TW202129805A - Machining apparatus capable of determining whether the machining conditions are appropriate or not without taking out a wafer from the machining apparatus - Google Patents

Abstract

[Problem] To provide a processing device in which an operator can judge whether the processing conditions are appropriate without removing the wafer from the processing device. [Solution] Provide a processing device including: a chuck table, a processing unit, a processing feed unit, an imaging unit, and a control unit. The control unit includes: a control unit that controls the wafer held by the chuck table in the processing unit After processing the entire area corresponding to the predetermined dividing line, the chuck table is positioned directly below the camera unit by operating the processing feed unit and relatively moves the chuck table, and the camera unit can shoot the crystal. Circle; and the report production department, which derives the information about the processing status in each area based on the images obtained by individual shooting of two or more different areas among all areas corresponding to the planned dividing line that have been processed, and makes records There are reports of information and images.

Description

Processing device

The present invention relates to a processing device that processes a wafer with elements formed in each area divided by a plurality of predetermined dividing lines.

Electronic devices such as mobile phones and computers are equipped with component chips. The device chip is manufactured by the following method: IC (Integrated Circuit), LSI (Large Scale Integration) and other components are formed in each area divided by a plurality of planned dividing lines. The wafer is diced along each planned dividing line to be divided into a plurality of element wafers.

The wafer is divided using a processing device equipped with a processing unit, which is a dicing unit with a dicing blade (for example, refer to Patent Document 1), and a laser irradiation unit that irradiates a laser beam having a wavelength absorbed by the wafer ( For example, refer to Patent Document 2) and so on.

The processing device includes a chuck table provided below the processing unit. A machining feed unit that moves the chuck table in the machining feed direction (X-axis direction) is provided under the chuck table. In addition, an imaging unit for imaging the wafer held by the chuck table is provided above the chuck table.

In addition, the processing device is also provided with a control unit that controls the operation of each component such as the processing unit, the chuck table, the processing feed unit, and the imaging unit. After the operator inputs the preset processing conditions into the control unit, the processing unit processes each wafer along the planned dividing line.

In order to confirm whether the processing conditions are appropriate, the operator sometimes takes out the wafer that has been actually processed several planned dividing lines from the processing device, and observes the multiple places of the planned dividing line with a microscope installed outside the processing device (that is, performing cuts). an examination).

Through this observation, the operator confirms whether the width of the cutting groove, the size and number of chipping (cracking), and the deviation between the center line of the cutting groove and the center line of the planned dividing line are within the allowable range. If the deviation is beyond the allowable range, the operator will appropriately correct the processing conditions. Then, the wafer that has been returned to the processing device will be processed under the corrected processing conditions. [Literature Technical Literature] [Patent Literature]

[Patent Document 1] JP 2000-108119 A [Patent Document 2] JP 2005-150523 A

[The problem to be solved by the invention] However, if the wafer is taken out of the processing device every time the processing conditions are confirmed with a microscope, there is a risk of damage to the wafer during transportation, and the risk of foreign matter adhering to the wafer and contaminating the wafer.

The present invention is an invention made in view of this problem, and its object is to provide a processing device in which an operator can judge whether the processing conditions are appropriate without taking out the wafer from the processing device.

[Technical means to solve the problem] According to one aspect of the present invention, there is provided a processing device that processes a wafer with elements formed in a plurality of regions, which are divided by a plurality of predetermined dividing lines set on the front side, and the The processing device is provided with: a cassette table which places a cassette that has accommodated a plurality of wafers; a chuck table which holds the wafers carried out from the cassette placed on the cassette table; and a processing unit which is in The region of the wafer held in the chuck table corresponding to the planned dividing line is processed; a processing and feeding unit that processes and feeds the chuck table and the processing unit oppositely; an imaging unit that holds the image of the chuck on the card And a control unit that controls the processing unit, the processing feed unit, and the imaging unit, the control unit includes: a control section, which is positioned between the processing unit and the wafer held by the chuck After processing the entire area corresponding to the planned dividing line, by operating the processing feed unit and relatively moving the chuck table, the chuck table is positioned directly below the camera unit, and the camera Unit shooting wafers; and report production department, which derives information about the processing status in each area based on the images obtained by individually shooting two or more different areas among all areas corresponding to the planned dividing line that have been processed , And make a report that records the information and the image.

Preferably, the report production unit produces the report for the wafer that is processed first among the plurality of wafers contained in the cassette.

Also, preferably, the information about the processing state includes: the width of the groove formed in the region corresponding to the planned dividing line, the state of the collapse formed in the groove, and the groove from the center of the planned dividing line The offset of the line.

