TWI868184B - Glass substrate conveying device, laminated glass manufacturing device and manufacturing method - Google Patents
Glass substrate conveying device, laminated glass manufacturing device and manufacturing method Download PDFInfo
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- TWI868184B TWI868184B TW109124777A TW109124777A TWI868184B TW I868184 B TWI868184 B TW I868184B TW 109124777 A TW109124777 A TW 109124777A TW 109124777 A TW109124777 A TW 109124777A TW I868184 B TWI868184 B TW I868184B
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- Prior art keywords
- roller
- glass substrate
- driving roller
- glass
- protective material
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- 239000011521 glass Substances 0.000 title claims abstract description 230
- 239000000758 substrate Substances 0.000 title claims abstract description 211
- 238000004519 manufacturing process Methods 0.000 title claims description 30
- 239000005340 laminated glass Substances 0.000 title claims description 22
- 239000000463 material Substances 0.000 claims description 86
- 230000001681 protective effect Effects 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 18
- 239000002346 layers by function Substances 0.000 claims description 14
- 238000001816 cooling Methods 0.000 description 59
- 238000004544 sputter deposition Methods 0.000 description 38
- 239000010410 layer Substances 0.000 description 34
- 238000011144 upstream manufacturing Methods 0.000 description 13
- 230000032258 transport Effects 0.000 description 12
- 238000005477 sputtering target Methods 0.000 description 11
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- 230000000052 comparative effect Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 230000005611 electricity Effects 0.000 description 6
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- 230000003068 static effect Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
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- 229910052787 antimony Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
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- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 206010039729 Scotoma Diseases 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000005354 aluminosilicate glass Substances 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- UQMRAFJOBWOFNS-UHFFFAOYSA-N butyl 2-(2,4-dichlorophenoxy)acetate Chemical compound CCCCOC(=O)COC1=CC=C(Cl)C=C1Cl UQMRAFJOBWOFNS-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000005670 ethenylalkyl group Chemical group 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- 238000001659 ion-beam spectroscopy Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920006290 polyethylene naphthalate film Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- 238000007751 thermal spraying Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H27/00—Special constructions, e.g. surface features, of feed or guide rollers for webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
- C03C17/245—Oxides by deposition from the vapour phase
- C03C17/2453—Coating containing SnO2
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Fluid Mechanics (AREA)
- Physics & Mathematics (AREA)
- Textile Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Advancing Webs (AREA)
- Registering, Tensioning, Guiding Webs, And Rollers Therefor (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laminated Bodies (AREA)
Abstract
本發明之玻璃基材1之搬送裝置11具備:捲出輥21,其以捲出具有可撓性之玻璃基材1之方式構成;捲取輥41,其以捲取玻璃基材1之方式構成;及第1驅動輥22,其配置於玻璃基材1之搬送方向上之捲出輥21及捲取輥41之間,以被賦予用以搬送玻璃基材1之動力之方式構成。第1驅動輥22構成為,於玻璃基材1及第1驅動輥22接觸之狀態下,玻璃基材1中相對於與第1驅動輥22之表面接觸之接觸面51相反側之非接觸面52不與其他搬送構件(夾輥44)接觸。第1驅動輥22之表面具有0.8 μm以下之最大高度粗糙度Rz。The glass substrate 1 conveying device 11 of the present invention comprises: a roll-out roller 21 configured to roll out the glass substrate 1 having flexibility; a take-up roller 41 configured to take up the glass substrate 1; and a first driving roller 22 disposed between the roll-out roller 21 and the take-up roller 41 in the conveying direction of the glass substrate 1 and configured to be provided with power for conveying the glass substrate 1. The first drive roller 22 is configured such that, when the glass substrate 1 and the first drive roller 22 are in contact, the non-contact surface 52 of the glass substrate 1 opposite to the contact surface 51 in contact with the surface of the first drive roller 22 does not contact other conveying members (clamping roller 44). The surface of the first drive roller 22 has a maximum height roughness Rz of 0.8 μm or less.
Description
本發明係關於一種玻璃基材之搬送裝置、積層玻璃之製造裝置及製造方法,詳細而言係關於一種玻璃基材之搬送裝置、具備該搬送裝置之積層玻璃之製造裝置、及使用該製造裝置之積層玻璃之製造方法。The present invention relates to a glass substrate conveying device, a laminated glass manufacturing device and a manufacturing method, and more specifically, to a glass substrate conveying device, a laminated glass manufacturing device having the conveying device, and a laminated glass manufacturing method using the manufacturing device.
先前,已知有一種裝置,其一面以輥對輥方式搬送基材,一面於該基材上形成各種功能層。Conventionally, there is known an apparatus which forms various functional layers on a substrate while conveying the substrate in a roll-to-roll manner.
例如,提出有一種裝置,其針對基材使用夾持機構來搬送樹脂基材(例如,參照下述專利文獻1)。專利文獻1之夾持機構具備由金屬輥構成之驅動輥、及由橡膠輥構成之夾輥(按壓輥)。專利文獻1之夾持機構中,以驅動輥及夾輥將基材夾入,驅動輥旋轉,夾輥將基材按壓於驅動輥,藉此,搬送基材而不會出現驅動輥空轉。 [先前技術文獻] [專利文獻]For example, a device is proposed that uses a clamping mechanism for the substrate to transport a resin substrate (for example, refer to the following patent document 1). The clamping mechanism of patent document 1 has a driving roller composed of a metal roller and a clamping roller (pressing roller) composed of a rubber roller. In the clamping mechanism of patent document 1, the substrate is clamped by the driving roller and the clamping roller, the driving roller rotates, and the clamping roller presses the substrate against the driving roller, thereby transporting the substrate without the driving roller idling. [Prior art document] [Patent document]
[專利文獻1]日本專利特開2014-49624號公報[Patent Document 1] Japanese Patent Publication No. 2014-49624
[發明所欲解決之問題][The problem the invention is trying to solve]
近年來,作為耐熱性優異之基材,研究使用薄玻璃基材來取代樹脂基材。In recent years, research has been conducted on using thin glass substrates as substrates with excellent heat resistance to replace resin substrates.
然而,薄玻璃基材較樹脂基材脆弱。因此,薄玻璃基材若自厚度方向兩側接觸驅動輥及夾輥,則有破損之不良情況。若薄玻璃基材破損,則無法以輥對輥方式搬送薄玻璃基材。However, thin glass substrates are more fragile than resin substrates. Therefore, if the thin glass substrate contacts the driving roller and the clamping roller from both sides in the thickness direction, there is a possibility of damage. If the thin glass substrate is damaged, it is impossible to transport the thin glass substrate in a roll-to-roll manner.
再者,本說明書中,「破損」係指薄玻璃基材遍及其厚度方向整體被撕裂,與下述「擦傷」有所區別。Furthermore, in this specification, "damage" refers to the thin glass substrate being torn throughout its thickness direction, which is different from the "scratch" described below.
本發明提供一種可抑制玻璃基材之破損,並且可將玻璃基材確實地搬送之玻璃基材之搬送裝置、積層玻璃之製造裝置及製造方法。 [解決問題之技術手段]The present invention provides a glass substrate conveying device, a laminated glass manufacturing device and a manufacturing method that can suppress damage to the glass substrate and can reliably convey the glass substrate. [Technical means for solving the problem]
本發明(1)包含一種玻璃基材之搬送裝置,其具備:捲出輥,其以捲出具有可撓性之玻璃基材之方式構成;捲取輥,其以捲取上述玻璃基材之方式構成;及驅動輥,其配置於上述玻璃基材之搬送方向上之上述捲出輥及上述捲取輥之間,以被賦予用以搬送上述玻璃基材之動力之方式構成;且上述驅動輥構成為,於上述玻璃基材及上述驅動輥接觸之狀態下,上述玻璃基材中相對於與上述驅動輥之表面接觸之接觸面相反側之非接觸面不與其他搬送構件接觸,上述驅動輥之上述表面具有0.8 μm以下之最大高度粗糙度Rz。The present invention (1) comprises a glass substrate conveying device, which comprises: a roll-out roller configured to roll out a glass substrate having flexibility; a take-up roller configured to take up the glass substrate; and a drive roller, which is arranged between the roll-out roller and the take-up roller in the conveying direction of the glass substrate and is configured to be provided with a power for conveying the glass substrate; and the drive roller is configured such that, when the glass substrate and the drive roller are in contact, a non-contact surface of the glass substrate on the opposite side to a contact surface in contact with a surface of the drive roller does not contact other conveying members, and the surface of the drive roller has a maximum height roughness Rz of 0.8 μm or less.
該玻璃基材之搬送裝置中,驅動輥於玻璃基材及驅動輥接觸之狀態下,玻璃基材中相對於與驅動輥之表面接觸之接觸面相反側之非接觸面不與其他搬送構件接觸。因此,可抑制接觸驅動輥之玻璃基材之破損。因此,可於捲出輥及捲取輥之間確實地搬送玻璃基材。In the glass substrate conveying device, when the driving roller is in contact with the glass substrate and the driving roller, the non-contact surface of the glass substrate opposite to the contact surface in contact with the surface of the driving roller does not contact other conveying members. Therefore, damage to the glass substrate in contact with the driving roller can be suppressed. Therefore, the glass substrate can be conveyed reliably between the unwinding roller and the winding roller.
而且,驅動輥之表面具有0.8 μm以下之較小之最大高度粗糙度Rz,故驅動輥之表面可密接於玻璃基材,且可抑制相對於玻璃基材滑動(驅動輥之空轉)。因此,可控制施加至玻璃基材之張力,可將驅動輥之旋轉確實地轉換為玻璃基材之搬送,從而更進一步確實地搬送玻璃基材。Furthermore, the surface of the drive roller has a relatively small maximum height roughness Rz of less than 0.8 μm, so the surface of the drive roller can be in close contact with the glass substrate and can suppress sliding relative to the glass substrate (idle rotation of the drive roller). Therefore, the tension applied to the glass substrate can be controlled, and the rotation of the drive roller can be accurately converted into the conveyance of the glass substrate, thereby further accurately conveying the glass substrate.
本發明(2)包含一種積層玻璃之製造裝置,其具備:如(1)之搬送裝置;及成膜裝置,其配置於上述搬送方向上之上述捲出輥及上述捲取輥之間,且構成為將功能層於真空下設置於上述玻璃基材。The present invention (2) comprises a manufacturing device for laminated glass, which comprises: a conveying device as in (1); and a film forming device, which is arranged between the above-mentioned unwinding roller and the above-mentioned winding roller in the above-mentioned conveying direction and is configured to place a functional layer on the above-mentioned glass substrate under vacuum.
該積層玻璃基材之搬送裝置由於具備上述搬送裝置及成膜裝置,故可抑制玻璃基材之破損,並且可將功能層設置於玻璃基材。因此,可確實地製造積層玻璃。Since the conveying device for the laminated glass substrate is equipped with the above-mentioned conveying device and film forming device, damage to the glass substrate can be suppressed and the functional layer can be provided on the glass substrate. Therefore, the laminated glass can be manufactured reliably.
