TWI867098B - Processing equipment - Google Patents

Abstract

[Topic] Provide a processing device that allows an operator to confirm whether a groove formed on the back side of a workpiece is formed along a predetermined dividing line set on the front side of the workpiece. [Solution] A processing device is provided, comprising: a holding workbench having a predetermined area formed from one side to the other side with a transparent material; a processing unit for processing a workpiece; a first photographing unit disposed above the holding workbench; a second photographing unit disposed below the holding workbench; a display unit; and a control unit including a memory unit, wherein the memory unit stores position information of a predetermined pattern, the predetermined pattern being included in an image of the front side obtained by photographing the workpiece held by one side of the holding workbench on the front side with the second photographing unit, and the control unit causes the predetermined pattern included in the second area on the front side corresponding to the first area on the back side of the workpiece in the thickness direction of the workpiece to be overlapped with the image of the first area and displayed on the display unit.

Description

Processing equipment

The present invention relates to a processing device for processing the back side of a workpiece while maintaining the front side of the workpiece having a predetermined shape formed on the front side.

Semiconductor device chips used in electric devices such as mobile phones and personal computers are manufactured by processing a disk-shaped wafer (workpiece) formed of semiconductor materials such as silicon. A plurality of predetermined dividing lines are set on the front side of the workpiece, and devices such as IC (Integrated Circuit), LSI (Large Scale Integration), and MEMS (Micro Electro Mechanical Systems) are formed in each area divided by the plurality of predetermined dividing lines.

In order to manufacture a device wafer from a workpiece, the workpiece may be thinned to a predetermined thickness by grinding the back side of the workpiece, and then the workpiece may be cut along each predetermined dividing line to divide the workpiece into device units to manufacture a device wafer.

In the cutting step of cutting the workpiece, a cutting device is used. The cutting device has a cutting unit with a cutting blade installed at one end of the spindle, and a holding table that attracts and holds the workpiece. In the usual cutting step, the front side of the workpiece is first set upward, and the back side of the workpiece is attracted and held by the holding table.

After holding the back side, calibration can be performed by photographing the front side of the workpiece with a camera installed above the holding table. During calibration, a camera with a photographing element is used, and the photographing element is a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor that photographs the object with visible light.

Calibration such as position correction of the workpiece can be performed based on the result of photographing the front side of the workpiece with calibration marks formed on it with this camera. After calibration, the workpiece is cut along each predetermined dividing line with a cutting blade.

However, in recent years, with the diversification of devices, the workpiece is sometimes cut from the back side of the workpiece (see, for example, Patent Document 1). At this time, since the front side of the workpiece is arranged downward and held by a holding table, even if the back side of the workpiece is photographed with the above-mentioned camera set above the holding table, the calibration mark, etc. cannot be photographed.

Therefore, a cutting device has been developed, which has a holding table formed of a material transparent to visible light and a camera for visible light arranged below the holding table (see, for example, Patent Document 2). By using this cutting device, the front side of the workpiece can be photographed from below the holding table while the front side of the workpiece is held by the holding table. Therefore, calibration can be performed even when the back side of the workpiece is set upward and the front side of the workpiece is held by the holding table.

Prior art literature Patent Literature

Patent document 1: Japanese Patent Publication No. 2006-140341

Patent document 2: Japanese Patent Publication No. 2010-87141

However, even when a cutting device is used in which the above-mentioned camera is arranged below the holding table, it may be impossible to confirm whether the cutting groove formed on the workpiece is formed along the predetermined dividing line.

For example, when a cutting groove (i.e., a half-cut groove) is formed locally to remove the workpiece from the back side of the workpiece to a predetermined depth that does not reach the front side of the workpiece, the operator cannot confirm whether the cutting groove is formed along the predetermined dividing line set on the front side.

The present invention is made in view of the above-mentioned problems, and its purpose is to provide a processing device that allows the operator to confirm whether the groove formed on the back side of the workpiece is formed along the predetermined dividing line set on the front side of the workpiece.

According to one aspect of the present invention, a processing device can be provided, which comprises: a plate-shaped holding workbench, including one side and another side located on the opposite side of the one side, and having a predetermined area formed by a transparent material from the one side to the other side; a processing unit, which uses the one side of the holding workbench to hold the front side of a workpiece having a predetermined shape on the front side, and processes the workpiece in a state where the back side of the workpiece is exposed upward; a first shooting unit, which is arranged above the holding workbench to face the one side; and a second shooting unit, which is arranged below the holding workbench to face the other side. ; a display unit that displays an image obtained by at least one of the first shooting unit and the second shooting unit; and a control unit that includes a memory unit that stores position information of the predetermined pattern, the predetermined pattern included in the image of the front side obtained by shooting the workpiece whose front side is held by the one side of the holding table with the second shooting unit, and the control unit causes the predetermined pattern included in the second area of the front side corresponding to the first area of the back side of the workpiece in the thickness direction of the workpiece to be overlapped with the image of the first area and displayed on the display unit.

Preferably, the image of the first area displayed on the display unit includes an area showing the processing groove formed by the processing unit, and the control unit causes the predetermined pattern in the second area to be displayed on the image of the first area including the area showing the processing groove.

Furthermore, preferably, the display unit displays the image of the second area, and the image of the first area includes an area showing the processing groove formed by the processing unit, and the control unit causes at least the area showing the processing groove of the image of the first area to be displayed on the image of the second area.

Furthermore, preferably, the control unit sets the direction of the X-axis direction and the Y-axis direction to be the same on the image of the first area and the image of the second area, so that the image of the first area and the image of the second area are overlapped and displayed on the display unit.

