TWI858033B - Glass substrate conveying device, laminated glass manufacturing device, and laminated glass manufacturing method - Google Patents
Glass substrate conveying device, laminated glass manufacturing device, and laminated glass manufacturing method Download PDFInfo
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- TWI858033B TWI858033B TW109109002A TW109109002A TWI858033B TW I858033 B TWI858033 B TW I858033B TW 109109002 A TW109109002 A TW 109109002A TW 109109002 A TW109109002 A TW 109109002A TW I858033 B TWI858033 B TW I858033B
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
- C03B35/167—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors specially adapted for removing defect sheets, ribbons or parts thereof
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
- C03B35/18—Construction of the conveyor rollers ; Materials, coatings or coverings thereof
- C03B35/183—Construction of the conveyor rollers ; Materials, coatings or coverings thereof specially adapted for thermal adjustment of the rollers, e.g. insulating, heating, cooling thereof
- C03B35/184—Cooling
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3655—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating containing at least one conducting layer
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/004—Other surface treatment of glass not in the form of fibres or filaments by irradiation by electrons, protons or alpha-particles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/151—Deposition methods from the vapour phase by vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
- Manufacturing Of Electric Cables (AREA)
Abstract
玻璃基材1之搬送裝置11具備:捲出輥21,其將具備玻璃基材1及第1保護材5之搬送基材4捲出;保護材捲取輥23,其自玻璃基材1捲取第1保護材5;捲取輥41,其配置於捲出輥21之搬送方向下游側,捲取玻璃基材1;及去靜電部15,其配置於捲出輥21與捲取輥41之間。The conveying device 11 for the glass substrate 1 includes: a take-out roller 21, which takes out the conveying substrate 4 including the glass substrate 1 and the first protective material 5; a protective material take-up roller 23, which takes up the first protective material 5 from the glass substrate 1; a take-up roller 41, which is arranged on the downstream side of the conveying direction of the take-out roller 21 and takes up the glass substrate 1; and a destaticizing section 15, which is arranged between the take-out roller 21 and the take-up roller 41.
Description
本發明係關於一種玻璃基材之搬送裝置、積層玻璃之製造裝置、及積層玻璃之製造方法。The present invention relates to a glass substrate conveying device, a laminated glass manufacturing device, and a laminated glass manufacturing method.
近年來,作為液晶顯示器、有機EL(Electroluminescence,電致發光)顯示器等圖像顯示裝置所具備之光學膜之撓性基材,就耐熱性等觀點而言,正逐步使用薄玻璃基材。具體而言,於薄玻璃基材形成銦錫氧化物(ITO)等透明導電層而成之透明導電性玻璃用作觸控面板膜。In recent years, as a flexible substrate for optical films in image display devices such as liquid crystal displays and organic EL (electroluminescence) displays, thin glass substrates are gradually being used from the perspective of heat resistance. Specifically, transparent conductive glass formed by forming a transparent conductive layer such as indium tin oxide (ITO) on a thin glass substrate is used as a touch panel film.
為了量產此種光學膜,採用輥對輥方式。即,利用驅動輥或導輥等輥搬送長條且撓性之薄玻璃基材,利用濺鍍法等成膜透明導電層等功能層,最後,將積層有功能層之積層玻璃捲繞成卷狀(參照專利文獻1)。 [先前技術文獻] [專利文獻]In order to mass produce such optical films, a roll-to-roll method is adopted. That is, a long and flexible thin glass substrate is transported by a drive roller or a guide roller, and a functional layer such as a transparent conductive layer is formed by sputtering, and finally, the laminated glass with the functional layer is rolled into a roll (see patent document 1). [Prior technical document] [Patent document]
[專利文獻1]日本專利特開2014-109073號公報[Patent Document 1] Japanese Patent Publication No. 2014-109073
[發明所欲解決之問題][The problem the invention is trying to solve]
然,於專利文獻1中,於功能層之成膜時存在以400℃以上之高溫進行加熱之情形,因此搬送中之薄玻璃基材於未積層保護材等之狀態下搬送及成膜。即,薄玻璃基材單獨被搬送及成膜。However, in Patent Document 1, the functional layer is heated at a high temperature of 400° C. or higher during film formation, so the thin glass substrate being conveyed is conveyed and film formed without being coated with a protective material, etc. That is, the thin glass substrate is conveyed and film formed alone.
因此,薄玻璃基材與輥直接接觸。薄玻璃基材與先前之塑膠基材相比,表面較平滑,因此容易產生與輥密接之黏連現象。其結果,於薄玻璃基材與輥分離時,產生薄玻璃基材破損之擔憂。Therefore, the thin glass substrate is in direct contact with the roller. Compared with the previous plastic substrate, the surface of the thin glass substrate is smoother, so it is easy to produce a phenomenon of close adhesion with the roller. As a result, when the thin glass substrate is separated from the roller, there is a concern that the thin glass substrate will be damaged.
本發明提供一種抑制玻璃基材之破損之玻璃基材之搬送裝置、積層玻璃之製造裝置、及積層玻璃之製造方法。 [解決問題之技術手段]The present invention provides a glass substrate conveying device that suppresses damage to the glass substrate, a laminated glass manufacturing device, and a laminated glass manufacturing method. [Technical means for solving the problem]
本發明[1]包含一種玻璃基材之搬送裝置,其係搬送具有可撓性之玻璃基材之搬送裝置,且具備:第1輥,其將具備上述玻璃基材及保護材之搬送基材捲出;第2輥,其自上述玻璃基材捲取上述保護材;第3輥,其配置於上述第1輥之搬送方向下游側,捲取上述玻璃基材;及去靜電部,其配置於上述第1輥與上述第3輥之間。The present invention [1] includes a glass substrate conveying device, which is a conveying device for conveying a flexible glass substrate and comprises: a first roller, which rolls out a conveying substrate having the glass substrate and a protective material; a second roller, which takes up the protective material from the glass substrate; a third roller, which is arranged on the downstream side of the conveying direction of the first roller and takes up the glass substrate; and a destaticizing section, which is arranged between the first roller and the third roller.
根據該玻璃基材之搬送裝置,於第1輥及第3輥之間具備去靜電部,因此,可去除玻璃基材所帶之電。因此,於玻璃基材與導輥等輥接觸時,可抑制由帶電所導致之玻璃基材與輥之密接(黏連)。因此,於玻璃基材與輥分離時,可減輕玻璃基材之負荷,可抑制玻璃基材之破損。According to the glass substrate conveying device, a destaticizing section is provided between the first roller and the third roller, so that the charge on the glass substrate can be removed. Therefore, when the glass substrate contacts the guide roller or other rollers, the glass substrate and the rollers can be prevented from being closely attached (adhered) to each other due to the charge. Therefore, when the glass substrate and the rollers are separated, the load on the glass substrate can be reduced, and the damage of the glass substrate can be prevented.
本發明[2]包含如[1]中記載之玻璃基材之搬送裝置,其進而具備驅動輥,且上述去靜電部配置於上述驅動輥之搬送方向下游側。The present invention [2] includes the glass substrate conveying device as described in [1], which further includes a driving roller, and the above-mentioned antistatic part is arranged on the downstream side of the driving roller in the conveying direction.
根據該玻璃基材之搬送裝置,其具備驅動輥,因此,可確實且連續地搬送玻璃基材。又,去靜電部配置於驅動輥之下游側,因此,可對因與驅動輥之接觸而產生之玻璃基材之帶電進行去靜電,其結果,可抑制因驅動輥所致之玻璃基材之破損。According to the glass substrate conveying device, the driving roller is provided, so that the glass substrate can be conveyed reliably and continuously. In addition, the destaticizing section is arranged on the downstream side of the driving roller, so that the glass substrate charged by contact with the driving roller can be destaticized, and as a result, the damage of the glass substrate caused by the driving roller can be suppressed.
本發明[3]包含一種積層玻璃之製造裝置,其具備:如[1]或[2]中記載之搬送裝置;及成膜裝置,其配置於上述第1輥與上述第3輥之間,在真空下於上述玻璃基材設置功能層。The present invention [3] includes a manufacturing device for laminated glass, which comprises: a conveying device as described in [1] or [2]; and a film forming device, which is arranged between the above-mentioned first roller and the above-mentioned third roller, and sets a functional layer on the above-mentioned glass substrate under vacuum.
根據該積層玻璃基材之搬送裝置,其具備上述搬送裝置及成膜裝置,因此,可抑制玻璃基材之破損地,於玻璃基材設置功能層。因此,可確實地製造積層玻璃。According to the conveying device for laminated glass substrate, the conveying device and the film forming device are provided, so that the functional layer can be provided on the glass substrate while suppressing damage to the glass substrate. Therefore, laminated glass can be manufactured reliably.