Moreover, it is preferable that the processing device further includes a display unit that displays the content of the report.

Furthermore, preferably, in the case of specifying the number of the two or more different regions photographed by the imaging unit, the control unit further includes: an arrangement determination unit that determines the arrangement of the two or more different regions.

Furthermore, preferably, the processing unit is any one of a cutting unit and a laser beam irradiation unit, the cutting unit is rotatably provided with a cutting blade, and the laser beam irradiation unit is provided with a condensing unit for condensing the laser beam. Optical device.

[Efficacy of invention] The control unit of the processing device according to one aspect of the present invention has a control section and a report creation section. After the processing unit processes the entire area corresponding to the planned dividing line of the wafer held on the chuck table, the control unit operates the processing feed unit and moves the chuck table relatively to move the chuck table Position it directly below the camera unit and make the camera unit photograph the wafer.

In addition, the report production department derives the information about the processing status in each area based on the images obtained by individually shooting two or more different areas among all areas corresponding to the planned dividing line that have been processed, and produces and records the Information and reports of the image. By referring to this report, the operator can confirm whether the processing conditions are appropriate without removing the wafer from the processing device. Therefore, the risk of wafer damage, contamination, etc. caused by taking the wafer out of the processing device can be eliminated.

With reference to the accompanying drawings, an embodiment of one aspect of the present invention will be described. FIG. 1 is a perspective view of a cutting device (processing device) 2. In addition, in FIG. 1, a part of the constituent elements of the cutting device 2 is represented by functional blocks. In addition, in the following description, the X-axis direction (processing feed direction), Y-axis direction (indexing feed direction), and Z-axis direction (height direction) are directions orthogonal to each other.

An operation panel 4 is provided on the front side of the cutting device 2. The operator makes a predetermined input through the operation panel 4, for example, so that the cutting device 2 can set processing conditions and the like. A monitor (display unit) 6 is provided on the side surface of the front side of the cutting device 2.

The display 6 displays a guide screen for guiding operations, an image taken by an imaging unit 24 described later, the content of a report described later, and the like to the operator. In addition, the display 6 may be a touch panel that functions as the operation panel 4. In this case, the operation panel 4 can be omitted.

In the dicing device 2, the wafer 11 formed of a semiconductor material such as silicon is diced (processed) (refer to FIG. 2). As shown in FIG. 2, a plurality of planned dividing lines (dicing lanes) 13 are set in a grid pattern on the front surface 11 a side of the wafer 11. Elements 15 such as IC (Integrated Circuit) and LSI (Large Scale Integration) are formed in each area divided by a plurality of planned dividing lines 13.

On the back side 11b of the wafer 11, a circular adhesive film (dicing film 17) formed of resin is adhered. The diameter of the dicing film 17 is larger than the diameter of the wafer 11. The wafer 11 is adhered to the center portion of the dicing glue film 17, and one surface of the ring-shaped frame 19 formed of metal is adhered to the outer peripheral portion of the dicing glue film 17.

The wafer 11, the dicing film 17 and the frame 19 constitute a frame unit 21. FIG. 2 is a perspective view of the frame unit 21. A plurality of (for example, 25) frame units 21 are transported to the cutting device 2 while being accommodated in one cassette 8 (refer to FIG. 1 ).

Returning to FIG. 1 again, other components of the cutting device 2 will be described. The cutting device 2 has a rectangular plate-shaped cassette table 10. The cassette 8 described above is placed on the cassette table 10. A cassette elevator 12 that can move the cassette table 10 up and down is connected below the cassette table 10.

A push-pull arm 14 is provided behind the cassette table 10. The push-pull arm 14 carries out the wafer 11 before dicing from the cassette 8 while holding the frame 19 of the frame unit 21. In addition, the push-pull arm 14 can also carry the diced wafer 11 into the cassette 8 by pushing the frame 19.

A pair of positioning members (rails) 16 are provided on both sides of the moving path of the push-pull arm 14. The pair of positioning members 16 adjust the position of the frame unit 21 in the X-axis direction. A first conveying unit 18 that conveys the frame unit 21 from the pair of positioning members 16 is provided in the vicinity of the pair of positioning members 16.

The first conveying unit 18 has: an arm; a suction mechanism provided on one end side of the arm; and a swing mechanism provided on the other end side of the arm. The first conveying unit 18 conveys the frame unit 21 by rotating the arm by a predetermined angle by the swing mechanism in a state where the frame 19 is sucked by the suction mechanism.