本發明(3)包含一種積層玻璃之製造方法,其係使用如(2)之積層玻璃之製造裝置來製造積層玻璃的方法,且具備以下步驟:將上述玻璃基材自上述捲出輥捲出;藉由上述驅動輥搬送上述玻璃基材;藉由上述成膜裝置將上述功能層於真空下設置於上述玻璃基材;及藉由上述捲取輥捲取具備上述玻璃基材及上述功能層之積層玻璃。The present invention (3) includes a method for manufacturing laminated glass, which is a method for manufacturing laminated glass using the laminated glass manufacturing device as described in (2), and comprises the following steps: unwinding the glass substrate from the unwinding roller; transporting the glass substrate by the driving roller; placing the functional layer on the glass substrate under vacuum by the film forming device; and taking up the laminated glass having the glass substrate and the functional layer by the taking-up roller.
該積層玻璃之製造方法由於使用上述積層玻璃之搬送裝置,故可抑制玻璃基材之破損,並且將功能層設置於玻璃基材,從而可確實地製造積層玻璃。 [發明之效果]The manufacturing method of laminated glass can suppress the damage of the glass substrate by using the above-mentioned laminated glass conveying device, and the functional layer is arranged on the glass substrate, so that the laminated glass can be manufactured reliably. [Effect of the invention]
本發明之玻璃基材之搬送裝置可抑制玻璃基材之破損,並且可確實地搬送玻璃基材。The glass substrate conveying device of the present invention can suppress damage to the glass substrate and can reliably convey the glass substrate.
根據本發明之積層玻璃之製造裝置及製造方法,可抑制玻璃基材之破損,並且將功能層設置於玻璃基材。According to the manufacturing device and manufacturing method of the laminated glass of the present invention, damage to the glass substrate can be suppressed and the functional layer can be arranged on the glass substrate.
1.搬送成膜裝置 參照圖1,說明本發明之製造裝置之一實施方式之搬送成膜裝置。1. Conveying film forming device Referring to FIG1, a conveying film forming device of one embodiment of the manufacturing device of the present invention is described.
圖1所示之搬送成膜裝置10一面搬送玻璃基材1一面於其厚度方向一面51上設置透明導電層(功能層之一例)2(參照圖2C),從而製造透明導電性玻璃(積層玻璃之一例)3。具體而言,搬送成膜裝置10自卷狀之搬送基材4(下述)剝離第1保護材5而單獨搬送玻璃基材1,繼之,於玻璃基材1上設置透明導電層2而製造透明導電性玻璃3,繼之,於透明導電性玻璃3上積層第2保護材6並捲繞成卷狀。The conveying film-forming device 10 shown in FIG1 conveys a glass substrate 1 while providing a transparent conductive layer (an example of a functional layer) 2 (see FIG2C ) on one surface 51 in the thickness direction thereof, thereby manufacturing a transparent conductive glass (an example of a laminated glass) 3. Specifically, the conveying film-forming device 10 peels off a first protective material 5 from a conveying substrate 4 (described below) in a roll form and conveys the glass substrate 1 alone, then provides a transparent conductive layer 2 on the glass substrate 1 to manufacture the transparent conductive glass 3, then laminates a second protective material 6 on the transparent conductive glass 3 and winds it into a roll form.
搬送成膜裝置10具備搬送裝置11、濺鍍裝置(成膜裝置之一例)12、及冷卻裝置13。進而,搬送裝置11具備捲出部14、去靜電部15、及捲取部16。再者,去靜電部15具備第1去靜電部17及第2去靜電部18。搬送成膜裝置10自搬送方向上游側(以下,省略為「上游側」)朝搬送方向下游側(以下,省略為「下游側」)依序具備捲出部14、第1去靜電部17、濺鍍裝置12、冷卻裝置13、第2去靜電部18、及捲取部16。以下,對其等進行詳細敍述。The conveying film-forming device 10 includes a conveying device 11, a sputtering device (an example of a film-forming device) 12, and a cooling device 13. Furthermore, the conveying device 11 includes a roll-out section 14, a destaticizing section 15, and a take-up section 16. Furthermore, the destaticizing section 15 includes a first destaticizing section 17 and a second destaticizing section 18. The conveying film-forming device 10 includes a roll-out section 14, a first destaticizing section 17, a sputtering device 12, a cooling device 13, a second destaticizing section 18, and a take-up section 16 in order from the upstream side in the conveying direction (hereinafter, abbreviated as the "upstream side") toward the downstream side in the conveying direction (hereinafter, abbreviated as the "downstream side"). The following describes them in detail.
捲出部14於搬送裝置11中配置於最上游側。捲出部14捲出長條之搬送基材4。捲出部14具備捲出輥21、第1驅動輥(驅動輥之一例)22、保護材捲取輥23、及捲出外殼24。The unwinding unit 14 is disposed at the most upstream side in the conveying device 11. The unwinding unit 14 unwinds the long conveying substrate 4. The unwinding unit 14 includes an unwinding roller 21, a first driving roller (an example of a driving roller) 22, a protective material taking-up roller 23, and an unwinding casing 24.
於捲出輥21上,置有卷狀之搬送基材4。即,於捲出輥21之表面(周面),捲繞有搬送方向上為長條之搬送基材4。捲出輥21為圓柱構件,其具有沿搬送方向旋轉之旋轉軸,且於寬度方向上延伸。再者,本實施方式中,下述各種輥(捲出輥21、第1~第2驅動輥(22、40)、保護材捲取輥23、第1~第4導輥(26、28、31、38)、保護材導輥43、第1~第2冷卻輥(34、35)、捲取輥41、保護材捲出輥42、夾輥44)均為圓柱構件,即,具有沿搬送方向旋轉之旋轉軸,且於寬度方向(與搬送方向及厚度方向正交之方向)上延伸。The roll-shaped conveying substrate 4 is placed on the unwinding roller 21. That is, the conveying substrate 4 is long in the conveying direction and is wound on the surface (circumference) of the unwinding roller 21. The unwinding roller 21 is a cylindrical member having a rotation axis that rotates in the conveying direction and extending in the width direction. Furthermore, in the present embodiment, the following various rollers (roll-out roller 21, 1st to 2nd driving rollers (22, 40), protective material take-up roller 23, 1st to 4th guide rollers (26, 28, 31, 38), protective material guide roller 43, 1st to 2nd cooling rollers (34, 35), take-up roller 41, protective material roll-out roller 42, clamping roller 44) are all cylindrical components, that is, they have a rotation axis that rotates along the conveying direction and extend in the width direction (a direction orthogonal to the conveying direction and the thickness direction).
捲出輥21構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The unwinding roller 21 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1 .
第1驅動輥22配置於捲出輥21之下游側。第1驅動輥22構成為自外部被賦予用以搬送玻璃基材1之動力。藉此,第1驅動輥22基於上述外部動力而沿圖1所示之箭頭方向旋轉。具體而言,於第1驅動輥22之旋轉軸之端部,設置有齒輪(未圖示),於齒輪上,連接有用以使第1驅動輥22沿箭頭方向旋轉之馬達(未圖示)。第1驅動輥22藉由馬達之驅動力而旋轉。The first drive roller 22 is disposed on the downstream side of the unwinding roller 21. The first drive roller 22 is configured to be externally provided with a power for conveying the glass substrate 1. Thus, the first drive roller 22 rotates in the direction of the arrow shown in FIG. 1 based on the external power. Specifically, a gear (not shown) is provided at the end of the rotation shaft of the first drive roller 22, and a motor (not shown) is connected to the gear for rotating the first drive roller 22 in the direction of the arrow. The first drive roller 22 rotates by the driving force of the motor.
藉此,第1驅動輥22將置於捲出輥21上之搬送基材4之玻璃基材1搬送至第1去靜電部17。Thereby, the first driving roller 22 transports the glass substrate 1 of the transport substrate 4 placed on the unwinding roller 21 to the first destaticizing section 17 .
又,該第1驅動輥22不同於與夾輥44鄰接配置之第2驅動輥40(下述),構成為於與玻璃基材1之厚度方向一面(接觸面)51(參照圖2B)接觸之狀態下,玻璃基材1之厚度方向另一面(非接觸面)52(參照圖2B)不與其他搬送構件(夾輥44等)接觸。Furthermore, the first driving roller 22 is different from the second driving roller 40 (described below) arranged adjacent to the clamping roller 44, and is configured such that when the first driving roller 22 is in contact with one surface (contact surface) 51 (see FIG. 2B ) in the thickness direction of the glass substrate 1, the other surface (non-contact surface) 52 (see FIG. 2B ) in the thickness direction of the glass substrate 1 is not in contact with other conveying components (clamping roller 44, etc.).
作為第1驅動輥22之材料,並未特別限定,可列舉例如金屬、樹脂、陶瓷等,較佳可列舉金屬。The material of the first driving roller 22 is not particularly limited, and examples thereof include metal, resin, ceramic, etc., and preferably metal.
第1驅動輥22之表面平坦,具體而言,具有0.8 μm以下之最大高度粗糙度Rz。The surface of the first driving roller 22 is flat, and specifically, has a maximum height roughness Rz of 0.8 μm or less.
再者,第1驅動輥22之表面之最大高度粗糙度Rz係基於JIS B 0601(2009)而測定。In addition, the maximum height roughness Rz of the surface of the first driving roller 22 is measured based on JIS B 0601 (2009).
若第1驅動輥22之表面之最大高度粗糙度Rz超過0.8 μm,則無法抑制第1驅動輥22之表面相對於玻璃基材1滑動,亦即,第1驅動輥22相對於玻璃基材1空轉。因此,無法控制施加至玻璃基材1之張力,無法將第1驅動輥22之材料之旋轉確實地轉換為玻璃基材1之搬送,從而無法搬送玻璃基材1。If the maximum height roughness Rz of the surface of the first drive roller 22 exceeds 0.8 μm, the surface of the first drive roller 22 cannot be suppressed from sliding relative to the glass substrate 1, that is, the first drive roller 22 idles relative to the glass substrate 1. Therefore, the tension applied to the glass substrate 1 cannot be controlled, and the rotation of the material of the first drive roller 22 cannot be reliably converted into the conveyance of the glass substrate 1, so that the glass substrate 1 cannot be conveyed.
又,第1驅動輥22之表面具有較佳為0.5 μm以下、更佳為0.3 μm以下之最大高度粗糙度Rz。又,第1驅動輥22之表面例如具有較佳為0.001 μm以上之最大高度粗糙度Rz。The surface of the first driving roller 22 preferably has a maximum height roughness Rz of 0.5 μm or less, more preferably 0.3 μm or less. The surface of the first driving roller 22 preferably has a maximum height roughness Rz of 0.001 μm or more, for example.
