TWI862780B - Light emitting display device and method of manufacturing the same - Google Patents

Abstract

A light-emitting display device has a substrate, a first patterned conductive layer and a second patterned conductive layer respectively disposed on opposite surfaces of the substrate, a plurality of soldering pad areas, and a plurality of light-emitting elements. The minimum distance between the light-emitting elements is 2 to 3 mm. The first patterned conductive layer has a plurality of grid-shaped intersected first wires, the second patterned conductive layer has a plurality of parallel and separated second wires with each of the second wires having derived extensions, and the substrate is used to electrically isolate the first patterned conductive layer and the second patterned conductive layer. The soldering pad areas are separated from each other with one soldering pad area being electrically connected to the first wires while the other soldering pad areas being respectively connected to the derived extensions of three adjacent second wires.

Description

Luminescent display device and manufacturing method thereof

The present invention relates to a display device, in particular to a luminous display device and a manufacturing method thereof.

In response to the development of display screens towards larger sizes, flatness, thinness, lightness and flexibility, the development of luminous display technology using passive point light sources and active point light sources as the light sources of the display and using flexible substrates as the substrates for configuring these light sources is becoming increasingly important. Passive point light sources are, for example, light emitting diodes (LEDs), while active point light sources are, for example, organic light-emitting diodes (OLEDs). In a branch of technological development, the subsequent progress of large-screen luminous displays developed with LEDs as light sources for people to watch from a distance is worth paying attention to.

In manufacturing, this type of luminous display for people to watch from a distance can be made by installing LED beads or LED chips composed of multiple LEDs in the form of an array on a substrate, and the distance between the LED beads or LED chips is not less than 2 mm, which is different from the organic light-emitting diode (OLED) display or micro-LED display for people to watch from a close distance. In order for each LED bead or LED chip in the array to be lit and have the required brightness, the configuration substrate of these LED beads or LED chips and their configuration wires must have good electrical conductivity. In addition, in order to improve the contrast of such light-emitting displays viewed from a distance, the visibility of the configuration substrate and configuration wires of these LED lamp beads or LED chips in the display screen must also be reduced. On the other hand, in order to cope with the display effects required in various application scenarios, the production of the configuration wires of these LED lamp beads or LED chips must have good design changes and be able to be produced quickly. In response to the above technical problems, the present invention hopes to propose solutions.

In view of the above problems, the present invention provides a luminous display device and a manufacturing method thereof.

In one embodiment, a light-emitting display device comprises a substrate, a first patterned conductive layer disposed on the substrate, a second patterned conductive layer, a first pad region, a second pad region, a third pad region and a fourth pad region electrically isolated from each other, and a plurality of light-emitting elements. The substrate comprises a first surface and a second surface opposite to the first surface, and the substrate comprises a plurality of through holes. The first patterned conductive layer is disposed on the first surface and comprises a plurality of first conductive lines interwoven into a grid shape. The second patterned conductive layer is disposed on the second surface and comprises at least three linear second conductive lines which are parallel to each other and spaced equidistantly or unequally from each other, a linear extension portion connected to each second conductive line, and at least one island portion spaced from the second conductive line, wherein the configuration direction of the extension portion intersects with the configuration direction of the second conductive line. The first pad area is arranged on the island, and the second pad area, the third pad area and the fourth pad area are arranged on the extension part respectively. A plurality of light-emitting elements are arranged on the same side of the second surface in an array, with a minimum spacing of 2 to 3 mm between them, and at least one light-emitting element has four different pins connected to the first pad area, the second pad area, the third pad area and the fourth pad area respectively.

In one embodiment, the island portion of the second patterned conductive layer of the light-emitting display device is electrically connected to the intersection of the first conductive line of the first patterned conductive layer through one of the through holes.

In one embodiment, the line width of each first conductive line of the first patterned conductive layer of the light-emitting display device is 25 microns to 100 microns, and the line width of each second conductive line is 25 microns to 100 microns.

In one embodiment, the grid shape of the first conductive line of the first patterned conductive layer of the light-emitting display device is one of a rectangle, a hexagon, an ellipse and a circle.

In one embodiment, the light-emitting display device further has a third patterned conductive layer, which is disposed on the second surface of the substrate and electrically isolated from the second patterned conductive layer, and has at least three third linear conductive lines connected to the second conductive lines, which are parallel to each other and are equidistant or unequally spaced from each other. The extension direction of the third conductive line intersects with the extension direction of the second conductive line, and the third conductive line extends to connect to the lighting signal input terminal of the light-emitting display device.

In one embodiment, the light-emitting display device further has a first patterned electrically insulating layer having a plurality of first electrically insulating blocks disposed between the second patterned conductive layer and the third patterned conductive layer, and the first electrically insulating blocks electrically isolate the third conductive line from the second conductive line.

