TWI868295B - Processing equipment - Google Patents

Abstract

[Topic] Provide a processing device that allows an operator to determine whether processing conditions are appropriate without removing a wafer from the processing device. [Solution] A processing device is provided, which includes: a chuck table, a processing unit, a processing feed unit, a camera unit and a control unit, the control unit comprising: a control unit, which positions the chuck table directly below the camera unit by operating the processing feed unit and moving the chuck table relatively after the processing unit processes all areas of the wafer held by the chuck table corresponding to the predetermined splitting line, and causes the camera unit to photograph the wafer; and a report preparation unit, which derives information about the processing status in each area based on images obtained by individually photographing two or more different areas among all areas corresponding to the predetermined splitting line on which processing has been performed, and prepares a report recording the information and images.

Description

Processing equipment

The present invention relates to a processing device for processing a wafer having components formed in each region divided by a plurality of predetermined dividing lines.

Component chips are installed in electronic devices such as mobile phones and computers. Component chips are manufactured by cutting a wafer with components such as IC (Integrated Circuit) and LSI (Large Scale Integration) formed in each area divided by a plurality of predetermined dividing lines into a plurality of component chips by cutting along each predetermined dividing line.

The wafer is divided using a processing device having a processing unit, such as a dicing unit having a dicing blade (see, for example, Patent Document 1), a laser irradiation unit for irradiating a laser beam having a wavelength absorbed by the wafer (see, for example, Patent Document 2), and the like.

The processing device includes a chuck table disposed below a processing unit. A processing feed unit is disposed below the chuck table to move the chuck table in a processing feed direction (X-axis direction). Furthermore, an imaging unit is disposed above the chuck table to photograph a wafer held by the chuck table.

In addition, the processing device is also provided with a control unit, which controls the operation of each component such as the processing unit, the chuck table, the processing feed unit, the imaging unit, etc. After the operator inputs the pre-set processing conditions into the control unit, the processing unit processes each wafer along the predetermined dividing line.

In order to confirm whether the processing conditions are appropriate, the operator sometimes removes a wafer that has been processed along several predetermined separation lines from the processing device and observes multiple locations along the predetermined separation lines using a microscope installed outside the processing device (i.e., performs a cut inspection).

Through this observation, the operator confirms whether the width of the cutting groove, the size and number of chips (cracks), the deviation between the center line of the cutting groove and the center line of the predetermined dividing line, etc. are within the allowable range. If the deviation, etc. exceeds the allowable range, the operator will appropriately correct the processing conditions. Then, the wafer that has been returned to the processing device will be processed with the corrected processing conditions. [Known technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Publication No. 2000-108119 [Patent Document 2] Japanese Patent Publication No. 2005-150523

[Problem to be solved by the invention] However, if the wafer is taken out from the processing device every time the processing conditions are confirmed under a microscope, there is a risk of the wafer being damaged during transportation, and there is a risk of foreign matter adhering to the wafer and contaminating the wafer.

The present invention is made in view of this problem, and its purpose is to provide a processing device that allows an operator to determine whether the processing conditions are appropriate without taking the wafer out of the processing device.

[Technical means for solving the problem] According to one aspect of the present invention, a processing device is provided, which processes a wafer having components formed in a plurality of regions, the regions being divided by a plurality of predetermined dividing lines set on the front side, and the processing device comprises: a cassette stage, which carries a cassette containing a plurality of wafers; a chuck stage, which holds wafers removed from the cassette mounted on the cassette stage; a processing unit, which performs processing on the regions of the wafer held on the chuck stage corresponding to the predetermined dividing lines; a processing feed unit, which processes and feeds the chuck stage and the processing unit relative to each other; a camera unit, which photographs the wafer held on the chuck stage; and a control unit. The control unit controls the processing unit, the processing feed unit and the imaging unit, the control unit comprising: a control section, which positions the chuck table directly below the imaging unit by operating the processing feed unit and moving the chuck table relatively after the processing unit processes all areas of the wafer held by the chuck table, and causes the imaging unit to photograph the wafer; and a report preparation section, which derives information on the processing status of each area based on images obtained by individually photographing two or more different areas among all areas corresponding to the predetermined splitting line on which processing has been performed, and prepares a report recording the information and the image.

Preferably, the report preparation section prepares the report for the wafer on which the processing is first performed among the plurality of wafers accommodated in the cassette.

Furthermore, preferably, the information on the processing state includes: the width of the groove formed in the area corresponding to the predetermined dividing line, the state of chipping formed in the groove, and the offset of the groove from the center line of the predetermined dividing line.