Furthermore, it is preferred that the processing unit is a cutting unit equipped with a cutting blade, or a laser irradiation unit irradiating a laser beam.

The holding table of the processing device of one embodiment of the present invention has a predetermined area formed by a transparent material from one side to the other side. Above the holding table, the first shooting unit is set to face one side of the holding table, and below the holding table, the second shooting unit is set to face the other side of the holding table.

The control unit includes a memory unit, and the position information of the predetermined pattern is stored in the memory unit, and the predetermined pattern is included in the front side image obtained by photographing the workpiece held by one side of the worktable held on the front side with the second photographing unit.

In addition, the control unit causes the predetermined pattern contained in the second area on the front side of the first area corresponding to the back side of the workpiece in the thickness direction of the workpiece to be displayed on the display unit by overlapping the image of the first area. Therefore, the operator can confirm whether the groove formed in the workpiece is formed along the predetermined dividing line.

2: Cutting device (processing device)

4: Base

4a,4b,4d: Opening

4c: Support structure

6: Film box

10: Keep the workbench

11: Object to be processed

11a: Front

11b: Back

11c: Groove (processing groove)

12: Maintain components

12a: One side

12b: The other side

12c ₁ : First attraction path

12c ₂ : Second attraction path

12c ₃ : Intersection

12d: Opening

12e: Peripheral attraction path

12f: Attraction Road

13: Split the predetermined line

14: Attraction source

15: Devices

16: Frame

16a: Opening

16b: Pulley part

17: Tape

18: X-axis moving table

18a: Base plate

18b: Side panels

18c: Top plate

18d: Space

19: Framework

20: X-axis guide rail

20a: X-axis linear scale

21: Processing unit

22: X-axis ball screw

24: X-axis pulse motor

26: X-axis moving mechanism

28: Conveyor belt

30: Rotation drive source

30a: Pulley

32: Y-axis moving mechanism

34:Y-axis guide rail

36: Y-axis moving worktable

38: Y-axis ball screw

40:Y-axis pulse motor

42: Z-axis moving mechanism

42a: Support structure

44: Z-axis guide rail

46: Z-axis moving plate

48: Z-axis ball screw

50: Z-axis pulse motor

52: Support arm

54: Lower camera unit (second camera unit)

56: Low magnification camera

56a: Lighting device

58: High magnification camera

58a: Lighting device

60: Processing unit moving mechanism

62:Y-axis guide rail

64: Y-axis moving plate

66: Y-axis ball screw

68:Y-axis pulse motor

70: Z-axis moving plate

72: Z-axis guide rail

74: Z-axis ball screw

76: Z-axis pulse motor

78: Cutting unit (processing unit)

80: Spindle housing

82a: Main axis

82b: Cutting blade

84: Upper shooting unit (first shooting unit)

86: Washing unit

88: Clean the workbench

90: Nozzle

92: Touch panel (display unit)

94: Control Department

96: Memory Department

98:Mark

100: Circuit

102,102a:Image

104: Laser processing device (processing device)

106: Static abutment

108: Y-axis moving worktable

110:Y-axis guide rail

110a: Y-axis scale

112: Y-axis ball screw

114:Y-axis pulse motor

116: Y-axis moving mechanism

118: Pillar

120: Shell

122: Laser irradiation unit (processing unit)

124: Irradiation head

A: Area

B,C,D: Corners

+X,-X,+Y,-Y,+Z,-Z: Direction

S10: Loading step

S20: Keep step

S30: Teaching steps

S40: Calibration step

S50: Image acquisition step

S60: Memory step

S70: Cutting step

S80: Back display steps

Figure 1 is a three-dimensional diagram of the cutting device.

Figure 2 is a three-dimensional diagram of the workpiece unit.

Figure 3 is a three-dimensional diagram of the workbench, etc.

Figure 4 is a partial cross-sectional side view of the holding table, etc.

Figure 5 is an enlarged view of area A in Figure 4.

Figure 6 is an enlarged three-dimensional diagram of the Z-axis moving mechanism, etc.

Figure 7 is a diagram showing the cutting steps.

Figure 8 is a diagram showing the back display step.

Figure 9(A) is an example of an image of the first area, and Figure 9(B) is an example of an image of the second area.

Figure 10 is an example of an image displayed in the back display step.

FIG. 11 is another example of an image displayed in the back display step.

Figure 12 is a three-dimensional diagram of the laser processing device.

The form used to implement the invention

Referring to the attached drawings, an embodiment of the present invention is described. FIG. 1 is a perspective view of a cutting device 2 of the first embodiment. Furthermore, in FIG. 1, a part of the components is shown as a functional block diagram. In addition, the X-axis direction (machining feed direction), Y-axis direction (indexing feed direction) and Z-axis direction (lead vertical direction, cutting feed direction) used in the following description are perpendicular to each other.

The cutting device (processing device) 2 has a base 4 that supports each component. An opening 4a is formed at the front corner (+Y direction) of the base 4, and a film cassette elevator (not shown) is arranged in the opening 4a. A film cassette 6 for accommodating a plurality of workpieces 11 (see FIG. 2) can be placed on the upper surface of the film cassette elevator.

In FIG. 1 , for the sake of convenience, only the outline of the cassette 6 is shown. The workpiece 11 is a disc-shaped wafer formed of a semiconductor material such as silicon. However, there is no limitation on the material, shape, structure, size, etc. of the workpiece 11. For example, a substrate formed of other semiconductor, ceramic, resin, metal, etc. materials can also be used as the workpiece 11.

