TWM615450U - Light emitting display device - Google Patents

Abstract

This case proposes a light-emitting display device, which has a substrate, a first patterned conductive layer and a second patterned conductive layer disposed on different sides of the substrate, at least four electrically isolated pad regions, and at least one corresponding pad region connected to each other. Light-emitting components. The minimum distance between the light-emitting components is 2 to 3 mm. The first patterned conductive layer has a plurality of grid-shaped first grid wires, and the second patterned conductive layer has a bonding pad area. One of the pad regions is electrically connected to the first grid wire via one of the through holes.

Description

Light-emitting display device

This creation is about a display device, especially a light-emitting display device.

In response to the development of display screens that are larger in size, planar, thinner, lighter, and flexible, light-emitting display technology using point light sources as the light-emitting source of the display and flexible substrates as the substrate on which these light-emitting sources are arranged Development is increasingly important. In a branch of technological development, the follow-up development of large-screen light-emitting displays developed by using light emitting diodes (LEDs) as light sources for people to watch from a distance is worthy of attention.

In the production of this type of light-emitting display for people to watch from a distance, you can choose to install LED components containing LEDs and their driver chips (IC) on the substrate in the form of an array, and the distance between the LED components is not less than 2 mm ( mm), which is different from organic light-emitting diode (OLED) displays or micro-size light-emitting diode (Micro-LED) displays for people to watch at close range. In order for each LED component in the array to be lit and have a brightness that meets the requirements, the configuration substrates and configuration wires of these LED components must have good conductive power. In addition, in order to improve the contrast of viewing such light-emitting displays from a long distance, it is also necessary to reduce the visibility of the configuration substrates of these LED components and their configuration wires in the display screen. On the other hand, in order to meet the display effects required by various applications, the production of the configuration wires of these LED components must have good design changeability and be quickly completed. In view of the above technical problems, this author hopes to propose solutions.

In view of the above-mentioned problems, the present creation provides a light-emitting display device.

In one embodiment, the light-emitting display device has a substrate, a first patterned conductive layer, a second patterned conductive layer disposed on the substrate, and at least four bonding pad regions that are electrically isolated from each other. The substrate has a first surface and a second surface opposite to the first surface. These pad areas are respectively electrically connected to the input voltage pin, data signal input or output pin, clock signal input or output pin, and ground pin of at least one light-emitting component. The light-emitting component has at least one light-emitting diode. Drive the chip. The first patterned conductive layer is disposed above the first surface and has a plurality of grid-shaped first grid wires. The second patterned conductive layer is disposed above the second surface and has the solder pad area. One of the pad areas is electrically connected to the first grid wire through one of the through holes, and a plurality of light-emitting components are arranged in an array on the same side of the first surface with a minimum distance of 2 to 3 mm. .

In one embodiment, the first patterned conductive layer of the light-emitting display device has at least two grid-shaped first grid wires respectively located on both sides of the first surface, and at least two parallel elongated linear wires. The wire and at least two extension portions respectively connected from the first grid wire, the extension direction of the extension portion is parallel to the arrangement plane of the first grid wire, the extension direction of the elongated wire and the extension direction of the extension portion intersect; and the bonding pad The zones are electrically connected with through holes and extensions and elongated wires, respectively.

In one embodiment, the first grid wires of the first patterned conductive layer of the light-emitting display device occupy 70% to 90% of the area of the first surface; the second patterned conductive layer has a plurality of grid-shaped second wires. The grid wire, at least one extension part connected from a grid node of the second grid wire, and at least two elongated wires parallel to each other in a linear shape, and the extension direction of the extension part is parallel to the arrangement plane of the second grid wire , The extending direction of the elongated wire and the extending direction of the extending portion cross. The pad areas that are electrically connected to the ground pins are electrically connected through the extension and the second grid wire, and are respectively electrically connected to the data signal input or output pins and the clock signal input or output pins. Connect a slender wire.

In one embodiment, the second patterned conductive layer of the light-emitting display device further has an island part separated from the second grid wire and the elongated wire, and the island part is electrically connected to the first grid wire through one of the through holes , And the pad area that is electrically connected to the input voltage pin is electrically connected to the first mesh wire via the island portion.

In one embodiment, the light-emitting display device further has a third patterned conductive layer and a patterned electrically insulating layer. The third patterned conductive layer is disposed above the second surface of the substrate and below the second patterned conductive layer. Grid wire. The patterned electrically insulating layer is disposed above the third patterned conductive layer and below the second patterned conductive layer to electrically isolate the second patterned conductive layer and the third patterned conductive layer. Wherein, a part of the third grid wire is electrically connected to the first grid wire through one of the through holes.

In one embodiment, the light-emitting display device further has a third patterned conductive metal seed layer formed on the second surface of the substrate as a preparation layer for forming the third patterned conductive layer.

