TWI855115B - Laminated glass manufacturing device and manufacturing method - Google Patents

Abstract

The conveying film forming device 10 of the present invention includes: a roll-out roller 21 configured to roll out a glass substrate 1 having flexibility; a sputtering device 12 configured to provide a transparent conductive layer 2 on the glass substrate 1 to produce a transparent conductive glass 3; a cooling device 13 configured to cool the transparent conductive glass 3; and a take-up roller 41 configured to take up the transparent conductive glass 3. The sputtering device 12 includes a heater 30. When cooling the transparent conductive glass 3 heated by the heater 30, the transparent conductive glass 3 includes: a first cooling roller 34, which contacts the transparent conductive glass 3 at a first cooling temperature T1; and a second cooling roller 35, which contacts the transparent conductive glass 3 at a second cooling temperature T2 lower than the first cooling temperature T1.

Description

Laminated glass manufacturing device and manufacturing method

The present invention relates to a manufacturing device and a manufacturing method for laminated glass.

In recent years, thin glass substrates with excellent heat resistance have been used as flexible substrates for optical films used in image display devices such as liquid crystal displays and organic EL (electroluminescence) displays. Specifically, transparent conductive glass having a transparent conductive layer such as indium tin oxide (ITO) formed on a thin glass substrate is used as a touch panel film.

As an apparatus for mass-producing such optical films, a roll-to-roll sputtering apparatus has been proposed, which has an expansion roll, a sputtering machine and a heater arranged opposite to each other, a cooling drum, and a take-up roll in sequence downstream in the conveying direction of the thin glass substrate (for example, refer to Patent Document 1).

In the roll-to-roll sputtering device described in Patent Document 1, a functional layer such as a transparent conductive film is sputtered onto a substrate by a sputtering machine while the substrate is heated, and then the substrate is cooled by a cooling cylinder. [Prior Technical Document] [Patent Document]

[Patent Document 1] Japanese Patent Publication No. 2014-109073

[The problem the invention is trying to solve]

In recent years, a transparent conductive layer with lower surface resistance has been required, so a plan to increase the heating temperature of the heater has been tried.

However, in the roll-to-roll sputtering device described in Patent Document 1, if a high-temperature thin glass substrate is cooled by a cooling cylinder, there is a disadvantage that the thin glass substrate may be damaged.

The present invention provides a manufacturing device and a manufacturing method for laminated glass that can suppress damage to a glass substrate. [Technical means for solving the problem]

The present invention [1] includes a manufacturing device for laminated glass, which comprises: a roll-out roller configured to roll out a glass substrate having flexibility; a film-forming and heating unit disposed on the downstream side of the roll-out roller in the conveying direction and configured to provide a functional layer on the glass substrate to manufacture laminated glass; a cooling unit disposed on the downstream side of the film-forming and heating unit in the conveying direction and configured to cool the laminated glass; and a take-up roller disposed on the cooling unit. The film forming heating unit is located downstream of the conveying direction of the unit and is configured to roll up the laminated glass; the film forming heating unit has a heating portion, which is configured to heat the laminated glass; the cooling unit, when cooling the laminated glass heated by the heating portion, at least has: a first cooling roller, which contacts the laminated glass at a first cooling temperature T1; and a second cooling roller, which contacts the laminated glass at a second cooling temperature T2 lower than the first cooling temperature T1.

In the manufacturing device of the laminated glass, the laminated glass can sequentially contact the first cooling roller with the first cooling temperature T1 and the second cooling roller with the second cooling temperature T2 lower than the first cooling temperature T1. Therefore, compared with the device of Patent Document 1 in which the laminated glass is cooled by one cooling roller, the first cooling roller and the second cooling roller sequentially cool the laminated glass, so that the breakage of the laminated glass, especially the breakage of the fragile glass substrate, can be suppressed.

The present invention [2] includes a manufacturing device for laminated glass as described in [1], wherein the surface temperature T0 of the laminated glass after being heated by the heating unit, the first cooling temperature T1, and the second cooling temperature T2 satisfy the following equations (1) and (2).

50℃≦T0－T1＜130℃      (1) 80℃≦T1－T2＜160℃      (2) In the manufacturing device of the laminated glass, the surface temperature T0, the first cooling temperature T1, and the second cooling temperature T2 of the laminated glass after being heated by the heating part of the film-forming heating unit satisfy equations (1) and (2), so the damage of the laminated glass in the cooling unit can be effectively suppressed.

The present invention [3] comprises a manufacturing device for laminated glass as described in [1] or [2], wherein the functional layer is a transparent conductive layer comprising a metal oxide, and the heating part is configured to heat the laminated glass to a temperature above 200°C.

In the manufacturing device of the laminated glass, the heating part is configured to heat the laminated glass to 200°C or more, so the surface resistance of the transparent conductive layer can be further reduced. On the other hand, if the set temperature of the heating part is set to the above high temperature, the laminated glass is easily broken in the cooling unit. However, since the manufacturing device of the laminated glass is provided with the first cooling roller and the second cooling roller, the above-mentioned breakage of the laminated glass (especially the glass substrate) can be suppressed, and the surface resistance of the functional layer can be reduced.

The present invention [4] includes a method for manufacturing laminated glass, which is a method for manufacturing laminated glass using the laminated glass manufacturing apparatus as described in any one of [1] to [3], and comprises: a step of unwinding the glass substrate from the unwinding roller; a step of heating the laminated glass by providing the functional layer on the glass substrate by the film-forming heating unit; a first cooling step of cooling the laminated glass by bringing it into contact with the first cooling roller; a second cooling step of cooling the laminated glass by bringing it into contact with the second cooling roller; and a step of rolling up the laminated glass by the taking-up roller.

In the manufacturing method of the laminated glass, in the first cooling step, the first cooling roller of the first cooling temperature T1 contacts the laminated glass, and in the second cooling step, the second cooling roller of the second cooling temperature T2 contacts the laminated glass. Therefore, by sequentially performing the first cooling step and the second cooling step, the breakage of the laminated glass, especially the breakage of the fragile glass substrate, can be suppressed. [Effect of the invention]

The manufacturing device and method of the laminated glass of the present invention can suppress the damage of the glass substrate.