Furthermore, preferably, the processing device further comprises: a display unit that displays the content of the report.

Furthermore, preferably, in the case of specifying the number of the two or more different areas photographed by the imaging unit, the control unit further includes: a configuration determination unit that determines the configuration of the two or more different areas.

Furthermore, preferably, the processing unit is any one of a cutting unit and a laser beam irradiation unit, wherein the cutting unit has a rotatable cutting blade, and the laser beam irradiation unit has a condenser for condensing the laser beam.

[Effect of the invention] The control unit of a processing device in one embodiment of the present invention has a control section and a report generation section. After the processing unit processes all areas of a wafer held on a chuck table corresponding to a predetermined dividing line, the control section operates the processing feed unit and moves the chuck table relatively, thereby positioning the chuck table directly below the imaging unit, and causing the imaging unit to photograph the wafer.

Furthermore, the report preparation department deduces information about the processing status of each area based on the images obtained by individually photographing two or more different areas among all areas corresponding to the predetermined dividing line where processing has been performed, and prepares a report recording the information and the image. By referring to this report, the operator can confirm whether the processing conditions are appropriate without removing the wafer from the processing device. Therefore, the risk of wafer damage, contamination, etc. caused by removing the wafer from the processing device can be eliminated.

Referring to the accompanying drawings, an embodiment of the present invention is described. FIG. 1 is a perspective view of a cutting device (processing device) 2. In addition, in FIG. 1, a part of the components of the cutting device 2 is represented by a functional block. In addition, in the following description, the X-axis direction (processing feed direction), the Y-axis direction (indexing feed direction) and the Z-axis direction (height direction) are mutually orthogonal directions.

An operation panel 4 is provided on the front side of the cutting device 2. The operator can set processing conditions and the like for the cutting device 2 by performing predetermined inputs through the operation panel 4. A monitor (display unit) 6 is provided on the side surface of the front side of the cutting device 2.

The display 6 displays a guidance screen for guiding the operator to perform the operation, an image captured by the camera unit 24 described later, the content of a report described later, etc. In addition, the display 6 may be a touch panel that functions as the operation panel 4. In this case, the operation panel 4 may be omitted.

In the cutting device 2, a wafer 11 formed of a semiconductor material such as silicon is cut (processed) (see FIG. 2 ). As shown in FIG. 2 , a plurality of predetermined dividing lines (cutting paths) 13 are arranged in a grid pattern on the front surface 11a of the wafer 11. Components 15 such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed in each area divided by the plurality of predetermined dividing lines 13.

A circular adhesive film (dicing film 17) formed of resin is adhered to the back surface 11b of the wafer 11. The diameter of the dicing film 17 is larger than the diameter of the wafer 11. The wafer 11 is adhered to the center of the dicing film 17, and one side of a ring-shaped frame 19 formed of metal is adhered to the outer periphery of the dicing film 17.

The wafer 11, the dicing film 17 and the frame 19 constitute a frame unit 21. Fig. 2 is a perspective view of the frame unit 21. A plurality of (eg, 25) frame units 21 are transported to the dicing device 2 while being accommodated in one cassette 8 (see Fig. 1).

Returning to Fig. 1 again, the other components of the cutting device 2 are described. The cutting device 2 has a rectangular plate-shaped cassette stage 10. The above-mentioned cassette 8 is placed on the cassette stage 10. A cassette elevator 12 is connected below the cassette stage 10 to move the cassette stage 10 up and down.

A push-pull arm 14 is provided at the rear of the cassette stage 10. The push-pull arm 14 carries out the wafer 11 before dicing from the cassette 8 while holding the frame 19 of the frame unit 21. Furthermore, the push-pull arm 14 can also carry the wafer 11 after dicing into the cassette 8 by pushing the frame 19.

A pair of positioning members (guide rails) 16 are provided on both sides of the moving path of the push-pull arm 14. The pair of positioning members 16 adjusts the position of the frame unit 21 in the X-axis direction. A first conveying unit 18 for conveying the frame unit 21 from the pair of positioning members 16 is provided near the pair of positioning members 16.

The first transport unit 18 has an arm, a suction mechanism disposed at one end of the arm, and a rotation mechanism disposed at the other end of the arm. The first transport unit 18 transports the frame unit 21 by rotating the arm by a predetermined angle while the suction mechanism absorbs the frame 19.