As shown in FIG2 , the front side 11a of the workpiece 11 is divided into a plurality of regions by a plurality of intersecting predetermined dividing lines (cutting paths) 13. In each region on the front side 11a, components 15 such as IC (Integrated Circuit), calibration marks (mark 98 in FIG9 (B)), etc. are formed. However, there are no restrictions on the type, quantity, shape, structure, size, and configuration of the components 15. The workpiece 11 may not have components 15 formed thereon.

A tape (cutting tape) 17 having a larger diameter than the object 11 is attached to the front side 11a of the object 11. The tape 17 is formed of a transparent material that can transmit visible light. The tape 17 has a layered structure such as a base layer and an adhesive layer (paste layer).

The base layer is formed of, for example, polyolefin (PO). The adhesive layer is formed of an adhesive resin such as an ultraviolet (UV) curable acrylic resin. The adhesive layer side of the tape 17 is attached to the front side 11a.

A ring-shaped frame 19 formed of metal is attached and fixed to the outer periphery of the tape 17. In this way, the workpiece 11 is accommodated in the cassette 6 in the state of the workpiece unit 21 supported by the frame 19 through the tape 17. Figure 2 is a three-dimensional view of the workpiece unit 21.

As shown in FIG1 , an opening 4b that is longer in the X-axis direction is formed behind the opening 4a (-Y direction). A holding table (work clamping table) 10 is arranged at the opening 4b. On the outer periphery of the holding table 10, a ring-shaped frame suction plate (not shown) with suction ports discretely formed in the circumferential direction is provided.

Here, referring to Figures 3 to 5, the holding table 10, etc. is described in more detail. Figure 3 is a three-dimensional view of the holding table 10, etc., and Figure 4 is a partial cross-sectional side view of the holding table 10, etc. However, in Figure 4, the section line is omitted for convenience. Figure 5 is an enlarged view of area A in Figure 4. In Figure 5, a part of the constituent elements is shown as a functional block diagram.

The holding table 10 has a disc-shaped (plate-shaped) holding member 12. The holding member 12 includes a substantially flat surface 12a and another surface 12b located on the opposite side of the surface 12a (see FIG. 5 ). The holding member 12 is formed of a transparent material that can transmit visible light, such as sodium glass, borosilicate glass, quartz glass, etc.

A plurality of flow paths are formed inside the holding member 12. Inside the holding member 12 of the present embodiment, a straight first suction path 12c ₁ is formed in a manner that crosses the center axis of the disk when the holding member 12 is viewed from the Z axis direction. In addition, a straight second suction path 12c ₂ is formed in a manner that is orthogonal to the first suction path 12c ₁ in the XY plane direction.

The first suction passage _12c1 and the second suction passage _12c2 intersect and are connected to each other at the intersection _12c3 located at the central axis of the disk. A plurality of openings 12d are formed on the outer periphery of one surface 12a in a manner separated from each other in the circumferential direction. Each opening 12d is formed from one surface 12a to a predetermined depth that does not reach the other surface 12b.

Openings 12d are formed at both ends of the first suction passage _12c1 and both ends of the second suction passage _12c2 . The openings 12d are connected in the circumferential direction by an outer peripheral suction passage 12e formed at a predetermined depth on the outer peripheral portion of the holding member 12.

A suction path 12f extending in the radial direction of the holding member 12 is formed on the outer peripheral side of the opening 12d, and a suction source 14 such as an ejector is connected to the suction path 12f (see FIG. 5 ). When the suction source 14 is operated to generate negative pressure, negative pressure is generated in the opening 12d. Therefore, one side 12a functions as a holding surface for attracting and holding the workpiece unit 21 (workpiece 11).

However, a part of the incident light is scattered or reflected on the flow path of the holding member 12 such as the first suction path 12c ₁ , the second suction path 12c ₂ , the opening 12d, the peripheral suction path 12e, and the suction path 12f. Therefore, the flow path of the holding member 12 is not completely transparent to visible light when viewed from one surface 12a or the other surface 12b, but may be translucent or opaque.

However, the predetermined area excluding the flow path of the holding member 12 is transparent from one side 12a to the other side 12b. Specifically, the transparent area from one side 12a to the other side 12b is divided into four by the first suction path _12c1 and the second suction path _12c2 , and is located further inside the peripheral suction path 12e in the radial direction of the holding member 12.

A cylindrical frame 16 made of a metal material such as stainless steel is provided on the outer periphery of the retaining member 12. An opening 16a (see FIG. 5 ) is formed on the upper portion of the frame 16, and the retaining member 12 is configured to block the opening 16a.

As shown in Figures 3 and 4, the frame 16 is supported by the X-axis moving table 18. The X-axis moving table 18 includes a bottom plate 18a having a rectangular shape when viewed from the Z-axis direction. The lower end of the side plate 18b having a rectangular shape when viewed from the Y-axis direction is connected to one end in front of the bottom plate 18a (in the +Y direction).

The upper end of the side plate 18b is connected to the front end of the top plate 18c, which is a rectangular shape similar to the bottom plate 18a when viewed from the Z axis direction. A space 18d is formed between the bottom plate 18a and the top plate 18c, which is open to one end toward the rear (-Y direction) and both ends in the X axis direction.

A pair of X-axis guide rails 20 are provided below the bottom plate 18a (-Z direction) so that the bottom plate 18a can slide. The pair of X-axis guide rails 20 are fixed to the upper surface of a stationary base (not shown).

An X-axis linear scale 20a is provided adjacent to the X-axis guide rail 20 and can be used to detect the position of the X-axis moving table 18 in the X-axis direction. In addition, a reading head (not shown) is provided on the lower surface of the X-axis moving table 18.