1. Conveying film forming device Referring to Figures 1 to 3, a conveying film forming device of one embodiment of the manufacturing device of the present invention is described.

The conveying film-forming device 10 shown in FIG1 conveys a glass substrate 1 while providing a transparent conductive layer (an example of a functional layer) 2 (see FIG2C ) on one surface 51 in the thickness direction thereof, thereby manufacturing a transparent conductive glass (an example of a laminated glass) 3. Specifically, the conveying film-forming device 10 peels off a first protective material 5 from a conveying substrate 4 (described below) in a roll form and conveys the glass substrate 1 alone, then provides a transparent conductive layer 2 on the glass substrate 1 to manufacture the transparent conductive glass 3, then laminates a second protective material 6 on the transparent conductive glass 3 and winds it into a roll form.

The transport film-forming device 10 includes a transport device 11, a sputtering device (an example of a film-forming heating unit) 12, and a cooling device (an example of a cooling unit) 13. Furthermore, the transport device 11 includes a roll-out section 14, a destaticizing section 15, and a take-up section 16. Furthermore, the destaticizing section 15 includes a first destaticizing section 17 and a second destaticizing section 18. The transport film-forming device 10 includes a roll-out section 14, a first destaticizing section 17, a sputtering device 12, a cooling device 13, a second destaticizing section 18, and a take-up section 16 in order from the upstream side in the transport direction (hereinafter, abbreviated as the "upstream side") toward the downstream side in the transport direction (hereinafter, abbreviated as the "downstream side"). The following describes them in detail.

The unwinding unit 14 is disposed at the most upstream side in the conveying device 11. The unwinding unit 14 unwinds the long conveying substrate 4. The unwinding unit 14 includes an unwinding roller 21, a first driving roller 22, a protective material taking-up roller 23, and an unwinding casing 24.

The roll-shaped conveying substrate 4 is placed on the unwinding roller 21. That is, the conveying substrate 4 is long in the conveying direction and is wound on the surface (circumference) of the unwinding roller 21. The unwinding roller 21 is a cylindrical member having a rotation axis that rotates in the conveying direction and extending in the width direction. Furthermore, in the present embodiment, the following various rollers (roll-out roller 21, 1st to 2nd drive rollers (22, 40), protective material take-up roller 23, 1st to 4th guide rollers (26, 28, 31, 38), protective material guide roller 43, 1st to 2nd cooling rollers (34, 35), take-up roller 41, protective material roll-out roller 42, clamping roller 44) are all cylindrical components, that is, they have a rotation axis that rotates along the conveying direction and extend in the width direction (a direction orthogonal to the conveying direction and the thickness direction).

The unwinding roller 21 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1 .

The first drive roller 22 is disposed on the downstream side of the unwinding roller 21. The first drive roller 22 is configured to be externally provided with a power for conveying the glass substrate 1. Thus, the first drive roller 22 rotates in the direction of the arrow shown in FIG. 1 based on the external power. Specifically, a gear (not shown) is provided at the end of the rotation shaft of the first drive roller 22, and a motor (not shown) is connected to the gear for rotating the first drive roller 22 in the direction of the arrow. The first drive roller 22 rotates by the driving force of the motor.

Thereby, the first driving roller 22 transports the glass substrate 1 of the transport substrate 4 placed on the unwinding roller 21 to the first destaticizing section 17 .

Furthermore, the first driving roller 22 is different from the second driving roller 40 (described below) arranged adjacent to the clamping roller 44, and is configured such that when it is in contact with one side (contact surface) 51 (see FIG. 2B ) in the thickness direction of the glass substrate 1, the other side (non-contact surface) 52 (see FIG. 2B ) in the thickness direction of the glass substrate 1 is not in contact with other conveying components (clamping roller 44, etc.).

The protective material take-up roller 23 is disposed near the unwinding roller 21. The protective material take-up roller 23 peels (leaves) the first protective material 5 from the conveying substrate 4 and takes up the first protective material 5. The protective material take-up roller 23 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1 .

The roll-out housing 24 accommodates the roll-out roller 21, the first drive roller 22 and the protective material take-up roller 23 therein. The roll-out housing 24 is configured so that the interior thereof is adjusted to a vacuum state. Specifically, a vacuum pump (not shown) is connected to the roll-out housing 24 to discharge the air inside the roll-out housing to the outside. Furthermore, in this specification, the so-called vacuum state refers to, for example, a state in which the air pressure is below 0.1 Pa, preferably below 1×10 ^-3 Pa.

The first destaticizing section 17 is disposed on the downstream side of the unwinding section 14 so as to be adjacent to the unwinding section 14. The first destaticizing section 17 removes static electricity from the glass substrate 1. The first destaticizing section 17 includes a first destaticizing motor 25, a first guide roller 26, and a first destaticizing housing 27.

The first anti-static machine 25 reduces the charge on the glass substrate 1. The first anti-static machine 25 is disposed downstream of the first drive roller 22 and upstream of the first guide roller 26. Examples of the first anti-static machine 25 include a scotoma discharge type anti-static machine and an ionizing radiation type anti-static machine.

The first guide roller 26 guides the glass substrate 1 conveyed from the first drive roller 22 through the first destaticizer 25 to the second guide roller 28 of the sputtering device 12. The first guide roller 26 is disposed downstream of the first destaticizer 25 and upstream of the second guide roller 28. The first guide roller 26 is a free roller that rotates as the glass substrate 1 is conveyed.

The first anti-static housing 27 accommodates the first anti-static motor 25 and the first guide roller 26 therein. The first anti-static housing 27 is configured so that the interior thereof is adjusted to a vacuum state.