In one embodiment, the patterned electrically insulating layer of the light-emitting display device has a plurality of first electrically insulating blocks, a plurality of second electrically insulating blocks, and a plurality of third electrically insulating blocks. Each of the first electrically insulating regions covers a configuration area on the third patterned conductive layer corresponding to the second grid wire to isolate the electrical contact between the second grid wire and the third grid wire; The two electrically insulating regions cover a configuration area of the adjacent portion of the solder pad area corresponding to the extension portion and the ground pin corresponding to the electrical connection on the third patterned conductive layer, so as to isolate the extension portion and the ground pin corresponding to the electrical connection The electrical contact between the adjacent portion of the pad area and the third grid wire; each third electrically insulating area covers one of the corresponding elongated wires on the third patterned conductive layer that includes the connection portion of the pad area The configuration area is used to isolate the electrical contact between the elongated wire and the third grid wire; the part of the third grid wire that is electrically connected to the first grid wire via one of the through holes is self-patterned and electrically insulated The layers are exposed.

In one embodiment, the patterned electrically insulating layer of the light-emitting display device has a plurality of first electrically insulating blocks, a plurality of second electrically insulating blocks, and a plurality of third electrically insulating blocks. Each of the first electrically insulating regions covers a configuration area on the third patterned conductive layer corresponding to the second grid wire to isolate the electrical contact between the second grid wire and the third grid wire; The two electrically insulating regions cover a configuration area on the third patterned conductive layer corresponding to the adjacent portion of the extension portion and the second grid wire to isolate the adjacent portion of the extension portion and the second grid wire from the third The electrical contact between the grid wires; each third electrically insulating area covers a configuration area on the third patterned conductive layer corresponding to each elongated wire except for the connection part of the pad area, and is used to isolate the elongated wire except The electrical contact between the part outside the connection part of the pad area and the third grid wire; the part of the third grid wire that is electrically connected to the first grid wire through one of the through holes is self-patterned and electrically insulated The layer is exposed and all the pad areas are exposed from the patterned electrical insulating layer.

In one embodiment, the connecting portion of the pad area of the elongated wire of the second patterned conductive layer of the light-emitting display device is disposed on the second surface of the substrate, and the extension portion is connected to the pad area of the pad area that is electrically connected to the ground pin. Part of it is arranged on the second surface of the substrate.

In each embodiment, the wire width of the first grid wire of the light-emitting display device is 25 micrometers to 100 micrometers.

In summary, according to the light-emitting display device described in each embodiment of the present invention, the input voltage connection wire and the ground wire in the pad area are staggered separately, so as to increase the plane configuration space of the input voltage connection wire and the ground wire. Therefore, the input voltage connection wire and the ground wire can be subdivided into multiple grid wires with smaller line widths in the enlarged planar configuration space to improve the transparency of the display screen. In this way, in the case that the configuration substrate of the light-emitting component is transparent, the positioning on the substrate can be greatly reduced The visibility of the configuration wires in the display screen, thereby improving the contrast and clarity of viewing this type of light-emitting display from a certain distance.

In order to make the above-mentioned features and advantages of this creation more obvious and understandable, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows.

1a, 1a', 1b, 1b', 1b", 1c, 1c', 1c", 1d: light-emitting display device

100: substrate

1001: first surface

1002: second surface

1003: Through hole

10a, 10b, 10c, 10d: the first patterned conductive layer

100a, 100b, 100c, 100d: the first patterned conductive metal seed layer

101a, 101b, 101c, 101d: first grid wire

102d: Extension of the first grid wire

103d: Slim wire

1011a, 1011b, 1011c: grid nodes

20a, 20b, 20c, 20d: second patterned conductive layer

200a, 200d: second patterned conductive metal seed layer

201a, 201b, 201c: second grid wire

202a, 202b, 202c: the extension of the second grid wire

203a, 203b, 203c: slender wire

204a, 204b, 204d: island

30b, 30c: the third patterned conductive layer

300b, 300c: the third patterned conductive metal seed layer

301b, 301c: third grid wire

40b, 40c: patterned electrical insulating layer

401b, 401c: the first electrical insulation block

402b, 402c: second electrical insulation block

403b, 403c: the third electrical insulation block

411~415: Electrical insulating layer

501a, 501b, 501c, 501d: the first pad area

502a, 502b, 502c, 502d: the second pad area

503a, 503b, 503c, 503d: third pad area

504a, 504b, 504c, 504d: fourth pad area

505a, 505b, 505c, 505d: fifth pad area

506a, 506b, 506c, 506d: sixth pad area

80: Electrical connection material

90: Light-emitting components

FIG. 1A is a schematic plan view showing the first patterned conductive layer on the first surface of the substrate of the light-emitting display device of the first embodiment of the invention.

FIG. 1B is a schematic plan view showing the second patterned conductive layer on the second surface of the substrate of the light-emitting display device of the first embodiment of the invention.

FIG. 1C is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1B in a manufacturing process.

FIG. 1D is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1B in another manufacturing process.

2A is a schematic plan view showing the first patterned conductive layer on the first surface of the substrate of the light-emitting display device of the second embodiment of the invention.

2B is a schematic plan view showing the second patterned conductive layer located above the second surface of the substrate of the light-emitting display device of the second embodiment of the invention.

FIG. 2C is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 2B in a manufacturing process.

FIG. 2D is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 2B in another manufacturing process.

FIG. 2E is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 2B in another manufacturing process.

3A is a schematic plan view showing the first patterned conductive layer on the first surface of the substrate of the light-emitting display device according to the third embodiment of the invention.