若第1驅動輥22之表面之最大高度粗糙度Rz為上述上限以下,則可抑制第1驅動輥22之表面相對於玻璃基材1滑動,可控制施加至玻璃基材1之張力,且可抑制第1驅動輥22相對於玻璃基材1空轉。因此,可將第1驅動輥22之材料之旋轉確實地轉換為玻璃基材1之搬送,從而可更進一步確實地搬送玻璃基材1。If the maximum height roughness Rz of the surface of the first drive roller 22 is below the upper limit, the surface of the first drive roller 22 can be suppressed from sliding relative to the glass substrate 1, the tension applied to the glass substrate 1 can be controlled, and the first drive roller 22 can be suppressed from idling relative to the glass substrate 1. Therefore, the rotation of the material of the first drive roller 22 can be reliably converted into the conveyance of the glass substrate 1, so that the glass substrate 1 can be further reliably conveyed.
若第1驅動輥22之表面之最大高度粗糙度Rz為上述下限以上,則可確實地搬送玻璃基材1。When the maximum height roughness Rz of the surface of the first driving roller 22 is equal to or greater than the above lower limit, the glass substrate 1 can be reliably conveyed.
為了將第1驅動輥22之表面設定為上述最大高度粗糙度Rz,例如對驅動輥22之表面進行平坦化處理。作為平坦化處理,並未特別限定,例如可列舉電鍍、無電解鍍覆、研磨等。或者,亦可預先準備具有上述最大高度粗糙度Rz之表面之第1驅動輥22。In order to set the surface of the first driving roller 22 to the above-mentioned maximum height roughness Rz, for example, the surface of the driving roller 22 is flattened. The flattening process is not particularly limited, and examples thereof include electroplating, electroless plating, and polishing. Alternatively, the first driving roller 22 having the surface of the above-mentioned maximum height roughness Rz may be prepared in advance.
保護材捲取輥23配置於捲出輥21之附近。保護材捲取輥23使第1保護材5自搬送基材4剝離(離開),並且捲取第1保護材5。保護材捲取輥23構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The protective material take-up roller 23 is disposed near the unwinding roller 21. The protective material take-up roller 23 peels (leaves) the first protective material 5 from the conveying substrate 4 and takes up the first protective material 5. The protective material take-up roller 23 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1 .
捲出外殼24於其內部收容捲出輥21、第1驅動輥22及保護材捲取輥23。捲出外殼24係以將其內部調節成真空狀態之方式構成。具體而言,於捲出外殼24上,連接有將其內部之空氣排出至外部之真空泵(未圖示)。再者,本說明書中,所謂真空狀態係指例如氣壓為0.1 Pa以下、較佳為1×10-3 Pa以下之狀態。The roll-out housing 24 accommodates the roll-out roller 21, the first drive roller 22 and the protective material take-up roller 23 therein. The roll-out housing 24 is configured so that the interior thereof is adjusted to a vacuum state. Specifically, a vacuum pump (not shown) is connected to the roll-out housing 24 to discharge the air inside thereof to the outside. Furthermore, in this specification, the so-called vacuum state refers to, for example, a state in which the air pressure is below 0.1 Pa, preferably below 1×10 -3 Pa.
第1去靜電部17以與捲出部14鄰接之方式配置於捲出部14之下游側。第1去靜電部17對玻璃基材1去除靜電。第1去靜電部17具備第1去靜電機25、第1導輥26、及第1去靜電外殼27。The first destaticizing section 17 is disposed on the downstream side of the unwinding section 14 so as to be adjacent to the unwinding section 14. The first destaticizing section 17 removes static electricity from the glass substrate 1. The first destaticizing section 17 includes a first destaticizing motor 25, a first guide roller 26, and a first destaticizing housing 27.
第1去靜電機25使玻璃基材1所帶之電減少。第1去靜電機25配置於第1驅動輥22之下游側且第1導輥26之上游側。作為第1去靜電機25,可列舉例如電暈放電式去靜電機、游離輻射式去靜電機等。The first anti-static machine 25 reduces the charge on the glass substrate 1. The first anti-static machine 25 is disposed downstream of the first drive roller 22 and upstream of the first guide roller 26. Examples of the first anti-static machine 25 include a scotoma discharge type anti-static machine and an ionizing radiation type anti-static machine.
第1導輥26將自第1驅動輥22通過第1去靜電機25搬送之玻璃基材1引導(guide)至濺鍍裝置12之第2導輥28。第1導輥26配置於第1去靜電機25之下游側且第2導輥28之上游側。The first guide roller 26 guides the glass substrate 1 conveyed from the first drive roller 22 through the first destaticizer 25 to the second guide roller 28 of the sputtering device 12. The first guide roller 26 is disposed downstream of the first destaticizer 25 and upstream of the second guide roller 28.
作為第1導輥26之材料,並未特別限定,可列舉例如金屬、樹脂、陶瓷等,較佳可列舉金屬。The material of the first guide roller 26 is not particularly limited, and examples thereof include metal, resin, ceramic, etc., and preferably metal.
第1導輥26之表面具有例如1.0 μm以上、較佳為2 μm以上、更佳為5 μm以上、進而較佳為10 μm以上之最大高度粗糙度Rz,又,具有例如較佳為100 μm以下、更佳為50 μm以下、進而較佳為30 μm以下之最大高度粗糙度Rz。The surface of the first guide roller 26 has a maximum height roughness Rz of, for example, 1.0 μm or more, preferably 2 μm or more, more preferably 5 μm or more, and further preferably 10 μm or more, and has a maximum height roughness Rz of, for example, preferably 100 μm or less, more preferably 50 μm or less, and further preferably 30 μm or less.
若第1導輥26之表面為上述下限以上,則可有效地抑制玻璃基材1黏連於第1導輥26之表面。因此,無需對搬送中之玻璃基材1施加較大張力,因此,第1導輥26可確實地引導玻璃基材1。If the surface of the first guide roller 26 is greater than the above lower limit, the glass substrate 1 can be effectively prevented from adhering to the surface of the first guide roller 26. Therefore, it is not necessary to apply a large tension to the glass substrate 1 being transported, and the first guide roller 26 can reliably guide the glass substrate 1.
另一方面,若第1導輥26之表面為上述上限以下,則可抑制玻璃基材1之表面(厚度方向一面及另一面)擦傷。On the other hand, if the surface of the first guide roller 26 is equal to or smaller than the above upper limit, scratches on the surface (one surface and the other surface in the thickness direction) of the glass substrate 1 can be suppressed.
為了設定第1導輥26之表面之最大高度粗糙度Rz,例如,準備表面平坦之第1導輥26,其後,對第1導輥26之表面進行粗化處理(粗面化)。作為粗化處理,並未特別限定。作為粗化處理之具體例,可列舉例如熔射(例如,日本專利特開2017-0665189號公報等中所記載之熔射皮膜之形成)、無電解鍍覆(例如,日本專利特開2016-103138號公報等中所記載之熔射皮膜之形成)、噴砂、蝕刻等。或者,亦可準備預先具有上述最大高度粗糙度Rz之表面之第1導輥26。In order to set the maximum height roughness Rz of the surface of the first guide roller 26, for example, a first guide roller 26 having a flat surface is prepared, and then the surface of the first guide roller 26 is roughened (roughened). The roughening treatment is not particularly limited. Specific examples of the roughening treatment include, for example, thermal spraying (for example, the formation of a thermal spray film as described in Japanese Patent Laid-Open No. 2017-0665189, etc.), electroless plating (for example, the formation of a thermal spray film as described in Japanese Patent Laid-Open No. 2016-103138, etc.), sandblasting, etching, etc. Alternatively, the first guide roller 26 having a surface having the above-mentioned maximum height roughness Rz in advance may be prepared.
第1去靜電外殼27於其內部收容第1去靜電機25及第1導輥26。第1去靜電外殼27係以將其內部調節成真空狀態之方式構成。The first anti-static housing 27 accommodates the first anti-static motor 25 and the first guide roller 26 therein. The first anti-static housing 27 is configured so that the interior thereof is adjusted to a vacuum state.
濺鍍裝置12以與第1去靜電部17鄰接之方式配置於第1去靜電部17之下游側。濺鍍裝置12於成膜區域33對玻璃基材1實施濺鍍,而形成透明導電層2(參照圖2C)。The sputtering device 12 is disposed on the downstream side of the first destaticizing section 17 so as to be adjacent to the first destaticizing section 17. The sputtering device 12 performs sputtering on the glass substrate 1 in the film forming area 33 to form a transparent conductive layer 2 (see FIG. 2C).
濺鍍裝置12具備第2導輥28、濺鍍靶29、加熱機30、第3導輥31、及濺鍍外殼32。The sputtering device 12 includes a second guide roller 28 , a sputtering target 29 , a heater 30 , a third guide roller 31 , and a sputtering housing 32 .
第2導輥28將自第1導輥26搬送之玻璃基材1引導(guide)至成膜區域33。第2導輥28配置於第1導輥26之下游側且濺鍍靶29之上游側。第2導輥28之構成與第1導輥26之構成相同。The second guide roller 28 guides the glass substrate 1 conveyed by the first guide roller 26 to the film forming area 33. The second guide roller 28 is disposed on the downstream side of the first guide roller 26 and on the upstream side of the sputtering target 29. The configuration of the second guide roller 28 is the same as that of the first guide roller 26.
濺鍍靶29為透明導電層2之原材料。濺鍍靶29於第2導輥28之下游側且第3導輥31之上游側與玻璃基材1隔開間隔地對向配置。濺鍍靶29面向玻璃基材1之厚度方向一面51。The sputtering target 29 is a raw material of the transparent conductive layer 2. The sputtering target 29 is disposed opposite to the glass substrate 1 at a distance from the downstream side of the second guide roller 28 and the upstream side of the third guide roller 31. The sputtering target 29 faces one surface 51 of the glass substrate 1 in the thickness direction.
作為濺鍍靶29之材料,可列舉例如包含選自由In、Sn、Zn、Ga、Sb、Nb、Ti、Si、Zr、Mg、Al、Au、Ag、Cu、Pd、W所組成之群中之至少1種金屬之金屬氧化物。具體而言,可列舉例如銦錫複合氧化物(ITO)等含銦氧化物、例如銻錫複合氧化物(ATO)等含銻氧化物等,較佳可列舉含銦氧化物,更佳可列舉ITO。As the material of the sputtering target 29, for example, there can be listed metal oxides containing at least one metal selected from the group consisting of In, Sn, Zn, Ga, Sb, Nb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W. Specifically, there can be listed indium-containing oxides such as indium-tin composite oxide (ITO), antimony-containing oxides such as antimony-tin composite oxide (ATO), etc., preferably, there can be listed indium-containing oxides, and more preferably, there can be listed ITO.