The first conveying unit 18 conveys the frame unit 21 to the chuck table 20, and the chuck table 20 is in a state where the chuck table 20 has moved to the region closest to the cassette table 10 in the X-axis direction. A disc-shaped porous plate is fixed to the upper surface side of the chuck table 20.

One end of a flow path (not shown) formed inside the chuck table 20 is connected to the lower surface side of the porous plate, and a suction source (not shown) such as an ejector is connected to the other end of the flow path.

If the suction source is operated, a negative pressure is generated on the upper surface of the porous plate, and the upper surface of the chuck table 20 functions as a holding surface 20a for sucking and holding the frame unit 21. The frame unit 21 is such that the front side 11a of the wafer 11 is exposed, and the holding surface 20a holds the dicing film 17 side.

A plurality of clamp units 20 b for fixing the frame 19 are provided on the outer periphery of the chuck table 20. In addition, a θ table (not shown) that rotates the chuck table 20 around a predetermined rotation axis is connected below the chuck table 20.

A machining feed unit 22 that moves the chuck table 20 in the X-axis direction is connected below the θ table. In addition, the rough position of the processing feed unit 22 is shown in FIG. 1, and the specific shape is not shown in figure.

The machining feed unit 22 has an X-axis moving table (not shown) that supports the θ table. The X-axis moving table is set to be able to slide on a pair of X-axis guide rails (not shown) parallel to the X-axis.

Between the pair of X-axis guide rails, a ball screw (not shown) is arranged along the X-axis direction. A pulse motor (not shown) for rotating the ball screw is connected to one end of the ball screw.

In addition, a nut portion (not shown) is provided on the lower surface of the X-axis moving table, and the nut portion is connected in a manner capable of rotating with respect to the ball screw. When the pulse motor is driven, the chuck table 20 moves in the X-axis direction together with the X-axis moving table and the like.

Above the moving path of the chuck table 20, an imaging unit 24 is provided so as to face the holding surface 20a. The imaging unit 24 includes a camera including a predetermined optical system, and imaging elements such as a CCD image sensor or a CMOS image sensor. Get the image.

The obtained image is displayed on the display 6, for example. With respect to the imaging unit 24, a cutting unit (processing unit) 26 is provided on one side in the X-axis direction. The cutting unit 26 has a cylindrical main shaft (not shown) arranged along the Y-axis direction.

A cutting blade 26a having a circular cutting edge is installed at one end of the main shaft. In addition, a rotation drive source such as a motor is connected to the other end side of the main shaft. If the rotation drive source is operated, the cutting blade 26a rotates at a high speed.

Here, a method of dicing the wafer 11 using the dicing blade 26a will be described. In the case of dicing the wafer 11, first, with the front side 11a exposed, the back side 11b side of the wafer 11 (that is, the dicing film 17) is held by the holding surface 20a, and the frame 19 is fixed by a plurality of clamp units 20b .

Next, the camera unit 24 is used to photograph the front side 11a of the wafer 11, and image processing such as pattern matching is performed on the image obtained by the photographing, thereby detecting the coordinates of a predetermined alignment mark. Thereby, the position of the planned dividing line 13 separated by a predetermined distance from the coordinates of the alignment mark is specified.

Next, the cutting blade 26a is positioned on an extension of the planned dividing line 13. After that, the lower end of the dicing blade 26a that has been rotated is positioned between the back surface 11b of the wafer 11 and the holding surface 20a.

Then, the chuck table 20 is processed and fed by the processing and feeding unit 22, whereby the wafer 11 and the chuck table 20 are relatively moved in the X-axis direction. Thereby, cutting (processing) corresponds to an area of the planned dividing line 13 to form a cutting groove 13a (refer to FIG. 3).

After the wafer 11 is cut along a planned dividing line 13, the cutting unit 26 is moved along the Y-axis direction, and the cutting blade 26a is positioned on another planned dividing line adjacent in the Y-axis direction relative to the planned dividing line 13 The extension line of 13.

Then, the wafer 11 is cut along another planned dividing line 13. In the same manner, the wafer 11 is cut along the remaining planned dividing line 13. After the wafer 11 is cut along all the planned dividing lines 13 provided along the X-axis direction, the wafer 11 is rotated by 90 degrees by the θ stage.

After that, the wafer 11 is cut along all the planned dividing lines 13 provided along the X-axis direction. In this way, after the cutting grooves 13a are formed in regions corresponding to all the planned dividing lines 13 set in a grid shape, the cutting is finished.