FIG. 3B is a schematic plan view showing the second patterned conductive layer on the second surface of the substrate of the light-emitting display device of the third embodiment of the invention.

FIG. 3C is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 3B in a manufacturing process.

FIG. 3D is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 3B in another manufacturing process.

FIG. 3E is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 3B in another manufacturing process.

4A is a schematic plan view showing the first patterned conductive layer on the first surface of the substrate of the light-emitting display device of the fourth embodiment of the invention.

4B is a schematic plan view showing the second patterned conductive layer located above the second surface of the substrate of the light-emitting display device of the fourth embodiment of the invention.

4C is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG. 4B in a manufacturing process.

FIG. 5 is a schematic cross-sectional view showing an electrical insulating layer in the form of a multilayer stack of a light-emitting display device according to an embodiment of the present invention.

This creation discloses a light-emitting display device. The following narratives are already understood by those of ordinary skill in the art and will not be fully described, such as the light-emitting principle of light-emitting diodes, and layers with specific conductive circuit patterns. A patterned conductive layer with a three-dimensional structure (the line patterns have a height difference between each other). In addition, if the meaning of the technical terms described in the following text is different from the meaning of the usual terms in the technical field, the meaning in the text shall prevail, and the accompanying drawings in the text are intended to express the meaning related to the creative feature , Not drawn completely according to the actual size, but also stated first. The first to sixth prepositions described in the following text are only used for distinguishing similar elements, and are not sequential.

1A, 1B and 1C at the same time, in the first embodiment, the light-emitting display device 1a has a substrate 100, a first patterned conductive layer 10a, a second patterned conductive layer 20a, six are separated from each other and electrically isolated The first pad area 501a to the sixth pad area 506a and a plurality of light-emitting components 90. Each light-emitting component 90 has more than one light-emitting diode (LED) capable of emitting red light (Red), green light (Green), and blue light (Blue) and its driving IC. The input voltage of these light-emitting components 90 is The pins, data signal input pins, clock signal input pins, grounded pins, clock signal output pins, and data signal output pins are respectively connected by electrical connection material 80 For example, the solder paste is fixed and electrically connected to the first pad area 501a, the second pad area 502a, the third pad area 503a, the fourth pad area 504a, the fifth pad area 505a, and the sixth pad area 506a. . In this embodiment, the substrate 100 is preferably transparent and the material can be glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, polymethyl ester, BT resin, glass Fiber or cyclic olefin copolymer, the minimum distance between the light-emitting components 90 is not less than 2 mm, preferably 2 to 3 mm, which is different from organic light-emitting diode (OLED) displays or micro-size light-emitting diodes (Micro-LED) display. In other embodiments, the six pad areas can be integrated into only four pad areas, which are respectively used for the input voltage pins, data signal input and output pins, and clock signal input and output pins of the light-emitting component 90. , The grounding pin corresponds to the electrical connection. Therefore, the number of pad regions is at least four.

Please continue to refer to FIGS. 1A to 1C. In this embodiment, the substrate 100 has a first surface 1001 and a second surface 1002 opposite to each other, and a plurality of through holes 1003. The first patterned conductive layer 10a is disposed on the first surface 1001, and the second patterned conductive layer 20a is disposed above the second surface 1002. The first pad area 501a to the sixth pad area 506a are disposed on the second patterned conductive layer 20a. If the local area including these pad areas is regarded as a pad area unit, there are a plurality of pad area units arranged in an array on the substrate 100, and all the light-emitting components 90 will be fixed to the corresponding pads. The zone units are arranged on the same side of the second surface 1002 in an array form. The first patterned conductive layer 10 a has a plurality of grid-shaped first grid wires 101 a, and the first grid wires 101 a occupy 70% to 90% of the area of the first surface 1001 of the substrate 100. The second patterned conductive layer 20a has a plurality of grid-shaped second grid wires 201a, at least one linear extension 202a connected from a grid node of the second grid wire 201a, and four mutually opposite The elongated wires 203a in a linear shape and the islands 204a separated from the second grid wires 201a and the elongated wires 203a that are adjacent and parallel to each other and spaced at equal or unequal distances from each other. The island 204a is electrically connected to a mesh node 1011a of the first mesh wire 101a through one of the through holes 1003. The so-called grid node is the junction of the grid wires that make up the wires. In one embodiment, the extension direction of the extension portion 202a is parallel to the configuration plane of the second grid wire 201a, and the extension direction of the elongated wire 203a and the extension direction of the extension portion 202a intersect, for example, are perpendicular. In an embodiment where there are only four pad areas, the number of elongated wires 203a may be only two.

