor
4121:第二容置槽 4121:Second Storage Tank
421:第一運料驅動器 421: The first transport drive
422:第二運料驅動器 422: The second transport drive
431:第一溫控器 431: The first thermostat
432:第二溫控器 432: Second thermostat
441:第一移料器 441: The first material shifter
442:第一移料驅動器 442: The first material transfer driver
451:第二移料器 451: Second shifter
452:第二移料驅動器 452: The second material transfer driver
461:第一載台 461: The first stage
4611:第一承載部 4611: the first bearing part
4612:第一抽氣孔 4612: The first air hole
462:載送驅動器 462: Carrying drive
463:第二載台 463:Second platform
4631:第二承載部 4631: the second bearing part
4632:第二抽氣孔 4632: Second air hole
471:第三移料器 471: The third shifter
472:第三移料驅動器 472: The third material transfer driver
50:檢知裝置 50: detection device
51:取像器 51: image picker
60:收料裝置 60: Receiving device
61:收料承置器 61: Receiver
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109139025A TWI791171B (en) | 2020-11-09 | 2020-11-09 | Electronic component handler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109139025A TWI791171B (en) | 2020-11-09 | 2020-11-09 | Electronic component handler |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202220540A TW202220540A (en) | 2022-05-16 |
| TWI791171B true TWI791171B (en) | 2023-02-01 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW109139025A TWI791171B (en) | 2020-11-09 | 2020-11-09 | Electronic component handler |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI791171B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI860652B (en) * | 2023-03-17 | 2024-11-01 | 鴻勁精密股份有限公司 | Processing device and processing machine |
Citations (7)
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| CN2904602Y (en) * | 2006-04-03 | 2007-05-23 | 环隆电气股份有限公司 | Assembly line for electronic products |
| TWI304310B (en) * | 2006-09-28 | 2008-12-11 | Hon Tech Inc | Conveying device and method adapted for electronic element |
| CN103369941A (en) * | 2012-04-02 | 2013-10-23 | 三星电子株式会社 | Apparatus and method for manufacturing substrate |
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| TWI502206B (en) * | 2013-12-27 | 2015-10-01 | Hon Tech Inc | Image sensing device for testing electronic components and its application |
| CN204948530U (en) * | 2015-06-10 | 2016-01-06 | 东莞市奥海电源科技有限公司 | For the brush board of charger for mobile phone PCBA, test, some glue automatic assembly line |
| TW201804163A (en) * | 2016-07-29 | 2018-02-01 | 鴻勁科技股份有限公司 | Electronic component operating device and test handler using the same capable of improving operational production performance and saving cost |
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2020
- 2020-11-09 TW TW109139025A patent/TWI791171B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2904602Y (en) * | 2006-04-03 | 2007-05-23 | 环隆电气股份有限公司 | Assembly line for electronic products |
| TWI304310B (en) * | 2006-09-28 | 2008-12-11 | Hon Tech Inc | Conveying device and method adapted for electronic element |
| TWI414800B (en) * | 2010-07-16 | 2013-11-11 | Hon Tech Inc | Applied to image sensing IC test classifier (2) |
| CN103369941A (en) * | 2012-04-02 | 2013-10-23 | 三星电子株式会社 | Apparatus and method for manufacturing substrate |
| TWI502206B (en) * | 2013-12-27 | 2015-10-01 | Hon Tech Inc | Image sensing device for testing electronic components and its application |
| CN204948530U (en) * | 2015-06-10 | 2016-01-06 | 东莞市奥海电源科技有限公司 | For the brush board of charger for mobile phone PCBA, test, some glue automatic assembly line |
| TW201804163A (en) * | 2016-07-29 | 2018-02-01 | 鴻勁科技股份有限公司 | Electronic component operating device and test handler using the same capable of improving operational production performance and saving cost |
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| Publication number | Publication date |
|---|---|
| TW202220540A (en) | 2022-05-16 |
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