TWI868324B - Light emitting display device and method of manufacturing the same - Google Patents

Abstract

A light-emitting display device has a substrate, a first patterned conductive layer and a second patterned conductive layer respectively disposed on separate sides of the substrate, at least four electrically isolated soldering pad areas, and a plurality of light-emitting elements one of which correspondingly connected to the soldering pad areas. The minimum distance between the light-emitting elements is 2 to 3 mm. The first patterned conductive layer has a first grid wiring, while the second patterned conductive layer has a second grid wiring, at least one extension derived from one node of the second grid wiring, and at least two string-shaped slender wirings. The soldering pad area corresponding to the grounded pin of one of the light-emitting elements is connected to the second grid wiring through the extension, and the soldering pad areas respectively corresponding to the data signal input or output pin and the clock signal input or output pin of one of the light-emitting elements are respectively connected to the slender wirings.

Description

Luminescent display device and manufacturing method thereof

The present invention relates to a display device, in particular to a luminous display device and a manufacturing method thereof.

As display screens are developing towards larger sizes, flatter, thinner, lighter, and more flexible displays, the development of luminous display technology that uses point light sources as the light source of the display and a flexible substrate as the substrate for configuring these light sources is becoming increasingly important. In one branch of technology development, the subsequent progress of large-screen luminous displays developed with light emitting diodes (LEDs) as light sources for people to watch from a distance is worth paying attention to.

In the production of this type of luminous display for people to watch from a distance, the LED components containing LEDs and their driver chips (ICs) can be installed in the form of an array on a substrate, and the distance between the LED components is not less than 2 millimeters (mm), which is different from the organic light-emitting diode (OLED) display or micro-LED display for people to watch from a close distance. In order for each LED component in the array to be lit and have the required brightness, the configuration substrate of these LED components and their configuration wires must have good conductivity. In addition, in order to improve the contrast of this type of luminous display when viewed from a distance, it is also necessary to reduce the visibility of the configuration substrate of these LED components and their configuration wires in the display screen. On the other hand, in order to meet the display effects required by various application scenarios, the configuration of these LED components and the production of the wires must have good design changes and can be completed quickly. In response to the above technical problems, the present invention hopes to propose solutions.

In view of the above problems, the present invention provides a luminous display device and a manufacturing method thereof.

In one embodiment, a light-emitting display device has a substrate, a first patterned conductive layer disposed on the substrate, a second patterned conductive layer, and at least four electrically isolated pad regions. The substrate has a first surface, a second surface opposite to the first surface, and a plurality of through holes. The pad regions are respectively electrically connected to an input voltage pin, a data signal input or output pin, a clock signal input or output pin, and a ground pin of a light-emitting component, and the light-emitting component has a driving chip of at least one light-emitting diode. The first patterned conductive layer is disposed above the first surface and has a first grid wire in a plurality of grid shapes. The second patterned conductive layer is disposed above the second surface and has the pad region. One of these pad areas is electrically connected to the first grid wire via one of the through holes; the wire width of the first grid wire is 25 microns to 100 microns; and a plurality of light-emitting components are arranged in an array on the same side of the first surface and the minimum spacing between them is 2 to 3 mm.

In one embodiment, the first patterned conductive layer of the light-emitting display device occupies 70% to 90% of the area of the first surface; the second patterned conductive layer has a plurality of second grid-shaped wires, at least one extension portion connected from one grid node of the second grid wire, and at least two parallel linear thin wires, the extension direction of the extension portion is parallel to the configuration plane of the second grid wire, and the extension direction of the thin wire and the extension direction of the extension portion are intersecting; the pad area electrically connected to the ground pin is electrically connected to the second grid wire through the extension portion; and the pad area electrically connected to the data signal input or output pin and the clock signal input or output pin is respectively connected to a thin wire.

In one embodiment, the second patterned conductive layer of the light-emitting display device also has an island portion separated from the second grid wire and the thin and long wire, the island portion is electrically connected to the first grid wire through one of the through holes, and the pad area electrically connected to the input voltage pin is electrically connected to the first grid wire through the island portion.

In one embodiment, the light-emitting display device further has a third patterned conductive layer and a patterned electrical insulating layer. The third patterned conductive layer is disposed above the second surface of the substrate and below the second patterned conductive layer, and has a third grid conductive line in a plurality of grid shapes and occupying 70% to 90% of the area of the second surface of the substrate. The patterned electrical insulating layer is disposed above the third patterned conductive layer and below the second patterned conductive layer to electrically isolate the second patterned conductive layer and the third patterned conductive layer. Part of the third grid conductive line is electrically connected to the first grid conductive line through one of the through holes.