本發明[4]包含如[3]中記載之積層玻璃之製造裝置,其中上述去靜電部具有第1去靜電部及第2去靜電部,上述第1去靜電部設置於上述成膜裝置之搬送方向上游側,上述第2去靜電部設置於上述成膜裝置之搬送方向下游側。The present invention [4] includes a manufacturing device for laminated glass as described in [3], wherein the above-mentioned destaticizing section has a first destaticizing section and a second destaticizing section, the above-mentioned first destaticizing section is arranged on the upstream side of the conveying direction of the above-mentioned film-forming device, and the above-mentioned second destaticizing section is arranged on the downstream side of the conveying direction of the above-mentioned film-forming device.
根據該積層玻璃之搬送裝置,於成膜裝置之上游側及下游側具備去靜電部(第1去靜電部或第2去靜電部),因此,可抑制成膜前後之玻璃基材之帶電。因此,可更確實地抑制玻璃基材之破損。According to the conveying device for laminated glass, a destaticizing section (first destaticizing section or second destaticizing section) is provided on the upstream side and downstream side of the film forming device, so that the charging of the glass substrate before and after the film forming can be suppressed. Therefore, the damage of the glass substrate can be more reliably suppressed.
本發明[5]包含一種積層玻璃之製造方法,其依序具備:準備步驟,其係準備具備具有可撓性之玻璃基材及保護材之搬送基材;剝離步驟,其係自上述玻璃基材剝離上述保護材;及成膜步驟,其係在真空下於上述玻璃基材設置功能層;且於上述成膜步驟之前及/或後具備將上述玻璃基材去靜電之去靜電步驟。The present invention [5] includes a method for manufacturing laminated glass, which sequentially comprises: a preparation step, which is to prepare a transfer substrate having a flexible glass substrate and a protective material; a stripping step, which is to strip the protective material from the glass substrate; and a film forming step, which is to set a functional layer on the glass substrate under vacuum; and a destaticizing step for destaticizing the glass substrate before and/or after the film forming step.
根據該積層玻璃之製造方法,可將玻璃基材去靜電,因此可去除玻璃基材所帶之電。因此,可抑制玻璃基材與輥接觸時之黏連,可減輕其等分離時之負荷。因此,可抑制玻璃基材之破損地,於玻璃基材設置功能層。結果,可確實地製造積層玻璃。According to the manufacturing method of the laminated glass, the glass substrate can be destaticized, thereby removing the charge on the glass substrate. Therefore, the adhesion of the glass substrate and the roller when they are in contact can be suppressed, and the load when they are separated can be reduced. Therefore, the damage of the glass substrate can be suppressed, and the functional layer can be provided on the glass substrate. As a result, the laminated glass can be reliably manufactured.
本發明[6]包含如[5]中記載之積層玻璃之製造方法,其中上述去靜電步驟至少於上述成膜步驟之前實施。The present invention [6] includes a method for manufacturing a laminated glass as described in [5], wherein the above-mentioned destaticization step is performed at least before the above-mentioned film forming step.
根據該積層玻璃之製造方法,於成膜前將玻璃基材去靜電,因此可抑制成膜前之玻璃基材之破損。According to the manufacturing method of the laminated glass, the glass substrate is destaticized before film formation, thereby suppressing damage to the glass substrate before film formation.
本發明[7]包含如[5]或[6]中記載之積層玻璃之製造方法,其中上述去靜電步驟於上述成膜步驟之前及之後實施。The present invention [7] includes a method for manufacturing a laminated glass as described in [5] or [6], wherein the above-mentioned destaticization step is performed before and after the above-mentioned film forming step.
根據該積層玻璃之製造方法,於成膜步驟之前後兩者實施去靜電步驟,因此,可抑制成膜前後之玻璃基材之帶電。因此,可更確實地抑制玻璃基材之破損。 [發明之效果]According to the manufacturing method of the laminated glass, a destaticizing step is performed both before and after the film forming step, thereby suppressing the charging of the glass substrate before and after the film forming step. Therefore, the damage of the glass substrate can be more reliably suppressed. [Effect of the invention]
根據本發明之玻璃基材之搬送裝置,可抑制玻璃基材之破損地搬送玻璃基材。又,根據本發明之積層玻璃之製造裝置及使用其之製造方法,可抑制玻璃基材之破損地製造積層玻璃。According to the glass substrate conveying device of the present invention, the glass substrate can be conveyed while suppressing the damage of the glass substrate. Also, according to the laminated glass manufacturing device and the manufacturing method using the same of the present invention, the laminated glass can be manufactured while suppressing the damage of the glass substrate.
1.搬送成膜裝置 參照圖1,對作為本發明之製造裝置之一實施形態之搬送成膜裝置10進行說明。1. Conveying film forming device With reference to FIG1 , a conveying film forming device 10 as one embodiment of the manufacturing device of the present invention will be described.
圖1所示之搬送成膜裝置10搬送玻璃基材1,並且於其厚度方向一面設置透明導電層(功能層之一例)2,而製造透明導電性玻璃(積層玻璃之一例)3。具體而言,搬送成膜裝置10自卷狀搬送基材4將第1保護材5(保護材之一例)剝離,而搬送玻璃基材1單獨體,其次,於玻璃基材1設置透明導電層2而製造透明導電性玻璃3,其次,於透明導電性玻璃3積層第2保護材6並捲繞成卷狀。The conveying film-forming device 10 shown in FIG1 conveys a glass substrate 1 and provides a transparent conductive layer (an example of a functional layer) 2 on one side in the thickness direction thereof to manufacture a transparent conductive glass (an example of a laminated glass) 3. Specifically, the conveying film-forming device 10 peels off a first protective material 5 (an example of a protective material) from a roll-shaped conveying substrate 4 and conveys the glass substrate 1 alone, then provides a transparent conductive layer 2 on the glass substrate 1 to manufacture a transparent conductive glass 3, then laminates a second protective material 6 on the transparent conductive glass 3 and winds it into a roll.
搬送成膜裝置10具備搬送裝置11、濺鍍裝置(成膜裝置之一例)12及冷卻裝置13。搬送裝置11具備捲出部14、去靜電部15及捲取部16。去靜電部15具備第1去靜電部17及第2去靜電部18。具體而言,搬送成膜裝置10自搬送方向上游側(以下,省略為「上游側」)朝向搬送方向下游側(以下,省略為「下游側」)依序具備捲出部14、第1去靜電部17、濺鍍裝置12、冷卻裝置13、第2去靜電部18及捲取部16。以下,對其等進行詳述。The conveying film-forming device 10 includes a conveying device 11, a sputtering device (an example of a film-forming device) 12, and a cooling device 13. The conveying device 11 includes a roll-out section 14, a destaticizing section 15, and a take-up section 16. The destaticizing section 15 includes a first destaticizing section 17 and a second destaticizing section 18. Specifically, the conveying film-forming device 10 includes a roll-out section 14, a first destaticizing section 17, a sputtering device 12, a cooling device 13, a second destaticizing section 18, and a take-up section 16 in order from the upstream side in the conveying direction (hereinafter, abbreviated as the "upstream side") toward the downstream side in the conveying direction (hereinafter, abbreviated as the "downstream side"). These will be described in detail below.
捲出部14配置於搬送裝置11中之最上游側,將長條之搬送基材4捲出。The unwinding unit 14 is disposed at the most upstream side of the conveying device 11 and unwinds the long conveying substrate 4.
捲出部14具備捲出輥(第1輥之一例)21、第1驅動輥(驅動輥之一例)22、保護材捲取輥(第2輥之一例)23及捲出殼體24。The unwinding section 14 includes an unwinding roller (an example of a first roller) 21 , a first driving roller (an example of a driving roller) 22 , a protective material taking-up roller (an example of a second roller) 23 , and an unwinding housing 24 .
於捲出輥21,設置卷狀搬送基材4。即,於捲出輥21之周面,捲繞有於搬送方向上為長條之搬送基材4。捲出輥21係具有朝搬送方向旋轉之旋轉軸且於寬度方向上延伸之圓柱構件。再者,於本說明書中,下述各種輥(捲出輥21、第1~2驅動輥(22、40)、保護材捲取輥23、第1~5導輥(26、28、31、38、43)、第1~2冷卻輥(34、35)、捲取輥41、保護材捲出輥42、夾輥44)均為具有朝搬送方向旋轉之旋轉軸且於寬度方向上延伸之圓柱構件。The roll-shaped conveying substrate 4 is provided on the unwinding roller 21. That is, the conveying substrate 4 which is long in the conveying direction is wound around the circumference of the unwinding roller 21. The unwinding roller 21 is a cylindrical member having a rotation axis rotating in the conveying direction and extending in the width direction. Furthermore, in this specification, the following various rollers (rolling-out roller 21, 1st to 2nd driving rollers (22, 40), protective material taking-up roller 23, 1st to 5th guide rollers (26, 28, 31, 38, 43), 1st to 2nd cooling rollers (34, 35), taking-up roller 41, protective material rolling-out roller 42, clamping roller 44) are all cylindrical components having a rotating axis rotating in the conveying direction and extending in the width direction.