In one embodiment, the light-emitting display device further has a second patterned electrically insulating layer having a plurality of second electrically insulating blocks, which are respectively arranged on the second surface of the substrate along a first arrangement direction of the first pad area, the second pad area, the third pad area and the fourth pad area, for isolating the electrical contact of the first pad area, the second pad area, the third pad area and the fourth pad area in a second arrangement direction, and the second arrangement direction intersects the first arrangement direction.

In one embodiment, the light-emitting display device further has a third patterned electrically insulating layer having a plurality of third electrically insulating blocks, which are respectively arranged above the second conductive wire connected to the third pad region along the second arrangement direction of the first pad region, the second pad region, the third pad region and the fourth pad region, to isolate the electrical contact of the first pad region, the second pad region, the third pad region and the fourth pad region in the first arrangement direction.

In one embodiment, the light-emitting display device further has a first patterned conductive metal seed layer, which is formed on the first surface of the substrate and has the same pattern as the first patterned conductive layer, and is used as a preparation layer for forming the first patterned conductive layer.

In one embodiment, the light-emitting display device further has a second patterned conductive metal seed layer, which is formed on the second surface of the substrate and has the same pattern as the second patterned conductive layer, and is used as a preparation layer for forming the second patterned conductive layer.

In each embodiment, the material of the substrate of the luminescent display device is one of glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, polymethyl methacrylate, BT resin, glass fiber and cyclic olefin copolymer.

In each embodiment, the light-emitting element of the light-emitting display device can be a light-emitting diode lamp bead.

On the other hand, the present invention provides a method for manufacturing a luminous display device.

In one embodiment, a method for manufacturing a light-emitting display device includes the following steps: providing a substrate having a plurality of through holes, the substrate having a first surface and a second surface opposite to the first surface; forming a first patterned conductive layer including a plurality of first conductive lines interwoven into a grid on the first surface, and aligning the intersections of the first conductive lines with the through holes; forming a second patterned conductive layer including a plurality of second conductive lines and an extension portion connected from each second conductive line and an island portion separated from the second conductive line on the second surface; and configuring a portion of the extension portion and a portion of the island portion of the second conductive line as a solder pad area of a pin of a light-emitting device.

In one embodiment, the manufacturing method of the proposed light-emitting display device may further include the following steps: forming a first patterned conductive metal seed layer on the first surface of the substrate by one of sputtering, screen printing and inkjet printing processes, and the first patterned conductive layer is formed on the first patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, and the side of the through hole close to the first surface of the substrate is plated with a first conductive wire material.

In one embodiment, the manufacturing method of the proposed light-emitting display device may further include the following steps: forming a second patterned conductive metal seed layer on the second surface of the substrate by one of sputtering, screen printing and inkjet printing processes; and the second patterned conductive layer is formed on the second patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, and the side of the through hole close to the second surface of the substrate is plated with an island material.

In one embodiment, the second patterned conductive layer of the proposed light-emitting display device can also be formed by using a process of screen printing or inkjet printing; and the second patterned conductive layer is in direct contact with the second surface.

In each embodiment, the material of the first conductive wire is one of a slurry doped with conductive powder, an indium tin oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film, an aluminum zinc oxide (AZO) film, copper, silver, nickel, and nickel-gold.

In summary, the light-emitting display device and the manufacturing method thereof described in the embodiments of the present invention are configured in layers in the pad area corresponding to the pins of the light-emitting element, so that the power connection wires in the pad area and the signal connection wires in the pad area do not share the same plane configuration space, which is beneficial to increase the plane configuration space of the power connection wires and improve the conductivity of the power connection wires. On the other hand, since the power connection wires and the signal connection wires are formed on different surfaces of the substrate, there is no need to make an electrical insulation layer to electrically isolate the power connection wires and the signal connection wires in the layered configuration design, which can simplify the overall process steps. In addition, only the power connection wires are arranged on a single surface of the substrate. In the enlarged plane arrangement space, the power connection wires can be subdivided into a plurality of equivalent wires with smaller line widths to improve the transparency of the display screen. In addition, the light-emitting element can also use a micro-light-emitting diode chip to reduce the visibility of the light-emitting element itself in the display screen. In this way, when the configuration substrate of the light-emitting element is transparent, the visibility of the wires and the light-emitting element on the substrate in the display screen can be greatly reduced, thereby improving the contrast and clarity of such light-emitting displays viewed from a certain distance. On the other hand, since the first patterned conductive layer and the second patterned conductive layer electrically connected to the light-emitting element can be manufactured by a printing process such as screen printing and inkjet printing, near-infrared light irradiation can be further used to quickly cure the printed or inkjet printed conductive layer to shorten the process time and facilitate the process procedure.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