When the X-axis moving table 18 moves, the scale of the X-axis linear scale 20a can be detected by a reading head to calculate the position (coordinate) of the X-axis moving table 18 in the X-axis direction or the amount of movement in the X-axis direction.

A nut portion (not shown) is provided on the lower surface of the bottom plate 18a of the X-axis moving worktable 18, and an X-axis ball screw 22 roughly parallel to the X-axis guide rail 20 is rotatably connected to the nut portion.

An X-axis pulse motor 24 is connected to one end of the X-axis ball screw 22. As long as the X-axis pulse motor 24 rotates the X-axis ball screw 22, the X-axis moving table 18 can move in the X-axis direction along the X-axis guide rail 20. The X-axis guide rail 20, the X-axis ball screw 22, the X-axis pulse motor 24, etc. constitute the X-axis moving mechanism 26 that moves the X-axis moving table 18.

On the upper surface side of the top plate 18c of the X-axis moving table 18, the frame 16 is supported on the top plate 18c in a manner that it can rotate around a rotation axis that is roughly parallel to the Z-axis direction. The frame 16 includes a cylindrical side surface, that is, a pulley portion 16b. When the frame 16 is supported by the X-axis moving table 18, the pulley portion 16b is located above the top plate 18c.

A rotational drive source 30 such as a motor is provided on the side plate 18b of the X-axis moving table 18. A pulley 30a is provided on the rotating shaft of the rotational drive source 30. A rotating endless conveyor belt (conveyor belt 28) is hung on the pulley 30a and the pulley portion 16b.

If the rotary drive source 30 is operated to rotate the pulley 30a, the frame 16 will rotate around the rotation axis roughly parallel to the Z-axis direction by the force transmitted through the conveyor belt 28. By controlling the rotation of the pulley 30a, the holding table 10 can be rotated around the rotation axis to an arbitrary angle.

A Y-axis moving mechanism 32 is provided on the extension line of the X-axis direction of the X-axis moving mechanism 26. The Y-axis moving mechanism 32 has a pair of Y-axis guide rails 34 roughly parallel to the Y-axis direction. The pair of Y-axis guide rails 34 are fixed to the upper surface of the stationary base (not shown).

A Y-axis moving table 36 is slidably mounted on the Y-axis guide rail 34. A nut portion (not shown) is provided on the lower surface of the Y-axis moving table 36, and a Y-axis ball screw 38 roughly parallel to the Y-axis guide rail 34 is rotatably connected to the nut portion.

A Y-axis pulse motor 40 is connected to one end of the Y-axis ball screw 38. As long as the Y-axis pulse motor 40 rotates the Y-axis ball screw 38, the Y-axis moving table 36 moves along the Y-axis guide rail 34 in the Y-axis direction.

A Y-axis linear scale (not shown) is provided adjacent to the Y-axis guide rail 34 and can be used to detect the position of the Y-axis moving table 36 in the Y-axis direction. In addition, a reading head (not shown) is provided on the lower surface of the Y-axis moving table 36.

When the Y-axis moving table 36 moves, the Y-axis position (coordinate) or the Y-axis movement amount of the Y-axis moving table 36 can be calculated by detecting the scale of the Y-axis linear scale with a reading head.

A Z-axis moving mechanism 42 is provided on the upper surface of the Y-axis moving table 36. FIG. 6 is an enlarged three-dimensional view of the Z-axis moving mechanism 42, etc. The Z-axis moving mechanism 42 has a supporting structure 42a fixed to the upper surface of the Y-axis moving table 36.

A pair of Z-axis guide rails 44 roughly parallel to the Z-axis direction are fixed on the side surface of the X-axis moving worktable 18 of the support structure 42a. A Z-axis moving plate 46 is slidably mounted on the Z-axis guide rails 44.

A nut portion (not shown) is provided on the side of the Z-axis guide rail 44 on the side of the Z-axis moving plate 46, and a Z-axis ball screw 48 roughly parallel to the Z-axis guide rail 44 is rotatably connected to the nut portion.

A Z-axis pulse motor 50 is connected to one end of the Z-axis ball screw 48. As long as the Z-axis pulse motor 50 rotates the Z-axis ball screw 48, the Z-axis moving plate 46 moves along the Z-axis guide rail 44 in the Z-axis direction.

A Z-axis linear scale (not shown) is provided adjacent to the Z-axis guide rail 44, and a reading head (not shown) is provided on the Z-axis guide rail 44 side of the Z-axis moving plate 46. When the Z-axis moving plate 46 moves, the reading head can be used to detect the scale of the Z-axis linear scale and calculate the position (coordinates) of the Z-axis moving plate 46 in the Z-axis direction.

On the Z-axis moving plate 46, a lower photographing unit (second photographing unit) 54 is fixed via a supporting arm 52 that is longer in the X-axis direction. The lower photographing unit 54 of this embodiment is arranged below the holding table 10 and includes a low-magnification camera 56 and a high-magnification camera 58. The low-magnification camera 56 and the high-magnification camera 58 each have a photographing lens and the like arranged to face the other surface 12b of the holding member 12.

However, the lower shooting unit 54 may not have two cameras, the low-magnification camera 56 and the high-magnification camera 58. The lower shooting unit 54 may also have only one camera with a predetermined magnification.

Each of the low-magnification camera 56 and the high-magnification camera 58 has a predetermined optical system and a photographing element such as a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor.

On the side of the low-magnification camera 56, there is an illumination device 56a that can illuminate the object (such as the object 11) located above with visible light. Similarly, on the side of the high-magnification camera 58, there is also an illumination device 58a.