The first transport unit 18 transports the frame unit 21 to the chuck table 20, and the chuck table 20 is in a state of being moved to a region closest to the cassette table 10 in the X-axis direction. A disk-shaped porous plate is fixed to the upper surface side of the chuck table 20.

One end of a flow path (not shown) formed inside the chuck table 20 is connected to the lower surface side of the porous plate, and the other end of the flow path is connected to a suction source (not shown) such as an ejector.

When the suction source is operated, negative pressure is generated on the upper surface of the porous plate, and the upper surface of the chuck table 20 functions as a holding surface 20a that attracts and holds the frame unit 21. The frame unit 21 holds the dicing film 17 side of the wafer 11 with the front surface 11a side exposed by the holding surface 20a.

A plurality of clamp units 20b for fixing the frame 19 are provided on the outer periphery of the chuck table 20. Further, a θ table (not shown) for rotating the chuck table 20 around a predetermined rotation axis is connected to the lower side of the chuck table 20.

A processing feed unit 22 for moving the chuck table 20 in the X-axis direction is connected below the θ table. In addition, FIG. 1 shows the schematic position of the processing feed unit 22, but the specific shape is not shown.

The processing feed unit 22 has an X-axis moving table (not shown) supporting the θ table. The X-axis moving table is arranged to be able to slide on a pair of X-axis guide rails (not shown) parallel to the X-axis.

A ball screw (not shown) is arranged along the X-axis direction between a pair of X-axis guide rails. A pulse motor (not shown) for rotating the ball screw is connected to one end of the ball screw.

Furthermore, a nut portion (not shown) is provided on the lower surface of the X-axis moving stage, and the nut portion is connected so as to be rotatable relative to the ball screw. When the pulse motor is driven, the chuck stage 20 moves along the X-axis direction together with the X-axis moving stage and the like.

An imaging unit 24 is disposed above the moving path of the chuck table 20 so as to face the holding surface 20a. The imaging unit 24 includes a camera including a predetermined optical system and an imaging element such as a CCD image sensor or a CMOS image sensor. The imaging unit 24 captures the front side 11a of the wafer 11 held by the holding surface 20a and obtains an image.

The acquired image is displayed on, for example, a display 6. A cutting unit (processing unit) 26 is provided on one side in the X-axis direction relative to the imaging unit 24. The cutting unit 26 has a cylindrical main shaft (not shown) arranged along the Y-axis direction.

A cutting blade 26a having an annular cutting blade is mounted on one end of the main shaft. A rotation drive source such as a motor is connected to the other end of the main shaft. When the rotation drive source is operated, the cutting blade 26a rotates at a high speed.

Here, a method of dicing the wafer 11 using the dicing blade 26a is described. In the case of dicing the wafer 11, first, the back side 11b of the wafer 11 (i.e., the dicing film 17) is held by the holding surface 20a in such a manner that the front side 11a is exposed, and the frame 19 is fixed by a plurality of clamping units 20b.

Next, the front side 11a of the wafer 11 is photographed by the imaging unit 24, and the image obtained by the photographing is subjected to image processing such as pattern matching to detect the coordinates of the predetermined alignment mark. In this way, the position of the predetermined dividing line 13 which is a predetermined distance away from the coordinates of the alignment mark is determined.

Next, the dicing blade 26a is positioned on an extension of the predetermined dividing line 13. Thereafter, the lower end of the rotated dicing blade 26a is positioned between the back surface 11b of the wafer 11 and the holding surface 20a.

Then, the chuck table 20 is fed by the feeding unit 22, so that the wafer 11 and the chuck table 20 are relatively moved along the X-axis direction. Thus, the area corresponding to one predetermined dividing line 13 is cut (processed) to form a cut groove 13a (see FIG. 3).

After the wafer 11 is cut along one planned dividing line 13, the cutting unit 26 is moved along the Y-axis direction and the cutting blade 26a is positioned on an extension line of another planned dividing line 13 adjacent to the one planned dividing line 13 in the Y-axis direction.

Then, the wafer 11 is cut along another predetermined dividing line 13. In the same manner, the wafer 11 is cut along the remaining predetermined dividing lines 13. After the wafer 11 is cut along all the predetermined dividing lines 13 arranged along the X-axis direction, the wafer 11 is rotated 90 degrees by the θ stage.

Then, the wafer 11 is cut along all the planned dividing lines 13 arranged along the X-axis direction. In this way, after the cutting grooves 13a are formed in the regions corresponding to all the planned dividing lines 13 arranged in a grid pattern, the cutting is completed.