加熱機30對玻璃基材1及自其獲得之透明導電性玻璃3進行加熱。於第2導輥28之下游側且第3導輥31之上游側,與玻璃基材1隔開間隔地配置。又,以玻璃基材1為基準,加熱機30對向配置於與濺鍍靶29相反側。加熱機30面向玻璃基材1之厚度方向另一面52。The heater 30 heats the glass substrate 1 and the transparent conductive glass 3 obtained therefrom. The heater 30 is disposed at a distance from the glass substrate 1 on the downstream side of the second guide roller 28 and the upstream side of the third guide roller 31. The heater 30 is disposed opposite to the sputtering target 29 with respect to the glass substrate 1. The heater 30 faces the other side 52 of the glass substrate 1 in the thickness direction.
成膜區域33被劃分在第2導輥28與第3導輥31之搬送方向中途。於成膜區域33,配置有濺鍍靶29及加熱機30。The film forming area 33 is divided in the middle of the conveying direction of the second guide roller 28 and the third guide roller 31. In the film forming area 33, a sputtering target 29 and a heater 30 are arranged.
第3導輥31將成膜後之玻璃基材1(具體而言為於厚度方向具備玻璃基材1及透明導電層2之透明導電性玻璃3)(參照圖2C)引導(guide)至冷卻裝置13之第1冷卻輥34。第3導輥31配置於濺鍍靶29之下游側且第1冷卻輥34(下述)之上游側。第3導輥31之構成與第1導輥26之構成相同。The third guide roller 31 guides the glass substrate 1 (specifically, the transparent conductive glass 3 having the glass substrate 1 and the transparent conductive layer 2 in the thickness direction) (see FIG. 2C ) after film formation to the first cooling roller 34 of the cooling device 13. The third guide roller 31 is arranged on the downstream side of the sputtering target 29 and the upstream side of the first cooling roller 34 (described below). The structure of the third guide roller 31 is the same as that of the first guide roller 26.
濺鍍外殼32收容第2導輥28、濺鍍靶29、加熱機30及第3導輥31。濺鍍外殼32構成包含成膜區域33之成膜室。濺鍍外殼32係以將其內部調節成真空狀態之方式構成。再者,雖未圖示,但濺鍍裝置12具備用以實施濺鍍之其他元件(陽極、陰極、Ar氣體導入器件等)。作為濺鍍裝置12,具體而言,可列舉例如二極型濺鍍裝置、電子回旋共振型濺鍍裝置、磁控型濺鍍裝置、離子束型濺鍍裝置等。The sputtering housing 32 accommodates the second guide roller 28, the sputtering target 29, the heater 30, and the third guide roller 31. The sputtering housing 32 constitutes a film forming chamber including a film forming area 33. The sputtering housing 32 is constructed in such a way that the inside thereof is adjusted to a vacuum state. Furthermore, although not shown, the sputtering device 12 is equipped with other elements (anode, cathode, Ar gas introduction device, etc.) for performing sputtering. As the sputtering device 12, specifically, for example, a diode type sputtering device, an electron cyclotron resonance type sputtering device, a magnetron type sputtering device, an ion beam type sputtering device, etc. can be listed.
冷卻裝置13以與濺鍍裝置12鄰接之方式配置於濺鍍裝置12之下游側。冷卻裝置13將經濺鍍裝置12加熱後之透明導電性玻璃3冷卻。冷卻裝置13具備第1冷卻輥34、第2冷卻輥35、及冷卻外殼36。The cooling device 13 is disposed downstream of the sputtering device 12 in such a manner as to be adjacent to the sputtering device 12. The cooling device 13 cools the transparent conductive glass 3 heated by the sputtering device 12. The cooling device 13 includes a first cooling roller 34, a second cooling roller 35, and a cooling housing 36.
第1冷卻輥34於冷卻裝置13中配置於上游側。第2冷卻輥35配置於第1冷卻輥34之下游側。第1冷卻輥34及第2冷卻輥35分別構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The first cooling roller 34 is disposed on the upstream side in the cooling device 13. The second cooling roller 35 is disposed on the downstream side of the first cooling roller 34. The first cooling roller 34 and the second cooling roller 35 are respectively configured to rotate in the arrow direction shown in FIG. 1 by being driven by an external power or the like.
構成為,第1冷卻輥34及第2冷卻輥35之表面溫度例如為280℃以下,較佳為150℃以下,又,例如維持於40℃以上,較佳為100℃以上。The surface temperature of the first cooling roller 34 and the second cooling roller 35 is, for example, 280° C. or less, preferably 150° C. or less, and is, for example, maintained at 40° C. or more, preferably 100° C. or more.
冷卻外殼36於其內部收容第1冷卻輥34及第2冷卻輥35。冷卻外殼36係以將其內部調節成真空狀態之方式構成。The cooling housing 36 accommodates the first cooling roller 34 and the second cooling roller 35 therein. The cooling housing 36 is configured so that the interior thereof is adjusted to a vacuum state.
第2去靜電部18以與冷卻裝置13鄰接之方式配置於冷卻裝置13之下游側。第2去靜電部18對透明導電性玻璃3去除靜電。第2去靜電部18具備第2去靜電機37、第4導輥38、及第2去靜電外殼39。The second destaticizing section 18 is disposed on the downstream side of the cooling device 13 so as to be adjacent to the cooling device 13. The second destaticizing section 18 removes static electricity from the transparent conductive glass 3. The second destaticizing section 18 includes a second destaticizing motor 37, a fourth guide roller 38, and a second destaticizing housing 39.
第2去靜電機37使玻璃基材1所帶之電減少。第2去靜電機37配置於第2冷卻輥35之下游側且第4導輥38之上游側。第2去靜電機37之構成與第1去靜電機25之構成相同。The second anti-static machine 37 reduces the charge on the glass substrate 1. The second anti-static machine 37 is disposed on the downstream side of the second cooling roller 35 and the upstream side of the fourth guide roller 38. The structure of the second anti-static machine 37 is the same as that of the first anti-static machine 25.
第4導輥38將自第2冷卻輥35通過第2去靜電機37搬送之透明導電性玻璃3引導(guide)至捲取部16之第2驅動輥40。第4導輥38配置於第2去靜電機37之下游側且第2驅動輥40之上游側。第4導輥38之構成與第1導輥26之構成相同。The fourth guide roller 38 guides the transparent conductive glass 3 conveyed from the second cooling roller 35 through the second destaticizing motor 37 to the second drive roller 40 of the take-up section 16. The fourth guide roller 38 is disposed downstream of the second destaticizing motor 37 and upstream of the second drive roller 40. The fourth guide roller 38 has the same structure as the first guide roller 26.
第2去靜電外殼39於其內部收容第2去靜電機37及第4導輥38。第2去靜電外殼39係以將其內部調節成真空狀態之方式構成。The second anti-static housing 39 accommodates the second anti-static motor 37 and the fourth guide roller 38 therein. The second anti-static housing 39 is configured so that the interior thereof is adjusted to a vacuum state.
捲取部16於搬送裝置11中配置於最下游側,且以與第2去靜電機37鄰接之方式配置於第2去靜電機37之下游側。捲取部16將透明導電性玻璃3與第2保護材6(參照圖2D)一起捲取。捲取部16具備第2驅動輥40、捲取輥41、保護材捲出輥42、保護材導輥43、夾輥44、及捲取外殼45。The take-up unit 16 is disposed at the most downstream side in the conveying device 11, and is disposed downstream of the second anti-static motor 37 in a manner adjacent to the second anti-static motor 37. The take-up unit 16 takes up the transparent conductive glass 3 together with the second protective material 6 (see FIG. 2D). The take-up unit 16 includes a second driving roller 40, a take-up roller 41, a protective material take-out roller 42, a protective material guide roller 43, a clamping roller 44, and a take-up housing 45.
第2驅動輥40配置於第4導輥38之下游側且捲取輥41之上游側。第2驅動輥40構成為自外部被賦予用以搬送包含玻璃基材1之透明導電性玻璃3之動力。藉此,第2驅動輥40基於上述外部動力而沿圖1所示之箭頭方向旋轉。藉此,第2驅動輥40將透明導電性玻璃3搬送至捲取輥41。The second drive roller 40 is disposed downstream of the fourth guide roller 38 and upstream of the take-up roller 41. The second drive roller 40 is configured to be externally provided with a power for conveying the transparent conductive glass 3 including the glass substrate 1. Thus, the second drive roller 40 rotates in the direction of the arrow shown in FIG. 1 based on the external power. Thus, the second drive roller 40 conveys the transparent conductive glass 3 to the take-up roller 41.
但是,第2驅動輥40構成為,於與透明導電性玻璃3之厚度方向一面53接觸之狀態下,第2保護材6之厚度方向另一面54與夾輥44接觸。亦即,第2驅動輥40及夾輥44構成夾持機構。However, the second driving roller 40 is configured such that the other surface 54 in the thickness direction of the second protective material 6 contacts the clamping roller 44 while the second driving roller 40 contacts the one surface 53 in the thickness direction of the transparent conductive glass 3. That is, the second driving roller 40 and the clamping roller 44 constitute a clamping mechanism.
第2驅動輥40之表面之最大高度粗糙度Rz並未特別限定。第2驅動輥40之表面之最大高度粗糙度Rz例如大於第1驅動輥22之表面之最大高度粗糙度Rz,具體而言,超過0.8 μm。The maximum height roughness Rz of the surface of the second driving roller 40 is not particularly limited. The maximum height roughness Rz of the surface of the second driving roller 40 is, for example, greater than the maximum height roughness Rz of the surface of the first driving roller 22, and specifically, exceeds 0.8 μm.
捲取輥41捲取自第2驅動輥40與夾輥44之間搬送之透明導電性玻璃3及第2保護材6之積層體7(下述)。捲取輥41構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The take-up roller 41 takes up the laminate 7 (described below) of the transparent conductive glass 3 and the second protective material 6 conveyed between the second drive roller 40 and the clamping roller 44. The take-up roller 41 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1 .
保護材捲出輥42配置於捲取輥41之附近。於保護材捲出輥42上,置有卷狀之第2保護材6。即,於保護材捲出輥42之表面,捲繞有搬送方向上為長條之第2保護材6。保護材捲出輥42構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。保護材捲出輥42將第2保護材6捲出至保護材導輥43。The protective material unwinding roller 42 is arranged near the take-up roller 41. A second protective material 6 in a roll is placed on the protective material unwinding roller 42. That is, the second protective material 6 which is long in the conveying direction is wound on the surface of the protective material unwinding roller 42. The protective material unwinding roller 42 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1. The protective material unwinding roller 42 unwinds the second protective material 6 to the protective material guide roller 43.
保護材導輥43將自保護材捲出輥42捲出之第2保護材6引導至夾輥44。保護材導輥43配置於保護材捲出輥42與夾輥44之搬送方向中途。The protective material guide roller 43 guides the second protective material 6 rolled out from the protective material roll-out roller 42 to the clamp roller 44. The protective material guide roller 43 is disposed midway between the protective material roll-out roller 42 and the clamp roller 44 in the conveying direction.