The frame unit 21 after cutting is transported from the chuck table 20 to the rotary cleaning unit 30 located behind the chuck table 20 by the second transport unit 28. In the rotary washing unit 30, the frame unit 21 is subjected to rotary washing and rotary drying.

The frame unit 21 after the rotation washing and the rotation drying are completed in the rotation washing unit 30 is carried into the cassette 8 by the first conveying unit 18, the positioning member 16, the push-pull arm 14, and the like. Next, the control unit 32 that controls the operation of the cutting device 2 will be described.

The control unit 32 controls the operations of the cassette elevator 12, the push-pull arm 14, the positioning member 16, the chuck table 20, the processing feed unit 22, the imaging unit 24, the cutting unit 26, the second conveying unit 28, the rotary cleaning unit 30, and the like.

The control unit 32 is, for example, constituted by a computer that includes processing devices such as CPU (Central Processing Unit), main memory devices such as DRAM (Dynamic Random Access Memory), and Auxiliary memory devices such as flash memory and hard disk drives. The function of the control unit 32 is realized by following the software stored in the auxiliary memory device and containing a predetermined program to operate the processing device and the like.

The control unit 32 includes, for example, a control unit 34 composed of a program. The control unit 34 controls, for example, the operation of a solenoid valve (not shown) provided between one end and the other end of a flow path formed inside the chuck table 20.

If the solenoid valve is set to the open state, negative pressure is generated on the holding surface 20a, and if the solenoid valve is set to the closed state, the negative pressure of the holding surface 20a disappears. The control unit 34 also controls the operation of the rotation driving source of the cutting unit 26, for example.

Following the above-mentioned cutting method of the wafer 11, after the cutting unit 26 cuts all the planned dividing lines 13, the control unit 34 controls the pulse motor of the processing feed unit 22 to position the chuck table 20 directly below the imaging unit 24 .

After that, the control unit 34 operates the imaging unit 24 and causes the imaging unit 24 to image the front side 11 a of the wafer 11. FIG. 3 is a diagram showing how the front surface 11a side of the wafer 11 is photographed.

The imaging unit 24 photographs the entire front side 11a of the wafer 11, and individually photographs two or more predetermined inspection areas (ranges) in a state of being enlarged to be larger than the entire image of the wafer 11. The imaging unit 24 of this embodiment captures seven inspection areas located at different positions.

Fig. 4 is a diagram showing each inspection area. In addition, in this embodiment, the lateral direction shown in FIG. 4 is referred to as channel 1 (CH1), and the longitudinal direction shown in FIG. 4 is referred to as channel 2 (CH2).

Each inspection area includes a predetermined range centered on the intersection of the planned dividing line 13 in the CH1 direction and the CH2 direction. As shown in the inspection area image A, in the cutting direction along CH1 groove 13a ₁ and 13a ₂ to generate missing collapse (chipping) CH2 grooves 13b along the cutting direction, respectively.

In the inspection area A, _{the center line of the cut groove 13a 1} in the CH1 direction is offset from the center line of the planned dividing line 13 in the CH1 direction to the rear side. The so-called central cutting wire groove 13a _1, is that the central position of the width direction by cutting CH2 groove 13a ₁ CH1 and parallel to the direction of a straight line. In addition, the center line of the planned dividing line 13 in the CH1 direction refers to a straight line that passes through the center of the width of the CH2 direction and is parallel to the CH1 direction of the planned dividing line 13 in the CH1 direction.

Inspection area B is located on the right side of inspection area A in the direction of CH1, and is located at the same position as inspection area A in the direction of CH2. In the inspection area B, _{the center line of the cut groove 13a 2} in the CH2 direction is shifted to the left from the center line of the planned dividing line 13 in the CH2 direction.

The so-called central cutting wire groove 13a ₂ refers to the center position of the width direction of the cutoff grooves 13a ₂ by the CH1 and CH2 direction parallel to the straight line. In addition, the center line of the planned dividing line 13 in the CH2 direction refers to a straight line that passes through the center of the width of the CH1 direction and is parallel to the CH2 direction of the planned dividing line 13 in the CH2 direction.

In the inspection area B, similarly to the inspection area A, _{the center line of the cut groove 13a 1} in the CH1 direction is shifted to the rear side from the center line of the planned dividing line 13 in the CH1 direction. In addition, there is no chipping 13b in the cut groove 13a _{1 in the CH1 direction.}

The inspection area C is located on the left side of the inspection area A in the CH1 direction, and is located on the front side of the inspection area A in the CH2 direction. In the inspection area C, _{the center line of the cutting groove 13a 1} in the CH1 direction is offset from the center line of the planned dividing line 13 in the CH1 direction to the rear side, and _{the center line of the cutting groove 13a 2} in the CH2 direction is the division from the CH2 direction. The center line of the planned line 13 is shifted to the right.