Please continue to refer to FIGS. 1A to 1C, the grid shapes of the first grid wire 101a and the second grid wire 201a are rectangular, hexagonal (see FIG. 5) or circular, and this creation is not limited here. As shown in FIGS. 1B and 1C, the first pad area 501a is electrically connected to the island portion 204a and is connected to the first grid wire 101a via the island portion 204a and the through hole 1003, and the fourth pad area 504a is connected to the second grid wire 201a The extension 202a is electrically connected to the second mesh wire 201a via the extension 202a, and the second pad area 502a, the third pad area 503a, the fifth pad area 505a, and the sixth pad area 506a are each connected to an elongated Wire 203a. In other words, the first mesh wire 101a and the island 204a are used as wires between the input voltage pin of the light-emitting component 90 and the input voltage source; the second mesh wire 201a and its extension 202a are used as the ground connection of the light-emitting component 90 The lead between the pin and the ground Wire; The elongated wire 203a is used as the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. Therefore, the second grid wire 201a is used to withstand the driving voltage and current of the light-emitting element 90, and the line width of the wires should be greater than or equal to the line width of the elongated wire 203a. In order to reduce the visibility of the second grid wire 201a, the extension 202a, and the elongated wire 203a, the line width can be reduced without affecting the required conductivity. In an embodiment, the line width of the constituent wires, the extension 202a, and the elongated wires 203a of the second grid wire 201a is 25 to 100 microns.

1C, in one embodiment, the light-emitting display device 1a may further include a first patterned conductive metal seed layer 100a, which is disposed on the first surface 1001, and has a first mesh with the first patterned conductive layer 10a. The pattern with the same pattern of the grid wire 101a is used as a preparation layer for the formation of the first patterned conductive layer 10a, which helps to make the first patterned conductive layer 10a firmly adhere to the substrate 100. In the same way, in an embodiment, the light-emitting display device 1a may further include a second patterned conductive metal seed layer 200a, which is disposed above the second surface 1002, and has a second grid wire connected to the second patterned conductive layer 20a. 201a, extension 202a, elongated wire 203a, and island 204a have the same pattern as a preparation layer for the formation of the second patterned conductive layer 20a, which helps to make the second patterned conductive layer 20a firmly adhere to the substrate 100 up.

FIG. 1D is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 1B in another manufacturing process. The only difference between the structure of FIG. 1D and FIG. 1C is that the light-emitting display device 1a' does not include a second patterned conductive metal seed layer 200a, and the other parts that are the same as those of FIG. 1C will not be repeated here.

2A, 2B and 2C at the same time, in the second embodiment, the light-emitting display device 1b has a substrate 100, a first patterned conductive layer 10b, a second patterned conductive layer 20b, six are separated from each other and electrically isolated The first pad area 501b to the sixth pad area 506b and a plurality of light-emitting components 90. In this embodiment, the substrate 100, the first patterned conductive layer 10b, the second patterned conductive layer 20b, and the light-emitting element 90 are the same as the substrate 100, the first patterned conductive layer 10a, and the first patterned conductive layer 10a described in the first embodiment. The similarities between the two patterned conductive layers 20a and the light-emitting components 90 will not be repeated here, and only the differences between this embodiment and the first embodiment will be described below.

Please continue to refer to FIGS. 2B and 2C. In this embodiment, each pin of each light-emitting element 90 is electrically connected to the first pad area 501b to the sixth pad area 506b, respectively. The first patterned conductive layer 10b is disposed on the first surface 1001 and has a plurality of grid-shaped first grid wires 101b, the first grid wires 101b occupy 70% to 90% of the first surface 1001 of the substrate 100 Area. The second patterned conductive layer 20b is disposed above the second surface 1002, and has a plurality of grid-shaped second grid wires 201b, and at least one wire connected from a grid node of the second grid wires 201b Shaped extension 202b, four adjacent and parallel elongated wires 203b in linear form that are equally or unequally spaced apart from each other, and island portions 204b separated from the second grid wire 201b and the elongated wires 203b. The extension 202b and the second mesh wire 201b can be formed in one process or different processes. The extension direction of the extension portion 202b and the extension direction of the elongated wire 203b intersect, for example, are perpendicular. The extending direction of the elongated wire 203b and the extending direction of the constituent wires of the second grid wire 201b are not parallel. The extension portion 202b, the elongated wire 203b, and the connection portion of the pad area of the island portion 204b are all disposed above the second surface 1002 of the substrate 100. The first pad area 501b to the sixth pad area 506b are disposed on the second patterned conductive layer 20b.

Please continue to refer to FIGS. 2A to 2C. In this embodiment, the light-emitting display device 1b further has a third patterned conductive layer 30b disposed above the second surface 1002 and below the second patterned conductive layer 20b. The third patterned conductive layer 30b has a third grid wire 301b in a grid shape, and the third grid wire 301b occupies 70% to 90% of the area of the second surface 1002. A part of the third mesh wire 301b, for example, a mesh node, is electrically connected to the mesh node 1011b of the first mesh wire 101b through one of the through holes 1003. The light-emitting display device 1b may further include a third patterned conductive metal seed layer 300b, which is disposed on the second surface 1002, and has the same pattern as that of the third grid wires 301b of the third patterned conductive layer 30b for As a formation preparation layer of the third patterned conductive layer 30b.