When the lower shooting unit 54 is used to shoot the object, the X-axis moving table 18 is moved toward the Y-axis moving table 36, and the lower shooting unit 54 is arranged in the space 18d. In this way, the object 11 arranged on the side 12a of the holding member 12 can be photographed from below.

Next, returning to Figure 1, the other components of the cutting device 2 are described. On the left (+X direction) and right (-X direction) of the top plate 18c of the X-axis moving table 18, a retractable bellows-shaped dust and drip-proof cover is installed to cover the opening 4b.

Above the opening 4b, a door-shaped support structure 4c is provided in a manner that spans the opening 4b. Two processing unit moving mechanisms (indexing feed unit, cutting feed unit) 60 are provided on one side of the side of the support structure 4c that faces the opening 4a.

Each processing unit moving mechanism 60 is fixed to a side surface of the supporting structure 4c and has a pair of Y-axis guide rails 62 roughly parallel to the Y-axis direction. Two Y-axis moving plates 64 are installed on the Y-axis guide rails 62 so as to slide independently of each other.

A nut portion (not shown) is provided on one side of the Y-axis moving plate 64 located on the supporting structure 4c side, and a Y-axis ball screw 66 roughly parallel to the Y-axis guide rail 62 is rotatably connected to the nut portion. Furthermore, the nut portion of the Y-axis moving plate 64 located on the front side and the nut portion of the Y-axis moving plate 64 located on the rear side are respectively connected to different Y-axis ball screws 66.

A Y-axis pulse motor 68 is connected to one end of each Y-axis ball screw 66. As long as the Y-axis pulse motor 68 rotates the Y-axis ball screw 66, the Y-axis moving plate 64 moves in the Y-axis direction along the Y-axis guide rail 62.

On the other side of each Y-axis moving plate 64, which is located on the opposite side to the supporting structure 4c, a pair of Z-axis guide rails 72 are respectively provided in a direction roughly parallel to the Z-axis direction. The Z-axis moving plate 70 is slidably mounted on the Z-axis guide rails 72.

A nut portion (not shown) is provided on one side of the Z-axis moving plate 70 located on the supporting structure 4c side, and a Z-axis ball screw 74 parallel to the Z-axis guide rail 72 is rotatably connected to the nut portion.

A Z-axis pulse motor 76 is connected to one end of the Z-axis ball screw 74. As long as the Z-axis pulse motor 76 rotates the Z-axis ball screw 74, the Z-axis moving plate 70 moves along the Z-axis guide rail 72 in the Z-axis direction.

A cutting unit (processing unit) 78 is provided at the lower part of the Z-axis moving plate 70. The cutting unit 78 has a cylindrical spindle housing 80. A part of a cylindrical spindle 82a (see FIG. 7 ) is rotatably accommodated in the spindle housing 80.

A rotation drive mechanism (not shown) such as a servo motor that rotates the spindle 82a is connected to one end of the spindle 82a. In addition, a cutting blade 82b having a circular cutting edge is installed at the other end of the spindle 82a.

At the lower part of the Z-axis moving plate 70, an upper photographing unit (first photographing unit) 84 is connected in a state adjacent to the cutting unit 78. The upper photographing unit 84 is located above the holding table 10, and the photographing lens and the like are arranged to face the one side 12a of the holding member 12. The upper photographing unit 84 has a predetermined optical system for photographing the workpiece 11 from above, and photographing elements such as a CCD image sensor or a CMOS image sensor.

An opening 4d is provided at a position opposite to the opening 4b and on the opposite side to the opening 4a. A cleaning unit 86 for cleaning the workpiece 11 after cutting is provided in the opening 4d. The cleaning unit 86 includes a cleaning table 88 for holding the workpiece 11 and a nozzle 90 with a nozzle disposed facing the cleaning table 88.

A box (not shown) is provided on the base 4, and a touch panel (display unit) 92 serving as both an input device and a display device is provided on the front side of the box. The touch panel 92 can display images captured by the lower shooting unit 54 and the upper shooting unit 84, processing conditions, GUI (Graphical User Interface) buttons, etc.

The cutting device 2 is equipped with a control unit 94. The control unit 94 controls the suction source 14, the X-axis moving mechanism 26, the rotation drive source 30, the Y-axis moving mechanism 32, the Z-axis moving mechanism 42, the lower shooting unit 54, the processing unit moving mechanism 60, the upper shooting unit 84, the cutting unit 78, the touch panel 92, etc.

The control unit 94 is composed of a computer including a processing device such as a CPU (Central Processing Unit), a main memory device such as a DRAM (Dynamic Random Access Memory), and an auxiliary memory device such as a flash memory and a hard disk drive. The functions of the control unit 94 can be realized by operating the processing device and the like according to the software stored in the auxiliary memory device.

A part of the auxiliary memory device functions as a memory unit 96. The memory unit 96 stores image processing software such as pattern matching. For example, the image processing software can be used to extract a predetermined pattern formed on the front side 11a from an image of the front side 11a captured by the lower shooting unit 54.

The predetermined pattern is, for example, the outline of the predetermined dividing line 13, the device 15, the mark 98, and the circuit 100 (see FIG. 9(B) etc.). Furthermore, the mark 98 is sometimes also referred to as a calibration mark, a main pattern, a target pattern, etc.

Next, the processing method of the workpiece 11 is described using Figures 7 to 10. First, the workpiece unit 21 is placed on one side 12a of the holding table 10 with the back side 11b exposed upward (placement step S10).

After the loading step S10, the suction source 14 is operated to hold the front side 11a of the workpiece 11 with one surface 12a through the tape 17, and the frame 19 is held with the frame suction plate (not shown) (holding step S20). After the holding step S20, the teaching step S30 is performed.