夾輥44與第2驅動輥40一起使第2保護材6積層於透明導電性玻璃3。夾輥44與第2驅動輥40對向配置。夾輥44構成為,其表面能夠與第2驅動輥40之表面將透明導電性玻璃3及第2保護材6夾住並且進行層壓。夾輥44之材料可列舉例如橡膠等彈性體。The clamping roller 44 and the second driving roller 40 together laminate the second protective material 6 on the transparent conductive glass 3. The clamping roller 44 is disposed opposite to the second driving roller 40. The clamping roller 44 is configured so that its surface can sandwich and laminate the transparent conductive glass 3 and the second protective material 6 with the surface of the second driving roller 40. The material of the clamping roller 44 can be, for example, an elastic body such as rubber.
捲取外殼45於其內部收容第2驅動輥40、捲取輥41、保護材捲出輥42、保護材導輥43及夾輥44。捲取外殼45係以將其內部調節成真空狀態之方式構成。The reel housing 45 accommodates the second driving roller 40, the reeling roller 41, the protective material reeling roller 42, the protective material guide roller 43 and the clamping roller 44. The reel housing 45 is configured so that the inside thereof is adjusted to a vacuum state.
2.透明導電性玻璃之製造方法 參照圖1及圖2A~圖2D,對使用搬送成膜裝置10製造透明導電性玻璃3之方法進行說明。透明導電性玻璃3之製造方法具備:準備步驟,其係準備搬送基材4;剝離步驟,其係自玻璃基材1將第1保護材5剝離;搬送步驟,其係藉由第1~第2驅動輥(22、40)搬送玻璃基材1;引導步驟,其係藉由第1~第4導輥(26、28、31、38)引導玻璃基材1;成膜步驟,其係將透明導電層2於真空下設置於玻璃基材1;冷卻步驟,其係冷卻透明導電性玻璃3;及捲取步驟,其係將透明導電性玻璃3捲取至捲取輥41。以下,詳細敍述各步驟。2. Method for manufacturing transparent conductive glass With reference to FIG. 1 and FIG. 2A to FIG. 2D , a method for manufacturing transparent conductive glass 3 using a conveying film-forming device 10 is described. The manufacturing method of transparent conductive glass 3 comprises: a preparation step of preparing a transfer substrate 4; a stripping step of stripping a first protective material 5 from a glass substrate 1; a transfer step of transferring the glass substrate 1 by first to second drive rollers (22, 40); a guiding step of guiding the glass substrate 1 by first to fourth guide rollers (26, 28, 31, 38); a film forming step of placing a transparent conductive layer 2 on the glass substrate 1 under vacuum; a cooling step of cooling the transparent conductive glass 3; and a winding step of winding the transparent conductive glass 3 onto a winding roller 41. Each step is described in detail below.
首先,於捲出輥21上準備搬送基材4(準備步驟)。具體而言,準備搬送基材4,且置於捲出輥21上。First, the substrate 4 is prepared to be transported on the unwinding roller 21 (preparation step). Specifically, the substrate 4 is prepared to be transported and placed on the unwinding roller 21.
搬送基材4係帶保護材之玻璃基材,具體而言,朝厚度方向另一側依序具備玻璃基材1與第1保護材5(參照圖2A)。搬送基材4於搬送方向上為長條,且捲繞成卷狀。此種卷狀之搬送基材4可使用公知或市售者。The transport substrate 4 is a glass substrate with a protective material. Specifically, it has a glass substrate 1 and a first protective material 5 in sequence on the other side in the thickness direction (see FIG. 2A ). The transport substrate 4 is long in the transport direction and is rolled into a roll. Such a roll-shaped transport substrate 4 can use a known or commercially available one.
玻璃基材1具有膜狀(包含片狀),且由透明之玻璃形成。作為玻璃,可列舉例如無鹼玻璃、鈉玻璃、硼矽酸玻璃、鋁矽玻璃等。The glass substrate 1 has a film shape (including a sheet shape) and is formed of transparent glass. Examples of the glass include alkali-free glass, sodium glass, borosilicate glass, and aluminosilicate glass.
玻璃基材1具有可撓性。The glass substrate 1 has flexibility.
另一方面,玻璃基材1之機械強度通常較低(脆弱),下述測定之彎曲試驗中之斷裂時之兩端部間距離L例如為15 mm以下、或20 mm以下。On the other hand, the mechanical strength of the glass substrate 1 is generally low (fragile), and the distance L between both ends at the time of fracture in the bending test measured below is, for example, 15 mm or less, or 20 mm or less.
如圖4所示,具體而言,將玻璃基材1切斷加工成長度120 mm,且將其長度方向兩端部卡於隔開間隔對向配置之2個治具81各者之卡住部82。繼而,使2個治具81相互緩慢靠近,獲得玻璃基材1斷裂時2個卡住部82間之長度L作為斷裂時之兩端部間距離L。As shown in FIG4 , specifically, the glass substrate 1 is cut into a length of 120 mm, and both ends in the length direction are clamped in the clamping parts 82 of two jigs 81 arranged opposite to each other at a distance. Then, the two jigs 81 are slowly brought closer to each other, and the length L between the two clamping parts 82 when the glass substrate 1 is broken is obtained as the distance L between the two ends when breaking.
玻璃基材1之厚度方向另一面52平坦。具體而言,玻璃基材1之厚度方向另一面52具有例如1 μm以下、進而0.1 μm以下、進而0.01 μm以下之最大高度粗糙度Rz,又,具有例如0.0001 μm以上之最大高度粗糙度Rz。與上述另一面52同樣,玻璃基材1之厚度方向一面51平坦,且具有上述最大高度粗糙度Rz。The other side 52 in the thickness direction of the glass substrate 1 is flat. Specifically, the other side 52 in the thickness direction of the glass substrate 1 has a maximum height roughness Rz of, for example, 1 μm or less, further, 0.1 μm or less, further, 0.01 μm or less, and further, has a maximum height roughness Rz of, for example, 0.0001 μm or more. Similar to the other side 52, the one side 51 in the thickness direction of the glass substrate 1 is flat and has the above-mentioned maximum height roughness Rz.
玻璃基材1之厚度例如為250 μm以下,較佳為200 μm以下,更佳為150 μm以下,進而較佳為100 μm以下,又,例如為10 μm以上,較佳為40 μm以上。The thickness of the glass substrate 1 is, for example, 250 μm or less, preferably 200 μm or less, more preferably 150 μm or less, further preferably 100 μm or less, and, for example, 10 μm or more, preferably 40 μm or more.
此種玻璃基材1可使用市售品,例如可使用G-leaf系列(日本電氣硝子公司製造)等。As such a glass substrate 1, a commercially available product can be used, for example, G-leaf series (manufactured by Nippon Electric Glass Co., Ltd.) and the like can be used.
第1保護材5防止於捲出卷狀之玻璃基材1時因玻璃基材1彼此接觸而導致破損。第1保護材5具有膜狀,配置於玻璃基材1之厚度方向另一面52。The first protective material 5 prevents damage to the glass substrates 1 due to contact between each other when the rolled glass substrate 1 is unrolled. The first protective material 5 has a film shape and is disposed on the other surface 52 of the glass substrate 1 in the thickness direction.
作為第1保護材5,可列舉例如帶黏著劑之膜、間隔紙等。Examples of the first protective material 5 include a film with an adhesive, a spacer paper, and the like.
帶黏著劑之膜於厚度方向上具備高分子膜與黏著劑層。The film with adhesive has a polymer film and an adhesive layer in the thickness direction.
作為高分子膜,可列舉例如聚酯系膜(聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚萘二甲酸乙二酯膜等)、聚碳酸酯系膜、烯烴系膜(聚乙烯膜、聚丙烯膜、環烯烴膜等)、丙烯酸系膜、聚醚碸系膜、聚芳酯系膜、三聚氰胺系膜、聚醯胺系膜、聚醯亞胺系膜、纖維素系膜、及聚苯乙烯系膜。Examples of the polymer film include polyester films (polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, etc.), polycarbonate films, olefin films (polyethylene films, polypropylene films, cycloolefin films, etc.), acrylic films, polyether sulfone films, polyarylate films, melamine films, polyamide films, polyimide films, cellulose films, and polystyrene films.
黏著劑層為感壓接著劑層,可列舉例如丙烯酸系黏著劑層、橡膠系黏著劑層、矽酮系黏著劑層、聚酯系黏著劑層、聚胺基甲酸酯系黏著劑層、聚醯胺系黏著劑層、環氧系黏著劑層、乙烯基烷基醚系黏著劑層、氟系黏著劑層等。The adhesive layer is a pressure-sensitive adhesive layer, for example, an acrylic adhesive layer, a rubber adhesive layer, a silicone adhesive layer, a polyester adhesive layer, a polyurethane adhesive layer, a polyamide adhesive layer, an epoxy adhesive layer, a vinyl alkyl ether adhesive layer, a fluorine adhesive layer, etc.
作為間隔紙,可列舉例如道林紙、日本紙、牛皮紙、玻璃紙、合成紙、面漆紙等。Examples of the spacer paper include woodfree paper, Japanese paper, kraft paper, glassine paper, synthetic paper, and coated paper.
第1保護材5之厚度例如為10 μm以上,較佳為30 μm以上,又,例如為1000 μm以下,較佳為500 μm以下。The thickness of the first protective material 5 is, for example, not less than 10 μm, preferably not less than 30 μm, and, for example, not more than 1000 μm, preferably not more than 500 μm.
繼之,使搬送成膜裝置10作動。具體而言,使所有外殼(捲出外殼24、第1去靜電外殼27、濺鍍外殼32、冷卻外殼36、第2去靜電外殼39、捲取外殼45)為真空,並且使所有驅動輥(捲出輥21、第1~第2驅動輥(22、40)、保護材捲取輥23、第1~第2冷卻輥(34、35)、捲取輥41、保護材捲出輥42)旋轉驅動。又,亦使去靜電部15(第1去靜電機25及第2去靜電機37)、冷卻裝置13、濺鍍裝置12等作動。藉此,將搬送基材4搬送至下游側(搬送步驟),並且依序實施剝離步驟、成膜步驟、冷卻步驟、及捲取步驟。又,藉由所有導輥(第1導輥26、第2導輥28、第3導輥31、第4導輥38)、保護材捲取輥23、保護材捲出輥42、保護材導輥43、及夾輥44之旋轉而實施引導步驟。Next, the film-forming conveyor 10 is operated. Specifically, all the housings (the unwinding housing 24, the first destaticizing housing 27, the sputtering housing 32, the cooling housing 36, the second destaticizing housing 39, and the reeling housing 45) are evacuated, and all the driving rollers (the unwinding roller 21, the first and second driving rollers (22, 40), the protective material reeling roller 23, the first and second cooling rollers (34, 35), the reeling roller 41, and the protective material unwinding roller 42) are driven and rotated. Furthermore, the destaticizing section 15 (the first destaticizing machine 25 and the second destaticizing machine 37), the cooling device 13, the sputtering device 12, etc. are also operated. Thus, the substrate 4 is transported to the downstream side (transportation step), and the stripping step, the film forming step, the cooling step, and the winding step are sequentially performed. Furthermore, the guiding step is performed by the rotation of all the guide rollers (the first guide roller 26, the second guide roller 28, the third guide roller 31, the fourth guide roller 38), the protective material winding roller 23, the protective material unwinding roller 42, the protective material guide roller 43, and the clamping roller 44.