Please continue to refer to FIGS. 2A to 2C. In this embodiment, the light-emitting display device 1b further has a patterned electrically insulating layer 40b disposed above the third patterned conductive layer 30b and below the second patterned conductive layer 20b , Used to electrically isolate the second patterned conductive layer 20b and the third patterned conductive layer 30b. Book In an embodiment, the patterned electrically insulating layer 40b has a plurality of first electrically insulating blocks 401b, a plurality of second electrically insulating blocks 402b, and a plurality of third electrically insulating blocks 403b. Each first electrically insulating block 401b covers a configuration area on the third patterned conductive layer 30b corresponding to the second grid wire 201b, and is used to isolate the electrical power between the second grid wire 201b and the third grid wire 301b. Sexual contact; each second electrically insulating block 402b covers a configuration area on the third patterned conductive layer 30b corresponding to the extension portion 202b and the adjacent portion of the pad area 504b to isolate the extension portion 202b and the pad area The electrical contact between the adjacent portion of 504b and the third grid wire 301b; each third electrically insulating block 403b covers a portion of the third patterned conductive layer 30b corresponding to each elongated wire 203b including the connection portion of the pad area The configuration area is used to isolate the electrical contact between the elongated wire 203b and the third grid wire 301b. The part of the third grid wire 301b that is electrically connected to the first grid wire 101b via one of the through holes 1003 is exposed from the patterned electrically insulating layer 40b and is connected to the island portion 204b of the second patterned conductive layer 20b Direct contact and electrical connection.

As shown in FIGS. 2B and 2C, the other pad areas except the first pad area 501b are all located on the patterned electrically insulating layer 40b, and the first pad area 501b is directly electrically connected to the third grid wire 301b. The fourth pad area 504b is electrically connected to the second mesh wire 201b via the extension 202b, and the second pad area 502b, the third pad area 503b, the fifth pad area 505b, and the sixth pad area 506b are each connected to one Slender wire 203b. In other words, the island portion 204b, the third grid wire 301b, and the first grid wire 101b serve as the connecting wires between the input voltage pin of the light-emitting component 90 and the input voltage source; the second grid wire 201b and its extension 202b serve as The connecting wire between the ground pin and the ground terminal of the light-emitting component 90; the elongated wire 203b serves as the connecting wire of the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. Therefore, the first grid wire 101b, the second grid wire 201b, and the third grid wire 301b are used to withstand the power supply voltage and current, and the line width of the wires should be greater than or equal to the line width of the elongated wire 203b. In order to reduce the visibility of the first grid wire 101b, the second grid wire 201b and its extension 202b, the elongated wire 203b, and the third grid wire 301b, the line width can be reduced without affecting the required conductivity . In an embodiment, the first grid wire 101b, the second grid wire 201b, and the third grid wire 301b constitute wires, The line width of the extension 202b and the elongated wire 203b is 25 to 100 microns. The line widths of the constituent wires of the first grid wire 101b, the second grid wire 201b, and the third grid wire 301b may be the same or different. The other aspects are the same as those described in the foregoing embodiments, and will not be repeated here.

2C, in one embodiment, the light-emitting display device 1b further includes a first patterned conductive metal seed layer 100b, which is disposed on the first surface 1001, and has a first mesh with the first patterned conductive layer 10b The pattern with the same pattern of the wires 101b is used as a preparation layer for the formation of the first patterned conductive layer 10b. In another embodiment, the light-emitting display device 1b further includes a third patterned conductive metal seed layer 300b, which is disposed above the second surface 1002 of the substrate 100, and has a third grid wire connected to the third patterned conductive layer 30b. The pattern with the same pattern of 301b is used as a preparation layer for forming the third patterned conductive layer 30b.

FIG. 2D is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 2B in another manufacturing process. The structure of FIG. 2D and FIG. 2C are different only in that the light-emitting display device 1b' does not include a third patterned conductive metal seed layer 300b. Others that are the same as those in Figure 2C will not be repeated here.

FIG. 2E is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 2B in another manufacturing process. The structure of FIG. 2E and FIG. 2D are different only in that the light-emitting display device 1b" does not include the first patterned conductive metal seed layer 100b. Others that are the same as those in FIGS. 2D and 2C will not be repeated here.

3A, 3B and 3C at the same time, in the third embodiment, the light-emitting display device 1c has a substrate 100, a first patterned conductive layer 10c, a second patterned conductive layer 20c, a third patterned conductive layer 30c, patterned The electrically insulating layer 40c, the six first pad regions 501c to the sixth pad regions 506c that are separated and electrically isolated from each other, and a plurality of light-emitting components 90. In this embodiment, the substrate 100, the first patterned conductive layer 10c, the second patterned conductive layer 20c, the third patterned conductive layer 30c, the patterned electrically insulating layer 40c, and the light emitting component 90 are compared with those in the second embodiment The similarities of the mentioned substrate 100, the first patterned conductive layer 10b, the second patterned conductive layer 20b, the third patterned conductive layer 30b, the patterned electrically insulating layer 40b, and the light-emitting element 90 mentioned above will not be repeated here. Only the differences between this embodiment and the second embodiment are described.

Please continue to refer to FIGS. 3B and 3C. In this embodiment, each pin of each light-emitting element 90 is electrically connected to the first pad area 501c to the sixth pad area 506c, respectively. The first patterned conductive layer 10c is disposed on the first surface 1001, and has a plurality of grid-shaped first grid wires 101c, the first grid wires 101c occupy 70% to 90% of the first surface 1001 of the substrate 100 Area. The second patterned conductive layer 20c is disposed above the second surface 1002, and has a plurality of grid-shaped second grid wires 201c, and at least one wire connected from a grid node of the second grid wires 201c The shaped extension 202c and four linear elongated wires 203c that are adjacent to each other, are parallel to each other, and are equally or unequally spaced apart from each other. The extension portion 202c and the connection portion of the pad area of the elongated wire 203c are both disposed on the second surface 1002 of the substrate 100. The other pad regions except the first pad region 501c are disposed on the second patterned conductive layer 20c.