In the teaching step S30, for example, the front side 11a is displayed on the touch panel 92 using the lower camera unit 54, so that the operator can search for the mark 98 on the front side 11a (see FIG. 9 (B) etc.).

After the operator finds any mark 98, the operator obtains an image of the front side 11a including the mark 98 with the bottom shooting unit 54. The shape and coordinates of the mark 98 can be stored in the memory unit 96 as a template for pattern matching. In addition, the distance between the mark 98 and the center line of the predetermined dividing line 13 calculated using the coordinates of the mark 98 and the predetermined dividing line 13 can be stored in the memory unit 96.

In addition, the distance between two adjacent predetermined dividing lines 13 in the Y-axis direction (cutting path spacing) calculated using the coordinates of the mark 98 can also be stored in the memory unit 96. Furthermore, each stored coordinate is an XY coordinate with the above-mentioned intersection 12c3 as the origin.

After the teaching step S30, the workpiece 11 is calibrated (calibration step S40). In the calibration step S40, the lower shooting unit 54 is first used to obtain images of the front side 11a at multiple locations separated from each other on a predetermined dividing line 13 along the X-axis direction.

Furthermore, in the images of the front side 11a obtained at multiple locations, the same pattern as the mark 98 stored as a template can be detected by predetermined processing such as pattern matching. Based on the same pattern as the detected mark 98, the deviation of the predetermined dividing line 13 in the θ direction around the central axis of the retaining member 12 can be identified.

Afterwards, by operating the rotation drive source 30, the conveyor belt 28 rotates by a predetermined amount to correct the deviation of the holding member 12 in the θ direction. In this way, the predetermined dividing line 13 is positioned to be roughly parallel to the X-axis direction. Furthermore, in the calibration step S40, predetermined processing and operations other than the correction in the θ direction can also be performed.

After the calibration step S40, the image of the front side 11a is obtained by photographing the front side 11a of the workpiece 11 held by the holding table 10 with the lower photographing unit 54 (image acquisition step S50).

In the image acquisition step S50, the X-axis moving mechanism 26, the Y-axis moving mechanism 32, etc. are used to adjust the relative position of the holding table 10 and the lower shooting unit 54 while shooting the front side 11a. However, in the image acquisition step S50, the entire front side 11a may not be shot.

That is, it is also possible to obtain only the overall image of the device area or the image of the area including the mark 98 in the device area, from the device area where the device 15 is formed and the peripheral remaining area surrounding the device area. If the shooting area is set to be limited, the time required for the image acquisition step S50 can be shortened.

After the image acquisition step S50, the control unit 94 first performs image processing and detects the edge of the acquired image. Then, the control unit 94 calculates the geometric shape specified by the edge and the degree of consistency with the pre-registered geometric shape through predetermined processing such as pattern matching, thereby extracting the predetermined pattern formed on the front side 11a.

The extracted predetermined pattern, the position information of the predetermined pattern, etc. can be stored in the memory unit 96 (storage step S60). For example, when the marker 98 shown in FIG. 9 (B) is used as the predetermined pattern, the shape of the marker 98 and the coordinates of the corners B, C, D, etc. of the marker 98 located on the side of the predetermined dividing line 13 can be stored in the memory unit 96.

At this time, the coordinates of at least one of the predetermined dividing line 13, the device 15, and the circuit 100 that have been predetermined to have a relative positional relationship with respect to the mark 98 can also be stored in the memory unit.

The image of the front side 11a is stored in the storage unit 96 in the storage step S60 in a state where the X and Y axis directions are the same as when viewed from the back side 11b (i.e., when the workpiece 11 is viewed from the top surface).

Furthermore, in order to set the X and Y axis directions of the image on the front side 11a to the same direction as the image on the back side 11b, for example, the control unit 94 can perform a predetermined coordinate conversion (for example, a mirror conversion that flips the image relative to the X axis) on the image on the front side 11a. The predetermined coordinate conversion can be performed by, for example, predetermined software that has been stored in the control unit 94.

Furthermore, instead of performing the predetermined coordinate conversion, the front side 11a can be photographed through a mirror that is tilted 45 degrees relative to the X-axis in the XZ plane to obtain an image of the front side 11a that has been mirror-converted relative to the X-axis.

In the present embodiment in which the photographing lens (not shown) of the lower photographing unit 54 is arranged to face the other surface 12b, a mirror surface tilted 45 degrees relative to the X-axis in the XZ plane can be arranged at a predetermined position between the photographing lens of the lower photographing unit 54 and the photographing element (not shown). Alternatively, the tilted mirror surface can be arranged between a cover glass (not shown) arranged to face the other surface 12b and a photographing lens arranged with the optical axis along the X-axis direction.

Furthermore, the mirror surface that is tilted 45 degrees relative to the X-axis in the XZ plane can also be set outside the lower shooting unit 54 in a state where the position relative to the lower shooting unit 54 has been fixed. In this case, the optical axis of the shooting lens of the lower shooting unit 54 is set along the X-axis direction in a manner facing the mirror surface.

Any XY coordinate position on the front side 11a can specify the intersection 12c ₃ as the origin of the coordinate system, and any XY coordinate position on the back side 11b can specify the intersection 12c ₃ as the origin of the coordinate system. Therefore, the second area on the front side 11a corresponding to the first area on the back side 11b can be specified.

After the memory step S60, the workpiece 11 is cut (cutting step S70). FIG. 7 is a diagram showing the cutting step S70. In the cutting step S70, the high-speed rotating cutting blade 82b is first positioned on the extension line of the predetermined dividing line 13. At this time, the lower end of the cutting blade 82b is positioned between the front side 11a and the back side 11b of the workpiece 11.