1: Luminous display device

100: Substrate

1001: First surface

1002: Second surface

1003:Through hole

900: First patterned conductive metal seed layer

10: First patterned conductive layer

101: First conductor

1011: The first conductive line in the first extension direction

1012: The first conductor in the second extension direction

102: Junction

103: Grid

20: Second patterned conductive layer

200: Second patterned conductive metal seed layer

201: Second conductor

202: Extension

203: Island Department

30: The third patterned conductive layer

301: Third conductor

40: First patterned electrical insulating layer

401: First electrically insulating block

501: First welding pad area

502: Second welding pad area

503: The third pad area

504: Fourth pad area

60: Second patterned electrical insulating layer

601: Second electrically insulating block

70: The third patterned electrical insulating layer

701: The third electrically insulating block

80: Electrical connection materials

1000: Luminous parts

11~16: Steps

21~25: Steps

FIG1A is a schematic plan view showing the first patterned conductive layer and its conductive lines of a light-emitting display device according to an embodiment of the present invention.

FIG1B is a schematic plan view showing other patterned conductive layers and their conductive lines of a light-emitting display device according to an embodiment of the present invention.

FIG2A is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG1A during a manufacturing process.

FIG2B is a schematic cross-sectional view showing the B-B cross-section of the light-emitting display device of FIG1A during a manufacturing process.

FIG2C is a schematic cross-sectional view showing the C-C cross-section of the light-emitting display device of FIG1A during a manufacturing process.

FIG2D is a schematic cross-sectional view showing the D-D cross section of the light-emitting display device of FIG1A during a manufacturing process.

FIG3 is a block flow chart showing the steps of a manufacturing method of the light-emitting display device of FIG1A in a manufacturing process.

FIG4A is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG1A in another manufacturing process.

FIG4B is a schematic cross-sectional view showing the B-B cross-section of the light-emitting display device of FIG1A in another manufacturing process.

FIG4C is a cross-sectional schematic diagram showing the C-C cross section of the light-emitting display device of FIG1A in another manufacturing process.

FIG4D is a cross-sectional schematic diagram showing the D-D cross section of the light-emitting display device of FIG1A in another manufacturing process.

FIG5 is a block flow chart showing the steps of the manufacturing method of the light-emitting display device of FIG1A in another manufacturing process.

FIG6 is a schematic plan view showing a honeycomb grid conductor of a light-emitting display device according to an embodiment of the present invention.

The present invention discloses a light-emitting display device. The following descriptions are already understood by ordinary technicians in this field and will not be fully described, such as the light-emitting principle of the light-emitting diode, the patterned conductive layer with a specific conductive circuit pattern and a layered three-dimensional structure (the circuit patterns have height differences), etc. In addition, if the meaning of the technical terms described in the following text is different from the meaning of the common terms in the technical field, the meaning in the text shall prevail. The accompanying drawings in the text are intended to express the meaning related to the characteristics of the present invention and are not fully drawn according to the actual size, which is also described in advance.

FIG. 1A is a schematic plan view showing a first patterned conductive layer and its conductive wires of a light-emitting display device of an embodiment of the present invention. FIG. 1B is a schematic plan view showing other patterned conductive layers and their conductive wires of a light-emitting display device of an embodiment of the present invention. FIG. 2A is a schematic cross-sectional view showing an A-A cross-section of the light-emitting display device of FIG. 1A in a process. FIG. 2B is a schematic cross-sectional view showing a B-B cross-section of the light-emitting display device of FIG. 1A in a process. FIG. 2C is a schematic cross-sectional view showing a C-C cross-section of the light-emitting display device of FIG. 1A in a process. FIG. 2D is a schematic cross-sectional view showing a D-D cross-section of the light-emitting display device of FIG. 1A in a process.

1A to 2C , in one embodiment, the light-emitting display device 1 comprises a substrate 100, a first patterned conductive layer 10, a second patterned conductive layer 20 and a third patterned conductive layer 30 disposed on the substrate 100, a first solder pad region 501, a second solder pad region 502, a third solder pad region 503, a fourth solder pad region 504 electrically isolated from each other, and a plurality of light-emitting elements 1000 electrically connected to the solder pad regions. Each pin of each light-emitting device 1000 corresponding to the pad area 501 to 504 is fixed and electrically connected to the corresponding pad area 501 to 504 through an electrical connection material 80 such as solder paste, wherein the pad area 501 is electrically connected to the power pin of the light-emitting device 1000 and the other pad areas 502, 503, 504 are electrically connected to the light-emitting signal pin of the light-emitting device 1000. The light-emitting device 1000 can be a single light-emitting diode element, a light-emitting diode assembly of more than one light-emitting diode combination, or a light-emitting diode chip, but does not include a driver chip (IC). When the light-emitting element 1000 is a single light-emitting diode, there may be only two corresponding pad areas connected thereto.