The frame unit 21 after cutting is transferred from the chuck table 20 to the rotary cleaning unit 30 located behind the chuck table 20 by the second transfer unit 28. In the rotary cleaning unit 30, the frame unit 21 is rotary cleaned and rotary dried.

The frame unit 21 that has completed the rotary cleaning and rotary drying in the rotary cleaning unit 30 is carried into the cassette 8 by the first conveying unit 18, the positioning member 16, the push-pull arm 14, etc. Next, the control unit 32 that controls the operation of the cutting device 2 will be described.

The control unit 32 controls the operations of the cassette elevator 12, the push-pull arm 14, the positioning member 16, the chuck table 20, the processing feed unit 22, the imaging unit 24, the cutting unit 26, the second conveying unit 28, the rotary cleaning unit 30, and the like.

The control unit 32 is constituted by, for example, a computer including a processing device such as a CPU (Central Processing Unit), a main memory device such as a DRAM (Dynamic Random Access Memory), and an auxiliary memory device such as a flash memory and a hard disk drive. The functions of the control unit 32 are realized by operating the processing device and the like according to software stored in the auxiliary memory device and including a predetermined program.

The control unit 32 includes, for example, a control unit 34 formed by a program. The control unit 34 controls, for example, the operation of an electromagnetic valve (not shown) provided between one end and the other end of a flow path formed inside the chuck table 20 .

If the electromagnetic valve is set to an open state, a negative pressure is generated on the holding surface 20a, and if the electromagnetic valve is set to a closed state, the negative pressure on the holding surface 20a disappears. The control unit 34 controls the operation of the rotation drive source of the cutting unit 26, for example.

According to the above-mentioned method of cutting the wafer 11 , after all the predetermined dividing lines 13 are cut by the cutting unit 26 , the control unit 34 controls the pulse motor of the processing feed unit 22 to position the chuck stage 20 directly below the imaging unit 24 .

Thereafter, the control unit 34 operates the imaging unit 24 to cause the imaging unit 24 to capture an image of the front surface 11a of the wafer 11. FIG3 is a diagram showing a state in which the front surface 11a of the wafer 11 is captured.

The imaging unit 24 captures the entire front side 11a of the wafer 11, and captures two or more pre-set inspection areas (ranges) in a manner that is magnified larger than the entire image of the wafer 11. The imaging unit 24 of this embodiment captures seven inspection areas located at different positions.

Fig. 4 is a diagram showing each inspection area. In addition, in this embodiment, the lateral direction shown in Fig. 4 is referred to as channel 1 (CH1), and the longitudinal direction shown in Fig. 4 is referred to as channel 2 (CH2).

Each inspection area includes a predetermined range centered at the intersection of the predetermined dividing lines 13 in the CH1 direction and the CH2 direction. As shown in the image of the inspection area A, chipping (cracks) 13b are generated in the cut groove _13a1 along the CH1 direction and the cut groove _13a2 along the CH2 direction.

In the inspection area A, the center line of the cutting groove _13a1 in the CH1 direction is offset from the center line of the predetermined dividing line 13 in the CH1 direction to the rear. The center line of the cutting groove _13a1 refers to a straight line passing through the center position of the width of the cutting groove _13a1 in the CH2 direction and parallel to the CH1 direction. In addition, the center line of the predetermined dividing line 13 in the CH1 direction refers to a straight line passing through the center position of the width of the predetermined dividing line 13 in the CH1 direction and parallel to the CH1 direction.

The inspection region B is located further to the right of the inspection region A in the CH1 direction and is located at the same position in the CH2 direction as the inspection region A. In the inspection region B, the center line of the cut groove _13a2 in the CH2 direction is offset to the left from the center line of the planned dividing line 13 in the CH2 direction.

The so-called center line of the cutting groove _13a2 refers to a straight line passing through the center position of the width of the cutting groove _13a2 in the CH1 direction and parallel to the CH2 direction. In addition, the so-called center line of the CH2 direction predetermined splitting line 13 refers to a straight line passing through the center position of the width of the CH1 direction of the CH2 direction and parallel to the CH2 direction.

In the inspection area B, the center line of the cut groove _13a1 in the CH1 direction is offset backward from the center line of the planned dividing line 13 in the CH1 direction, similarly to the inspection area A. In addition, no chip 13b is generated in the cut groove _13a1 in the CH1 direction.