Please continue to refer to FIGS. 3A to 3C. In this embodiment, the light-emitting display device 1c further has a third patterned conductive layer 30c disposed above the second surface 1002 of the substrate 100 and below the second patterned conductive layer 20c. The third patterned conductive layer 30c has a plurality of grid-shaped third grid wires 301c. A part of the third mesh wire 301c, for example, a mesh node, is electrically connected to the mesh node 1011c of the first mesh wire 101c via one of the through holes 1003. The light-emitting display device 1c may further include a third patterned conductive metal seed layer 300c, which is disposed on the second surface 1002, and has the same pattern as the pattern of the third grid wires 301c of the third patterned conductive layer 30c for As a formation preparation layer of the third patterned conductive layer 30c.

Please continue to refer to FIGS. 3A to 3C. In this embodiment, the light-emitting display device 1c further has a patterned electrically insulating layer 40c, which is disposed above the third patterned conductive layer 30c and below the second patterned conductive layer 20c , Used to electrically isolate the second patterned conductive layer 20c and the third patterned conductive layer 30c. In this embodiment, the patterned electrically insulating layer 40c has a plurality of first electrically insulating blocks 401c, a plurality of second electrically insulating blocks 402c, and a plurality of third electrically insulating blocks 403c. Each first electrically insulating block 401c covers a configuration area on the third patterned conductive layer 30c corresponding to the second grid wire 201c, and is used to isolate the electrical power between the second grid wire 201c and the third grid wire 301c. Sexual contact; each second electrically insulating block 402c covers A configuration area on the third patterned conductive layer 30c corresponding to the adjacent portion of the extension 202c and the second grid wire 201c is used to isolate the adjacent portion of the extension 202c and the second grid wire 201c from the third grid Electrical contact between the wires 301c; each third electrically insulating block 403c covers a configuration area on the third patterned conductive layer 30c corresponding to each elongated wire 203c except for the connection portion of the pad area to isolate the elongated wire The electrical contact between the part of 203c except the connection part of the pad area and the third grid wire 301c. The part of the third grid wire 301c that is electrically connected to the first grid wire 101c via one of the through holes 1003 is exposed from the patterned electrically insulating layer 40c.

As shown in FIGS. 3B and 3C, all the pad areas are exposed from the patterned electrically insulating layer 40c, and the first pad area 501c is disposed on the third patterned conductive layer 30c and passes through the through holes 1003 and the first mesh. The grid wire 101c is electrically connected, the fourth pad area 504c is electrically connected to the second grid wire 201c via the extension 202c, the second pad area 502c, the third pad area 503c, the fifth pad area 505c, and the sixth pad area Each of the pad regions 506c is connected to an elongated wire 203c. In other words, the third grid wire 301c and the first grid wire 101c serve as the connection wires between the input voltage pin of the light-emitting component 90 and the input voltage source; the second grid wire 201c and its extension 202c serve as the connection wires of the light-emitting component 90 The connecting wire between the ground pin and the ground terminal; the elongated wire 203c is used as the connecting wire of the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. Therefore, the first grid wire 101c, the second grid wire 201c, and the third grid wire 301c are used to withstand the power supply voltage and current, and the line width of the wires should be greater than or equal to the line width of the elongated wire 203c. In order to reduce the visibility of the first grid wire 101c, the second grid wire 201c and its extension 202c, the elongated wire 203c, and the third grid wire 301c, they can be reduced as required without affecting the required conductivity. Line width. In one embodiment, the wire width of the first grid wire 101c, the second grid wire 201c, and the third grid wire 301c, the extension 202c, and the elongated wire 203c is 25 to 100 microns. The line widths of the constituent wires of the first grid wire 101c, the second grid wire 201c, and the third grid wire 301c may be the same or different. The other aspects are the same as those described in the foregoing embodiment, and will not be repeated here.

Please continue to refer to FIG. 3C. In one embodiment, the light-emitting display device 1c further includes a first patterned conductive metal seed layer 100c, which is disposed on the first surface 1001 and has a first mesh with the first patterned conductive layer 10c The pattern with the same pattern of the wire 101c is used as a preparation layer for the formation of the first patterned conductive layer 10c. In another embodiment, the light-emitting display device 1c further includes a third patterned conductive metal seed layer 300c, which is disposed above the second surface 1002, and has a pattern similar to the third grid wires 301c of the third patterned conductive layer 30c The same pattern is used as a preparation layer for forming the third patterned conductive layer 30c.

FIG. 3D is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 3B in another manufacturing process. The structure of FIG. 3D and FIG. 3C are different only in that the light-emitting display device 1c' does not include the third patterned conductive metal seed layer 300c. Others that are the same as those in FIG. 3C will not be repeated here.