又,捲出輥21以利用外部動力等驅動,且能夠於圖1所示之箭頭方向上旋轉之方式構成。即,捲出輥21、驅動輥之構成均於第1驅動輥22中詳述。Furthermore, the unwinding roller 21 is driven by an external power and is configured to be rotatable in the direction of the arrow shown in Fig. 1. That is, the configurations of the unwinding roller 21 and the driving roller are described in detail in the first driving roller 22.
第1驅動輥22對設置於捲出輥21之搬送基材4之玻璃基材1賦予用以向下游側捲出之動力。即,將玻璃基材1自捲出輥21捲出,而搬送至第1去靜電部17。The first driving roller 22 applies a driving force to roll the glass substrate 1 of the substrate conveying unit 4 provided on the unwinding roller 21 toward the downstream side. That is, the glass substrate 1 is unwound from the unwinding roller 21 and conveyed to the first destaticizing section 17.
第1驅動輥22以利用外部動力等驅動,且能夠朝圖1所示之箭頭方向旋轉之方式構成。具體而言,於第1驅動輥22之旋轉軸之端部,設置有齒輪(未圖示),於齒輪,連接有用以使第1驅動輥22朝箭頭方向旋轉之馬達(未圖示)。第1驅動輥22利用馬達之驅動力旋轉。The first drive roller 22 is driven by an external power and is configured to rotate in the direction of the arrow shown in FIG. 1 . Specifically, a gear (not shown) is provided at the end of the rotation shaft of the first drive roller 22, and a motor (not shown) is connected to the gear to rotate the first drive roller 22 in the direction of the arrow. The first drive roller 22 rotates by the driving force of the motor.
保護材捲取輥23自搬送基材4剝離第1保護材5,並且捲取第1保護材5。保護材捲取輥23配置於捲出輥21之附近。保護材捲取輥23為驅動輥,以利用外部動力等驅動,且能夠朝圖1所示之箭頭方向旋轉之方式構成。The protective material take-up roller 23 peels off the first protective material 5 from the conveying substrate 4 and takes up the first protective material 5. The protective material take-up roller 23 is arranged near the unwinding roller 21. The protective material take-up roller 23 is a driving roller, which is driven by an external power and is configured to be rotatable in the direction of the arrow shown in FIG. 1 .
捲出殼體24於其內部收容捲出輥21、第1驅動輥22及保護材捲取輥23。The unwinding housing 24 accommodates the unwinding roller 21, the first driving roller 22 and the protective material taking-up roller 23 therein.
捲出殼體24以能夠將其內部調節為真空狀態之方式構成。具體而言,於捲出殼體24,連接有將其內部之空氣排出至外部之真空泵(未圖示)。再者,於本說明書中,真空狀態例如係指氣壓為0.1 Pa以下、較佳為1×10-3 Pa以下之狀態。The roll-out casing 24 is configured to be able to adjust its interior to a vacuum state. Specifically, a vacuum pump (not shown) is connected to the roll-out casing 24 to discharge the air inside to the outside. In this specification, the vacuum state refers to, for example, a state where the air pressure is below 0.1 Pa, preferably below 1×10 -3 Pa.
第1去靜電部17以與捲出部14相鄰之方式配置於捲出部14之下游側。第1去靜電部17對玻璃基材1進行去靜電。The first destaticizing section 17 is disposed on the downstream side of the unwinding section 14 so as to be adjacent to the unwinding section 14. The first destaticizing section 17 destaticizes the glass substrate 1.
第1去靜電部17具備第1去靜電機25、第1導輥26、及第1去靜電罩殼27。The first anti-static unit 17 includes a first anti-static motor 25 , a first guide roller 26 , and a first anti-static housing 27 .
第1去靜電機25使玻璃基材1所帶之電減少。第1去靜電機25配置於第1驅動輥22之下游側且第1導輥26之上游側。The first anti-static machine 25 reduces the charge on the glass substrate 1. The first anti-static machine 25 is disposed on the downstream side of the first driving roller 22 and the upstream side of the first guide roller 26.
作為第1去靜電機25,例如可列舉電暈放電式去靜電機、電離輻射線式去靜電機等。Examples of the first anti-static machine 25 include a stun discharge type anti-static machine and an ionizing radiation type anti-static machine.
電暈放電式去靜電機藉由電暈放電使空氣離子化,使離子化之空氣與玻璃基材1接觸,藉此進行去靜電。作為電暈放電式去靜電機,例如可為電壓施加式及自放電式之任一者。The corona discharge type antistatic machine ionizes air by corona discharge and brings the ionized air into contact with the glass substrate 1, thereby performing antistatic treatment. The corona discharge type antistatic machine may be, for example, a voltage application type or a self-discharge type.
電離輻射線式去靜電機例如藉由使軟X射線、α粒子、紫外線等電離輻射線與玻璃基材1接觸而進行去靜電。The ionizing radiation type destaticizer performs destaticization by bringing ionizing radiation such as soft X-rays, α particles, and ultraviolet rays into contact with the glass substrate 1 .
第1導輥26將自第1驅動輥22通過第1去靜電機25搬送之玻璃基材1導引至濺鍍裝置12之第2導輥28。第1導輥26配置於第1去靜電機25之下游側且第2導輥28之上游側。The first guide roller 26 guides the glass substrate 1 conveyed from the first drive roller 22 through the first destaticizer 25 to the second guide roller 28 of the sputtering device 12. The first guide roller 26 is disposed downstream of the first destaticizer 25 and upstream of the second guide roller 28.
第1去靜電罩殼27於其內部收容第1去靜電機25及第1導輥26。第1去靜電罩殼27以能夠將其內部調節為真空狀態之方式構成。The first anti-static housing 27 accommodates the first anti-static motor 25 and the first guide roller 26 therein. The first anti-static housing 27 is configured so that the interior thereof can be adjusted to a vacuum state.
濺鍍裝置12以與第1去靜電部17相鄰之方式配置於第1去靜電部17之下游側。濺鍍裝置12於成膜區域33(成膜室)對玻璃基材1實施濺鍍,形成透明導電層2。The sputtering device 12 is disposed on the downstream side of the first destaticizing section 17 so as to be adjacent to the first destaticizing section 17. The sputtering device 12 performs sputtering on the glass substrate 1 in the film forming area 33 (film forming chamber) to form the transparent conductive layer 2.
濺鍍裝置12具備第2導輥28、濺鍍靶29、加熱機30、第3導輥31、及濺鍍罩殼32。The sputtering device 12 includes a second guide roller 28 , a sputtering target 29 , a heater 30 , a third guide roller 31 , and a sputtering cover 32 .
第2導輥28將自第1導輥26搬送之玻璃基材1導引至成膜區域33。第2導輥28配置於第1導輥26之下游側且濺鍍靶29之上游側。The second guide roller 28 guides the glass substrate 1 conveyed by the first guide roller 26 to the film forming area 33. The second guide roller 28 is disposed on the downstream side of the first guide roller 26 and on the upstream side of the sputtering target 29.
濺鍍靶29為透明導電層2之原材料。濺鍍靶29與玻璃基材1空開間隔地對向配置於第2導輥28之下游側且第3導輥31之上游側。The sputtering target 29 is a raw material of the transparent conductive layer 2. The sputtering target 29 is disposed opposite to the glass substrate 1 at a downstream side of the second guide roller 28 and at an upstream side of the third guide roller 31 with a space therebetween.
作為濺鍍靶29之材料,例如可列舉包含選自由In、Sn、Zn、Ga、Sb、Nb、Ti、Si、Zr、Mg、Al、Au、Ag、Cu、Pd、W所組成之群中之至少1種金屬之金屬氧化物。Examples of the material of the sputtering target 29 include metal oxides containing at least one metal selected from the group consisting of In, Sn, Zn, Ga, Sb, Nb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W.
具體而言,例如可列舉銦錫複合氧化物(ITO)等含銦之氧化物,例如可列舉銻錫複合氧化物(ATO)等含銻之氧化物等,較佳可列舉含銦之氧化物,更佳可列舉ITO。Specifically, for example, an oxide containing indium such as indium-tin composite oxide (ITO), for example, an oxide containing antimony such as antimony-tin composite oxide (ATO), etc. can be cited. Preferably, an oxide containing indium can be cited, and more preferably, ITO can be cited.
加熱機30對玻璃基材1或其後獲得之透明導電性玻璃3進行加熱。其於第2導輥28之下游側且第3導輥31之上游側,與玻璃基材1空開間隔地配置。又,加熱機30以玻璃基材1為基準,對向配置於濺鍍靶29之相反側。The heater 30 heats the glass substrate 1 or the transparent conductive glass 3 obtained later. The heater 30 is disposed at a distance from the glass substrate 1 on the downstream side of the second guide roller 28 and the upstream side of the third guide roller 31. The heater 30 is disposed on the opposite side of the sputtering target 29 with respect to the glass substrate 1.