The inspection region C is located to the left of the inspection region A in the CH1 direction and to the front of the inspection region A in the CH2 direction. In the inspection region C, the center line of the cutting groove _13a1 in the CH1 direction is offset to the rear from the center line of the predetermined dividing line 13 in the CH1 direction, and the center line of the cutting groove _13a2 in the CH2 direction is offset to the right from the center line of the predetermined dividing line 13 in the CH2 direction.

The inspection area D is located approximately in the center of the front surface 11a. The inspection area D is located between the inspection areas A and B in the CH1 direction and is located at the same position as the inspection area C in the CH2 direction. In the inspection area D, the center line of the cut groove _13a1 in the CH1 direction is also offset backward from the center line of the predetermined dividing line 13 in the CH1 direction.

Inspection region E is located further to the right of inspection region B in the CH1 direction and is located at the same position in the CH2 direction as inspection regions C and D. In inspection region E, the center line of cut groove _13a1 in the CH1 direction is also offset backward from the center line of planned dividing line 13 in the CH1 direction.

The inspection region F is located at the same position as the inspection region A in the CH1 direction and is located more anterior to the inspection region C in the CH2 direction. In the inspection region F, the center line of the cut groove _13a1 in the CH1 direction is offset backward from the center line of the planned dividing line 13 in the CH1 direction.

The inspection region G is located at the same position as the inspection region B in the CH1 direction and at the same position as the inspection region F in the CH2 direction. In the inspection region G, the center line of the cutting groove _13a1 in the CH1 direction is offset backward from the center line of the predetermined dividing line 13 in the CH1 direction, and the center line of the cutting groove _13a2 in the CH2 direction is offset leftward from the center line of the predetermined dividing line 13 in the CH2 direction.

The arrangement of the examination areas A to G is determined by an arrangement determination unit 36 which is a part of the control unit 32, when the operator has designated the number of two or more different examination areas (ranges) to be photographed by the imaging unit 24. The arrangement determination unit 36 is constituted by a program, for example.

The arrangement determination unit 36 sets the coordinates of the intersection of the center line of the planned division line 13 in the CH1 direction and the center line of the planned division line 13 in the CH2 direction as the center coordinates of the inspection region. The arrangement determination unit 36 determines the center coordinates of the plurality of inspection regions according to the number of designated inspection regions.

For example, the arrangement determining unit 36 uses one coordinate located at the approximate center of the front surface 11a and a plurality of other coordinates located around the one coordinate as the center coordinates of the inspection area, among the coordinates of the plurality of intersections. For example, the arrangement determining unit 36 determines the arrangement of the center coordinates of the inspection area so that the center coordinates of at least two inspection areas are the same in the CH1 direction or the CH2 direction.

After determining the configuration of the center coordinates of the inspection area, the imaging unit 24 captures the range from the center coordinates of each inspection area to a predetermined diameter (e.g., 200 μm to 300 μm). In addition, the range captured by the imaging unit 24 is not limited to a circle, but can be any shape.

The control unit 32 further includes a report generation unit 38 for generating a report recording images of each inspection area and information on the processing status of the wafer 11 in each inspection area. The report generation unit 38 is composed of a program, for example, and generates a report for the wafer 11 that is processed first among the plurality of wafers 11 accommodated in the cassette 8.

By referring to this report, the operator can check whether the processing conditions are appropriate without removing the wafer 11 from the processing device. If the processing conditions are inappropriate, the processing conditions can be corrected. Therefore, when processing the second and subsequent wafers 11, the corrected processing conditions can be used to process the wafer 11.

The information about the processing state includes: the width of the cutting groove 13a, the state of the chip 13b formed in the cutting groove 13a, and the offset of the center line of the cutting groove 13a from the center line of the predetermined dividing line 13. In addition, the width of the cutting groove _13a1 along the CH1 direction refers to the length of the cutting groove _13a1 in the CH2 direction, and the width of the cutting groove _13a2 along the CH2 direction refers to the length of the cutting groove _13a2 in the CH1 direction.

Furthermore, the state of the chipping 13b formed in the cutting groove 13a refers to, for example, the number of chippings 13b and the size of the chippings 13b. For example, the size of the chipping 13b means the maximum length of the chipping 13b in the CH2 direction from the edge of the cutting groove _13a1 , or the maximum length of the chipping 13b in the CH1 direction from the edge of the cutting groove _13a2 .

The report of this embodiment is displayed in the form of an image on the display 6. Fig. 5 is an image showing an example of the report. In the upper right corner of the report, an overall image of the front surface 11a side of the wafer 11 is displayed. In this overall image, the positions corresponding to the inspection areas A to G are indicated by circles.