The sputtering device 12 is disposed on the downstream side of the first destaticizing section 17 so as to be adjacent to the first destaticizing section 17. The sputtering device 12 performs sputtering on the glass substrate 1 in the film forming area 33 to form a transparent conductive layer 2 (see FIG. 2C).

The sputtering device 12 includes a second guide roller 28 , a sputtering target 29 , a heater 30 , a third guide roller 31 , and a sputtering housing 32 .

The second guide roller 28 guides the glass substrate 1 conveyed by the first guide roller 26 to the film forming area 33. The second guide roller 28 is disposed on the downstream side of the first guide roller 26 and on the upstream side of the sputtering target 29. The configuration of the second guide roller 28 is the same as that of the first guide roller 26.

The sputtering target 29 is a raw material of the transparent conductive layer 2. The sputtering target 29 is disposed opposite to the glass substrate 1 at a distance from the downstream side of the second guide roller 28 and the upstream side of the third guide roller 31. The sputtering target 29 faces one surface 51 of the glass substrate 1 in the thickness direction.

As the material of the sputtering target 29, for example, there can be listed metal oxides containing at least one metal selected from the group consisting of In, Sn, Zn, Ga, Sb, Nb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W. Specifically, there can be listed indium-containing oxides such as indium-tin composite oxide (ITO), antimony-containing oxides such as antimony-tin composite oxide (ATO), etc., preferably, there can be listed indium-containing oxides, and more preferably, there can be listed ITO.

The heater 30 heats the glass substrate 1 and the transparent conductive glass 3 obtained therefrom. The heater 30 is disposed at a distance from the glass substrate 1 on the downstream side of the second guide roller 28 and the upstream side of the third guide roller 31. The heater 30 is disposed opposite to the sputtering target 29 with respect to the glass substrate 1. The heater 30 faces the other side 52 of the glass substrate 1 in the thickness direction.

The heating method of the heater 30 is not particularly limited, and examples thereof include thermal radiation, convection, thermal conduction, etc., and thermal radiation is preferred. Specifically, the heater 30 includes an infrared heater, a halogen lamp heater, a high-frequency induction heater, a hot air heater, an electric heater, etc. The heater 30 includes an infrared heater and a halogen lamp heater.

The film forming area 33 is divided in the middle of the conveying direction of the second guide roller 28 and the third guide roller 31. In the film forming area 33, a sputtering target 29 and a heater 30 are arranged.

The third guide roller 31 guides the glass substrate 1 (specifically, the transparent conductive glass 3 having the glass substrate 1 and the transparent conductive layer 2 in the thickness direction) (see FIG. 2C ) after film formation to the first cooling roller 34 of the cooling device 13. The third guide roller 31 is arranged on the downstream side of the sputtering target 29 and the upstream side of the first cooling roller 34 (described below). The structure of the third guide roller 31 is the same as that of the first guide roller 26.

The sputtering housing 32 accommodates the second guide roller 28, the sputtering target 29, the heater 30, and the third guide roller 31. The sputtering housing 32 constitutes a film forming chamber including a film forming area 33. The sputtering housing 32 is constructed in such a way that the inside thereof is adjusted to a vacuum state. Furthermore, although not shown, the sputtering device 12 is equipped with other elements (anode, cathode, Ar gas introduction device, etc.) for performing sputtering. As the sputtering device 12, specifically, for example, a diode type sputtering device, an electron cyclotron resonance type sputtering device, a magnetron type sputtering device, an ion beam type sputtering device, etc. can be listed.

The cooling device 13 is disposed downstream of the sputtering device 12 in such a manner as to be adjacent to the sputtering device 12. The cooling device 13 cools the transparent conductive glass 3 heated by the sputtering device 12. The cooling device 13 includes a first cooling roller 34, a second cooling roller 35, and a cooling housing 36.

The first cooling roller 34 is disposed on the upstream side in the cooling device 13. The second cooling roller 35 is disposed on the downstream side of the first cooling roller 34. The first cooling roller 34 and the second cooling roller 35 are respectively configured to rotate in the direction of the arrow shown in FIG. 1 by being driven by an external power or the like.

The first cooling roller 34 includes a flow path for a cooling medium such as cooling water to flow therein. The first cooling roller 34 is configured to contact the transparent conductive glass 3 at a first cooling temperature T1 when cooling the transparent conductive glass 3. Specifically, the surface temperature of the first cooling roller 34 becomes the first cooling temperature T1. The first cooling temperature T1 will be described in detail below.

The second cooling roller 35 includes a flow path for a cooling medium such as cooling water to flow therein. The second cooling roller 35 is configured to contact the transparent conductive glass 3 at the second cooling temperature T2 when cooling the transparent conductive glass 3. Specifically, the surface temperature of the second cooling roller 35 becomes the second cooling temperature T2. The second cooling temperature T2 is described in detail below together with the first cooling temperature T1, and the second cooling temperature T2 is lower than the first cooling temperature T1.

The cooling housing 36 accommodates the first cooling roller 34 and the second cooling roller 35 therein. The cooling housing 36 is configured so that the interior thereof is adjusted to a vacuum state.

The second destaticizing section 18 is disposed on the downstream side of the cooling device 13 so as to be adjacent to the cooling device 13. The second destaticizing section 18 removes static electricity from the transparent conductive glass 3. The second destaticizing section 18 includes a second destaticizing motor 37, a fourth guide roller 38, and a second destaticizing housing 39.

The second anti-static machine 37 reduces the charge on the glass substrate 1. The second anti-static machine 37 is disposed on the downstream side of the second cooling roller 35 and the upstream side of the fourth guide roller 38. The structure of the second anti-static machine 37 is the same as that of the first anti-static machine 25.

The fourth guide roller 38 guides the transparent conductive glass 3 conveyed from the second cooling roller 35 through the second destaticizing motor 37 to the second drive roller 40 of the take-up section 16. The fourth guide roller 38 is disposed downstream of the second destaticizing motor 37 and upstream of the second drive roller 40. The configuration of the fourth guide roller 38 is the same as that of the first guide roller 26.