成膜區域33劃分為第2導輥28與第3導輥31之間之搬送方向中途,於成膜區域33配置有濺鍍靶29及加熱機30。The film forming area 33 is divided into a portion between the second guide roller 28 and the third guide roller 31 in the conveying direction, and a sputtering target 29 and a heater 30 are arranged in the film forming area 33 .
第3導輥31將成膜之玻璃基材1(即,透明導電性玻璃3)導引至冷卻裝置13之第1冷卻輥34。第3導輥31配置於濺鍍靶29之下游側且第1冷卻輥34(下述)之上游側。The third guide roller 31 guides the film-formed glass substrate 1 (ie, the transparent conductive glass 3) to the first cooling roller 34 of the cooling device 13. The third guide roller 31 is disposed downstream of the sputtering target 29 and upstream of the first cooling roller 34 (described below).
濺鍍罩殼32收容第2導輥28、濺鍍靶29、加熱機30及第3導輥31。濺鍍罩殼32以能夠將其內部調節為真空狀態之方式構成。The sputtering housing 32 accommodates the second guide roller 28, the sputtering target 29, the heater 30, and the third guide roller 31. The sputtering housing 32 is configured so that the inside thereof can be adjusted to a vacuum state.
再者,濺鍍裝置12未圖示,但具備用以實施濺鍍之其他元件(陽極、陰極、Ar氣體導入機構等)。Furthermore, the sputtering device 12 is not shown in the figure, but is equipped with other components for performing sputtering (anode, cathode, Ar gas introduction mechanism, etc.).
作為濺鍍裝置12,具體而言,例如可列舉雙極型濺鍍裝置、電子迴旋共振型濺鍍裝置、磁控型濺鍍裝置、離子束型濺鍍裝置等。Specific examples of the sputtering apparatus 12 include a dipole sputtering apparatus, an electron cyclotron resonance sputtering apparatus, a magnetron sputtering apparatus, and an ion beam sputtering apparatus.
冷卻裝置13以與濺鍍裝置12相鄰之方式配置於濺鍍裝置12之下游側。冷卻裝置13使於濺鍍裝置12中加熱之透明導電性玻璃3冷卻。The cooling device 13 is disposed on the downstream side of the sputtering device 12 so as to be adjacent to the sputtering device 12. The cooling device 13 cools the transparent conductive glass 3 heated in the sputtering device 12.
冷卻裝置13具備第1冷卻輥34、第2冷卻輥35及冷卻殼體36。The cooling device 13 includes a first cooling roller 34 , a second cooling roller 35 , and a cooling housing 36 .
第1冷卻輥34於冷卻裝置13中配置於上游側,第2冷卻輥35配置於第1冷卻輥34之下游側。又,第1冷卻輥34及第2冷卻輥35分別亦為驅動輥。The first cooling roller 34 is disposed on the upstream side in the cooling device 13, and the second cooling roller 35 is disposed on the downstream side of the first cooling roller 34. In addition, the first cooling roller 34 and the second cooling roller 35 are also driving rollers.
第1冷卻輥34及第2冷卻輥35之表面溫度以能夠維持於例如280℃以下,較佳為150℃以下,又,例如為40℃以上,較佳為100℃以上之方式構成。The surface temperature of the first cooling roller 34 and the second cooling roller 35 is configured to be maintained at, for example, 280° C. or less, preferably 150° C. or less, and, for example, 40° C. or more, preferably 100° C. or more.
冷卻殼體36於其內部收容第1冷卻輥34及第2冷卻輥35。冷卻殼體36以能夠將其內部調節為真空狀態之方式構成。The cooling housing 36 accommodates the first cooling roller 34 and the second cooling roller 35 therein. The cooling housing 36 is configured so that the interior thereof can be adjusted to a vacuum state.
第2去靜電部18以與冷卻裝置13相鄰之方式配置於冷卻裝置13之下游側。第2去靜電部18對透明導電性玻璃3進行去靜電。The second destaticizing section 18 is disposed on the downstream side of the cooling device 13 so as to be adjacent to the cooling device 13. The second destaticizing section 18 destaticizes the transparent conductive glass 3.
第2去靜電部18具備第2去靜電機37、第4導輥38、及第2去靜電罩殼39。The second anti-static unit 18 includes a second anti-static motor 37 , a fourth guide roller 38 , and a second anti-static cover 39 .
第2去靜電機37使玻璃基材1所帶之電減少。第2去靜電機37配置於第2冷卻輥35之下游側且第3導輥31之上游側。作為第2去靜電機37之具體例,可列舉與第1去靜電機25相同者。The second anti-static machine 37 reduces the charge on the glass substrate 1. The second anti-static machine 37 is disposed downstream of the second cooling roller 35 and upstream of the third guide roller 31. As specific examples of the second anti-static machine 37, the same ones as the first anti-static machine 25 can be cited.
第4導輥38將自第2冷卻輥35通過第2去靜電機37搬送之透明導電性玻璃3導引至捲取部16之第2驅動輥40。第4導輥38配置於第2去靜電機37之下游側且第2驅動輥40之上游側。The fourth guide roller 38 guides the transparent conductive glass 3 conveyed from the second cooling roller 35 through the second destaticizing motor 37 to the second drive roller 40 of the take-up section 16. The fourth guide roller 38 is disposed downstream of the second destaticizing motor 37 and upstream of the second drive roller 40.
第2去靜電罩殼39於其內部收容第2去靜電機37及第4導輥38。第2去靜電罩殼39以能夠將其內部調節為真空狀態之方式構成。The second anti-static housing 39 accommodates the second anti-static motor 37 and the fourth guide roller 38 therein. The second anti-static housing 39 is configured so that the interior thereof can be adjusted to a vacuum state.
捲取部16於搬送裝置11中配置於最下游側,且以與第2去靜電機37相鄰之方式配置於第2去靜電機37之下游側。捲取部16將透明導電性玻璃3與第2保護材6一起進行捲取。The take-up unit 16 is disposed on the most downstream side in the conveying device 11, and is disposed on the downstream side of the second anti-static machine 37 so as to be adjacent to the second anti-static machine 37. The take-up unit 16 takes up the transparent conductive glass 3 together with the second protective material 6.
捲取部16具備第2驅動輥40、捲取輥(第3輥之一例)41、保護材捲出輥42、第5導輥43、夾輥44、及捲取罩殼45。The winding section 16 includes a second driving roller 40 , a winding roller (an example of a third roller) 41 , a protective material unwinding roller 42 , a fifth guide roller 43 , a clamping roller 44 , and a winding case 45 .
第2驅動輥40對自第2去靜電部18搬送之透明導電性玻璃3賦予用以向下游側捲出之動力。即,第2驅動輥40將透明導電性玻璃3導引至捲取輥41。The second driving roller 40 applies a driving force to roll the transparent conductive glass 3 conveyed from the second destaticizing section 18 toward the downstream side. That is, the second driving roller 40 guides the transparent conductive glass 3 to the take-up roller 41.
捲取輥41對自第5導輥43與夾輥44之間搬送之透明導電性玻璃3及第2保護材6之積層體7進行捲取。捲取輥41亦為驅動輥。The take-up roller 41 takes up the laminate 7 of the transparent conductive glass 3 and the second protective material 6 conveyed between the fifth guide roller 43 and the clamping roller 44. The take-up roller 41 is also a driving roller.
於保護材捲出輥42設置有卷狀第2保護材6。即,於保護材捲出輥42之周面,捲繞有於搬送方向上為長條之第2保護材6。保護材捲出輥42為驅動輥,將第2保護材6捲出至第5導輥43。The protective material unwinding roller 42 is provided with a rolled second protective material 6. That is, the second protective material 6 which is long in the conveying direction is wound around the peripheral surface of the protective material unwinding roller 42. The protective material unwinding roller 42 is a driving roller, and unwinds the second protective material 6 to the fifth guide roller 43.
第5導輥43將自保護材捲出輥42捲出之第2保護材6導引至夾輥44。第5導輥43配置於保護材捲出輥42與夾輥44之搬送方向中途。The fifth guide roller 43 guides the second protective material 6 rolled out from the protective material roll-out roller 42 to the clamping roller 44. The fifth guide roller 43 is disposed midway between the protective material roll-out roller 42 and the clamping roller 44 in the conveying direction.
夾輥44與第2驅動輥40一起使第2保護材6積層於透明導電性玻璃3。夾輥44與第2驅動輥40空開少許間隔而對向配置。The clamping roller 44 and the second driving roller 40 together laminate the second protective material 6 on the transparent conductive glass 3. The clamping roller 44 and the second driving roller 40 are disposed facing each other with a small gap therebetween.
捲取罩殼45於其內部收容第2驅動輥40、捲取輥41、保護材捲出輥42、第5導輥43及夾輥44。捲取罩殼45以能夠將其內部調節為真空狀態之方式構成。The reeling case 45 accommodates the second driving roller 40, the reeling roller 41, the protective material reeling roller 42, the fifth guide roller 43 and the clamping roller 44. The reeling case 45 is configured so that the inside thereof can be adjusted to a vacuum state.