具體而言,於捲出部14中,搬送基材4被自捲出輥21捲出。此時,第1保護材5自玻璃基材1剝離(剝離步驟)。第1保護材5捲取至保護材捲取輥23上。另一方面,玻璃基材1單獨由第1驅動輥22搬送至第1去靜電部17(參照圖2B)(搬送步驟)。於玻璃基材1之厚度方向一面51與第1驅動輥22接觸之狀態下,玻璃基材1之厚度方向另一面52(非接觸面52)不與其他構件接觸。玻璃基材1即便與第1驅動輥22接觸而帶電,亦可藉由第1去靜電部17之第1去靜電機25作動而去除靜電。Specifically, in the unwinding section 14, the conveying substrate 4 is unwound from the unwinding roller 21. At this time, the first protective material 5 is peeled off from the glass substrate 1 (peeling step). The first protective material 5 is rolled up onto the protective material rolling roller 23. On the other hand, the glass substrate 1 is conveyed to the first destaticizing section 17 (refer to FIG. 2B ) by the first driving roller 22 alone (conveying step). In a state where one surface 51 of the glass substrate 1 in the thickness direction is in contact with the first driving roller 22, the other surface 52 of the glass substrate 1 in the thickness direction (non-contact surface 52) is not in contact with other components. Even if the glass substrate 1 is charged due to contact with the first driving roller 22 , static electricity can be removed by operating the first antistatic machine 25 of the first antistatic unit 17 .
繼而,玻璃基材1由第1導輥26引導至濺鍍裝置12(引導步驟)。Next, the glass substrate 1 is guided to the sputtering device 12 by the first guide roller 26 (guiding step).
繼而,於濺鍍裝置12中,玻璃基材1由第2導輥28引導至成膜區域33(引導步驟)。於成膜區域33,對玻璃基材1實施濺鍍。作為濺鍍,具體而言,可列舉二極濺鍍法、電子回旋共振濺鍍法、磁控濺鍍法、離子束濺鍍法等。濺鍍時之氣壓(即,成膜區域33之氣壓)為真空,較佳為未達1.0 Pa,更佳為0.5 Pa以下。Next, in the sputtering device 12, the glass substrate 1 is guided to the film forming area 33 by the second guide roller 28 (guiding step). In the film forming area 33, the glass substrate 1 is sputtered. Specifically, as sputtering, there can be cited diode sputtering method, electron cyclotron resonance sputtering method, magnetron sputtering method, ion beam sputtering method, etc. The air pressure during sputtering (i.e., the air pressure of the film forming area 33) is vacuum, preferably less than 1.0 Pa, and more preferably less than 0.5 Pa.
藉此,於成膜區域33中,在玻璃基材1之厚度方向一面51成膜透明導電層2,而製造出朝厚度方向一側依序具備玻璃基材1及透明導電層2之透明導電性玻璃3(參照圖2C)(成膜步驟)。Thus, in the film forming area 33, the transparent conductive layer 2 is formed on one surface 51 of the glass substrate 1 in the thickness direction, thereby manufacturing a transparent conductive glass 3 having the glass substrate 1 and the transparent conductive layer 2 in sequence on one side in the thickness direction (see FIG. 2C ) (film forming step).
又,與濺鍍同時,透明導電性玻璃3由加熱機30加熱。Furthermore, the transparent conductive glass 3 is heated by the heater 30 simultaneously with the sputtering.
由加熱機30加熱之透明導電性玻璃3之表面溫度例如為200℃以上,較佳為300℃以上,更佳為400℃以上,又,例如為800℃以下,較佳為600℃以下。藉此,例如於透明導電層2之材料為ITO之情形時,可與透明導電層2之成膜同時地使透明導電層2於高溫下結晶化,從而可提高透明導電層2之導電性。The surface temperature of the transparent conductive glass 3 heated by the heater 30 is, for example, 200° C. or higher, preferably 300° C. or higher, more preferably 400° C. or higher, and, for example, 800° C. or lower, preferably 600° C. or lower. Thus, when the material of the transparent conductive layer 2 is ITO, the transparent conductive layer 2 can be crystallized at a high temperature simultaneously with the formation of the transparent conductive layer 2, thereby improving the conductivity of the transparent conductive layer 2.
其後,透明導電性玻璃3由第3導輥31引導至冷卻裝置13(引導步驟)。Thereafter, the transparent conductive glass 3 is guided to the cooling device 13 by the third guide roller 31 (guiding step).
於冷卻裝置13中,透明導電性玻璃3依序接觸第1冷卻輥34及第2冷卻輥35而被冷卻(冷卻步驟)。In the cooling device 13, the transparent conductive glass 3 sequentially contacts the first cooling roller 34 and the second cooling roller 35 to be cooled (cooling step).
各冷卻輥(34、35)之表面溫度例如為280℃以下,較佳為150℃以下,又,例如為40℃以上。The surface temperature of each cooling roller (34, 35) is, for example, 280°C or less, preferably 150°C or less, and, for example, 40°C or more.
此時,就擴大透明導電性玻璃3與冷卻輥34、35之接觸面積(進而提高冷卻效率)之觀點而言,以將連結第1冷卻輥34之旋轉軸與第2冷卻輥35之旋轉軸之線段橫切之方式搬送透明導電性玻璃3。At this time, from the viewpoint of increasing the contact area between the transparent conductive glass 3 and the cooling rollers 34 and 35 (and thus improving the cooling efficiency), the transparent conductive glass 3 is conveyed so that the line segment connecting the rotation axis of the first cooling roller 34 and the rotation axis of the second cooling roller 35 intersects.
此時,透明導電性玻璃3之玻璃基材1中,其厚度方向另一面52直接接觸第2冷卻輥35。另一方面,透明導電性玻璃3之透明導電層2中,其厚度方向一面53直接接觸第1冷卻輥34。其後,透明導電性玻璃3自冷卻裝置13被搬送至第2去靜電部18。At this time, the other side 52 of the glass substrate 1 of the transparent conductive glass 3 in the thickness direction directly contacts the second cooling roller 35. On the other hand, the one side 53 of the transparent conductive layer 2 of the transparent conductive glass 3 in the thickness direction directly contacts the first cooling roller 34. Thereafter, the transparent conductive glass 3 is transferred from the cooling device 13 to the second destaticizing section 18.
此時,透明導電性玻璃3之厚度方向另一面52(玻璃基材1之厚度方向另一面52)中,即便因與第2冷卻輥35之摩擦而產生帶電,亦可藉由第2去靜電部18之第2去靜電機37作動而去除靜電。再者,於透明導電性玻璃3之厚度方向一面53(透明導電層2之厚度方向一面53),由於透明導電層2為導電性,故即便與第1冷卻輥34摩擦,通常亦不會帶電。At this time, even if the other surface 52 in the thickness direction of the transparent conductive glass 3 (the other surface 52 in the thickness direction of the glass substrate 1) is charged due to friction with the second cooling roller 35, the static electricity can be removed by the operation of the second antistatic motor 37 of the second antistatic unit 18. Furthermore, since the transparent conductive layer 2 is conductive, the one surface 53 in the thickness direction of the transparent conductive glass 3 (the one surface 53 in the thickness direction of the transparent conductive layer 2) is usually not charged even if it is rubbed with the first cooling roller 34.
其後,透明導電性玻璃3由第4導輥38引導至捲取部16(引導步驟)。Thereafter, the transparent conductive glass 3 is guided to the take-up section 16 by the fourth guide roller 38 (guiding step).
於捲取部16中,第2保護材6被自保護材捲出輥42捲出,由保護材導輥43引導,而搬送至夾輥44。In the take-up section 16 , the second protective material 6 is unwound from the protective material unwinding roller 42 , guided by the protective material guide roller 43 , and conveyed to the clamping roller 44 .
另一方面,透明導電性玻璃3與第2保護材6一起通過第2驅動輥40與夾輥44之間,將第2保護材6層壓至透明導電性玻璃3之厚度方向另一面52。On the other hand, the transparent conductive glass 3 and the second protective material 6 pass through between the second driving roller 40 and the clamping roller 44 , and the second protective material 6 is laminated to the other surface 52 of the transparent conductive glass 3 in the thickness direction.
於積層體7之透明導電性玻璃3之厚度方向一面53接觸第2驅動輥40之狀態下,積層體7中之第2保護材6之厚度方向另一面54(接觸面54)接觸夾輥44(被加壓)。When one surface 53 of the transparent conductive glass 3 of the laminate 7 in the thickness direction contacts the second driving roller 40, the other surface 54 (contact surface 54) of the second protective material 6 in the laminate 7 in the thickness direction contacts the clamping roller 44 (is pressed).
其後,透明導電性玻璃3與第2保護材6一起被捲取至捲取輥41上(捲取步驟)。具體而言,將具備透明導電性玻璃3、及配置於其厚度方向另一面52(與透明導電層2相反側之表面52)之第2保護材6的積層體7(參照圖2D)捲繞成卷狀。積層體7朝厚度方向一側依序具備第2保護材6、玻璃基材1及透明導電層2。Thereafter, the transparent conductive glass 3 and the second protective material 6 are rolled up onto the roll 41 (rolling step). Specifically, a laminate 7 (see FIG. 2D ) having the transparent conductive glass 3 and the second protective material 6 disposed on the other surface 52 in the thickness direction (the surface 52 opposite to the transparent conductive layer 2) is rolled up. The laminate 7 has the second protective material 6, the glass substrate 1, and the transparent conductive layer 2 in order on one side in the thickness direction.
3.透明導電性玻璃之用途 透明導電性玻璃3例如用於圖像顯示裝置等光學裝置。將透明導電性玻璃3配備於圖像顯示裝置(具體而言為具有LCD(liquid crystal display,液晶顯示器)模組、有機EL模組等圖像顯示元件之圖像顯示裝置)之情形時,透明導電性玻璃3例如用作觸控面板用基材、抗反射基材等,較佳為用作觸控面板用基材。作為觸控面板之形式,可列舉光學方式、超音波方式、靜電電容方式、電阻膜方式等各種方式,尤其適宜用於靜電電容方式之觸控面板。3. Uses of transparent conductive glass The transparent conductive glass 3 is used, for example, in optical devices such as image display devices. When the transparent conductive glass 3 is provided in an image display device (specifically, an image display device having an image display element such as an LCD (liquid crystal display) module or an organic EL module), the transparent conductive glass 3 is used, for example, as a substrate for a touch panel, an anti-reflection substrate, etc., preferably as a substrate for a touch panel. As the form of the touch panel, various methods such as an optical method, an ultrasonic method, an electrostatic capacitance method, and a resistive film method can be listed, and it is particularly suitable for use in an electrostatic capacitance method touch panel.