The second anti-static housing 39 accommodates the second anti-static motor 37 and the fourth guide roller 38 therein. The second anti-static housing 39 is configured so that the interior thereof is adjusted to a vacuum state.

The take-up unit 16 is disposed at the most downstream side in the conveying device 11, and is disposed downstream of the second anti-static motor 37 in a manner adjacent to the second anti-static motor 37. The take-up unit 16 takes up the transparent conductive glass 3 together with the second protective material 6 (see FIG. 2D). The take-up unit 16 includes a second driving roller 40, a take-up roller 41, a protective material take-out roller 42, a protective material guide roller 43, a clamping roller 44, and a take-up housing 45.

The second drive roller 40 is disposed on the downstream side of the fourth guide roller 38 and the upstream side of the take-up roller 41. The second drive roller 40 is configured to be externally provided with a power for conveying the transparent conductive glass 3 including the glass substrate 1. Thus, the second drive roller 40 rotates in the direction of the arrow shown in FIG. 1 based on the external power. Thus, the second drive roller 40 conveys the transparent conductive glass 3 to the take-up roller 41.

The second driving roller 40 is configured such that, while in contact with one surface 53 in the thickness direction of the transparent conductive glass 3, the other surface 54 in the thickness direction of the second protective material 6 is in contact with the clamping roller 44. That is, the second driving roller 40 and the clamping roller 44 constitute a clamping mechanism.

The take-up roller 41 takes up the laminate 7 (described below) of the transparent conductive glass 3 and the second protective material 6 conveyed between the second drive roller 40 and the clamping roller 44. The take-up roller 41 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1 .

The protective material unwinding roller 42 is arranged near the take-up roller 41. A second protective material 6 in a roll is placed on the protective material unwinding roller 42. That is, the second protective material 6 which is long in the conveying direction is wound on the surface of the protective material unwinding roller 42. The protective material unwinding roller 42 is configured to be driven by an external power and rotate in the direction of the arrow shown in FIG. 1. The protective material unwinding roller 42 rolls the second protective material 6 onto the protective material guide roller 43.

The protective material guide roller 43 guides the second protective material 6 rolled out from the protective material roll-out roller 42 to the clamping roller 44. The protective material guide roller 43 is disposed midway between the protective material roll-out roller 42 and the clamping roller 44 in the conveying direction.

The clamping roller 44 and the second drive roller 40 together laminate the second protective material 6 on the transparent conductive glass 3. The clamping roller 44 is disposed opposite to the second drive roller 40. The clamping roller 44 is configured so that its surface can sandwich and laminate the transparent conductive glass 3 and the second protective material 6 with the surface of the second drive roller 40.

The reel housing 45 accommodates the second driving roller 40, the reeling roller 41, the protective material reeling roller 42, the protective material guide roller 43 and the clamping roller 44. The reel housing 45 is configured so that the inside thereof is adjusted to a vacuum state.

2. Manufacturing method of transparent conductive glass The method of manufacturing transparent conductive glass 3 using the conveying film forming device 10 is described. The manufacturing method of transparent conductive glass 3 comprises: a preparation step of preparing a conveying substrate 4; a peeling step of peeling off the first protective material 5 from the glass substrate 1; a film forming step of placing a transparent conductive layer 2 on the glass substrate 1 under vacuum; a cooling step of cooling the transparent conductive glass 3; and a winding step of winding the transparent conductive glass 3 onto a winding roller 41. Each step is described in detail below.

First, the substrate 4 is prepared to be transported on the unwinding roller 21 (preparation step). Specifically, the substrate 4 is prepared to be transported and placed on the unwinding roller 21.

The transport substrate 4 is a glass substrate with a protective material. Specifically, it has a glass substrate 1 and a first protective material 5 in sequence on the other side in the thickness direction (see FIG. 2A ). The transport substrate 4 is long in the transport direction and is rolled into a roll. Such a roll-shaped transport substrate 4 can use a known or commercially available one.

The glass substrate 1 has a film shape (including a sheet shape) and is formed of transparent glass. Examples of the glass include alkali-free glass, sodium glass, borosilicate glass, and aluminosilicate glass.

The glass substrate 1 has flexibility.

On the other hand, the mechanical strength of the glass substrate 1 is generally low (fragile), and the distance L between both ends at the time of fracture in the bending test measured below is, for example, 15 mm or less, or 20 mm or less.

As shown in FIG6 , specifically, the glass substrate 1 is cut into a length of 120 mm, and both ends in the length direction are clamped in the clamping parts 82 of two jigs 81 arranged opposite to each other at a distance. Then, the two jigs 81 are slowly brought closer to each other, and the length L between the two clamping parts 82 when the glass substrate 1 is broken is obtained as the distance L between the two ends when breaking.

The thickness of the glass substrate 1 is, for example, 250 μm or less, preferably 200 μm or less, more preferably 150 μm or less, further preferably 100 μm or less, and, for example, 10 μm or more, preferably 40 μm or more.

As the glass substrate 1, a commercially available product can be used, for example, G-leaf series (manufactured by Nippon Electric Glass Co., Ltd.)

The first protective material 5 prevents damage to the glass substrates 1 due to contact between each other when the rolled glass substrate 1 is unrolled. The first protective material 5 has a film shape and is disposed on the other surface 52 of the glass substrate 1 in the thickness direction.

Examples of the first protective material 5 include a film with an adhesive, a spacer paper, and the like.

The film with adhesive has a polymer film and an adhesive layer in the thickness direction.

Examples of the polymer film include polyester films (polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, etc.), polycarbonate films, olefin films (polyethylene films, polypropylene films, cycloolefin films, etc.), acrylic films, polyether sulfone films, polyarylate films, melamine films, polyamide films, polyimide films, cellulose films, and polystyrene films.

The adhesive layer is a pressure-sensitive adhesive layer, for example, an acrylic adhesive layer, a rubber adhesive layer, a silicone adhesive layer, a polyester adhesive layer, a polyurethane adhesive layer, a polyamide adhesive layer, an epoxy adhesive layer, a vinyl alkyl ether adhesive layer, a fluorine adhesive layer, etc.