2.透明導電性玻璃之製造方法 參照圖1及圖2,對使用搬送成膜裝置10製造透明導電性玻璃3之方法進行說明。透明導電性玻璃3之製造方法依序具備:準備步驟,其係準備搬送基材4;剝離步驟,其係自玻璃基材1剝離第1保護材5;第1去靜電步驟,其係對玻璃基材1進行去靜電;成膜步驟,其係在真空下於玻璃基材1設置透明導電層2;冷卻步驟,其係將透明導電性玻璃3冷卻;第2去靜電步驟,其係對透明導電性玻璃3進行去靜電;及捲取步驟,其係將透明導電性玻璃3捲取至捲取輥41。以下,對各步驟進行詳述。2. Manufacturing method of transparent conductive glass Referring to FIG1 and FIG2, the method of manufacturing transparent conductive glass 3 using the conveying film forming device 10 is described. The manufacturing method of transparent conductive glass 3 sequentially comprises: a preparation step, which is to prepare the conveying substrate 4; a stripping step, which is to strip the first protective material 5 from the glass substrate 1; a first destaticization step, which is to destaticize the glass substrate 1; a film forming step, which is to set the transparent conductive layer 2 on the glass substrate 1 under vacuum; a cooling step, which is to cool the transparent conductive glass 3; a second destaticization step, which is to destaticize the transparent conductive glass 3; and a winding step, which is to wind the transparent conductive glass 3 onto the winding roller 41. Each step is described in detail below.
首先,於捲出輥21準備搬送基材4(準備步驟)。具體而言,準備搬送基材4,設置於捲出輥21。First, the unwinding roller 21 is prepared to be transported with the substrate 4 (preparation step). Specifically, the unwinding roller 21 is prepared to be transported with the substrate 4 and is placed on the unwinding roller 21.
搬送基材4於厚度方向上具備玻璃基材1及第1保護材5(參照圖2A)。即,搬送基材4為附保護材之玻璃基材。搬送基材4於搬送方向上為長條,而捲繞成卷狀。此種卷狀搬送基材4可使用公知或市售者。The conveying substrate 4 has a glass substrate 1 and a first protective material 5 in the thickness direction (see FIG. 2A ). That is, the conveying substrate 4 is a glass substrate with a protective material. The conveying substrate 4 is long in the conveying direction and is rolled into a roll. Such a roll-shaped conveying substrate 4 can use a known or commercially available one.
玻璃基材1具有膜形狀(包含薄片形狀),由透明玻璃形成。作為玻璃,例如可列舉無鹼玻璃、鈉玻璃、硼矽酸玻璃、鋁矽酸玻璃等。The glass substrate 1 has a film shape (including a sheet shape) and is formed of transparent glass. Examples of the glass include alkali-free glass, sodium glass, borosilicate glass, and aluminosilicate glass.
玻璃基材1具有可撓性,其厚度例如為250 μm以下,較佳為100 μm以下,且例如為10 μm以上,較佳為40 μm以上。The glass substrate 1 has flexibility, and has a thickness of, for example, 250 μm or less, preferably 100 μm or less, and, for example, 10 μm or more, preferably 40 μm or more.
第1保護材5於捲出卷狀玻璃基材1時,防止由玻璃基材1彼此之接觸所導致之破損。第1保護材5具有膜形狀,配置於玻璃基材1之厚度方向一面。The first protective material 5 prevents damage caused by contact between the glass substrates 1 when the rolled glass substrate 1 is unrolled. The first protective material 5 has a film shape and is disposed on one surface of the glass substrate 1 in the thickness direction.
作為第1保護材5,例如可列舉附黏著劑之膜、間隔紙等。Examples of the first protective material 5 include an adhesive film, a spacer paper, and the like.
附黏著劑之膜於厚度方向上具備高分子膜及黏著劑層。The film with adhesive has a polymer film and an adhesive layer in the thickness direction.
作為高分子膜,例如可列舉聚酯系膜(聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚萘二甲酸乙二酯膜等)、聚碳酸酯系膜、烯烴系膜(聚乙烯膜、聚丙烯膜、環烯烴膜等)、丙烯酸系膜、聚醚碸系膜、聚芳酯系膜、三聚氰胺系膜、聚醯胺系膜、聚醯亞胺系膜、纖維素系膜、聚苯乙烯系膜。Examples of the polymer film include polyester films (polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, etc.), polycarbonate films, olefin films (polyethylene films, polypropylene films, cycloolefin films, etc.), acrylic films, polyether sulfone films, polyarylate films, melamine films, polyamide films, polyimide films, cellulose films, and polystyrene films.
黏著劑層為感壓接著劑層,例如可列舉丙烯酸系黏著劑層、橡膠系黏著劑層、聚矽氧系黏著劑層、聚酯系黏著劑層、聚胺基甲酸酯系黏著劑層、聚醯胺系黏著劑層、環氧系黏著劑層、乙烯基烷基醚系黏著劑層、氟系黏著劑層等。The adhesive layer is a pressure-sensitive adhesive layer, for example, an acrylic adhesive layer, a rubber adhesive layer, a silicone adhesive layer, a polyester adhesive layer, a polyurethane adhesive layer, a polyamide adhesive layer, an epoxy adhesive layer, a vinyl alkyl ether adhesive layer, a fluorine adhesive layer, etc.
作為間隔紙,例如可列舉道林紙、日本紙、牛皮紙、玻璃紙、合成紙、面漆紙等。Examples of the spacer paper include wood-based paper, Japanese paper, kraft paper, glass paper, synthetic paper, and coated paper.
第1保護材5之厚度例如為10 μm以上,較佳為30 μm以上,又,例如為1000 μm以下,較佳為500 μm以下。The thickness of the first protective material 5 is, for example, not less than 10 μm, preferably not less than 30 μm, and, for example, not more than 1000 μm, preferably not more than 500 μm.
其次,使搬送成膜裝置10作動。具體而言,將各種殼體(捲出殼體24、第1去靜電罩殼27、第2去靜電罩殼39、捲取罩殼45)全部調整為真空,並且使各種驅動輥(捲出輥21、第1~2驅動輥(22、40)、保護材捲取輥23、第1~5導輥(26、28、31、38、43)、第1~2冷卻輥(34、35)、捲取輥41、保護材捲出輥42、夾輥44))全部旋轉驅動。又,亦使去靜電部15(第1去靜電機25及第2去靜電機37)、冷卻裝置13、濺鍍裝置12等作動。藉此,搬送基材4被搬送至下游側,並且依序實施剝離步驟、第1去靜電步驟、成膜步驟、冷卻步驟、第2去靜電步驟、及捲取步驟。Next, the film-forming conveyor 10 is operated. Specifically, all the housings (the unwinding housing 24, the first antistatic housing 27, the second antistatic housing 39, and the take-up housing 45) are adjusted to be vacuum, and all the driving rollers (the unwinding roller 21, the first and second driving rollers (22, 40), the protective material take-up roller 23, the first to fifth guide rollers (26, 28, 31, 38, 43), the first and second cooling rollers (34, 35), the take-up roller 41, the protective material unwinding roller 42, and the clamping roller 44)) are driven to rotate. Furthermore, the destaticizing section 15 (the first destaticizing machine 25 and the second destaticizing machine 37), the cooling device 13, the sputtering device 12, etc. are also operated. Thus, the substrate 4 is conveyed to the downstream side, and the stripping step, the first destaticizing step, the film forming step, the cooling step, the second destaticizing step, and the winding step are sequentially performed.
具體而言,於捲出部14,搬送基材4自捲出輥21捲出。此時,自搬送基材4之玻璃基材1剝離第1保護材5。第1保護材5被捲取至保護材捲取輥23,玻璃基材1單獨朝第1驅動輥22搬送(參照圖2B)。Specifically, in the unwinding section 14, the conveying substrate 4 is unwound from the unwinding roller 21. At this time, the first protective material 5 is peeled off from the glass substrate 1 of the conveying substrate 4. The first protective material 5 is taken up by the protective material taking-up roller 23, and the glass substrate 1 is conveyed toward the first driving roller 22 alone (see FIG. 2B).
其後,玻璃基材1係其厚度方向一面與第1驅動輥22直接接觸,自捲出部14搬送至第1去靜電部17。此時,由於第1驅動輥22之驅動力及摩擦力,而於玻璃基材1之厚度方向一面產生帶電。Thereafter, the glass substrate 1 is directly contacted with the first driving roller 22 in the thickness direction and is transported from the unwinding section 14 to the first destaticizing section 17. At this time, the glass substrate 1 is charged in the thickness direction due to the driving force and friction of the first driving roller 22.