Below the overall image of the wafer 11, a circle in which the overall image is simplified is displayed, and within this circle, inspection areas A to G are displayed. Images of the inspection areas are displayed to the left of the overall image of the wafer 11. In the example shown in FIG5, the image of the inspection area D is displayed.

In addition, the operator can select the image of the inspection area to be displayed by specifying the desired inspection area. For example, the operator can switch the image of the inspection area D to the image of the inspection area A by specifying the inspection area A displayed within the circle in which the entire image has been simplified.

Below the image of the inspection area, information about the processing status of the selected inspection area is displayed. In the example shown in FIG5 , information about the processing status of the inspection area D is displayed. Each information is generated by the report generation unit 38 based on the obtained image.

As shown in "Groove Width" in FIG5 , the width of the cut groove _13a1 in the inspection area D is 30 μm, and the width of the cut groove _13a2 in the inspection area D is 31 μm. In addition, "Cracks" in FIG5 indicates the number of cracks smaller than 5 μm. As shown in FIG5 , in the inspection area D, the number of cracks smaller than 5 μm in the cut groove _13a1 is 1, and the number of cracks smaller than 5 μm in the cut groove _13a2 is 4.

"(5 μm or more)" in FIG5 indicates the number of chippings of 5 μm or more. As shown in FIG5, in the inspection area D, there are no chippings of 5 μm or more in the cutting grooves _13a1 and _13a2 . In addition, "cutting line deviation" in FIG5 is the deviation of the center line of the cutting groove 13a from the center line of the predetermined dividing line 13.

5, the center line of the cut groove _13a1 in the CH1 direction of the inspection area D is offset by 3 μm from the center line of the planned dividing line 13 in the CH1 direction. Also, the center line of the cut groove _13a2 in the CH2 direction of the inspection area D is offset by 2 μm from the center line of the planned dividing line 13 in the CH2 direction.

The report generation unit 38 derives the width of the cutting groove 13a, the number of chippings less than 5 μm, the number of chippings greater than 5 μm, the cutting path offset, etc. from the acquired image. Since the length of each pixel of the acquired image is preset, the report generation unit 38 calculates the width of the cutting groove 13a and the position of the center line of the cutting groove 13a from the number of pixels corresponding to the width of the cutting groove 13a in the image.

Similarly, the report generation unit 38 can calculate the size of the chipping in the predetermined direction from the number of pixels corresponding to the chipping in the predetermined direction in the image. Furthermore, the report generation unit 38 can count the number of chippings according to the size of the chippings. In this way, the report generation unit 38 generates a report recording the image of each inspection area and the information about the processing status in each inspection area.

By referring to this report, the operator can check whether the processing conditions are appropriate without removing the wafer 11 from the dicing device 2 or observing the predetermined dividing line 13 through a microscope, etc. Therefore, the risk of damage or contamination of the wafer 11 caused by removing the wafer 11 from the dicing device 2 can be eliminated.

In addition, the report is not limited to image display, but can also be printed on paper. In the case where the report is printed on paper, the cutting device 2 can have a report printing unit (not shown) including a printer. In addition, instead of the report printing unit, the report production unit 38 can also output the data required for producing the report to an external printer (not shown) and make the printer print the report.

When the report is printed on paper, it is preferred that the image of each inspection area and the information on the processing status are recorded in the report in a manner that can identify the correspondence between the image of each inspection area and the information on the processing status of the wafer 11 in each inspection area.

Next, the confirmation and correction method of the processing conditions will be described. First, the operator inputs the predetermined processing conditions into the control unit 32 through the operation panel 4 (preparation step S10). The processing conditions are the type of the cutting blade 26a, the flow rate of the cutting water supplied to the processing point, the number of rotations of the main shaft, etc.

In the preparation step S10 , the number of inspection areas (ranges) to be photographed is also input, and the above-mentioned arrangement determination unit 36 automatically determines the arrangement of the inspection areas. After the processing conditions are input, the operator presses the automatic processing start button to cause the dicing device 2 to start processing the wafer 11 .

When the automatic processing start button is pressed, the first frame unit 21 is transferred from the cassette 8 to the chuck table 20, and the frame unit 21 is held by the holding surface 20a and the clamp unit 20b (holding step S20).

After the holding step S20, the above-mentioned cutting method is followed and the cutting unit 26 cuts all the areas of the wafer 11 corresponding to the predetermined dividing line 13 (cutting step S30). After the cutting step S30, the camera unit 24 photographs the entirety of each inspection area designated by the configuration determination unit 36 and the front side 11a of the wafer 11 (photographing step S40).