Please continue to refer to FIG. 1A to FIG. 2C . In this embodiment, the substrate 100 has a first surface 1001, a second surface 1002 opposite to the first surface 1001, and a plurality of through holes 1003 penetrating the first surface 1001 and the second surface 1002. The through holes 1003 are used to electrically connect the patterned conductive layer located on one side of the first surface 1001 of the substrate 100 and the patterned conductive layer located on one side of the second surface 1002 of the substrate 100. The substrate 100 is preferably transparent, and its material can be glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, polymethyl methacrylate, BT resin, glass fiber or cyclic olefin copolymer. The light-emitting elements 1000 that have completed electrical connection are arranged in an array on the same side of the second surface 1002 of the substrate 100. The minimum distance between the light-emitting elements is not less than 2 mm, preferably 2 to 3 mm, to distinguish them from organic light-emitting diode (OLED) displays or micro-LED displays.

As shown in FIG. 1B and FIG. 2A to FIG. 2D, the first patterned conductive layer 10 is disposed on the first surface 1001 of the substrate 100, and has a plurality of first conductive lines 101 interwoven into a grid shape. The first conductive lines 101 include first conductive lines 1011 in a first extension direction and first conductive lines 1012 in a second extension direction. The first extension direction and the second extension direction intersect each other. In this embodiment, the grid shape interwoven by the first conductive lines 101 in different extension directions is, for example, a rectangle, a hexagon, an ellipse or a circle. The line width of the first conductive line 101 is 25 to 100 microns, which is smaller than the line width of the conventional conductive line, so as to reduce its visibility in the display screen. As shown in FIG. 1A and FIG. 2A to FIG. 2D , the second patterned conductive layer 20 is disposed on the second surface 1002 of the substrate 100, and has at least three linear second conductive lines 201 that are parallel to each other and spaced equidistantly or unequally from each other, a linear extension portion 202 connected to each second conductive line 201, and at least one island portion 203 spaced from the second conductive line 201. The third patterned conductive layer 30 is disposed on the second surface 1002 of the substrate 100 but is electrically isolated from the second patterned conductive layer 20 by a first patterned electrical insulating layer 40. The third patterned conductive layer 30 has at least three linear third conductive lines 301 that are parallel to each other and spaced equidistantly or unequally from each other and connected to each second conductive line 201. The extension direction of the third conductive line 301 is intersecting with the extension direction of the second conductive line 201, for example, being perpendicular. The second wire 201 is connected to a pad area through the extension portion 202, and the third wire 301 is extended to be connected to the lighting signal input terminal of the light-emitting display device. In one embodiment, the extension direction of the extension portion 202 is intersecting with the extension direction of the second wire 201, for example, perpendicular, but parallel to the extension direction of the third wire 301. The island portion 203 is a block independently configured at a distance from the second wire 201, and the extension direction of the island portion 203 is perpendicular to the second surface 1002 of the substrate 100. It can be formed in the same process as the second wire 201, or in another process. As shown in Figure 2B, the island portion 203 is electrically connected to the intersection 102 of the first wire 101 through one of the through holes 1003 of the substrate 100. The intersection 102 is the grid node of the first wire 101. The configuration direction of the second wire 201 intersects with the configuration direction of the first wire 101. The line width of the second wire 201 and the extension 202 of the second wire 201 is 25 microns to 100 microns. Optionally, the line width of the second wire 201 and the extension 202 of the second wire 201 is the same as or different from the line width of the first wire 101.

As shown in FIG. 1A, FIG. 2B and FIG. 2C, the first pad region 501 is disposed on the island portion 203 of the second patterned conductive layer 20 above the second surface 1002 of the substrate 100, and the second pad region 502, the third pad region 503 and the fourth pad region 504 are respectively disposed on the extension portions 202 of three adjacent second conductive lines 201 of the second patterned conductive layer 20 above the second surface 1002 of the substrate 100.

Please refer to FIG. 1A and FIG. 2D . In one embodiment, the light-emitting display device 1 further includes a first patterned electrically insulating layer 40, which is disposed above the second patterned conductive layer 20 and has a plurality of first electrically insulating blocks 401, so that a portion of the third conductive line 301 is located on the first electrically insulating block 401 and is electrically isolated from the second conductive line 201 and disposed in layers, thereby increasing the configuration space of the second conductive line 201 in the second patterned conductive layer 20 and overlapping the wiring space of the third conductive line 301 with the wiring space of the first conductive line 101 to weaken the visibility of the third conductive line 301 in the display screen.