In one embodiment, the patterned electrically insulating layer of the light emitting display device has a plurality of first electrically insulating regions, a plurality of second electrically insulating regions, and a plurality of third electrically insulating regions. Each first electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to the second grid wire, so as to isolate the electrical contact between the second grid wire and the third grid wire; each second electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to the adjacent portion of the welding pad area electrically connected to the extension portion and the ground pin, so as to isolate the adjacent portion of the welding pad area electrically connected to the extension portion and the ground pin and the third grid wire. Electrical contact; each third electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to each thin and long wire including the connection part of the pad area, for isolating the electrical contact between the thin and long wire and the third grid wire; the part of the third grid wire electrically connected to the first grid wire through one of the through holes is exposed from the patterned electrically insulating layer and electrically connected to an island part in the second patterned conductive layer separated from the second grid wire and the thin and long wire.

In one embodiment, the patterned electrically insulating layer of the light emitting display device has a plurality of first electrically insulating regions, a plurality of second electrically insulating regions, and a plurality of third electrically insulating regions. Each first electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to the second grid conductive line, so as to isolate the electrical contact between the second grid conductive line and the third grid conductive line; each second electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to the extension portion and the adjacent portion of the second grid conductive line, so as to isolate the electrical contact between the extension portion and the adjacent portion of the second grid conductive line and the third grid conductive line; each third electrically insulating block covers a configuration area on the third patterned conductive layer corresponding to each thin and long conductive line. A configuration area other than the pad area connection portion of the thin wire is used to isolate the electrical contact between the portion other than the pad area connection portion of the thin wire and the third grid wire; the portion of the third grid wire electrically connected to the first grid wire through one of the through holes is exposed from the patterned electrical insulation layer and all the pad areas are exposed from the patterned electrical insulation layer; the pad area connection portion of each thin wire is configured on the second surface, and the portion of the extension portion connected to the pad area electrically connected to the ground pin is configured on the second surface.

On the other hand, the present invention provides a method for manufacturing a luminous display device.

In one embodiment, a method for manufacturing a light-emitting display device comprises the following steps: providing a substrate having a plurality of through holes; forming a first patterned conductive layer on a first surface of the substrate, the first patterned conductive layer having a plurality of first grid-shaped conductive lines; forming a second patterned conductive layer on a second surface of the substrate opposite to the first surface, the second patterned conductive layer having at least four pad regions electrically isolated from each other and respectively electrically connected to an input voltage pin, a data signal input or output pin, a clock signal input or output pin, and a ground pin of a light-emitting component, the light-emitting component having at least one light-emitting diode driving chip; electrically connecting one of these pad regions to the first grid conductive line via one of the through holes.

In one embodiment, the second patterned conductive layer has a plurality of second grid-shaped wires, at least one extension connected from a grid node of the second grid wire, and at least two parallel and equally or unequally spaced linear thin wires, the extension direction of the extension is parallel to the configuration plane of the second grid wire, and the extension direction of the thin wire and the extension direction of the extension are intersecting; and the manufacturing method further includes: configuring a portion of the extension as a welding pad area of a ground pin of a light-emitting component, and configuring a portion of each thin wire as a welding pad area of a data signal input pin, a data signal output pin, a clock signal input pin, or a clock signal output pin of the light-emitting component.

In one embodiment, the second patterned conductive layer of the light-emitting display device further forms an island portion separated from the second grid wire and the thin and long wire, and the island portion is electrically connected to the first grid wire through one of the through holes, and the manufacturing method of the light-emitting display device further includes: configuring a part of the island portion as a pad area of the input voltage pin of the light-emitting component.

In one embodiment, the manufacturing method of the light-emitting display device further comprises the following steps: forming a third patterned conductive layer above the second surface of the substrate and below the second patterned conductive layer, the third patterned conductive layer having a third grid conductive line in a plurality of grid shapes, a portion of the third grid conductive line being electrically connected to the first grid conductive line via one of the through holes.

In one embodiment, the manufacturing method of the light-emitting display device further comprises the following steps: forming a third patterned conductive metal seed layer on the second surface of the substrate by using one of the processes of sputtering, screen printing and inkjet printing; wherein the third patterned conductive layer is formed on the third patterned conductive metal seed layer by using one of the processes of sputtering, etching, chemical plating and electroplating.