The inspection area D is located approximately in the center of the front surface 11a. The inspection area D is located between the inspection areas A and B in the CH1 direction, and is located at the same position as the inspection area C in the CH2 direction. In the inspection area D, _{the center line of the cut groove 13a 1} in the CH1 direction is also offset from the center line of the planned dividing line 13 in the CH1 direction to the rear side.

The inspection area E is located on the right side of the inspection area B in the CH1 direction, and is located at the same position as the inspection areas C and D in the CH2 direction. In the inspection area E, _{the center line of the cut groove 13a 1} in the CH1 direction is also offset from the center line of the planned dividing line 13 in the CH1 direction to the rear side.

The inspection area F is located at the same position as the inspection area A in the CH1 direction, and is located in front of the inspection area C in the CH2 direction. In the inspection area F, _{the center line of the cut groove 13a 1} in the CH1 direction is offset from the center line of the planned dividing line 13 in the CH1 direction to the rear side.

The inspection area G is located at the same position as the inspection area B in the CH1 direction, and at the same position as the inspection area F in the CH2 direction. In the inspection area G, _{the center line of the cutting groove 13a 1} in the CH1 direction is offset from the center line of the planned dividing line 13 in the CH1 direction to the rear side, and _{the center line of the cutting groove 13a 2} in the CH2 direction is the division from the CH2 direction. The center line of the planned line 13 is shifted to the left.

The arrangement of the inspection areas A to G is determined by a part of the control unit 32, that is, the arrangement determining unit 36 in the case where the operator has designated the number of two or more different inspection areas (ranges) photographed by the imaging unit 24 . The arrangement determination unit 36 is composed of, for example, a program.

The arrangement determination unit 36 sets the coordinates of the intersection of the center line of the planned dividing line 13 in the CH1 direction and the center line of the planned dividing line 13 in the CH2 direction as the center coordinates of the inspection area. The arrangement determining unit 36 determines the center coordinates of a plurality of inspection areas based on the number of designated inspection areas.

For example, among the coordinates of a plurality of intersections, the arrangement determining unit 36 uses one coordinate located at the approximate center of the front surface 11a and a plurality of other coordinates located around the one coordinate as the center coordinates of the inspection area. For example, the arrangement determining unit 36 determines the arrangement of the center coordinates of the inspection area so that the center coordinates of at least two inspection areas are the same in the CH1 direction or the CH2 direction.

After determining the arrangement of the center coordinates of the inspection area, the imaging unit 24 captures a range from the center coordinates of each inspection area to a predetermined diameter (for example, 200 μm to 300 μm). In addition, the range captured by the imaging unit 24 is not limited to a circle, but can have any shape.

The control unit 32 further includes a report making section 38 that makes reports that record images of each inspection area and information about the processing state of the wafer 11 in each inspection area. The report generating unit 38 is composed of, for example, a program, and generates a report for the wafer 11 that is processed first among the plurality of wafers 11 contained in the cassette 8.

By referring to this report, the operator can confirm whether the processing conditions are appropriate without removing the wafer 11 from the processing device. If the processing conditions are inappropriate, the processing conditions can be corrected. Therefore, when processing the second and subsequent wafer 11, the wafer 11 can be processed using the corrected processing conditions.

The information about the processing state includes: the width of the cutting groove 13a, the state of the collapse 13b formed in the cutting groove 13a, and the offset amount of the center line of the cutting groove 13a from the center line of the planned dividing line 13. In addition, the width of the cutting groove 13a ₁ along the CH1 direction refers to the length of the cutting groove 13a _{1 in} the CH2 direction, and _{the width of the cutting groove 13a 2} along the CH2 direction refers to the width of the cutting groove 13a _{2 in} the CH1 direction length.

In addition, the state of the collapses 13b formed in the dicing groove 13a means, for example, the number of collapses 13b and the size of the collapses 13b. For example, the size of the chipping 13b means the maximum length of the chipping 13b in the CH2 direction from the edge of the _{cutting groove 13a 1} or the maximum length of the chipping 13b in the CH1 direction from the edge of the _{cutting groove 13a 2.}

The report of this embodiment is displayed on the display 6 in the form of an image. Fig. 5 is an image showing an example of the report. At the upper right of the report, the overall image of the front side 11a of the wafer 11 is displayed. In this overall image, the positions corresponding to the inspection areas A to G are indicated by circles.