Please continue to refer to Figure 1A. In one embodiment, the light-emitting display device 1 further has a second patterned electrical insulating layer 60, which has a plurality of second electrical insulating blocks 601. These second electrical insulating blocks 601 are respectively arranged on the second surface 1002 of the substrate 100 along the first arrangement direction of the pad regions 501, 502, 503, and 504, such as the horizontal direction, to isolate the electrical contact of the pad regions 501, 502, 503, and 504 in the second arrangement direction of the pad regions 501, 502, 503, and 504, such as the vertical direction. In another embodiment, the light-emitting display device 1 further has a third patterned electrical insulating layer 70 having a plurality of third electrical insulating blocks 701. These third electrical insulating blocks 701 are respectively arranged above the second conductive wire 201 connected to the third pad area 503 along the second arrangement direction of the pad areas 501, 502, 503, 504, such as the vertical direction, to isolate the electrical contact of the pad areas 501, 502, 503, 504 in the first arrangement direction, such as the horizontal direction. In other embodiments, the third patterned electrical insulating layer 70 and the second patterned electrical insulating layer 60 may also be formed in the same process, so that the third electrical insulating region 701 is arranged below the second wire 201 connected to the third pad region 503 and arranged on the second surface 1002 of the substrate 100. The second arrangement direction and the first arrangement direction mentioned above are mutually intersecting, for example, perpendicular to each other. In the embodiment, the first arrangement direction is, for example, parallel to the arrangement direction of the second wire 201 (the horizontal direction shown in FIG. 1A), and the second arrangement direction is, for example, perpendicular to the arrangement direction of the second wire 201.

2A to 2C , in one embodiment, the light-emitting display device 1 further includes a first patterned conductive metal seed layer 900 disposed on the first surface 1001 of the substrate 100, having the same pattern as the first conductive line 101 of the first patterned conductive layer 10, and serving as a preparation layer for forming the first patterned conductive layer 10. In this case, the first conductive line 101 is disposed on the first patterned conductive metal seed layer 900. In addition, the luminescent display device 1 further includes a second patterned conductive metal seed layer 200, which is disposed on the second surface 1002 of the substrate 100 and has the same pattern as the second conductive wire 201, the extension 202 and the island 203 of the second patterned conductive layer 20, and is used as a preparation layer for forming the second patterned conductive layer 20. In this case, the second conductive wire 201, the extension 202 and the island 203 are disposed on the second patterned conductive metal seed layer 200. FIG. 3 is a block flow chart showing an embodiment of the manufacturing method of the luminescent display device of FIG. 1A. Referring to FIG. 3, in one embodiment, the manufacturing method of the luminescent display device of FIG. 1A includes the following steps:

Step 11: Provide a substrate having a plurality of through holes. As shown in FIG. 2B , provide a substrate 100 having a plurality of through holes 1003 .

Step 12: Form a first patterned conductive metal seed layer on the substrate using one of the processes of sputtering, screen printing and inkjet printing. As shown in FIG. 2A to FIG. 2D , a first patterned conductive metal seed layer 900 is formed on the first surface 1001 of the substrate 100.

Step 13: Form a first patterned conductive layer including a plurality of first conductive lines interwoven into a grid on the first patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, align the intersections of the first conductive lines with the through holes, and plate the first conductive line material on one side of some of the through holes close to the first surface of the substrate. As shown in FIGS. 1A to 2C , a first patterned conductive layer 10 including first conductive lines 101 is formed on the first patterned conductive metal seed layer 900, and the first patterned conductive layer 10 and the first patterned conductive metal seed layer 900 have the same pattern. As shown in Figures 1B and 2B, the intersection 102 of the two first conductive lines 101 is aligned with each through hole 1003, and the material of the first conductive line 101 is plated on the side of the first surface 1001 of the substrate 100. By forming the first patterned conductive metal seed layer 900, the formed first patterned conductive layer 10 can be stably attached to the substrate 100.

Step 14: Form a second patterned conductive metal seed layer on the second surface of the substrate using one of the processes of sputtering, screen printing and inkjet printing. As shown in FIG. 2A to FIG. 2C , a second patterned conductive metal seed layer 200 is formed on the second surface 1002 of the substrate 100.

Step 15: Form a second patterned conductive layer including a second conductive line, an extension of the second conductive line, and an island on the second patterned conductive metal seed layer by one of the processes of sputtering, etching, chemical plating, and electroplating, and make the through hole near the first surface of the substrate, which has been plated with the material of the first conductive line, be plated with the material of the island on the other side of the second surface of the substrate, and the island and the first conductive line are electrically connected. As shown in FIG. 1A to FIG. 2C, a second patterned conductive layer 20 including a second conductive line 201, an extension of the second conductive line 201 202, and an island 203 is formed on the second patterned conductive metal seed layer 200, wherein the material of the island 203 is plated into the through hole 1003 and electrically connected to the junction 102 of the two first conductive lines 101 through the through hole 1003.