After the imaging step S40, the report preparation unit 38 prepares the above-mentioned report (report preparation step S50). The operator confirms whether the processing conditions input in the preparation step S10 are appropriate by referring to the prepared report (confirmation step S60). In this way, the risk of damage and contamination of the wafer 11 caused by removing the wafer 11 from the dicing device 2 can be eliminated.

After the confirmation step S60, the first frame unit 21 is cleaned and dried in the rotary cleaning unit 30 and is moved into the cassette 8. When the processing conditions are appropriate, the cutting step S30 is also performed on the second and subsequent frame units 21 under the same processing conditions.

However, if the processing conditions are inappropriate, after the confirmation step S60, the processing conditions are corrected (correction step S70). In the correction step S70, for example, the cutting blade 26a is replaced or reinstalled, the flow rate of cutting water is changed, the number of rotations of the main shaft is changed, etc.

After the correction step S70, the steps from the holding step S20 to the confirmation step S60 are performed for the second frame unit 21. When the processing conditions are appropriate, the second frame unit 21 is cleaned and dried, and is moved into the cassette 8. However, when the processing conditions are inappropriate, the correction step S70 is performed again.

Next, the second embodiment will be described. FIG6 is a perspective view of a laser processing device (processing device) 40 of the second embodiment. The laser processing device 40 has a laser beam irradiation unit (processing unit) 42 instead of the cutting unit 26. This point is different from the cutting device 2.

The laser beam irradiation unit 42 has a laser beam generating unit (not shown) that generates a pulsed laser beam having a wavelength absorbed by the wafer 11. In addition, the laser beam generating unit includes a laser oscillator (not shown). The laser beam irradiation unit 42 has a cylindrical outer shell 42a, and a head 42b is provided at the front end of the outer shell 42a.

The head 42b is provided with a focusing lens (not shown) for focusing the laser beam, and the head 42b functions as a focusing device. The laser beam generated by the laser beam generating unit passes through a predetermined optical system provided in the outer casing 42a and is emitted downward from the head 42b.

When processing the wafer 11, for example, the back side 11b of the wafer 11 is held by the holding surface 20a with the front side 11a exposed. Then, the area directly below the head 42b is positioned on an extension line of a predetermined dividing line 13.

When the chuck table 20 and the head 42b are fed relative to each other while a laser beam of a predetermined output is irradiated from the head 42b, an area corresponding to the predetermined dividing line 13 is etched to form a laser processed groove.

The laser processing device 40 also has the control unit 32 similarly to the dicing device 2. Therefore, similarly to the first embodiment, after laser processing grooves are formed on all the planned dividing lines 13 of the first wafer 11, a report is prepared by the report preparation section 38.

By referring to this report, the operator can check whether the processing conditions are appropriate without removing the wafer 11 from the laser processing apparatus 40. Therefore, the risk of damage or contamination of the wafer 11 caused by removing the wafer 11 from the laser processing apparatus 40 can be eliminated.

Next, another example of the configuration determination unit 36 determining the configuration of the inspection area is described. The inspection area is meaningless if it is not set on the wafer 11. However, since the wafer 11 is disk-shaped, if a plurality of inspection areas are arranged at equal intervals in the CH1 and CH2 directions, the inspection area at the end may be located outside the periphery of the front surface 11.

FIG. 7(A) is a diagram showing an example in which the inspection region 13c located at the end is located outside the periphery of the wafer 11. In FIG. 7(A), the position of the inspection region 13c is simply indicated by a cross. In this case, the configuration determination unit 36 corrects the configuration of the inspection region 13c so that the interval of the inspection region 13c becomes narrower in the CH1 or CH2 direction.

Fig. 7(B) is a diagram showing the corrected arrangement of the inspection region 13c. The arrangement determination unit 36 corrects the coordinates of the inspection region 13c so that the inspection region 13c located at the end is located further inward than the outer periphery of the front surface 11a.

For example, the arrangement determination unit 36 sets the interval in the CH1 direction between the five inspection regions 13c located between one end and the center in the CH2 direction and the five inspection regions 13c located between the other end and the center in the CH2 direction to a first interval narrower than that in FIG. 7(A) .

Furthermore, the configuration determination unit 36 sets the interval in the CH1 direction between the five inspection regions 13c located at one end in the CH2 direction and the five inspection regions 13c located at the other end in the CH2 direction to a second interval narrower than the first interval. In the modified example of FIG. 7(B), although the interval in the CH1 direction is narrowed, the interval in the CH2 direction may be narrowed instead.