FIG. 3E is a schematic cross-sectional view showing the A-A cross-section of the light-emitting display device of FIG. 3B in another manufacturing process. The structure difference between FIG. 3E and FIG. 3D is only that the light-emitting display device 1c" does not include the first patterned conductive metal seed layer 100c. Others that are the same as those in FIG. 3D will not be repeated here.

Referring to FIGS. 4A, 4B and 4C at the same time, in the fourth embodiment, the patterns of the first patterned conductive layer 10d and the second patterned conductive layer 20d of the light-emitting display device 1d are different from those described in the foregoing embodiment, and only the description will be given below. This embodiment is different from the above-mentioned embodiments. In this embodiment, the first patterned conductive layer 10d and the second patterned conductive layer 20d are respectively disposed above the first surface 1001 and above the second surface 1002. The first patterned conductive layer 10d has two first grid wires 101d in a plurality of grids, at least one linear extension 102d connected from a grid node of the first grid wires 101d, and four The elongated wires 103d in a linear shape are adjacent and parallel to each other and spaced at equal or unequal distances from each other. The extension direction of the extension portion 102d is parallel to the configuration plane of the first grid wire 101d, and the extension direction of the elongated wire 103d and the extension direction of the extension portion 102d cross, for example, are perpendicular. The second patterned conductive layer 20d only has islands 204d spaced apart and respectively corresponding to the first pad region 501d to the sixth pad region 506d. The island portion 204d is electrically connected to the extension portion 102d or the elongated wire 103d via a through hole 1003, respectively. In an embodiment where there are only four pad areas, the number of elongated wires 103d may be only two.

As shown in FIGS. 4B and 4C, the first pad area 501d to the sixth pad area 506d are respectively electrically connected to the six island portions 204d and connected to the first grid wire 101d of the first patterned conductive layer 10d through the through hole 1003. The extension 102d or the elongated wire 103d. In other words, the first grid wire 101d and the island 204d on one side serve as the wires between the input voltage pin of the light-emitting component 90 and the input voltage source; the first grid wire 101d and the island 204d on the other side serve as the light-emitting components The wire between the ground pin of 90 and the ground terminal; the elongated wire 103d serves as the wire of the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. In an embodiment, the line width of the constituent wires, the extension 102d and the elongated wires 103d of the first grid wire 101d is 25 micrometers to 100 micrometers.

Please continue to refer to FIG. 4C, the same as the above-mentioned embodiment, the light-emitting display device 1d may further include a first patterned conductive metal seed layer 100d and a second patterned conductive metal seed layer 200d, which are respectively disposed on the first surface 1001 and Above the second surface 1002. In another embodiment, the light-emitting display device 1d may not have the first patterned conductive metal seed layer 100d and the second patterned conductive metal seed layer 200d.

5, in the foregoing embodiment, the first, second, or third electrically insulating block of the patterned electrically insulating layer 40b or 40c may be formed by stacking a plurality of electrically insulating layers 411 to 415 and have side edges It is stepped to increase flexibility.

In summary, according to the light-emitting display device described in each embodiment of the present invention, the input voltage connection wire and the ground wire in the pad area are staggered separately, so as to increase the plane configuration space of the input voltage connection wire and the ground wire. Therefore, the input voltage connection wire and the ground wire can be subdivided into multiple grid wires with smaller line widths in the enlarged planar configuration space to improve the transparency of the display screen. In this way, when the configuration substrate of the light-emitting component is transparent, the visibility of the configuration wires on the substrate in the display screen can be greatly reduced, thereby improving the contrast and clarity of viewing this type of light-emitting display from a certain distance. . In addition, in terms of process design, the material of each patterned conductive layer can be selected according to the process to be flexible. As long as it has conductive properties, this creation is not limited here. example For example, the materials of the first grid wires of the first patterned conductive layer, the third grid wires of the third patterned conductive layer, the second grid wires of the second patterned conductive layer and the extensions in each embodiment It can be a slurry doped with conductive powder and can be further added with an electroless plating material. It can be a high-transparency indium tin oxide (ITO) film, a fluorine-doped tin oxide (FTO) film, a zinc oxide (ZnO) film or The aluminum oxide zinc (AZO) film can be made of copper, silver, nickel or nickel gold, or it can be made of graphene, carbon nanotubes and other materials.

The above description should be understood and implemented for ordinary knowledgeable persons in the technical field to which this creation belongs. Some embodiments of this creation are disclosed above, but they are not used to limit this creation. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of this creation. In other words, other equivalent embodiments completed without departing from the spirit disclosed in this creation should be included in this creation, and the scope of protection of this creation shall be subject to the scope of the patent application attached hereafter.