In one embodiment, the second patterned conductive layer of the light-emitting display device further has an island portion separated from the second grid conductive line and the thin long conductive line, and the manufacturing method of the light-emitting display device further has the following steps: using one of screen printing and inkjet printing processes to form a patterned electrically insulating layer including first, second and third electrically insulating blocks above the third patterned conductive layer and below the second patterned conductive layer, and to form a conductive layer through one of the through holes and the first grid conductive line. The portion of the third grid wire electrically connected to the wire is exposed from the patterned electrically insulating layer; the second grid wire is located on the first electrically insulating block, the extension portion is located on the second electrically insulating block, each thin and long wire is located on the third electrically insulating block, and the island portion is directly in contact with the portion of the third grid wire exposed from the patterned electrically insulating layer; and a portion of the island portion is configured as a pad area of the input voltage pin of the light-emitting component.

In one embodiment, the manufacturing method of the light-emitting display device further comprises the following steps: forming a patterned electrically insulating layer including first, second and third electrically insulating blocks on the third patterned conductive layer and below the second patterned conductive layer by using one of screen printing and inkjet printing processes, and exposing a portion of the third grid conductive line electrically connected to the first grid conductive line through one of the through holes from the patterned electrically insulating layer, so that the data signal input pin, data signal output pin, clock signal input pin or clock signal output pin of the light-emitting component is configured as a data signal input pin, a data signal output pin, a clock signal input pin or a clock signal output pin of the light-emitting component is exposed. A portion of the pad area is exposed from the patterned electrically insulating layer; the second grid wire is located on the first electrically insulating block, the portion of the extension except the pad area connection portion is located on the second electrically insulating block, and the portion of each thin wire except the pad area connection portion is located on the third electrically insulating block, and the pad area connection portion of the extension and the pad area connection portion of each thin wire are formed on the second surface of the substrate; and the portion of the third grid wire electrically connected to the first grid wire through one of the through holes is configured as the pad area of the input voltage pin of the light-emitting component.

In each embodiment, the second patterned conductive layer is formed by using a process of screen printing or inkjet printing.

In each embodiment, the manufacturing method of the light-emitting display device further comprises the following steps: forming a first patterned conductive metal seed layer on the first surface of the substrate by one of sputtering, screen printing and inkjet printing processes; and forming the first patterned conductive layer on the first patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes.

In summary, according to the luminescent display device and the manufacturing method thereof described in the various embodiments of the present invention, the input voltage connection wire and the ground wire in the pad area are staggered to increase the plane configuration space of the input voltage connection wire and the ground wire. Therefore, the input voltage connection wire and the ground wire can be subdivided into a plurality of grid wires with smaller line widths in the enlarged plane configuration space to improve the transparency of the display screen. In this way, when the configuration substrate of the luminescent component is transparent, the visibility of the configuration wire on the substrate in the display screen can be greatly reduced, thereby improving the contrast and clarity of such a luminescent display viewed from a certain distance. On the other hand, since each patterned conductive layer electrically connected to the light-emitting component can be manufactured by a printing process such as screen printing and inkjet printing, near-infrared light irradiation can be further used to quickly cure the printed or inkjet printed patterned conductive layer to shorten the process time and facilitate the process procedure. In addition, in terms of process design, the material of each patterned conductive layer can be selected according to different processes and has flexibility, as long as it has conductive properties, the present invention is not limited thereto. For example, the material of the first grid wire of the first patterned conductive layer, the third grid wire of the third patterned conductive layer, the second grid wire of the second patterned conductive layer and the extension part in each embodiment can be a slurry mixed with conductive powder and can further add a chemically plated material, which can be a highly transparent indium tin oxide (ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film or aluminum zinc oxide (AZO) film, which can be copper, silver, nickel or nickel gold, or graphene, carbon nanotubes and other materials.

In order to make the above features and advantages of the present invention more clearly understood, the following is a detailed description of the embodiments with the accompanying drawings.