4.一實施方式之作用效果 而且,該搬送裝置11中,第1驅動輥22於玻璃基材1及第1驅動輥22接觸之狀態下,玻璃基材1中相對於與第1驅動輥22之表面接觸之接觸面51相反側之非接觸面52不與其他搬送構件(夾輥44等)接觸。亦即,第1驅動輥22不構成夾持機構。因此,可抑制接觸第1驅動輥22之玻璃基材1之破損。因此,可將玻璃基材1於捲出輥21及捲取輥41之間確實地搬送。4. Effect of an embodiment In addition, in the conveying device 11, when the first drive roller 22 is in contact with the glass substrate 1 and the first drive roller 22, the non-contact surface 52 of the glass substrate 1 opposite to the contact surface 51 in contact with the surface of the first drive roller 22 does not contact other conveying components (clamping roller 44, etc.). That is, the first drive roller 22 does not constitute a clamping mechanism. Therefore, damage to the glass substrate 1 contacting the first drive roller 22 can be suppressed. Therefore, the glass substrate 1 can be reliably conveyed between the unwinding roller 21 and the winding roller 41.
而且,第1驅動輥22之表面具有0.8 μm以下之較小之最大高度粗糙度Rz,故第1驅動輥22之表面可密接於玻璃基材1,可抑制其相對於玻璃基材1滑動,具體而言,可抑制第1驅動輥22之空轉。因此,可控制施加至玻璃基材1之張力,可將第1驅動輥22之旋轉確實地轉換為玻璃基材1之搬送,從而可更進一步確實地搬送玻璃基材1。Furthermore, the surface of the first driving roller 22 has a relatively small maximum height roughness Rz of 0.8 μm or less, so the surface of the first driving roller 22 can be in close contact with the glass substrate 1, and the sliding relative to the glass substrate 1 can be suppressed. Specifically, the idling of the first driving roller 22 can be suppressed. Therefore, the tension applied to the glass substrate 1 can be controlled, and the rotation of the first driving roller 22 can be reliably converted into the conveyance of the glass substrate 1, so that the glass substrate 1 can be further reliably conveyed.
該搬送成膜裝置10由於具備上述搬送裝置11及濺鍍裝置12,故可抑制濺鍍裝置12之破損,並且可將透明導電層2設置於濺鍍裝置12。因此,可確實地製造透明導電性玻璃3。Since the conveying film-forming apparatus 10 includes the conveying apparatus 11 and the sputtering apparatus 12, damage to the sputtering apparatus 12 can be suppressed and the transparent conductive layer 2 can be placed in the sputtering apparatus 12. Therefore, the transparent conductive glass 3 can be reliably manufactured.
該透明導電性玻璃3之製造方法由於使用搬送成膜裝置10,故可抑制玻璃基材1之破損,並且可將透明導電層2設置於玻璃基材1,從而可確實地製造透明導電性玻璃3。Since the method for manufacturing the transparent conductive glass 3 uses the conveying film-forming apparatus 10 , damage to the glass substrate 1 can be suppressed, and the transparent conductive layer 2 can be provided on the glass substrate 1 , thereby reliably manufacturing the transparent conductive glass 3 .
4.變化例 以下各變化例中,對與上述一實施方式相同之構件及步驟標註相同之參照符號,並省略其詳細說明。又,除特別記載以外,各變化例可發揮與一實施方式相同之作用效果。進而,可將一實施方式及其變化例適當組合。4. Variations In the following variations, the same reference symbols are used for the same components and steps as those in the above-mentioned embodiment, and their detailed descriptions are omitted. In addition, unless otherwise specified, each variation can exert the same effects as the above-mentioned embodiment. Furthermore, an embodiment and its variations can be appropriately combined.
於一實施方式中,第1驅動輥22接觸玻璃基材1之厚度方向一面51,但例如雖未圖示,亦可接觸玻璃基材1之厚度方向另一面52。再者,該情形時,玻璃基材1之厚度方向一面51不與其他搬送構件(夾輥44等)接觸。In one embodiment, the first driving roller 22 contacts one surface 51 of the glass substrate 1 in the thickness direction, but although not shown, it may contact another surface 52 of the glass substrate 1 in the thickness direction. In this case, the one surface 51 of the glass substrate 1 in the thickness direction does not contact other conveying members (clamping rollers 44, etc.).
又,第1驅動輥22之數量亦可為複數。Furthermore, the number of the first driving rollers 22 may be plural.
又,如圖3所示,作為本發明之搬送裝置之一例,亦可例示如下搬送裝置8:不具備濺鍍裝置12及第1~第4導輥(26、28、31、38)(參照圖1)而具備捲出輥21、捲取輥41、及配置於其等之間之第1驅動輥22。3, as an example of the conveying device of the present invention, the following conveying device 8 can also be illustrated: it does not have the sputtering device 12 and the first to fourth guide rollers (26, 28, 31, 38) (refer to FIG. 1) but has a take-off roller 21, a take-up roller 41, and a first drive roller 22 arranged therebetween.
又,圖1及圖2所示之實施方式中,例示出透明導電層2作為功能層,但作為功能層,例如雖未圖示,亦可設為例如硬塗層、光學調整層、金屬層(例如,銅層等非透明導電層)等。又,作為功能層,可為1層,亦可為2層以上。In the embodiment shown in FIG. 1 and FIG. 2 , the transparent conductive layer 2 is exemplified as the functional layer, but the functional layer may be, for example, a hard coating layer, an optical adjustment layer, a metal layer (for example, a non-transparent conductive layer such as a copper layer), etc., although not shown. In addition, the functional layer may be one layer or two or more layers.
圖1所示之實施方式中,例示出濺鍍裝置12作為成膜裝置,但例如雖未圖示,亦可列舉真空蒸鍍裝置、化學蒸鍍裝置等真空成膜裝置等。 [實施例]In the embodiment shown in FIG. 1 , a sputtering device 12 is illustrated as a film forming device, but although not illustrated, vacuum film forming devices such as a vacuum evaporation device and a chemical evaporation device may also be cited. [Embodiment]
以下示出實施例及比較例,更具體地說明本發明。再者,本發明並不限定於任何實施例及比較例。又,以下記載中使用之調配比例(比例)、物性值、參數等具體數值可取代為上述「實施方式」中記載之與其等對應之調配比例(比例)、物性值、參數等相關記載之上限(定義為「以下」、「未達」之數值)或下限(定義為「以上」、「超過」之數值)。The following are examples and comparative examples to illustrate the present invention in more detail. Furthermore, the present invention is not limited to any of the examples and comparative examples. In addition, the specific numerical values such as the blending ratio (ratio), physical property values, and parameters used in the following descriptions can be replaced by the upper limit (defined as a value "below" or "less than") or lower limit (defined as a value "above" or "exceeding") of the corresponding blending ratio (ratio), physical property values, and parameters recorded in the above-mentioned "Implementation Method".
實施例1 準備一實施方式中所說明之搬送成膜裝置10。Example 1 Prepare the film-forming transport device 10 described in one embodiment.
基於JIS B 0601(2009)測定第1驅動輥22之最大高度粗糙度Rz,結果為0.2 μm。The maximum height roughness Rz of the first driving roller 22 was measured based on JIS B 0601 (2009) and the result was 0.2 μm.
繼而,將具備厚度50 μm、厚度方向另一面52之最大高度粗糙度Rz為0.001 μm之G-leaf(日本電氣硝子公司製造)、及配置於其厚度方向另一面52之第1保護材5的搬送基材4作為玻璃基材1置於捲出輥21(準備步驟)。Next, a conveying substrate 4 having a G-leaf (manufactured by Nippon Electric Glass Co., Ltd.) with a thickness of 50 μm, a maximum height roughness Rz of 0.001 μm on the other side 52 in the thickness direction, and a first protective material 5 arranged on the other side 52 in the thickness direction is placed on the unwinding roller 21 as a glass substrate 1 (preparation step).
繼而,依序實施剝離步驟、成膜步驟、冷卻步驟、及捲取步驟。又,藉由第1驅動輥22實施搬送步驟,藉由第1~第4導輥(26、28、31、38)實施引導步驟。Then, the peeling step, the film forming step, the cooling step, and the winding step are sequentially performed. Furthermore, the conveying step is performed by the first driving roller 22, and the guiding step is performed by the first to fourth guide rollers (26, 28, 31, 38).
成膜步驟中,將材料為ITO、厚度為130 nm之透明導電層2形成於玻璃基材1之厚度方向一面51。In the film forming step, a transparent conductive layer 2 made of ITO and having a thickness of 130 nm is formed on one surface 51 of the glass substrate 1 in the thickness direction.
實施例2 按照表1變更第1驅動輥22之表面之最大高度粗糙度Rz,除此之外,以與實施例1相同之方式進行處理。Example 2 The maximum height roughness Rz of the surface of the first driving roller 22 is changed according to Table 1. Otherwise, the treatment is performed in the same manner as in Example 1.
比較例1~比較例3 按照表1變更第1驅動輥22之表面之最大高度粗糙度Rz,除此之外,以與實施例1相同之方式進行處理,並嘗試搬送玻璃基材1。Comparative Examples 1 to 3 Examples 1 to 3 were compared to Table 1, except that the maximum height roughness Rz of the surface of the first driving roller 22 was changed. The glass substrate 1 was transported in the same manner as in Example 1.
然而,玻璃基材1未密接於第1驅動輥22,第1驅動輥22空轉,而無法控制施加至玻璃基材1之張力,因此,無法搬送玻璃基材1。結果,無法形成透明導電層2,進而,亦無法獲得積層體7,進而,亦無法利用捲取輥41捲取積層體7。However, the glass substrate 1 is not in close contact with the first driving roller 22, and the first driving roller 22 is idle, and the tension applied to the glass substrate 1 cannot be controlled, so the glass substrate 1 cannot be conveyed. As a result, the transparent conductive layer 2 cannot be formed, and further, the laminate 7 cannot be obtained, and further, the laminate 7 cannot be rolled up by the take-up roller 41.
比較例4 於第1驅動輥22之附近配置夾輥,由其等構成夾持機構,除此之外,以與實施例1相同之方式進行處理。該夾持機構中,第1驅動輥22及夾輥自厚度方向兩側將玻璃基材1夾入。Comparative Example 4 A clamping roller is arranged near the first driving roller 22, and the clamping mechanism is formed by the clamping roller. Except for this, the same method as in Example 1 is used. In the clamping mechanism, the first driving roller 22 and the clamping roller clamp the glass substrate 1 from both sides in the thickness direction.