Below the overall image of the wafer 11, a circle in which the overall image has been simplified is displayed, and within this circle, inspection areas A to G are displayed. On the left side of the overall image of the wafer 11, an image of the inspection area is displayed. In the example shown in FIG. 5, an image of the inspection area D is displayed.

In addition, the operator can select the image of the displayed inspection area by specifying the desired inspection area. For example, the operator can switch the image of the inspection area D to the image of the inspection area A by specifying the inspection area A displayed in the circle that has simplified the overall image.

Below the image of the inspection area, information about the processing status of the selected inspection area is displayed. In the example shown in FIG. 5, information about the processing state of the inspection area D is displayed. Each piece of information is generated by the report generation unit 38 based on the obtained image, for example.

As shown in the "groove width" of FIG. 5, the width of the cut groove 13a ₁ of the inspection area D is 30 μm, and the width of the cut groove 13a ₂ of the inspection area D is 31 μm. In addition, the "crack" in FIG. 5 indicates the number of cracks smaller than 5 μm. As shown in FIG. 5, in the inspection area D, _{the number of chippings smaller than 5 μm in the dicing groove 13a 1} is one, and the number of chippings smaller than 5 μm in the dicing groove 13a ₂ is four.

"(5μm or more)" in Figure 5 indicates the number of chippings of 5μm or more. As shown in FIG. 5, in the inspection area D, there is no chipping of 5 μm or more in the _{dicing groove 13a 1} and the dicing groove 13a _2. In addition, the "cut path offset" in FIG. 5 is the offset amount of the center line of the dicing groove 13 a from the center line of the planned dividing line 13.

As shown in FIG. 5, the direction of the central line is checked CH1 region D of the cut grooves 13a ₁ is shifted from the center line dividing the line direction 13 of the CH1 3μm. _{In addition, the center line of the cut groove 13a 2} in the CH2 direction of the inspection area D is offset from the center line of the planned dividing line 13 in the CH2 direction by 2 μm.

The report creation unit 38 derives the width of the dicing groove 13a, the number of chippings smaller than 5 μm, the number of chippings larger than 5 μm, the offset of the dicing path, etc., based on the acquired image. Because the length of each pixel of the acquired image is set in advance, the report creation unit 38 calculates the width of the cutting groove 13a and the center line of the cutting groove 13a from the number of pixels corresponding to the width of the cutting groove 13a in the image, for example. Location.

Similarly, the report generation unit 38 can calculate the size of the collapse in the predetermined direction from the number of pixels corresponding to the predetermined direction of the collapse in the image. In addition, the report preparation unit 38 may count the number of collapses based on the size of the collapses. In this way, the report creating unit 38 creates a report in which the images of each inspection area and the information about the processing status in each inspection area are recorded.

By referring to this report, the operator does not need to take out the wafer 11 from the dicing device 2 and does not need to observe the planned dividing line 13 with a microscope or the like to confirm whether the processing conditions are appropriate. Therefore, the risk of damage and contamination of the wafer 11 caused by taking the wafer 11 out of the dicing device 2 can be eliminated.

In addition, the report is not limited to image display, but can also be printed on paper. When the report is printed on paper, the cutting device 2 may include a report printing section (not shown) including a printer. In addition, instead of the report printing unit, the report producing unit 38 may output data required for producing the report to an external printer (not shown), and cause the printer to print the report.

When the report is printed on paper, it is preferable to identify the corresponding relationship between the image of each inspection area and the information about the processing state of the wafer 11 in each inspection area, and combine the image of the inspection area with the information about the processing state. The information is recorded in the report.

Next, the method of confirming and correcting the processing conditions will be explained. First, the operator inputs predetermined processing conditions into the control unit 32 through the operation panel 4 (preparation step S10). The processing conditions include the type of cutting blade 26a, the flow rate of cutting water supplied to the processing point, the number of rotations of the main shaft, and the like.

In the preparation step S10, the number of inspection areas (ranges) to be photographed is also input, and the above-mentioned arrangement determination unit 36 automatically determines the arrangement of the inspection areas. After the processing conditions are input, the operator presses the automatic processing start button to cause the dicing device 2 to start the processing of the wafer 11.

When the automatic processing start button is pressed, the first frame unit 21 is transported from the cassette 8 to the chuck table 20, and the frame unit 21 is held by the holding surface 20a and the clamp unit 20b (holding step S20).