In this way, the arrangement determination unit 36 corrects the arrangement of the inspection areas 13 c according to the number of inspection areas 13 c designated by the operator, thereby preventing the imaging unit 24 from acquiring an image outside the periphery of the wafer 11 .

In addition, the structure and method of the above-mentioned embodiment can be appropriately changed and implemented without departing from the scope of the purpose of the present invention. For example, the cutting groove 13a and the laser processing groove are not limited to the groove formed by cutting (that is, completely cutting) the wafer 11, but can also be a half-cut groove by partially removing the wafer 11.

2: Cutting device (processing device) 4: Operation panel 6: Display (display unit) 8: Cassette 10: Cassette table 12: Cassette elevator 14: Push-pull arm 16: Positioning member 18: First conveying unit 20: Chuck table 20a: Holding surface 20b: Clamp unit 22: Processing feed unit 24: Imaging unit 26: Cutting unit (processing unit) 26a: Cutting blade 28: Second conveying unit 30: Rotary cleaning unit 32: Control unit 34: Control unit 36: Configuration determination unit 38: Report generation unit 40: Laser processing device (processing device) 42: Laser beam irradiation unit (processing unit) 42a: Housing 42b: Head 11: Wafer 11a: Front surface 11b: Back surface 13: Predetermined dividing line 13a, 13a ₁ , 13a ₂ : cutting groove 13b: chipping 13c: inspection area 15: component 17: cutting film 19: frame 21: frame unit A, B, C, D, E, F, G: inspection area (range)

FIG. 1 is a perspective view of a cutting device. FIG. 2 is a perspective view of a frame unit. FIG. 3 is a view showing a state of photographing the front side of a wafer. FIG. 4 is a view showing each inspection area. FIG. 5 shows an image of an example of a report. FIG. 6 is a perspective view of a laser processing device of a second embodiment. FIG. 7 (A) is a view showing an example in which an inspection area located at an end is located outside the periphery of a wafer; and FIG. 7 (B) is a view showing the configuration of the inspection area after correction.

A,B,C,D,E,F,G: Inspection area (range)

Claims (6)

A processing device processes a wafer having components formed in a plurality of regions, wherein the regions are divided by a plurality of predetermined dividing lines set on the front side, and is characterized in that the processing device comprises: a cassette stage, which carries a cassette containing a plurality of wafers; a chuck stage, which holds wafers removed from the cassette mounted on the cassette stage; a processing unit, which performs processing on regions of the wafer held on the chuck stage corresponding to the predetermined dividing lines; a processing feed unit, which processes and feeds the chuck stage and the processing unit relative to each other; an imaging unit, which photographs the wafer held on the chuck stage; and a control unit, which controls the processing unit, the processing feed unit and the imaging unit, and the control unit comprises: ... After the work unit processes all the areas of the wafer held by the chuck table corresponding to the predetermined splitting line, the chuck table is positioned directly below the imaging unit by operating the processing feed unit and moving the chuck table relatively, and the imaging unit photographs the wafer; and a report preparation unit, which derives information about the processing status of each area based on the images obtained by individually photographing two or more different areas among all the areas corresponding to the predetermined splitting line on which the work has been performed, and prepares a report recording the information and the image. In the case of specifying the number of the two or more different areas photographed by the imaging unit, the control unit further includes: a configuration determination unit, which determines the configuration of the two or more different areas. The processing device of claim 1, wherein the report production unit produces the report for the wafer that is processed first among the multiple wafers contained in the cassette. A processing device as claimed in claim 1 or 2, wherein the information about the processing state includes: the width of the groove formed in the area corresponding to the predetermined dividing line, the state of the chipping formed in the groove, and the offset of the groove from the center line of the predetermined dividing line. The processing device of claim 1 or 2, further comprising: a display unit that displays the content of the report. The processing device of claim 1 or 2, wherein the configuration determination unit configures the regions in the first direction and the second direction orthogonal to each other in the front face according to the number of the designated regions, sets the intervals of the regions in the second direction to be equal intervals, and adjusts the intervals of the regions in the first direction by configuring the plurality of regions at equal intervals within the width of the front face in the first direction passing through the predetermined position of the second direction. A processing device as claimed in claim 1 or 2, wherein the processing unit is any one of a cutting unit and a laser beam irradiation unit, the cutting unit is rotatably provided with a cutting blade, and the laser beam irradiation unit is provided with a condenser for focusing the laser beam.