1d: Light-emitting display device

80: Electrical connection material

90: Light-emitting components

100: substrate

1001: first surface

1002: second surface

1003: Through hole

10d: the first patterned conductive layer

100d: the first patterned conductive metal seed layer

101d: first grid wire

102d: Extension

103d: Slim wire

20d: second patterned conductive layer

200d: second patterned conductive metal seed layer

204d: Island

501d: first pad area

502d: second pad area

504d: The fourth pad area

Claims (10)

A light-emitting display device includes: a substrate having a first surface and a second surface opposite to the first surface, the substrate having a plurality of through holes; at least four solder pad regions electrically isolated from each other, and at least The input voltage pin, the data signal input or output pin, the clock signal input or output pin, and the ground pin of a light-emitting component are electrically connected correspondingly, and the light-emitting component has at least one light-emitting diode driving chip; a first The patterned conductive layer is disposed above the first surface and has a plurality of grid-shaped first grid wires; and a second patterned conductive layer is disposed on the second surface and has the solder Pad area; wherein one of the pad areas is electrically connected to the first grid wire through one of the through holes, and a plurality of the light-emitting components are arranged in an array on the same side of the first surface and The minimum distance between each other is 2 to 3 mm. The light-emitting display device of claim 1, wherein the first patterned conductive layer has at least two grid-shaped first grid wires located on both sides of the first surface, and at least two parallel lines The elongated wire and at least two extensions respectively connected from the first grid wire, the extension direction of the extension is parallel to the arrangement plane of the first grid wire, the extension direction of the elongated wire and the extension portion The extending directions are crossed; and the solder pad regions are electrically connected to the elongated wires through the through holes and the extending portion, respectively. The light-emitting display device of claim 1, wherein the first grid wire occupies 70% to 90% of the area of the first surface; the second patterned conductive layer has a second grid wire in the shape of a plurality of grids , At least one extension part connected from a grid node of the second grid wire and at least two elongated wires parallel to each other in a linear shape, the extension direction of the extension part is parallel to the arrangement level of the second grid wire Surface, the extending direction of the elongated wires and the extending direction of the extending portion cross; the pad area electrically connected to the ground pin is electrically connected to the second grid wire via the extending portion; The data signal input or output pins, the clock signal input or output pins corresponding to the electrical connection of the solder pad areas are respectively connected to the slender wires. The light-emitting display device of claim 3, wherein the second patterned conductive layer further has an island portion separated from the second grid wire and the elongated wires, and the island portion passes through one of the through holes and The first grid wire is electrically connected, and the pad area corresponding to the input voltage pin is electrically connected to the first grid wire via the island portion. For example, the light-emitting display device of claim 3, further comprising: a third patterned conductive layer disposed above the second surface and below the second patterned conductive layer, and having a third mesh in the shape of a plurality of grids Grid wire, the third grid wire occupies 70% to 90% of the area of the second surface of the substrate; and a patterned electrically insulating layer disposed above the third patterned conductive layer and the second The bottom of the patterned conductive layer is used to electrically isolate the second patterned conductive layer and the third patterned conductive layer; wherein, a part of the third grid wire passes through one of the through holes and the first The grid wires are electrically connected. The light-emitting display device of claim 5, further comprising: a third patterned conductive metal seed layer formed on the second surface as a preparation layer for forming the third patterned conductive layer. Such as the light-emitting display device of claim 5, wherein: The patterned electrical insulation layer has a plurality of first electrical insulation blocks, a plurality of second electrical insulation blocks, and a plurality of third electrical insulation blocks; and each of the first electrical insulation blocks covers the third electrical insulation block A configuration area on the patterned conductive layer corresponding to the second grid wire is used to isolate the electrical contact between the second grid wire and the third grid wire; each of the second electrically insulating regions Covering a configuration area on the third patterned conductive layer that corresponds to the extension portion and the adjacent portion of the pad area that is electrically connected to the ground pin to isolate the extension portion and the ground pin corresponding to the electrical connection The electrical contact between the adjacent portion of the pad area and the third grid wire; each of the third electrically insulating regions covers the third patterned conductive layer corresponding to each of the elongated wires containing solder A configuration area of the connecting portion of the pad region is used to isolate the electrical contact between the elongated wires and the third grid wires; the third grid wire passes through one of the through holes and the first The electrically connected part of the grid wire is exposed from the patterned electrically insulating layer. The light-emitting display device of claim 5, wherein: the patterned electrical insulation layer has a plurality of first electrical insulation blocks, a plurality of second electrical insulation blocks, and a plurality of third electrical insulation blocks; and each of these The first electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to the second grid wire to isolate the electrical contact between the second grid wire and the third grid wire ; Each of the second electrically insulating regions covers a configuration area on the third patterned conductive layer corresponding to the extension portion and the adjacent portion of the second grid wire to isolate the extension portion and the first Electrical contact between the adjacent part of the two grid wires and the third grid wire; each of the third electrically insulating regions covers the solder removal pads on the third patterned conductive layer corresponding to each of the elongated wires A configuration area outside the connecting portion of the area to isolate the portions of the elongated wires except the connecting portion of the pad area and the Electrical contact between the third grid wires; the part of the third grid wire that is electrically connected to the first grid wire through one of the through holes is exposed from the patterned electrical insulating layer And the solder pad regions are exposed from the patterned electrical insulating layer. Such as the light-emitting display device of claim 8, wherein the bonding pad area connection portion of each of the elongated wires is disposed on the second surface, and the extension portion is connected to the portion of the bonding pad area that is electrically connected to the ground pin It is arranged on the second surface. The light-emitting display device according to any one of claims 1 to 9, wherein the wire width of the conductive wires of the first grid wire is 25 micrometers to 100 micrometers.

Images