於第1去靜電部17中,玻璃基材1藉由第1去靜電機25之作動而去靜電。即,玻璃基材1攜帶之電量減少。此時,第1去靜電部17自玻璃基材1之厚度方向一側進行去靜電,以便將玻璃基材1之厚度方向一面去靜電。In the first destaticizing section 17, the glass substrate 1 is destaticized by the operation of the first destaticizing machine 25. That is, the amount of electricity carried by the glass substrate 1 is reduced. At this time, the first destaticizing section 17 performs destaticization from one side of the glass substrate 1 in the thickness direction, so as to destaticize the entire thickness direction of the glass substrate 1.
其後,經去靜電之玻璃基材1被導引至第1導輥26,而搬送至濺鍍裝置12。Thereafter, the destaticized glass substrate 1 is guided to the first guide roller 26 and transported to the sputtering device 12 .
於濺鍍裝置12中,玻璃基材1經第2導輥28導引而搬送至成膜區域33。於成膜區域33中,對玻璃基材1實施濺鍍。In the sputtering device 12, the glass substrate 1 is guided by the second guide roller 28 and transported to the film forming area 33. In the film forming area 33, the glass substrate 1 is sputtered.
濺鍍係藉由供給氣體並且自電源施加電壓,而使氣體離子加速,照射至濺鍍靶29,自濺鍍靶29表面濺出靶材料,使該靶材料積層於玻璃基材1之表面。The sputtering process is performed by supplying gas and applying voltage from a power source to accelerate gas ions and irradiate the sputtering target 29 , sputtering target material from the surface of the sputtering target 29 , and depositing the target material on the surface of the glass substrate 1 .
作為濺鍍,具體而言,可列舉雙極濺鍍法、電子迴旋共振濺鍍法、磁控濺鍍法、離子束濺鍍法等。Specifically, as the sputtering method, there can be mentioned a dipole sputtering method, an electron cyclotron resonance sputtering method, a magnetron sputtering method, an ion beam sputtering method, and the like.
作為濺鍍所使用之氣體(即,要導入至成膜區域33之氣體),例如可列舉氬氣(Ar)等惰性氣體。較佳為可併用氧氣等反應性氣體。As the gas used for sputtering (i.e., the gas to be introduced into the film forming area 33), for example, an inert gas such as argon (Ar) can be cited. Preferably, a reactive gas such as oxygen can be used in combination.
濺鍍時之氣壓(即,成膜區域33之氣壓)為真空,較佳為未達1.0 Pa,更佳為0.5 Pa以下。The air pressure during sputtering (i.e., the air pressure in the film forming area 33) is vacuum, preferably less than 1.0 Pa, and more preferably less than 0.5 Pa.
藉此,於成膜區域33中,於玻璃基材1之厚度方向一面成膜透明導電層2,而獲得透明導電性玻璃3(參照圖2C)。Thus, in the film forming area 33, the transparent conductive layer 2 is formed on one surface in the thickness direction of the glass substrate 1, thereby obtaining the transparent conductive glass 3 (see FIG. 2C).
又,與濺鍍同時,透明導電性玻璃3利用加熱機30進行加熱。Furthermore, the transparent conductive glass 3 is heated by the heater 30 simultaneously with the sputtering.
作為加熱溫度,例如為300℃以上,較佳為400℃以上,又,例如為800℃以下,較佳為600℃以下。藉此,例如於透明導電層2為ITO層之情形時,可與成膜同時使ITO層於高溫下結晶化,可提高導電性。The heating temperature is, for example, 300° C. or higher, preferably 400° C. or higher, and, for example, 800° C. or lower, preferably 600° C. or lower. Thus, when the transparent conductive layer 2 is an ITO layer, the ITO layer can be crystallized at a high temperature while being formed, thereby improving conductivity.
其後,透明導電性玻璃3被導引至第3導輥31,而被搬送至冷卻裝置13。Thereafter, the transparent conductive glass 3 is guided to the third guide roller 31 and transported to the cooling device 13 .
於冷卻裝置13中,透明導電性玻璃3依序與第1冷卻輥34及第2冷卻輥35接觸,而得以冷卻。In the cooling device 13, the transparent conductive glass 3 sequentially contacts the first cooling roller 34 and the second cooling roller 35 to be cooled.
各冷卻輥(34、35)之表面溫度例如為280℃以下,較佳為150℃以下,又,例如為40℃以上。The surface temperature of each cooling roller (34, 35) is, for example, 280°C or less, preferably 150°C or less, and, for example, 40°C or more.
此時,就透明導電性玻璃3與冷卻輥34、35之接觸面積擴大(進而提高冷卻效率)之觀點而言,以於第1冷卻輥34與第2冷卻輥35之間,橫穿其等之對向方向之方式搬送透明導電性玻璃3。即,以第1冷卻輥34之徑向一側端部與第2冷卻輥35之徑向另一端部相接觸之方式搬送透明導電性玻璃3。At this time, from the viewpoint of increasing the contact area between the transparent conductive glass 3 and the cooling rollers 34 and 35 (and thus improving the cooling efficiency), the transparent conductive glass 3 is conveyed between the first cooling roller 34 and the second cooling roller 35 so as to cross the opposing direction thereof. That is, the transparent conductive glass 3 is conveyed so that one radial end of the first cooling roller 34 is in contact with the other radial end of the second cooling roller 35.
此時,透明導電性玻璃3之玻璃基材1之厚度方向另一面與第2冷卻輥35直接接觸,自冷卻裝置13搬送至第2去靜電部18。此時,由於第2冷卻輥35之驅動力及摩擦力,而於透明導電性玻璃3之厚度方向另一面(玻璃基材1側之表面)產生帶電。At this time, the other side of the transparent conductive glass 3 in the thickness direction of the glass substrate 1 is in direct contact with the second cooling roller 35, and is transported from the cooling device 13 to the second destaticizing section 18. At this time, due to the driving force and friction of the second cooling roller 35, the other side of the transparent conductive glass 3 in the thickness direction (the surface on the glass substrate 1 side) is charged.
其後,經冷卻之透明導電性玻璃3被搬送至第2去靜電部18。Thereafter, the cooled transparent conductive glass 3 is transported to the second destaticizing section 18.
於第2去靜電部18中,透明導電性玻璃3藉由第2去靜電機37之作動而去靜電。即,透明導電性玻璃3之玻璃基材1攜帶之電量減少。此時,第2去靜電部18自透明導電性玻璃3之厚度方向另一側去靜電,以便將透明導電性玻璃3之厚度方向另一面(玻璃基材1側之表面)去靜電。In the second destaticizing section 18, the transparent conductive glass 3 is destaticized by the operation of the second destaticizing machine 37. That is, the amount of electricity carried by the glass substrate 1 of the transparent conductive glass 3 is reduced. At this time, the second destaticizing section 18 destaticizes from the other side in the thickness direction of the transparent conductive glass 3, so as to destaticize the other side in the thickness direction of the transparent conductive glass 3 (the surface on the glass substrate 1 side).
其後,經去靜電之透明導電性玻璃3被導引至第4導輥38,而搬送至捲取部16。Thereafter, the destaticized transparent conductive glass 3 is guided to the fourth guide roller 38 and transported to the take-up section 16 .
於捲取部16中,第2保護材6自保護材捲出輥42捲出,被導引至第5導輥43,而搬送至夾輥44。In the take-up section 16 , the second protective material 6 is unwound from the protective material unwinding roller 42 , guided to the fifth guide roller 43 , and conveyed to the clamping roller 44 .
另一方面,透明導電性玻璃3與第2保護材6一起通過第2驅動輥40與夾輥44之間,而於透明導電性玻璃3之厚度方向一面積層第2保護材6。On the other hand, the transparent conductive glass 3 and the second protective material 6 pass through between the second driving roller 40 and the clamping roller 44, and the second protective material 6 is laminated on the transparent conductive glass 3 in the thickness direction.
其後,透明導電性玻璃3與第2保護材6一起被捲取至捲取輥41。具體而言,具備透明導電性玻璃3及配置於其厚度方向另一面(與透明導電層2為相反側之表面)之第2保護材6之積層體7(參照圖2D)被捲繞成卷狀。Thereafter, the transparent conductive glass 3 and the second protective material 6 are taken up on the take-up roll 41. Specifically, the laminate 7 (see FIG. 2D ) having the transparent conductive glass 3 and the second protective material 6 disposed on the other side in the thickness direction (the surface opposite to the transparent conductive layer 2) is wound into a roll.
3.透明導電性玻璃之用途 透明導電性玻璃3例如用於圖像顯示裝置等光學裝置。於圖像顯示裝置(具體而言,具有LCD(Liquid Crystal Display,液晶顯示裝置)模組、有機EL模組等圖像顯示元件之圖像顯示裝置)具備透明導電性玻璃3之情形時,透明導電性玻璃3例如用作觸控面板用基材、抗反射基材等,較佳為用作觸控面板用基材。作為觸控面板之形式,可列舉光學方式、超音波方式、靜電電容方式、電阻膜方式等各種方式,尤其適宜用於靜電電容方式之觸控面板。3. Application of transparent conductive glass The transparent conductive glass 3 is used, for example, in optical devices such as image display devices. When the image display device (specifically, an image display device having an LCD (Liquid Crystal Display) module, an organic EL module, or other image display element) has the transparent conductive glass 3, the transparent conductive glass 3 is used, for example, as a substrate for a touch panel, an anti-reflection substrate, etc., preferably as a substrate for a touch panel. As the form of the touch panel, various methods such as optical method, ultrasonic method, electrostatic capacitance method, and resistive film method can be listed, and it is particularly suitable for use in an electrostatic capacitance touch panel.