Furthermore, the X-axis moving mechanism 26 is used to move the holding table 10 and the cutting blade 82b relative to each other along the X-axis direction. Thus, the cutting blade 82b can partially cut (process) the workpiece 11 from the back side 11b to a predetermined depth that does not reach the front side 11a in the thickness direction of the workpiece 11 (i.e., perform a half cut), and form a groove (processing groove) 11c along the predetermined dividing line 13.

Furthermore, the cutting in the cutting step S70 is not limited to half cutting. In the cutting step S70, the workpiece 11 can also be cut from the back surface 11b to the front surface 11a (i.e., full cut).

The workpiece 11 is cut along a predetermined dividing line 13 parallel to the X-axis direction. The cutting unit 78 is then indexed to position the cutting blade 82b on the extension line of the adjacent predetermined dividing line 13 in the Y-axis direction. Then, the workpiece 11 is cut along the predetermined dividing line 13 in the same manner.

After cutting an arbitrary number of predetermined dividing lines 13, the operator uses the upper camera unit 84 to obtain an image of the back side 11b and displays it on the touch panel 92 (back side display step S80).

FIG8 is a diagram showing the back display step S80. In FIG8, the control unit 94 and the like are displayed as a functional block diagram. Furthermore, the lower shooting unit 54 will retreat outside the space 18d of the X-axis moving table 18.

In the back display step S80 of the present embodiment, the control unit 94 displays a predetermined pattern including a mark 98 of the second area on the front 11a side corresponding to the first area on the back 11b side in the thickness direction of the workpiece 11, superimposed on the image of the first area, on the touch panel 92.

FIG9(A) is an example of an image of the first area on the back side 11b. In FIG9(A), the area showing the groove 11c formed on the back side 11b is displayed as a black area. FIG9(B) is an example of an image of the second area on the front side 11a corresponding to the first area on the back side 11b.

FIG9(B) shows the outlines of the display device 15, the predetermined dividing line 13, the mark 98, and the circuit 100. Furthermore, as mentioned above, the directions of the X and Y axis directions of the image of the second area on the front side 11a shown in FIG9(B) are the same as the directions of the X and Y axis directions on the back side 11b of the workpiece 11.

The control unit 94 reads the image of the second area corresponding to the first area on the back side 11b from the memory unit 96, and displays an image 102 (see FIG. 10 ) in which the predetermined pattern of the image of the second area is superimposed on the image of the first area on the back side 11b on the touch panel 92. In this way, the operator can confirm whether the groove 11c formed in the workpiece 11 is formed along the predetermined dividing line 13.

In this embodiment, the image of the back side 11b displayed on the touch panel 92 is a real-time image of the back side 11b obtained by the upper shooting unit 84, but it can also be a still image of the back side 11b obtained by the upper shooting unit 84.

FIG10 is an example of an image (image 102) displayed in the back display step S80. In FIG10, the outlines of the device 15, the predetermined dividing line 13, the mark 98, and the circuit 100 are indicated by dotted lines.

In FIG. 10 , although the device 15, the predetermined dividing line 13, the mark 98 and the circuit 100 are all overlapped and displayed on the image 102, any one of them can be selectively displayed (for example, only the predetermined dividing line 13).

In addition, the outlines of the predetermined dividing line 13, the mark 98, etc. can also be displayed on the image 102 in a state of being processed into a predetermined thickness, a predetermined color, and a predetermined brightness after the image on the front side 11a is binarized.

Furthermore, as shown in FIG. 10 , in the image 102 , although only the outlines of the predetermined dividing line 13 and the mark 98 are displayed, the image of the predetermined dividing line 13 and the mark 98 may be displayed instead of the outline.

After the back display step S80, if the workpiece 11 has not been cut along all the predetermined dividing lines 13, it will return to the cutting step S70 and cut the workpiece 11. The cutting step S70 and the back display step S80 can also be repeated several times.

After cutting the workpiece 11 along all the predetermined dividing lines 13 parallel to the X-axis direction, the rotary drive source 30 is operated to rotate the holding table 10 90 degrees. Then, the cutting step S70 is performed again. At this time, the cutting step S70 and the back display step S80 can also be repeated several times.

Furthermore, in the back display step S80, an image may be displayed on the touch panel 92: an image in which at least the area showing the groove 11c of the image in the first area is superimposed on an image of a predetermined pattern including the mark 98 included in the second area. FIG. 11 is another example (image 102a) of the image displayed in the back display step S80. In FIG. 11, the outline of the groove 11c is indicated by a dotted line.

In the image including the area showing the groove 11c, only the outline of the groove 11c may be shown as shown in FIG. 11, or the groove 11c obtained by shooting may be directly displayed. In any case, at least the area showing the groove 11c may be used in the image of the first area. In this way, even when the touch panel 92 displays the image 102a, the operator can confirm whether the groove 11c formed in the workpiece 11 is formed along the predetermined dividing line 13.

Next, the second embodiment is described. In the second embodiment, a laser processing device (processing device) 104 is used instead of the cutting device 2 to process the workpiece 11. However, the above-mentioned loading step S10 to the back display step S80 are performed in the same manner as the first embodiment.

FIG. 12 is a perspective view of the laser processing device 104 of the second embodiment. In addition, the same symbols are attached to the same components as the cutting device 2 of the first embodiment. The following mainly describes the differences from the cutting device 2.