1a, 1a', 1b, 1b', 1b", 1c, 1c', 1c", 1d: Luminous display device

100: Substrate

1001: First surface

1002: Second surface

1003:Through hole

10a, 10b, 10c, 10d: first patterned conductive layer

100a, 100b, 100c, 100d: first patterned conductive metal seed layer

101a, 101b, 101c, 101d: first grid wire

102d: Extension of the first grid wire

103d: Thin and long wire

1011a, 1011b, 1011c: grid nodes

20a, 20b, 20c, 20d: second patterned conductive layer

200a, 200d: Second patterned conductive metal seed layer

201a, 201b, 201c: Second grid wire

202a, 202b, 202c: extensions of the second grid wire

203a, 203b, 203c: thin and long wires

204a, 204b, 204d: Island Department

30b, 30c: The third patterned conductive layer

300b, 300c: The third patterned conductive metal seed layer

301b, 301c: Third grid wire

40b, 40c: Patterned electrical insulating layer

401b, 401c: first electrically insulating block

402b, 402c: second electrically insulating block

403b, 403c: the third electrically insulating block

411~415: Electrical insulation layer

501a, 501b, 501c, 501d: First welding pad area

502a, 502b, 502c, 502d: Second welding pad area

503a, 503b, 503c, 503d: The third welding pad area

504a, 504b, 504c, 504d: Fourth welding pad area

505a, 505b, 505c, 505d: Fifth welding pad area

506a, 506b, 506c, 506d: Sixth welding pad area

80: Electrical connection materials

90: Light-emitting components

11~16, 21~25, 31~38, 41~47, 51~56, 61~68, 71~77, 81~86, 91~96: Steps

FIG. 1A is a schematic plan view showing a first patterned conductive layer located on a first surface of a substrate of a light-emitting display device of the first embodiment of the present invention.

FIG1B is a schematic plan view showing the second patterned conductive layer located above the second surface of the substrate of the light-emitting display device of the first embodiment of the present invention.

FIG1C is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG1B during a manufacturing process.

FIG1D is a block flow chart showing a method for manufacturing the light-emitting display device of FIG1C.

FIG1E is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG1B in another manufacturing process.

FIG1F is a block flow chart showing a method for manufacturing the light-emitting display device of FIG1E .

FIG2A is a schematic plan view showing the first patterned conductive layer located on the first surface of the substrate of the light-emitting display device of the second embodiment of the present invention.

FIG2B is a schematic plan view showing the second patterned conductive layer located above the second surface of the substrate of the light-emitting display device of the second embodiment of the present invention.

FIG2C is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG2B during a manufacturing process.

FIG2D is a block flow chart showing a method for manufacturing the light-emitting display device of FIG2C.

FIG2E is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG2B in another manufacturing process.

FIG2F is a block flow chart showing a method for manufacturing the light-emitting display device of FIG2E.

FIG2G is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG2B in another manufacturing process.

FIG2H is a block flow chart showing a method for manufacturing the light-emitting display device of FIG2G .

FIG3A is a schematic plan view showing the first patterned conductive layer located on the first surface of the substrate of the light-emitting display device of the third embodiment of the present invention.

FIG3B is a schematic plan view showing the second patterned conductive layer located above the second surface of the substrate of the light-emitting display device of the third embodiment of the present invention.

FIG3C is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG3B during a manufacturing process.

FIG3D is a block flow chart showing a method for manufacturing the light-emitting display device of FIG3C.

FIG3E is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG3B in another manufacturing process.

FIG3F is a block flow chart showing a method for manufacturing the light-emitting display device of FIG3E.

FIG3G is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG3B in another manufacturing process.

FIG3H is a block flow chart showing a method for manufacturing the light-emitting display device of FIG3G .

FIG4A is a schematic plan view showing the first patterned conductive layer located on the first surface of the substrate of the light-emitting display device of the fourth embodiment of the present invention.

FIG4B is a schematic plan view showing the second patterned conductive layer located above the second surface of the substrate of the light-emitting display device of the fourth embodiment of the present invention.

FIG4C is a schematic cross-sectional view showing the A-A cross section of the light-emitting display device of FIG4B during a manufacturing process.

FIG4D is a block flow chart showing a method for manufacturing the light-emitting display device of FIG4C.

FIG5 is a cross-sectional schematic diagram showing a multi-layer stacked electrical insulating layer of a light-emitting display device of an embodiment of the present invention.

The present invention discloses a light-emitting display device. The following descriptions are already understood by ordinary technicians in this field and will not be fully described, such as the light-emitting principle of the light-emitting diode, the patterned conductive layer with a specific conductive circuit pattern and a layered three-dimensional structure (the circuit patterns have height differences), etc. In addition, if the meaning of the technical terms described in the following text is different from the meaning of the common terms in the technical field to which it belongs, the meaning in the text shall prevail. The accompanying drawings in the text are intended to express the meaning related to the characteristics of the present invention and are not fully drawn according to the actual size, and are also described in advance. The first to sixth prepositions described in the following text are only used as distinguishing marks for similar components and have no order.