Examples of the spacer paper include woodfree paper, Japanese paper, kraft paper, glass paper, synthetic paper, and coated paper.

The thickness of the first protective material 5 is, for example, not less than 10 μm, preferably not less than 30 μm, and, for example, not more than 1000 μm, preferably not more than 500 μm.

Next, the film-forming conveyor 10 is operated. Specifically, all the housings (the unwinding housing 24, the first destaticizing housing 27, the sputtering housing 32, the cooling housing 36, the second destaticizing housing 39, and the reeling housing 45) are evacuated, and all the driving rollers (the unwinding roller 21, the first and second driving rollers (22, 40), the protective material reeling roller 23, the first and second cooling rollers (34, 35), the reeling roller 41, and the protective material unwinding roller 42) are driven and rotated. Furthermore, the destaticizing section 15 (the first destaticizing machine 25 and the second destaticizing machine 37), the cooling device 13, the sputtering device 12, etc. are also operated. Thus, the substrate 4 is conveyed to the downstream side, and the peeling step, the film forming step, the cooling step, and the winding step are sequentially performed.

Specifically, in the unwinding section 14, the conveying substrate 4 is unwound from the unwinding roller 21. At this time, the first protective material 5 is peeled off from the glass substrate 1 (peeling step). The first protective material 5 is rolled onto the protective material rolling roller 23. On the other hand, the glass substrate 1 is conveyed to the first destaticizing section 17 by the first driving roller 22 alone (refer to FIG. 2B). In a state where one surface 51 of the glass substrate 1 in the thickness direction is in contact with the first driving roller 22, the other surface 52 (non-contact surface 52) of the glass substrate 1 in the thickness direction is not in contact with other components. Even if the glass substrate 1 is charged due to contact with the first driving roller 22 , static electricity can be removed by operating the first antistatic machine 25 of the first antistatic unit 17 .

Next, the glass substrate 1 is guided to the sputtering device 12 by the first guide roller 26 .

Next, in the sputtering device 12, the glass substrate 1 is guided to the film forming area 33 by the second guide roller 28. In the film forming area 33, the glass substrate 1 is sputtered. Specifically, as sputtering, there can be cited diode sputtering, electron cyclotron resonance sputtering, magnetron sputtering, ion beam sputtering, etc. The air pressure during sputtering (i.e., the air pressure of the film forming area 33) is vacuum, preferably less than 1.0 Pa, and more preferably less than 0.5 Pa.

Thus, in the film forming area 33, the transparent conductive layer 2 is formed on one surface 51 of the glass substrate 1 in the thickness direction, thereby manufacturing a transparent conductive glass 3 having the glass substrate 1 and the transparent conductive layer 2 in sequence on one side in the thickness direction (see FIG. 2C ) (film forming step).

In addition, at the same time as the sputtering, the transparent conductive glass 3 is heated by the heater 30. Thus, for example, when the material of the transparent conductive layer 2 is a metal oxide (preferably ITO), the transparent conductive layer 2 can be crystallized at the same time as the transparent conductive layer 2 is formed, and as a result, the surface resistance of the transparent conductive layer 2 can be reduced.

The heating temperature of the heater 30 is, for example, 300° C. or higher, preferably 400° C. or higher, more preferably 450° C. or higher, and, for example, 800° C. or lower.

The surface temperature T0 of the transparent conductive glass 3 is, for example, 175° C. or higher, preferably 200° C. or higher, more preferably 250° C. or higher, and for example, 500° C. or lower, preferably 400° C. or lower. The surface temperature T0 of the transparent conductive glass 3 is a value obtained by multiplying the temperature of the heater 30 by 0.6, or can be actually measured.

If the surface temperature T0 of the transparent conductive glass 3 is above the above lower limit, the surface resistance of the transparent conductive layer 2 can be effectively reduced.

The surface resistance of the heated transparent conductive layer 2 (specifically, the crystallized transparent conductive layer 2) is, for example, 100 Ω/□ or less, preferably 50 Ω/□ or less, more preferably 40 Ω/□ or less, further preferably 30 Ω/□ or less, particularly preferably 25 Ω/□ or less, most preferably 20 Ω/□ or less, and more than 0 Ω/□. The surface resistance is measured by a four-terminal method.

Thereafter, the transparent conductive glass 3 is guided to the cooling device 13 by the third guide roller 31 .

In the cooling device 13, the transparent conductive glass 3 sequentially contacts the first cooling roller 34 and the second cooling roller 35 to be cooled (cooling step).

The cooling step includes a first cooling step and a second cooling step in sequence. In the first cooling step, the first cooling roller 34 contacts the transparent conductive glass 3, and then, in the second cooling step, the second cooling roller 35 contacts the transparent conductive glass 3.

Specifically, the transparent conductive glass 3 sequentially contacts the first cooling roller 34 at the first cooling temperature T1 and the second cooling roller 35 at the second cooling temperature T2 lower than the first cooling temperature T1, and is cooled stepwise.

The first cooling temperature T1 is, for example, less than 400° C., preferably less than 350° C., more preferably less than 300° C., further preferably less than 250° C., and, for example, greater than 100° C., preferably greater than 125° C., more preferably greater than 175° C.

The second cooling temperature T2 is, for example, less than 100° C., preferably less than 95° C., more preferably less than 90° C., and further preferably less than 85° C. Further, the second cooling temperature T2 is, for example, -25° C. or higher, preferably 0° C. or higher, more preferably 25° C. or higher, further preferably 50° C. or higher, and particularly preferably 75° C. or higher.

Furthermore, the first cooling temperature T1 and the second cooling temperature T2 together with the temperature (surface temperature) T0 of the heated transparent conductive glass 3 satisfy, for example, the following equations (1) to (2), preferably satisfy the following equations (3) to (4), and more preferably satisfy the following equations (5) to (6).