Step 16: respectively configure a portion of the extension portion of the second conductor and a portion of the island portion as the soldering pad area of the pin of the light-emitting device. As shown in FIG. 1A, FIG. 2B and FIG. 2C, a portion of the island portion 203 is configured as the soldering pad area 501 of the pin of the light-emitting device, and a portion of the extension portion 202 of the three adjacent second conductors 201 is configured as the soldering pad areas 502, 503, and 504 of the three pins of the light-emitting device. In one embodiment, the island portion 203 and the soldering pad area 501 are formed into one body, and the extension portions 202 of the three adjacent second conductors 201 are respectively formed into one body with the soldering pad areas 502, 503, and 504.

FIG4A is a cross-sectional schematic diagram showing the A-A cross section of the luminescent display device of FIG1A in another process. FIG4B is a cross-sectional schematic diagram showing the B-B cross section of the luminescent display device of FIG1A in another process. FIG4C is a cross-sectional schematic diagram showing the C-C cross section of the luminescent display device of FIG1A in another process. FIG4D is a cross-sectional schematic diagram showing the D-D cross section of the luminescent display device of FIG1A in another process.

Please refer to FIG. 1A, FIG. 1B, and FIG. 4A to FIG. 4D simultaneously. In another process, different from the above embodiment, the light-emitting display device 1 has a first patterned conductive metal seed layer 900, but does not have a second patterned conductive metal seed layer 200. The other components are the same as the above embodiment.

FIG5 is a block flow chart showing the steps of the manufacturing method of the light-emitting display device of FIG1A in another process. Referring to FIG4A to FIG4C, in another embodiment, the second patterned conductive layer of the light-emitting display device of FIG1A can be formed without using one of the processes of sputtering, etching and electroplating, thereby eliminating the step of forming the second patterned conductive metal seed layer. The manufacturing method of FIG5 includes the following steps:

Step 21: Provide a substrate having a plurality of through holes. As shown in FIG. 4B , provide a substrate 100 having a plurality of through holes 1003.

Step 22: Form a first patterned conductive metal seed layer on the substrate using one of the processes of sputtering, screen printing and inkjet printing. As shown in FIGS. 4A to 4D , a first patterned conductive metal seed layer 900 is formed on the first surface 1001 of the substrate 100.

Step 23: Form a first patterned conductive layer including a plurality of first conductive lines interwoven into a grid on the first patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, align the intersections of the first conductive lines with the through holes, and plate the first conductive line material on one side of some through holes close to the first surface of the substrate. As shown in FIG. 1A , FIG. 1B , and FIG. 4A to FIG. 4D , a first patterned conductive layer 10 including first conductive lines 101 is formed on the first patterned conductive metal seed layer 900, and the first patterned conductive layer 10 and the first patterned conductive metal seed layer 900 have the same pattern. As shown in Figures 1B and 4B, the intersection 102 of the two first conductive lines 101 is aligned with each through hole 1003, and the material of the first conductive line 101 is plated on the side of the first surface 1001 of the substrate 100 near the part of the through hole 1003. By forming the first patterned conductive metal seed layer 900, the formed first patterned conductive layer 10 can be stably attached to the substrate 100.

Step 24: Form a second patterned conductive layer including a second conductive line, an extension of the second conductive line, and an island on the second surface of the substrate by using one of screen printing and inkjet printing processes, and fill the island with the material of the through hole on one side close to the first surface of the substrate and the other side close to the second surface of the substrate, so that the island is electrically connected to the first conductive line. As shown in FIG. 1A, FIG. 1B and FIG. 4A to FIG. 4C, the second patterned conductive layer 20 including the second conductive line 201, the extension portion 202 of the second conductive line 201, and the island portion 203 is directly formed on the second surface 1002 of the substrate, that is, the second patterned conductive layer 20 is in direct contact with the second surface 1002 of the substrate, wherein the material of the island portion 203 is filled into the through hole 1003 by screen printing and inkjet printing and is electrically connected through the through hole 1003 and the intersection of the two first conductive lines 101.

Step 25: respectively configure a portion of the extension portion of the second conductor and a portion of the island portion as the soldering pad area of the pin of the light-emitting device. As shown in FIG. 1A, FIG. 4B and FIG. 4C, a portion of the island portion 203 is configured as the soldering pad area 501 of the pin of the light-emitting device, and a portion of the extension portion 202 of the three adjacent second conductors 201 is configured as the soldering pad areas 502, 503, and 504 of the three pins of the light-emitting device. In one embodiment, the island portion 203 and the soldering pad area 501 are integrated, and the extension portions 202 of the three adjacent second conductors 201 are respectively integrated with the soldering pad areas 502, 503, and 504.

FIG6 is a schematic plan view showing a honeycomb-shaped grid conductor of a light-emitting display device according to an embodiment of the present invention. In the aforementioned embodiment, the shape of the grid 103 formed by the first conductor 101 of the first patterned conductive layer 10 in a mesh shape can be hexagonal and honeycomb-shaped, thereby improving the conductive efficiency of the first conductor.