In the laser processing device 104, the lower photographing unit 54 is fixed to the stationary base 106. In addition, in order to allow the lower photographing unit 54 to enter the space 18d from the area on the opposite side of the side plate 18b of the X-axis moving table 18, the X-axis moving table 18 is configured in a state rotated 90 degrees in the direction on the XY plane.

The laser processing device 104 has a Y-axis movable table 108 fixed with a pair of X-axis guide rails 20. The Y-axis movable table 108 is slidably mounted on a pair of Y-axis guide rails 110 fixed to the upper surface of the stationary base 106.

Furthermore, a Y-axis scale 110a is provided adjacent to the Y-axis guide rail 110 and can be used to detect the Y-axis position of the Y-axis moving table 108. A nut portion (not shown) is provided on the lower surface of the Y-axis moving table 108, and a Y-axis ball screw 112 roughly parallel to the Y-axis guide rail 110 is rotatably connected to the nut portion.

A Y-axis pulse motor 114 is connected to one end of the Y-axis ball screw 112. As long as the Y-axis pulse motor 114 rotates the Y-axis ball screw 112, the Y-axis moving table 108 moves in the Y-axis direction along the Y-axis guide rail 110. The Y-axis guide rail 110, the Y-axis ball screw 112, the Y-axis pulse motor 114, etc. constitute the Y-axis moving mechanism 116 that moves the Y-axis moving table 108.

A support 118 is provided adjacent to the lower camera unit 54 so as to protrude upward from the upper surface of the stationary base 106. A housing 120 is provided on the support 118, and the housing 120 has a long side that is substantially parallel to the X-axis direction.

At least a portion of the laser irradiation unit 122 is disposed in the housing 120. The laser irradiation unit 122 has a laser oscillation generator (not shown) for generating a laser beam having a wavelength that can be absorbed by the workpiece 11 or a wavelength that can penetrate the workpiece 11.

At the front end of the laser irradiation unit 122 in the X-axis direction, an irradiation head 124 including a condenser is provided. The laser beam of a predetermined wavelength generated by the laser irradiation unit 122 is irradiated downward from the irradiation head 124 through a predetermined optical system. In addition, at the front end of the housing 120, an upper shooting unit 84 is provided at a position adjacent to the irradiation head 124.

Even in the back display step S80 of the second embodiment, the predetermined pattern of the mark 98 etc. obtained in the image acquisition step S50 can be superimposed on the image of the first area on the back side 11b displayed on the touch panel 92 for display. In this way, the operator can confirm whether the groove 11c formed in the workpiece 11 is formed along the predetermined dividing line 13.

In addition, the structure and method of the above-mentioned embodiments can be appropriately changed and implemented as long as they do not deviate from the scope of the purpose of the present invention. For example, in the second embodiment, a Y-axis moving mechanism that moves the Z-axis moving mechanism 42 in the Y-axis direction can be added as in the first embodiment.

2: Cutting device (processing device)

4: Base

4a,4b,4d: Opening

4c: Support structure

6: Film box

10: Keep the workbench

18: X-axis moving table

60: Processing unit moving mechanism

62:Y-axis guide rail

64: Y-axis moving plate

66: Y-axis ball screw

68:Y-axis pulse motor

70: Z-axis moving plate

72: Z-axis guide rail

74: Z-axis ball screw

76: Z-axis pulse motor

78: Cutting unit (processing unit)

80: Spindle housing

82b: Cutting blade

84: Upper shooting unit (first shooting unit)

86: Washing unit

88: Clean the workbench

90: Nozzle

92: Touch panel (display unit)

94: Control Department

96: Memory Department

+X,-X,+Y,-Y,+Z,-Z: Direction

Claims (4)

A processing device is characterized by comprising: a plate-shaped holding table, including one side and another side located on the opposite side of the one side, and having a predetermined area formed of a transparent material from the one side to the other side; a processing unit, which holds the front side of a workpiece having a predetermined shape on the front side with the one side of the holding table, and processes the workpiece in a state where the back side of the workpiece is exposed upward. processing; a first photographing unit, arranged above the holding workbench to face the one side; a second photographing unit, arranged below the holding workbench to face the other side; a display unit, displaying the image obtained by at least one of the first photographing unit and the second photographing unit; and a control unit, including a memory unit, the memory unit storing the position information of the predetermined pattern, the predetermined pattern being included in the predetermined pattern obtained by the first photographing unit and the second photographing unit. The second photographing unit photographs the front side of the workpiece held by the one side of the holding worktable to obtain an image of the front side, and the control unit causes the predetermined pattern contained in the second area of the front side corresponding to the first area of the back side of the workpiece in the thickness direction of the workpiece to be overlapped with the image of the first area to be displayed on the display unit, and the image of the first area is the back side. The image of a part of the surface side includes an area showing the processing groove formed by the processing unit, the image of the second area is an image of a part of the surface side, and the control unit displays the predetermined pattern in the second area on the image of the first area including the area showing the processing groove, or displays at least the area showing the processing groove of the image of the first area on the image of the second area. A processing device as claimed in claim 1, wherein the control unit sets the direction of the X-axis direction and the Y-axis direction to the same state on the image of the first area and the image of the second area, so that the image of the first area and the image of the second area are overlapped and displayed on the display unit. A processing device as claimed in claim 1 or 2, wherein the processing unit is a cutting unit equipped with a cutting blade, or a laser irradiation unit irradiating a laser beam. In the processing device of claim 1 or 2, wherein the processing groove is a half-cut groove, the control unit causes the predetermined pattern in the second area to be displayed on the image of the first area including the area showing the half-cut groove, or causes at least the area of the image of the first area showing the half-cut groove to be displayed on the image of the second area.