After the holding step S20, the above-mentioned cutting method is followed and the entire area of the wafer 11 corresponding to the planned dividing line 13 is cut by the cutting unit 26 (cutting step S30). After the dicing step S30, the imaging unit 24 captures the entirety of each inspection area designated by the arrangement determination unit 36 and the front side 11a side of the wafer 11 (imaging step S40).

After the imaging step S40, the report creation unit 38 creates the above-mentioned report (report creation step S50). The operator confirms whether the processing conditions input in the preparation step S10 are appropriate by referring to the prepared report (confirmation step S60). Thereby, the risk of damage and contamination of the wafer 11 caused by taking the wafer 11 out of the dicing device 2 can be eliminated.

After the confirmation step S60, the first frame unit 21 is cleaned and dried in the rotating cleaning unit 30, and is carried into the cassette 8. When the processing conditions are appropriate, the cutting step S30 is also performed under the same processing conditions for the frame unit 21 after the second one.

However, in the case where the processing conditions are inappropriate, after confirming step S60, the processing conditions are corrected (correction step S70). In the correction step S70, for example, the cutting blade 26a is exchanged or reinstalled, the flow rate of the cutting water is changed, and the number of rotations of the main shaft is changed.

After the correction step S70, the steps from the holding step S20 to the confirming step S60 are performed for the second frame unit 21. When the processing conditions are appropriate, the second frame unit 21 is washed and dried, and is carried into the cassette 8. However, when the processing conditions are inappropriate, the correction step S70 and the like are performed again.

Next, the second embodiment will be described. FIG. 6 is a perspective view of a laser processing device (processing device) 40 of the second embodiment. The laser processing device 40 has a laser beam irradiation unit (processing unit) 42 instead of the cutting unit 26. This point is different from the cutting device 2.

The laser beam irradiation unit 42 has a laser beam generator (not shown) that generates a pulsed laser beam having a wavelength absorbed by the wafer 11. In addition, the laser beam generator includes a laser oscillator (not shown). The laser beam irradiation unit 42 has a cylindrical housing part 42a, and a head 42b is provided at the front end of the housing part 42a.

The head 42b is provided with a condenser (not shown) for condensing the laser beam, and the head 42b functions as a condenser. The laser beam generated by the laser beam generating unit passes through a predetermined optical system provided in the housing portion 42a, and is emitted downward from the head 42b.

When processing the wafer 11, for example, the front surface 11a is exposed, and the back surface 11b side of the wafer 11 is held by the holding surface 20a. Then, the area directly under the head 42b is positioned on an extension line of the planned dividing line 13.

In the state where the predetermined output laser beam is irradiated from the head 42b, if the chuck table 20 and the head 42b are processed and fed relative to each other, the area corresponding to the planned dividing line 13 is ablated and processed to form a laser Processing grooves.

The laser processing device 40 also has a control unit 32 similarly to the cutting device 2. Therefore, as in the first embodiment, after the laser processing grooves are formed on all the planned dividing lines 13 of the first wafer 11, the report generating unit 38 generates a report.

By referring to this report, the operator can confirm whether the processing conditions are appropriate without removing the wafer 11 from the laser processing apparatus 40. Therefore, the risk of damage and contamination of the wafer 11 caused by taking the wafer 11 out of the laser processing apparatus 40 can be eliminated.

Next, another example in which the arrangement determination unit 36 determines the arrangement of the inspection area will be described. If the inspection area is not set on the wafer 11, it is meaningless. However, since the wafer 11 is a disc shape, if a plurality of inspection areas are arranged at equal intervals in the CH1 and CH2 directions, the inspection area at the end may be located outside the outer periphery of the front surface 11.

FIG. 7(A) is a diagram showing an example in which the inspection area 13c at the end is located outside the outer periphery of the wafer 11. In addition, in FIG. 7(A), the position of the inspection area 13c is simply indicated by a cross. In this case, the arrangement determination unit 36 corrects the arrangement of the inspection area 13c so that the interval of the inspection area 13c becomes narrower in the CH1 or CH2 direction.

FIG. 7(B) is a diagram showing the arrangement of the inspection area 13c after correction. The arrangement determining unit 36 corrects the coordinates of the inspection area 13c so that the inspection area 13c at the end is located more inside than the outer circumference of the front surface 11a.

For example, the arrangement determining unit 36 determines the interval in the CH1 direction among the five inspection areas 13c located between one end and the center in the CH2 direction and the five inspection areas 13c located between the other end and the center in the CH2 direction. The first interval is set to be narrower than in the case of FIG. 7(A).