30℃≦T0－T1＜250℃      (1) 50℃≦T1－T2＜200℃      (2) 50℃≦T0－T1＜130℃      (3) 80℃≦T1－T2＜160℃      (4) 60℃≦T0－T1＜120℃      (5) 110℃≦T1－T2＜130℃     (6) In addition, the above-mentioned temperatures T0～T2, for example, satisfy the following formula (7) related to the ratio of the temperature difference, preferably satisfy the following formula (8), and more preferably satisfy the following formula (9).

0.25≦(T0－T1)/(T1－T2)＜4      (7) 0.5≦(T0－T1)/(T1－T2)＜1.75      (8) 0.6≦(T0－T1)/(T1－T2)＜1.25      (9) If the temperature T0～T2 satisfies the above formula, the damage (especially cracking) of the transparent conductive glass 3 in the cooling device 13 can be effectively suppressed.

As shown in Fig. 3, in the first cooling step, the transparent conductive layer 2 directly contacts the first cooling roller 34. Also, the glass substrate 1 is adjacent to the first cooling roller 34 via the transparent conductive layer 2, and is therefore cooled to the same extent as the transparent conductive layer 2.

In the second cooling step, the glass substrate 1 directly contacts the second cooling roller 35. In addition, the transparent conductive layer 2 is adjacent to the second cooling roller 35 via the glass substrate 1, and is therefore cooled to the same extent as the glass substrate 1.

From the viewpoint of increasing the contact area between the transparent conductive glass 3 and the first cooling roller 34 and the second cooling roller 35 (and thus improving the cooling efficiency), the transparent conductive glass 3 is conveyed in a manner that crosses the line segment connecting the rotation axis of the first cooling roller 34 and the rotation axis of the second cooling roller 35.

As shown in FIG. 1 , the transparent conductive glass 3 is then transferred from the cooling device 13 to the second destaticizing section 18 .

As shown in FIG3 , even if the other surface 52 in the thickness direction of the transparent conductive glass 3 (the other surface 52 in the thickness direction of the glass substrate 1) is charged due to friction with the second cooling roller 35, static electricity can be removed by the operation of the second antistatic motor 37 of the second antistatic unit 18. On the other hand, since the transparent conductive layer 2 is conductive, the one surface 53 in the thickness direction of the transparent conductive glass 3 (the one surface 53 in the thickness direction of the transparent conductive layer 2) is not normally charged even if it is rubbed with the first cooling roller 34.

Thereafter, the transparent conductive glass 3 is guided to the take-up unit 16 by the fourth guide roller 38 .

In the take-up section 16 , the second protective material 6 is unwound from the protective material unwinding roller 42 , guided by the protective material guide roller 43 , and conveyed to the clamping roller 44 .

On the other hand, the transparent conductive glass 3 and the second protective material 6 pass through between the second driving roller 40 and the clamping roller 44 , and the second protective material 6 is laminated and pressed onto the other surface 52 of the transparent conductive glass 3 in the thickness direction.

While one surface 53 of the transparent conductive glass 3 of the laminate 7 in the thickness direction contacts the second driving roller 40, another surface 54 (contact surface 54) of the second protective material 6 in the laminate 7 in the thickness direction contacts the clamping roller 44 (is pressed).

Thereafter, the transparent conductive glass 3 and the second protective material 6 are rolled up onto the roll 41 (rolling step). Specifically, a laminate 7 (see FIG. 2D ) having the transparent conductive glass 3 and the second protective material 6 disposed on the other surface 52 in the thickness direction (the surface 52 opposite to the transparent conductive layer 2) is rolled up. The laminate 7 has the second protective material 6, the glass substrate 1, and the transparent conductive layer 2 in order on one side in the thickness direction.

3. Uses of transparent conductive glass The transparent conductive glass 3 is used, for example, in optical devices such as image display devices. When the transparent conductive glass 3 is provided in an image display device (specifically, an image display device having an image display element such as an LCD (liquid crystal display) module or an organic EL module), the transparent conductive glass 3 is used, for example, as a substrate for a touch panel, an anti-reflection substrate, etc., preferably as a substrate for a touch panel. As the form of the touch panel, various methods such as an optical method, an ultrasonic method, an electrostatic capacitance method, and a resistive film method can be listed, and it is particularly suitable for use in an electrostatic capacitance method touch panel.

4. Effect of an embodiment In addition, in the conveying film-forming device 10, the transparent conductive glass 3 can sequentially contact the first cooling roller 34 of the first cooling temperature T1 and the second cooling roller 35 of the second cooling temperature T2 lower than the first cooling temperature T1. Therefore, compared with the device of patent document 1 in which the transparent conductive glass 3 is determined by one cooling roller, the contact between the first cooling roller 34 and the second cooling roller 35 can suppress the breakage of the transparent conductive glass 3, especially the breakage of the fragile glass substrate 1.

Furthermore, if the surface temperature T0 of the transparent conductive glass 3 after being heated by the heater 30 of the sputtering device 12, the first cooling temperature T1, and the second cooling temperature T2 satisfy the following equations (3) and (4), the damage of the transparent conductive glass 3 in the cooling device 13 can be effectively suppressed.

50℃≦T0－T1＜130℃      (3) 80℃≦T1－T2＜160℃      (4) If the heater 30 is configured to heat the transparent conductive glass 3 to 200℃ or above, the surface resistance of the transparent conductive layer 2 can be further reduced. On the other hand, if the set temperature of the heater 30 is set to the above-mentioned high temperature, the transparent conductive glass 3 is easily damaged in the cooling device 13. However, since the conveying film-forming device 10 is provided with the above-mentioned first cooling roller 34 and second cooling roller 35, the above-mentioned damage of the transparent conductive glass 3 (especially the glass substrate 1) can be suppressed, and the surface resistance of the transparent conductive layer 2 can be reduced.