而且,該搬送成膜裝置10中之搬送裝置11具備捲出輥21、保護材捲取輥23、捲取輥41及去靜電部15。Furthermore, the transport device 11 in the transport film-forming device 10 includes a take-out roller 21 , a protective material take-up roller 23 , a take-up roller 41 , and a destaticizing section 15 .
因此,可去除玻璃基材1表面所帶之電。因此,於玻璃基材1與第1導輥26等其他輥接觸時,可抑制由帶電所導致之玻璃基材1與其他輥之黏連。因此,於玻璃基材1與其他輥分離時,可減輕玻璃基材1之負荷,可抑制玻璃基材1之破損。Therefore, the charge on the surface of the glass substrate 1 can be removed. Therefore, when the glass substrate 1 contacts other rollers such as the first guide roller 26, the glass substrate 1 can be prevented from sticking to other rollers due to the charge. Therefore, when the glass substrate 1 is separated from other rollers, the load on the glass substrate 1 can be reduced, and the damage of the glass substrate 1 can be prevented.
又,搬送裝置11進而具備第1驅動輥22,因此,可確實且連續地搬送玻璃基材1。又,第1去靜電機25配置於第1驅動輥22之下游側,因此可對因與第1驅動輥22之接觸而產生之玻璃基材1之帶電進行去靜電,其結果,可抑制由第1驅動輥22所引起之玻璃基材1之破損。Furthermore, the conveying device 11 further includes the first drive roller 22, so that the glass substrate 1 can be conveyed reliably and continuously. Furthermore, the first destaticizer 25 is disposed on the downstream side of the first drive roller 22, so that the glass substrate 1 charged due to contact with the first drive roller 22 can be destaticized, and as a result, damage to the glass substrate 1 caused by the first drive roller 22 can be suppressed.
尤其是,若第1驅動輥22與玻璃基材1之平滑之表面直接接觸,則因由第1驅動輥22之旋轉所導致之摩擦,而容易於玻璃基材1之表面產生靜電。因此,藉由緊隨第1驅動輥22後配置第1去靜電部17,可立即且確實地減少玻璃基材1之帶電。另一方面,於透明導電性玻璃3中,就透明導電層2與第1冷卻輥34(驅動輥)之接觸而言,透明導電層2不如玻璃表面平滑,難以產生靜電,因此並不特別需要緊隨與透明導電層2接觸之第1冷卻輥34(驅動輥)後配置去靜電部。另一方面,若緊隨與玻璃基材1接觸之第2冷卻輥35(驅動輥)後配置第2去靜電部18,則可有效地抑制由玻璃基材1之帶電所導致之破損。In particular, if the first drive roller 22 is in direct contact with the smooth surface of the glass substrate 1, static electricity is easily generated on the surface of the glass substrate 1 due to friction caused by the rotation of the first drive roller 22. Therefore, by arranging the first antistatic unit 17 immediately after the first drive roller 22, the charge of the glass substrate 1 can be immediately and reliably reduced. On the other hand, in the transparent conductive glass 3, in terms of the contact between the transparent conductive layer 2 and the first cooling roller 34 (drive roller), the transparent conductive layer 2 is not as smooth as the glass surface and static electricity is not easily generated. Therefore, it is not particularly necessary to arrange the antistatic unit immediately after the first cooling roller 34 (drive roller) in contact with the transparent conductive layer 2. On the other hand, if the second destaticizing unit 18 is disposed immediately after the second cooling roller 35 (driving roller) in contact with the glass substrate 1, damage to the glass substrate 1 caused by charging can be effectively suppressed.
又,搬送成膜裝置10具備搬送裝置11及濺鍍裝置12。Furthermore, the transport film forming apparatus 10 includes a transport apparatus 11 and a sputtering apparatus 12 .
因此,可抑制玻璃基材1之破損地,於玻璃基材1設置透明導電層2。因此,可確實地製造透明導電性玻璃3。Therefore, the transparent conductive layer 2 can be provided on the glass substrate 1 while suppressing damage to the glass substrate 1. Therefore, the transparent conductive glass 3 can be reliably manufactured.
又,去靜電部15具有第1去靜電部17及第2去靜電部18,第1去靜電部17設置於濺鍍裝置12之上游側,第2去靜電部18設置於濺鍍裝置12之下游側。Furthermore, the destaticizing section 15 includes a first destaticizing section 17 and a second destaticizing section 18 . The first destaticizing section 17 is provided on the upstream side of the sputtering device 12 , and the second destaticizing section 18 is provided on the downstream side of the sputtering device 12 .
因此,於透明導電層2之成膜前後,可抑制玻璃基材1或透明導電性玻璃3之帶電。因此,可更確實地抑制玻璃基材1或透明導電性玻璃3之破損,可確實地製造透明導電性玻璃3。Therefore, the glass substrate 1 or the transparent conductive glass 3 can be prevented from being charged before and after the formation of the transparent conductive layer 2. Therefore, the glass substrate 1 or the transparent conductive glass 3 can be prevented from being damaged more reliably, and the transparent conductive glass 3 can be manufactured reliably.
透明導電性玻璃3之製造方法依序具備:準備步驟,其係準備具備玻璃基材1及第1保護材5之搬送基材4;剝離步驟,其係自玻璃基材1剝離第1保護材5;及成膜步驟,其係在真空下於玻璃基材1設置透明導電層2;且於成膜步驟之前後,具備對玻璃基材1進行去靜電之去靜電步驟。The manufacturing method of the transparent conductive glass 3 sequentially comprises: a preparation step, which is to prepare a conveying substrate 4 having a glass substrate 1 and a first protective material 5; a peeling step, which is to peel off the first protective material 5 from the glass substrate 1; and a film forming step, which is to set a transparent conductive layer 2 on the glass substrate 1 under vacuum; and before and after the film forming step, a destaticizing step for destaticizing the glass substrate 1 is provided.
因此,可抑制玻璃基材1與輥之接觸時之黏連,減輕其等分離時之負荷。因此,可抑制玻璃基材1之破損地,於玻璃基材1設置透明導電層2。結果,可確實地製造透明導電性玻璃3。Therefore, the adhesion between the glass substrate 1 and the roller when in contact can be suppressed, and the load when they are separated can be reduced. Therefore, the transparent conductive layer 2 can be provided on the glass substrate 1 while suppressing the damage of the glass substrate 1. As a result, the transparent conductive glass 3 can be reliably manufactured.
尤其關於去靜電步驟,其於成膜步驟之前及之後實施。因此,於透明導電層2之成膜前後,可抑制玻璃基材1或透明導電性玻璃3之帶電。因此,可更確實地抑制玻璃基材1或透明導電性玻璃3之破損,可確實地製造透明導電性玻璃3。In particular, the destaticizing step is performed before and after the film forming step. Therefore, the glass substrate 1 or the transparent conductive glass 3 can be prevented from being charged before and after the transparent conductive layer 2 is formed. Therefore, the damage of the glass substrate 1 or the transparent conductive glass 3 can be more reliably prevented, and the transparent conductive glass 3 can be reliably manufactured.
4.變化例 以下,對圖1所示之一實施形態之變化例進行說明。再者,關於該等變化例,亦發揮與上述一實施形態同樣之作用效果。4. Variations The following describes variations of one embodiment shown in FIG. 1. These variations also have the same effects as the above-mentioned embodiment.
(1)於圖1所示之實施形態中,2個去靜電部15配置於濺鍍裝置12之前後。即,去靜電步驟於成膜步驟之前後實施。例如,雖未圖示,去靜電部15可僅具備第1去靜電部17,又,亦可僅具備第2去靜電部18。即,去靜電步驟可僅作為濺鍍成膜之前步驟實施,又,亦可僅作為後續步驟實施。(1) In the embodiment shown in FIG. 1 , two destaticizing sections 15 are arranged before and after the sputtering device 12. That is, the destaticizing step is performed before and after the film forming step. For example, although not shown, the destaticizing section 15 may include only the first destaticizing section 17 or only the second destaticizing section 18. That is, the destaticizing step may be performed only as a step before the sputtering film forming step or only as a step after the sputtering film forming step.
較佳可列舉圖1所示之實施形態。於該實施形態中,可隨時對因與配置於濺鍍裝置12之前後之驅動輥之接觸而產生之電進行去靜電,而確實地抑制由帶電所導致之玻璃基材1之破損。A preferred embodiment is shown in Fig. 1. In this embodiment, the static electricity generated by the contact with the driving rollers arranged before and after the sputtering device 12 can be de-staticized at any time, thereby reliably suppressing the damage of the glass substrate 1 caused by the static electricity.