然而,玻璃基材1因上述夾入而破損。However, the glass substrate 1 is damaged due to the above-mentioned clamping.
[評估] <玻璃基材之搬送> 按照以下基準評估實施例1~比較例3各者之玻璃基材之搬送。 ○:第1驅動輥22相對於玻璃基材1之滑動被抑制,可將玻璃基材1於控制了對其施加之張力之狀態下搬送。 ×:第1驅動輥22相對於玻璃基材1滑動。無法控制對玻璃基材1施加之張力,無法準確地搬送玻璃基材1。[Evaluation] <Conveying of glass substrate> The conveying of glass substrates in each of Example 1 to Comparative Example 3 was evaluated according to the following criteria. ○: The sliding of the first drive roller 22 relative to the glass substrate 1 was suppressed, and the glass substrate 1 could be conveyed while the tension applied thereto was controlled. ×: The first drive roller 22 slid relative to the glass substrate 1. The tension applied to the glass substrate 1 could not be controlled, and the glass substrate 1 could not be accurately conveyed.
<玻璃基材之破損> 按照以下基準評估實施例1~比較例4各者之玻璃基材1之破損。 ○:玻璃基材1未破損。 ×:玻璃基材1破損。<Damage of glass substrate> The damage of the glass substrate 1 of each of Example 1 to Comparative Example 4 was evaluated according to the following criteria. ○: The glass substrate 1 was not damaged. ×: The glass substrate 1 was damaged.
[表1]
再者,上述發明係作為本發明之例示之實施方式而提供,但其僅為例示,不可限定性地解釋。由該技術領域之業者明確之本發明之變化例包含於下述申請專利範圍中。Furthermore, the above invention is provided as an exemplary embodiment of the present invention, but it is only an example and cannot be interpreted as limiting. Variations of the present invention that are clearly understood by a person skilled in the art are included in the scope of the following patent application.
1:玻璃基材 2:透明導電層 3:透明導電性玻璃 4:搬送基材 5:第1保護材 6:第2保護材 7:積層體 8:搬送裝置 10:搬送成膜裝置 11:搬送裝置 12:濺鍍裝置 13:冷卻裝置 14:捲出部 15:去靜電部 16:捲取部 17:第1去靜電部 18:第2去靜電部 21:捲出輥 22:第1驅動輥 23:保護材捲取輥 24:捲出外殼 25:第1去靜電機 26:第1導輥 27:第1去靜電外殼 28:第2導輥 29:濺鍍靶 30:加熱機 31:第3導輥 32:濺鍍外殼 33:成膜區域 34:第1冷卻輥 35:第2冷卻輥 36:冷卻外殼 37:第2去靜電機 38:第4導輥 39:第2去靜電外殼 40:第2驅動輥 41:捲取輥 42:保護材捲出輥 43:保護材導輥 44:夾輥 45:捲取外殼 51:厚度方向一面(玻璃基材)(接觸面之一例) 52:厚度方向另一面(玻璃基材)(非接觸面之一例) 53:導電性玻璃之厚度方向一面 54:第2保護材之厚度方向另一面 81:治具 82:卡住部1: Glass substrate 2: Transparent conductive layer 3: Transparent conductive glass 4: Conveying substrate 5: First protective material 6: Second protective material 7: Laminated body 8: Conveying device 10: Conveying film forming device 11: Conveying device 12: Sputtering device 13: Cooling device 14: Unwinding unit 15: Antistatic unit 1 6: Take-up section 17: 1st anti-static section 18: 2nd anti-static section 21: Take-up roller 22: 1st drive roller 23: Protective material take-up roller 24: Take-up shell 25: 1st anti-static machine 26: 1st guide roller 27: 1st anti-static shell 28: 2nd guide roller 29: Sputtering target 30: Heating machine 31: 3rd guide roller 32: Sputtering shell 33: Film forming area 34: 1st cooling roller 35: 2nd cooling roller 36: Cooling shell 37: 2nd anti-static motor 38: 4th guide roller 39: 2nd anti-static shell 40: 2nd driving roller 41: Take-up roller 42: Protective material take-out roller 43: Protective material Guide roller 44: Clamping roller 45: Rolling shell 51: One side in the thickness direction (glass substrate) (one example of contact surface) 52: The other side in the thickness direction (glass substrate) (one example of non-contact surface) 53: One side in the thickness direction of conductive glass 54: The other side in the thickness direction of the second protective material 81: Jig 82: Clamping part
圖1表示本發明之製造裝置之一實施方式之搬送成膜裝置。 圖2A~圖2D係由圖1之搬送成膜裝置搬送之搬送物之剖視圖,圖2A表示自捲出輥捲出之第1保護材及玻璃基材,圖2B表示搬送至第1驅動輥之玻璃基材,圖2C表示搬送至冷卻裝置之玻璃基材及透明導電層,圖2D表示被捲取輥捲取之第2保護材、透明導電層及玻璃基材。 圖3表示本發明之搬送裝置之變化例。 圖4表示玻璃基材之彎曲試驗中使用之2個治具。FIG1 shows a conveying film-forming device of one embodiment of the manufacturing device of the present invention. FIG2A to FIG2D are cross-sectional views of the conveyed objects conveyed by the conveying film-forming device of FIG1 , FIG2A shows the first protective material and the glass substrate unrolled from the unrolling roller, FIG2B shows the glass substrate conveyed to the first driving roller, FIG2C shows the glass substrate and the transparent conductive layer conveyed to the cooling device, and FIG2D shows the second protective material, the transparent conductive layer and the glass substrate taken up by the taking-up roller. FIG3 shows a variation of the conveying device of the present invention. FIG4 shows two jigs used in the bending test of the glass substrate.
1:玻璃基材 1: Glass substrate
3:透明導電性玻璃 3: Transparent conductive glass
4:搬送基材 4: Transporting substrate
5:第1保護材 5: 1st protective material
6:第2保護材 6: Second protective material
7:積層體 7: Laminated body
10:搬送成膜裝置 10: Transport film forming device
11:搬送裝置 11: Transport device
12:濺鍍裝置 12: Sputtering device
13:冷卻裝置 13: Cooling device
14:捲出部 14: Rolling out section
15:去靜電部 15: Remove static electricity
16:捲取部 16: Rolling section
17:第1去靜電部 17:1st anti-static part
18:第2去靜電部 18: Second static electricity removal section
21:捲出輥 21: Roll out roller
22:第1驅動輥 22: 1st drive roller
23:保護材捲取輥 23: Protective material take-up roller
24:捲出外殼 24: Roll out the outer shell
25:第1去靜電機 25: No. 1 anti-static machine
26:第1導輥 26: 1st guide roller
27:第1去靜電外殼 27: No. 1 Anti-static Housing
28:第2導輥 28: Second guide roller
29:濺鍍靶 29: Splash-plated target
30:加熱機 30:Heating machine
31:第3導輥 31: The third guide roller
32:濺鍍外殼 32: Splash-plated outer shell
33:成膜區域 33: Film forming area
34:第1冷卻輥 34: 1st cooling roller
35:第2冷卻輥 35: Second cooling roller
36:冷卻外殼 36: Cooling the shell
37:第2去靜電機 37: Second anti-static machine
38:第4導輥 38: 4th guide roller
39:第2去靜電外殼 39: Second anti-static housing
40:第2驅動輥 40: Second drive roller
41:捲取輥 41: Roller
42:保護材捲出輥 42: Protective material roll-out roller
43:保護材導輥 43: Protective material guide roller
44:夾輥 44: Clamp Roller
45:捲取外殼 45: Roll up the outer shell
Claims (3)
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| JP2019138891A JP7381238B2 (en) | 2019-07-29 | 2019-07-29 | Glass substrate conveyance device, laminated glass manufacturing device and manufacturing method |
| JP2019-138891 | 2019-07-29 |
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| TW202110759A TW202110759A (en) | 2021-03-16 |
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| KR (1) | KR102786040B1 (en) |
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| JP2010271619A (en) * | 2009-05-25 | 2010-12-02 | Konica Minolta Opto Inc | Roll-like polarizing plate protective film, polarizing plate, and method of manufacturing roll-like polarizing plate protective film |
| JP2016041840A (en) * | 2014-08-18 | 2016-03-31 | 住友金属鉱山株式会社 | Film-forming method and method for producing resin film with metal film using the same |
| TW201802046A (en) * | 2016-03-24 | 2018-01-16 | 康寧公司 | Laser sintering system and method for forming high purity, low roughness, low warp silica glass |
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| JP5742082B2 (en) * | 2011-06-30 | 2015-07-01 | 日本電気硝子株式会社 | Manufacturing method of glass roll |
| JP2012026024A (en) * | 2010-07-28 | 2012-02-09 | Gunze Ltd | Film formation apparatus and film formation method |
| JP5740244B2 (en) * | 2011-08-12 | 2015-06-24 | 日東電工株式会社 | Method and apparatus for manufacturing organic EL element |
| JP2015167152A (en) * | 2012-07-10 | 2015-09-24 | 旭硝子株式会社 | Imprint method and imprint apparatus |
| CN104428871A (en) * | 2012-07-10 | 2015-03-18 | 旭硝子株式会社 | Imprint method, and imprinting device |
| JP5859405B2 (en) * | 2012-08-27 | 2016-02-10 | 株式会社神戸製鋼所 | Glass film transport device |
| JP6142485B2 (en) | 2012-08-31 | 2017-06-07 | 三菱化学株式会社 | Method for producing organic thin film solar cell element |
| JP5868309B2 (en) * | 2012-12-21 | 2016-02-24 | 株式会社神戸製鋼所 | Substrate transport roll |
| JP2017101270A (en) * | 2015-11-30 | 2017-06-08 | 東レエンジニアリング株式会社 | Thin film formation apparatus and thin film formation method |
| KR102690478B1 (en) * | 2016-11-30 | 2024-07-31 | 엘지디스플레이 주식회사 | Roll-to-roll substrate deposition apparatus |
| JP6507223B1 (en) * | 2017-12-27 | 2019-04-24 | 株式会社金陽社 | Metal surface rubber roll for film |
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| JP2010271619A (en) * | 2009-05-25 | 2010-12-02 | Konica Minolta Opto Inc | Roll-like polarizing plate protective film, polarizing plate, and method of manufacturing roll-like polarizing plate protective film |
| JP2016041840A (en) * | 2014-08-18 | 2016-03-31 | 住友金属鉱山株式会社 | Film-forming method and method for producing resin film with metal film using the same |
| TW201802046A (en) * | 2016-03-24 | 2018-01-16 | 康寧公司 | Laser sintering system and method for forming high purity, low roughness, low warp silica glass |
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