In the manufacturing method of the transparent conductive glass 3, in the first cooling step, the first cooling roller 34 at the first cooling temperature T1 contacts the transparent conductive glass 3, and in the second cooling step, the second cooling roller 35 at the second cooling temperature T2 contacts the transparent conductive glass 3. Therefore, by sequentially performing the first cooling step and the second cooling step, the breakage of the transparent conductive glass 3, especially the breakage of the fragile glass substrate 1, can be suppressed.

4. Variations In the following variations, the same reference symbols are used for the same components and steps as those in the above-mentioned embodiment, and their detailed descriptions are omitted. In addition, unless otherwise specified, each variation can exert the same effects as the above-mentioned embodiment. Furthermore, an embodiment and its variations can be appropriately combined.

Although not shown, the film-forming conveyor device 10 may include three or more cooling rollers having different cooling temperatures. For example, the cooling device 13 includes a first cooling roller 34, a second cooling roller 35, and a third cooling roller not shown. The third cooling roller not shown is arranged on the downstream side of the second cooling roller 35. The third cooling roller not shown can implement the third cooling step. In the third cooling step, the third cooling roller not shown becomes a third cooling temperature T3 lower than the second cooling temperature T2.

For example, although not shown, there may be a plurality of first cooling rollers 34. The first cooling temperature T1 of the plurality of first cooling rollers 34 is the same.

For example, although not shown, there may be a plurality of second cooling rollers 35. The second cooling temperatures T2 of the plurality of second cooling rollers 35 are the same.

As shown in FIG4 , in the first cooling step, the other side 52 of the glass substrate 1 of the transparent conductive glass 3 in the thickness direction directly contacts the first cooling roller 34 . On the other hand, in the second cooling step, the one side 53 of the transparent conductive layer 2 of the transparent conductive glass 3 in the thickness direction directly contacts the second cooling roller 35 .

5, the transparent conductive glass 3 may be transported in a manner parallel to the line segment connecting the rotation axis of the first cooling roller 34 and the rotation axis of the second cooling roller 35.

The first cooling roller 34 and/or the second cooling roller 35 may be free rollers that are not driven by an external force but rotate as the transparent conductive glass 3 is transported.

In the embodiment shown in FIG. 1 , a sputtering device 12 is illustrated as a film forming device, but although not illustrated, vacuum film forming devices such as a vacuum evaporation device and a chemical evaporation device may also be cited. [Embodiment]

The following are examples and comparative examples to illustrate the present invention in more detail. Furthermore, the present invention is not limited to any of the examples and comparative examples. In addition, the specific numerical values such as the blending ratio (ratio), physical property values, and parameters used in the following descriptions can be replaced by the upper limit (defined as a value "below" or "less than") or lower limit (defined as a value "above" or "exceeding") of the corresponding blending ratio (ratio), physical property values, and parameters recorded in the above-mentioned "Implementation Method".

Example 1 The transport film forming device 10 described in the first embodiment is prepared. The first cooling temperature T1 of the first cooling roller 34 is set to 200°C. The second cooling temperature T2 of the second cooling roller 35 is set to 80°C.

Next, the conveying substrate 4 having a G-leaf (manufactured by Nippon Electric Glass Co., Ltd.) with a thickness of 50 μm and a first protective material 5 disposed on the other surface 52 in the thickness direction thereof is placed on the unwinding roller 21 as the glass substrate 1 (preparation step).

Then, a peeling step, a film forming step, a first cooling step, a second cooling step, and a winding step are sequentially performed.

In the film forming step, a transparent conductive layer 2 made of ITO and having a thickness of 130 nm is formed on one surface 51 in the thickness direction of the glass substrate 1. In addition, in the film forming step, the transparent conductive glass 3 is heated to 300°C by a heater 30 at 500°C to make the surface resistance less than 10 Ω/□.

Example 2 to Example 3 The first cooling temperature T1 of the first cooling roller 34 and the second cooling temperature T2 of the second cooling roller 35 were changed according to Table 1, and the same treatment as in Example 1 was performed.

Example 4 According to Table 1, the temperature of the heater 30 was changed to 350°C, and the process was performed in the same manner as in Example 1. In addition, the surface temperature T0 of the transparent conductive glass 3 was 210°C.

Comparative Example 1-Comparative Example 2 According to Table 1, the cooling device 13 is provided with a first cooling roller 34 instead of a second cooling roller 35, and further, the first cooling temperature T1 of the first cooling roller 34 is changed according to Table 1. Other than that, the same treatment as in Example 1 is performed.

[Evaluation] The following items were evaluated. The results are shown in Table 1.

<Damage of glass substrate> Damage of glass substrate 1 of each embodiment and each comparative example was evaluated according to the following criteria. ×: Glass substrate 1 was damaged in cooling device 13. ○: Micro cracks were observed in glass substrate 1 in cooling device 13, but the entire glass substrate was not damaged. ◎: Glass substrate 1 was neither cracked nor damaged in cooling device 13.

<Conductivity of transparent conductive layer> The surface resistance of the transparent conductive layer 2 of each embodiment and each comparative example was measured by a four-terminal method, and the conductivity of the transparent conductive layer 2 was evaluated according to the following criteria. ○: The surface resistance of the transparent conductive layer 2 is 10 Ω/□ or less. △: The surface resistance of the transparent conductive layer 2 exceeds 10 Ω/□ and is 100 Ω/□ or less. ×: The surface resistance of the transparent conductive layer 2 exceeds 100 Ω/□.

[Table 1] Table 1 Embodiments, Comparative Examples Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4 Comparison Example 1 Comparison Example 2 Heater temperature (℃) 500 500 500 350 500 500 Surface temperature of transparent conductive glass T0(℃) 300 300 300 210 300 300 First cooling temperature T1(℃) 200 150 150 200 80 40 Second cooling temperature T2 (℃) 80 80 40 80 - ^{* 1} - ^{* 1} Temperature difference T0-T1(℃) 100 150 150 10 220 260 T1-T2(℃) 120 70 110 120 - - T0-T2(℃) 220 220 260 130 - - Difference Ratio (T0-T1)/(T1-T2) 0.8 2.1 1.4 0.1 - - evaluate Glass cracks ◎ ○ ○ ○ × × Surface resistance ○ ○ ○ △ ○ ○ *1: Without second cooling roller

Furthermore, the above invention is provided as an exemplary embodiment of the present invention, but it is only an example and cannot be interpreted as limiting. Variations of the present invention that are clear to those skilled in the art are included in the scope of the following patent applications.