In the above-mentioned embodiment, although the third patterned conductive layer 30 and the second patterned conductive layer 20 are disposed on the second surface 1002 of the substrate 100, the present invention is not limited thereto. In other embodiments, the third patterned conductive layer 30 may also be disposed on the first surface 1001 of the substrate 100 and electrically isolated from the first patterned conductive layer 10. In other words, as long as the first patterned conductive layer 10, the second patterned conductive layer 20 and the third patterned conductive layer 30 can be electrically isolated from each other, the layered arrangement order on the substrate 100 may be changed according to circumstances to meet the best arrangement relationship and the minimum visibility requirement. In addition, the wires or extensions or islands on each patterned conductive layer can also be arranged in layers, as long as the electrical connection relationship that the first wire is connected to the pad area of the power pin of the light-emitting device, the extension of the second wire is connected to the pad area of the other pins of the light-emitting device, and the second wires are each connected to the third wire is satisfied, the present invention does not limit the configuration of the layered arrangement.

In summary, the light-emitting display device and the manufacturing method thereof described in the embodiments of the present invention configure the connection wires of the pad area corresponding to the pins of the light-emitting element in layers, so that the power connection wires in the pad area and the signal connection wires in the pad area do not share the same plane configuration space, which is beneficial to increase the plane configuration space of the power connection wires and improve the conductivity of the power connection wires. Since only the power connection wires are configured on a single side surface of the substrate, the power connection wires can be subdivided into a plurality of equivalent wires with smaller line widths within the enlarged plane configuration space to improve the transparency of the display screen. On the other hand, the lead-out lines of the signal connection wires (i.e., the third wires in the embodiment) can be further configured in layers using an electrical insulation layer, so that these lead-out lines can be overlapped with the power connection wires under electrical isolation to weaken the visibility of the lead-out lines. In addition, the light-emitting element can also use a micro-light-emitting diode chip to reduce the visibility of the light-emitting element itself in the display screen. In this way, when the configuration substrate of the light-emitting element is transparent, the visibility of the wires and the light-emitting element on the substrate in the display screen can be greatly reduced, thereby improving the contrast and clarity of such a light-emitting display when viewed from a certain distance. On the other hand, since the first patterned conductive layer and the second patterned conductive layer electrically connected to the light-emitting element can be manufactured by printing processes such as screen printing and inkjet printing, near-infrared light irradiation can be further used to quickly cure the printed or inkjet printed conductive layer to shorten the process time and facilitate the process procedure. In addition, the materials of the first patterned conductive layer and the second patterned conductive layer can be selected according to different processes, which is flexible in process design. For example, the material of the first conductive line of the first patterned conductive layer may be a slurry mixed with conductive powder and may further include a chemically plated material, such as an indium tin oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film or an aluminum zinc oxide (AZO) film with high transparency, or copper, silver, nickel or nickel gold. Similarly, the material of the second conductive line, the extension part of the second conductive line and the island part of the second patterned conductive layer can be a slurry mixed with conductive powder and can further add a material that can be chemically plated, which can be a highly transparent indium tin oxide (ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film or aluminum zinc oxide (AZO) film, or copper, silver, nickel or nickel gold. In the present invention, the material of the first patterned conductive layer or the second conductive layer is not limited to the above-mentioned materials, and any conductive material such as graphene, carbon nanotubes, etc. can also be used.

The above description should be understandable and implementable to those with ordinary knowledge in the technical field to which the present invention belongs. Some embodiments of the present invention are disclosed as above, but they are not used to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. In other words, other equivalent embodiments completed without departing from the spirit disclosed by the present invention should be included in the present invention, and the scope of protection of the present invention shall be defined by the scope of the attached patent application.

1: Luminous display device

100: Substrate

1001: First surface

1002: Second surface

1003:Through hole

900: First patterned conductive metal seed layer

101: First conductor

102: Junction

200: Second patterned conductive metal seed layer

202: Extension

203: Island Department

501: First welding pad area

502: Second welding pad area

80: Electrical connection materials

1000: Luminous parts

Claims (15)