(2)於圖1及圖2所示之實施形態中,作為積層玻璃,例示了透明導電性玻璃3,即,作為功能層,例示了透明導電層2,例如,雖未圖示,但作為功能層,例如亦可設為硬塗層、光學調整層、金屬層(例如銅層等非透明導電層)等。又,作為功能層,可為1層,亦可為2層以上。(2) In the embodiments shown in FIG. 1 and FIG. 2 , a transparent conductive glass 3 is exemplified as the laminated glass, that is, a transparent conductive layer 2 is exemplified as the functional layer. For example, although not shown, the functional layer may be a hard coating layer, an optical adjustment layer, a metal layer (for example, a non-transparent conductive layer such as a copper layer), etc. Furthermore, the functional layer may be a single layer or may be two or more layers.
(3)於圖1所示之實施形態中,作為成膜裝置,例示了濺鍍裝置12,例如,雖未圖示,但可列舉真空蒸鍍裝置、化學蒸鍍裝置等真空成膜裝置等。(3) In the embodiment shown in FIG. 1 , a sputtering apparatus 12 is exemplified as the film forming apparatus. For example, although not shown, vacuum film forming apparatuses such as a vacuum evaporation apparatus and a chemical evaporation apparatus can be exemplified.
再者,上述發明提供本發明之例示之實施形態,但此僅為例示,不能限定性地進行解釋。對該技術領域之業者而言顯而易見之本發明之變化例包含於下述申請專利範圍。 [產業上之可利用性]Furthermore, the above invention provides an exemplary embodiment of the present invention, but this is only an example and cannot be interpreted in a limiting sense. Variations of the present invention that are obvious to those skilled in the art are included in the scope of the following patent application. [Industrial Applicability]
玻璃基材之搬送裝置及積層玻璃之製造裝置用於積層玻璃之製造。The glass substrate conveying device and the laminated glass manufacturing device are used for manufacturing laminated glass.
1:玻璃基材 2:透明導電層 3:透明導電性玻璃 4:搬送基材 5:第1保護材 6:第2保護材 7:積層體 10:搬送成膜裝置 11:搬送裝置 12:濺鍍裝置 13:冷卻裝置 14:捲出部 15:去靜電部 16:捲取部 17:第1去靜電部 18:第2去靜電部 21:捲出輥 22:第1驅動輥 23:保護材捲取輥 24:捲出殼體 25:第1去靜電機 26:第1導輥 27:第1去靜電罩殼 28:第2導輥 29:濺鍍靶 30:加熱機 31:第3導輥 33:成膜區域 34:第1冷卻輥 35:第2冷卻輥 36:冷卻殼體 37:第2去靜電機 38:第4導輥 39:第2去靜電罩殼 40:第2驅動輥 41:捲取輥 42:保護材捲出輥 43:第5導輥 44:夾輥 45:捲取罩殼1: Glass substrate 2: Transparent conductive layer 3: Transparent conductive glass 4: Conveying substrate 5: First protective material 6: Second protective material 7: Laminated body 10: Conveying film forming device 11: Conveying device 12: Sputtering device 13: Cooling device 14: Unwinding unit 15: Antistatic unit 16: Take-up unit 17: First antistatic unit 18: Second antistatic unit 21: Unwinding roller 22: First driving roller 23: Protective material take-up roller 24: Unwinding shell 25 :1st anti-static machine 26:1st guide roller 27:1st anti-static cover 28:2nd guide roller 29:Sputtering target 30:Heating machine 31:3rd guide roller 33:Film forming area 34:1st cooling roller 35:2nd cooling roller 36:Cooling cover 37:2nd anti-static machine 38:4th guide roller 39:2nd anti-static cover 40:2nd driving roller 41:Taking roller 42:Protective material unloading roller 43:5th guide roller 44:Clamping roller 45:Taking cover
圖1表示本發明之搬送成膜裝置之一實施形態。 圖2A-D表示用圖1之搬送成膜裝置搬送之搬送物之剖視圖,圖2A表示捲繞至捲出輥之階段之搬送物(即,搬送基材),圖2B表示自捲出輥搬送至第1驅動輥之階段之搬送物(即,玻璃基材單獨體),圖2C表示自成膜區域搬送至冷卻裝置之階段之搬送物(即,透明導電性玻璃),圖2D表示自第5導輥捲繞至捲取輥之階段之搬送物(即,透明導電性玻璃與第2保護材之積層體)。FIG1 shows an embodiment of the conveying film-forming device of the present invention. FIG2A-D show cross-sectional views of the conveyed object conveyed by the conveying film-forming device of FIG1 , FIG2A shows the conveyed object (i.e., the conveyed substrate) at the stage of being wound around the unwinding roller, FIG2B shows the conveyed object (i.e., the glass substrate alone) at the stage of being transported from the unwinding roller to the first driving roller, FIG2C shows the conveyed object (i.e., the transparent conductive glass) at the stage of being transported from the film-forming area to the cooling device, and FIG2D shows the conveyed object (i.e., the laminate of the transparent conductive glass and the second protective material) at the stage of being wound around the fifth guide roller to the take-up roller.
1:玻璃基材 1: Glass substrate
3:透明導電性玻璃 3: Transparent conductive glass
4:搬送基材 4: Transporting substrate
5:第1保護材 5: 1st protective material
6:第2保護材 6: Second protective material
7:積層體 7: Laminated body
10:搬送成膜裝置 10: Transport film forming device
11:搬送裝置 11: Transport device
12:濺鍍裝置 12: Sputtering device
13:冷卻裝置 13: Cooling device
14:捲出部 14: Rolling out section
15:去靜電部 15: Remove static electricity
16:捲取部 16: Rolling section
17:第1去靜電部 17:1st anti-static part
18:第2去靜電部 18: Second static electricity removal section
21:捲出輥 21: Roll out the roller
22:第1驅動輥 22: 1st drive roller
23:保護材捲取輥 23: Protective material take-up roller
24:捲出殼體 24: Roll out the shell
25:第1去靜電機 25: No. 1 anti-static machine
26:第1導輥 26: 1st guide roller
27:第1去靜電罩殼 27: No. 1 anti-static cover
28:第2導輥 28: Second guide roller
29:濺鍍靶 29: Splash-plated target
30:加熱機 30:Heating machine
31:第3導輥 31: The third guide roller
32:濺鍍罩殼 32: Splash-plated cover
33:成膜區域 33: Film forming area
34:第1冷卻輥 34: 1st cooling roller
35:第2冷卻輥 35: Second cooling roller
36:冷卻殼體 36: Cooling shell
37:第2去靜電機 37: Second anti-static machine
38:第4導輥 38: 4th guide roller
39:第2去靜電罩殼 39: Second anti-static cover
40:第2驅動輥 40: Second drive roller
41:捲取輥 41: Roller
42:保護材捲出輥 42: Protective material roll-out roller
43:第5導輥 43: 5th guide roller
44:夾輥 44: Clamp Roller
45:捲取罩殼 45: Roll up cover
Claims (6)
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| JP2019064118A JP7324028B2 (en) | 2019-03-28 | 2019-03-28 | Glass substrate conveying device, laminated glass manufacturing device, and laminated glass manufacturing method |
| JP2019-064118 | 2019-03-28 |
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| JP2014051429A (en) * | 2012-08-07 | 2014-03-20 | Kobe Steel Ltd | Glass film transport device |
| TW201446673A (en) * | 2013-03-20 | 2014-12-16 | Corning Inc | Apparatuses and methods for processing lengths of flexible glass |
| JP2017066003A (en) * | 2015-09-30 | 2017-04-06 | AvanStrate株式会社 | Display glass substrate manufacturing method, display glass substrate manufacturing apparatus |
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| JPH1111980A (en) * | 1997-06-27 | 1999-01-19 | Asahi Glass Co Ltd | Transparent conductive glass substrate and method for manufacturing the same |
| JP4613048B2 (en) | 2004-10-29 | 2011-01-12 | 大日本印刷株式会社 | Pressure gradient ion plating film deposition system |
| CN108425098A (en) | 2011-12-21 | 2018-08-21 | 应用材料公司 | System and method for handling substrate |
| KR20140071058A (en) | 2012-12-03 | 2014-06-11 | 코닝정밀소재 주식회사 | Roll-to-roll sputtering apparatus |
| JPWO2014092015A1 (en) * | 2012-12-13 | 2017-01-12 | 旭硝子株式会社 | Method for manufacturing electronic device and method for manufacturing glass laminate |
| JP6615520B2 (en) * | 2015-07-15 | 2019-12-04 | 日東電工株式会社 | Optical laminate |
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| JP2014051429A (en) * | 2012-08-07 | 2014-03-20 | Kobe Steel Ltd | Glass film transport device |
| TW201446673A (en) * | 2013-03-20 | 2014-12-16 | Corning Inc | Apparatuses and methods for processing lengths of flexible glass |
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