1: Glass substrate 2: Transparent conductive layer 3: Transparent conductive glass 4: Transport substrate 5: First protective material 6: Second protective material 7: Laminated body 10: Transport film forming device 11: Transport device 12: Sputtering device 13: Cooling device 14: Unwinding unit 15: Antistatic unit 16: Take-up unit 17: 1st antistatic section 18: 2nd antistatic section 21: Roll-out roller 22: 1st drive roller 23: Protective material take-up roller 24: Roll-out shell 25: 1st antistatic machine 26: 1st guide roller 27: 1st antistatic shell 28: 2nd guide roller 29: Sputtering target 30: Heating machine 31: 3rd guide roller 32: Sputtering Plating shell 33: Film forming area 34: 1st cooling roller 35: 2nd cooling roller 36: Cooling shell 37: 2nd anti-static motor 38: 4th guide roller 39: 2nd anti-static shell 40: 2nd driving roller 41: Take-up roller 42: Protective material take-out roller 43: Protective material guide roller 44: Clamping roller 45: Take-up Housing 51: One side of the glass substrate in the thickness direction 52: The other side of the glass substrate in the thickness direction 53: One side of the transparent conductive glass in the thickness direction 54: The other side of the second protective material in the thickness direction 81: Fixture 82: Clamping part T0: Surface temperature of laminated glass T1: First cooling temperature T2: Second cooling temperature

FIG1 shows a conveying film-forming device of one embodiment of the manufacturing device of the present invention. FIG2A to FIG2D are cross-sectional views of the conveyed objects conveyed by the conveying film-forming device of FIG1 , FIG2A shows the first protective material and glass substrate unrolled from the unwinding roller, FIG2B shows the glass substrate conveyed to the first driving roller, FIG2C shows the glass substrate and transparent conductive layer conveyed to the cooling device, and FIG2D shows the second protective material, transparent conductive layer and glass substrate taken up by the taking-up roller. FIG3 is an enlarged view of the first cooling roller and the second cooling roller in the conveying film-forming device shown in FIG1 , and the transparent conductive glass conveyed thereto. FIG4 is an enlarged view of the first cooling roller, the second cooling roller, and a variation of the transparent conductive glass shown in FIG3 (a state where the first cooling roller contacts the glass substrate). FIG5 is an enlarged view of the first cooling roller, the second cooling roller, and a variation of the transparent conductive glass shown in FIG3 (a state where the transparent conductive glass is transported parallel to the line segment connecting the rotation axis of the first cooling roller and the rotation axis of the second cooling roller). FIG6 shows two jigs used in the bending test of the glass substrate.

1: Glass substrate

3: Transparent conductive glass

4: Transporting substrate

5: 1st protective material

6: Second protective material

7: Laminated body

10: Transport film forming device

11: Transport device

12: Sputtering device

13: Cooling device

14: Rolling out section

15: Remove static electricity

16: Rolling section

17:1st anti-static part

18: Second static electricity removal section

21: Roll out roller

22: 1st drive roller

23: Protective material take-up roller

24: Roll out the outer shell

25: No. 1 anti-static machine

26: 1st guide roller

27: No. 1 Anti-static Housing

28: Second guide roller

29: Splash-plated target

30:Heating machine

31: The third guide roller

32: Splash-plated outer shell

33: Film forming area

34: 1st cooling roller

35: Second cooling roller

36: Cooling the shell

37: Second anti-static machine

38: 4th guide roller

39: Second anti-static housing

40: Second drive roller

41: Roller

42: Protective material roll-out roller

43: Protective material guide roller

44: Clamp Roller

45: Roll up the outer shell

Claims (4)

A manufacturing device for laminated glass is characterized in that it comprises: a roll-out roller configured to roll out a glass substrate having flexibility; a film-forming and heating unit disposed on the downstream side of the roll-out roller in the conveying direction and configured to provide a functional layer on the glass substrate to manufacture the laminated glass; a cooling unit disposed on the downstream side of the film-forming and heating unit in the conveying direction and configured to cool the laminated glass; and a take-up roller disposed on the downstream side of the cooling unit in the conveying direction and configured to take up the laminated glass; The film-forming heating unit has a heating part, which is configured to heat the laminated glass. When cooling the laminated glass heated by the heating part, the cooling unit has at least: a first cooling roller, which contacts the laminated glass at a first cooling temperature T1; and a second cooling roller, which contacts the laminated glass at a second cooling temperature T2 lower than the first cooling temperature T1. The surface temperature T0 of the laminated glass heated by the heating part is above 200°C, and the first cooling temperature T1 is above 125°C. For example, in the manufacturing device of laminated glass of claim 1, the surface temperature T0 of the laminated glass after being heated by the heating unit, the first cooling temperature T1, and the second cooling temperature T2 satisfy the following equations (1) and (2): 50℃≦T0-T1<130℃ (1) 80℃≦T1-T2<160℃ (2). As in the manufacturing device of laminated glass of claim 1 or 2, wherein the functional layer is a transparent conductive layer containing a metal oxide, and the heating part is constructed in a manner to heat the laminated glass to above 200°C. A method for manufacturing laminated glass, characterized in that: it is a method for manufacturing laminated glass using a laminated glass manufacturing device as described in any one of claims 1 to 3, and comprises: a step of unwinding the glass substrate from the unwinding roller; a step of heating the laminated glass by arranging the functional layer on the glass substrate by the film-forming heating unit; a first cooling step of cooling the laminated glass by bringing it into contact with the first cooling roller; a second cooling step of cooling the laminated glass by bringing it into contact with the second cooling roller; and a step of rolling up the laminated glass by the taking-up roller.