A light-emitting display device comprises: a substrate having a first surface and a second surface opposite to the first surface, the substrate having a plurality of through holes; a first patterned conductive layer disposed on the first surface of the substrate, having a plurality of first conductive lines interwoven into a grid; a second patterned conductive layer disposed on the second surface of the substrate, having at least three linear second conductive lines parallel to each other and spaced equidistantly or unequally from each other, linear extensions connected from each of the second conductive lines, and at least one island portion spaced from the second conductive lines, wherein the arrangement direction of the extensions intersects the arrangement direction of the second conductive lines. , the island portion is electrically connected to the intersection of the first conductive lines through one of the through holes; a first pad area, a second pad area, a third pad area and a fourth pad area are electrically isolated from each other, the first pad area is arranged on the island portion, the second pad area, the third pad area and the fourth pad area are respectively arranged on the extension portions; and a plurality of light-emitting elements are arranged in an array on the same side of the second surface of the substrate, with a minimum spacing of 2 to 3 mm between each other, and at least four different pins of at least one of the light-emitting elements are respectively connected to the first pad area, the second pad area, the third pad area and the fourth pad area. As in claim 1, the light-emitting display device, wherein the line width of each of the first conductive lines and each of the second conductive lines is 25 microns to 100 microns. As in claim 1, the light-emitting display device, wherein the grid shape of the first conductive lines is one of rectangular, hexagonal, elliptical and circular. The light-emitting display device of claim 1 further comprises: A third patterned conductive layer, disposed on the second surface of the substrate and electrically isolated from the second patterned conductive layer, having at least three third linear conductive lines connected to each of the second conductive lines, parallel to each other and spaced equidistantly or unequally from each other, the extension direction of the third conductive lines intersecting with the extension direction of the second conductive lines, and the third conductive lines extending to connect to the lighting signal input terminal of the light-emitting display device. The light-emitting display device of claim 4 further comprises: a first patterned electrically insulating layer having a plurality of first electrically insulating blocks disposed between the second patterned conductive layer and the third patterned conductive layer, wherein the first electrically insulating blocks electrically isolate the third conductive lines from the second conductive lines. The light-emitting display device of claim 1 further comprises: a second patterned electrically insulating layer having a plurality of second electrically insulating regions, the second electrically insulating regions being arranged on the second surface of the substrate along a first arrangement direction of the first pad region, the second pad region, the third pad region and the fourth pad region, respectively, for isolating the electrical contact of the first pad region, the second pad region, the third pad region and the fourth pad region in a second arrangement direction, the second arrangement direction intersecting the first arrangement direction. The light-emitting display device of claim 6 further comprises: a third patterned electrically insulating layer having a plurality of third electrically insulating blocks, the third electrically insulating blocks being respectively arranged above the second wire connected to the third welding pad area along the second arrangement direction of the first welding pad area, the second welding pad area, the third welding pad area and the fourth welding pad area, for isolating the electrical contact of the first welding pad area, the second welding pad area, the third welding pad area and the fourth welding pad area in the first arrangement direction. The light-emitting display device of claim 1 further comprises: A first patterned conductive metal seed layer formed on the first surface of the substrate, having the same pattern as the first patterned conductive layer, and used as a preparation layer for forming the first patterned conductive layer. The light-emitting display device of claim 8 further comprises: a second patterned conductive metal seed layer formed on the second surface of the substrate, having the same pattern as the second patterned conductive layer, and used as a preparation layer for forming the second patterned conductive layer. A light-emitting display device as claimed in any one of claims 1 to 9, wherein the material of the substrate is one of glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, polymethyl methacrylate, BT resin, glass fiber and cyclic olefin copolymer. A light-emitting display device as claimed in any one of claims 1 to 9, wherein the light-emitting elements are light-emitting diode lamp beads. A method for manufacturing a light-emitting display device comprises: providing a substrate having a plurality of through holes, the substrate having a first surface and a second surface opposite to the first surface; forming a first patterned conductive metal seed layer on the first surface by using one of a process selected from the group consisting of sputtering, screen printing and inkjet printing; forming a first patterned conductive layer comprising a plurality of first conductive lines interwoven into a grid on the first patterned conductive metal seed layer by using one of a process selected from the group consisting of sputtering, etching, chemical plating and electroplating. On the second surface, a second patterned conductive layer is formed, which includes a plurality of second conductive lines, extensions connected from each of the second conductive lines, and islands separated from the second conductive lines; and a portion of the extensions and a portion of the islands of the second conductive lines are respectively configured as a soldering pad area of a pin of a light-emitting device; wherein the side of the through holes close to the first surface of the substrate is plated with the material of the first conductive line. The manufacturing method of the light-emitting display device of claim 12 further comprises: forming a second patterned conductive metal seed layer on the second surface by one of sputtering, screen printing and inkjet printing; and the second patterned conductive layer is formed on the second patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating; wherein the side of the through holes close to the second surface of the substrate is plated with the material of the island portion. A method for manufacturing a light-emitting display device as claimed in claim 12, wherein the second patterned conductive layer is formed by a process of screen printing or inkjet printing; and the second patterned conductive layer is in direct contact with the second surface. A method for manufacturing a light-emitting display device as claimed in any one of claims 12 to 14, wherein the material of the first conductive line is one of a slurry doped with conductive powder, an indium tin oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film, an aluminum zinc oxide (AZO) film, copper, silver, nickel and nickel-gold.