Furthermore, the arrangement determining unit 36 sets the interval in the CH1 direction among the five inspection areas 13c located at one end of the CH2 direction and the five inspection areas 13c located at the other end of the CH2 direction to the first interval narrower than the first interval. Two intervals. In addition, in the modified example of FIG. 7(B), although the interval in the CH1 direction is narrowed, the interval in the CH2 direction may be narrowed instead.

In this way, the arrangement determining unit 36 corrects the arrangement of the inspection areas 13c according to the number of inspection areas 13c designated by the operator, so that it is possible to prevent the imaging unit 24 from taking images outside the outer periphery of the wafer 11.

In addition, the structure, method, and the like of the above-mentioned embodiment may be appropriately changed and implemented without departing from the scope of the present invention. For example, the dicing groove 13a and the laser processing groove are not limited to grooves formed by cutting (that is, completely cutting) the wafer 11, and may be half-cut grooves in which the wafer 11 is partially removed.

2: Cutting device (processing device) 4: Operation panel 6: Display (display unit) 8: Cassette 10: Cassette table 12: Cassette elevator 14: Push-pull arm 16: Positioning member 18: First conveying unit 20: Card Disk table 20a: holding surface 20b: clamp unit 22: processing feed unit 24: camera unit 26: cutting unit (processing unit) 26a: cutting blade 28: second conveying unit 30: rotating cleaning unit 32: control unit 34: control Section 36: Arrangement decision section 38: Report preparation section 40: Laser processing device (processing device) 42: Laser beam irradiation unit (processing unit) 42a: Housing 42b: Head 11: Wafer 11a: Front 11b: Back 13: Pre-divided lines 13a, 13a ₁ , 13a ₂ : Cutting groove 13b: Chipping 13c: Inspection area 15: Element 17: Cutting film 19: Frame 21: Frame unit A, B, C, D, E, F, G: Inspection area (range)

Figure 1 is a perspective view of a cutting device. Figure 2 is a perspective view of the frame unit. FIG. 3 is a diagram showing how the front side of the wafer is photographed. Fig. 4 is a diagram showing each inspection area. Fig. 5 shows an image of an example of the report. Fig. 6 is a perspective view of the laser processing apparatus of the second embodiment. FIG. 7(A) is a diagram showing an example in which the inspection area at the end is located outside the outer periphery of the wafer; FIG. 7(B) is a diagram showing the arrangement of the inspection area after correction.

A, B, C, D, E, F, G: inspection area (range)

Claims (6)

A processing device that processes wafers with elements respectively formed in a plurality of regions, the regions being divided by a plurality of predetermined dividing lines set on the front side, and is characterized in that: The processing device includes: a cassette table that places a cassette that has accommodated a plurality of wafers; a chuck table that holds wafers carried out from the cassette placed on the cassette table; a processing unit, which Processing is performed on the region of the wafer held in the chuck table corresponding to the planned dividing line; a processing and feeding unit that processes and feeds the chuck table and the processing unit oppositely; and an imaging unit that holds the image of the The wafer of the chuck table; and a control unit that controls the processing unit, the processing feed unit and the imaging unit, The control unit contains: The control unit, after the processing unit processes all the regions corresponding to the planned dividing line of the wafer held by the chuck table, operates the processing feed unit and moves the chuck table relatively, Position the chuck table directly below the camera unit, and make the camera unit photograph the wafer; and The report production department, which derives the information about the processing status in each area based on the images obtained by individual shooting of two or more different areas of the entire area corresponding to the planned dividing line that has been processed, and produces and records the Information and reports of the image. For example, the processing device of claim 1, wherein the report production unit produces the report for the wafer that is processed first among the plurality of wafers contained in the cassette. The processing device of claim 1 or 2, wherein the information about the processing state includes: the width of the groove formed in the region corresponding to the predetermined dividing line, the state of the collapse formed in the groove, and the groove The offset from the center line of the planned dividing line. For example, the processing device of claim 1 or 2, which is further provided with: a display unit that displays the content of the report. For example, the processing device of claim 1 or 2, wherein, in the case where the number of the two or more different regions to be photographed by the imaging unit is specified, the control unit further includes: a configuration determining unit that determines the two or more different regions Configuration. For example, the processing device of claim 1 or 2, wherein the processing unit is any one of a cutting unit and a laser beam irradiation unit, the cutting unit is rotatably provided with a cutting blade, and the laser beam irradiation unit is provided with a laser beam Concentrator for concentrating light.

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