1A, 1B and 1C, in the first embodiment, the light-emitting display device 1a has a substrate 100, a first patterned conductive layer 10a, a second patterned conductive layer 20a, six first pad regions 501a to sixth pad regions 506a separated from each other and electrically isolated, and a plurality of light-emitting components 90. The minimum spacing distance between the light-emitting components 90 is not less than 2 mm, preferably 2 to 3 mm, to distinguish from an organic light-emitting diode (OLED) display or a micro-LED display. Each light-emitting component 90 has one or more light-emitting diodes (LEDs) that can emit red light, green light, and blue light, and their driving ICs. The input voltage pins, data signal input pins, clock signal input pins, grounded pins, clock signal output pins, and data signal output pins are fixed by electrical connection materials 80 such as solder paste and are electrically connected to the first welding pad area 501a, the second welding pad area 502a, the third welding pad area 503a, the fourth welding pad area 504a, the fifth welding pad area 505a, and the sixth welding pad area 506a, respectively. In other embodiments, the data signal input pin and the data signal output pin are combined and the clock signal input pin and the clock signal output pin are combined, so that the six pad areas can be integrated into only four pad areas. The material of the substrate 100 is preferably transparent, and can be glass, ceramic, aluminum nitride ceramic, polycarbonate, polyethylene terephthalate, polyimide, polymethyl methacrylate, BT resin, glass fiber or cyclic olefin copolymer.

Please continue to refer to Figures 1A to 1C. In this embodiment, the substrate 100 has a first surface 1001 and a second surface 1002 facing each other and a plurality of through holes 1003. The first patterned conductive layer 10a is arranged on the first surface 1001, and the second patterned conductive layer 20a is arranged above the second surface 1002. The first welding pad area 501a to the sixth welding pad area 506a are arranged on the second patterned conductive layer 20a. If the local area including these welding pad areas is regarded as a welding pad area unit, the substrate 100 has a plurality of welding pad area units deployed in an array, and all the light-emitting components 90 will be fixed to the corresponding welding pad area units and arranged in an array on the same side of the second surface 1002. The first patterned conductive layer 10a has a plurality of first grid-shaped wires 101a, and the first grid wires 101a occupy 70% to 90% of the area of the first surface 1001 of the substrate 100. The second patterned conductive layer 20a has a plurality of second grid-shaped wires 201a, at least one linear extension 202a connected from a grid node of the second grid wire 201a, four linear thin wires 203a adjacent to each other and parallel to each other and spaced equidistantly or unequally from each other, and an island 204a separated from the second grid wire 201a and the thin wires 203a. The island 204a is electrically connected to a grid node 1011a of the first grid wire 101a through one of the through holes 1003. The so-called grid node is the intersection of the constituent wires of the grid wire. In one embodiment, the extension direction of the extension portion 202a is parallel to the configuration plane of the second grid wire 201a, and the extension direction of the thin wire 203a and the extension direction of the extension portion 202a are intersecting, for example, perpendicular. In an embodiment in which there are only four pad areas, the number of thin wires 203a can be only two.

Please continue to refer to FIG. 1A to FIG. 1C , the grid shapes of the first grid wire 101a and the second grid wire 201a are rectangular, hexagonal or circular, and the present invention is not limited thereto. As shown in FIG. 1B and FIG. 1C , the first pad area 501a and the island portion 204a are electrically connected and the first grid wire 101a is connected via the island portion 204a and the through hole 1003, the fourth pad area 504a is connected to the extension portion 202a of the second grid wire 201a and is electrically connected via the extension portion 202a and the second grid wire 201a, and the second pad area 502a, the third pad area 503a, the fifth pad area 505a, and the sixth pad area 506a are each connected to a thin wire 203a. In other words, the first grid wire 101a and the island 204a are used as wires between the input voltage pin and the input voltage source of the light-emitting component 90; the second grid wire 201a and its extension 202a are used as wires between the ground pin and the ground terminal of the light-emitting component 90; and the thin wire 203a is used as a wire for the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. Therefore, the second grid wire 201a is used to bear the driving voltage and current of the light-emitting component 90, and the wire width of the wire should be greater than or equal to the wire width of the thin wire 203a. In order to reduce the visibility of the second grid wire 201a, the extension 202a and the thin wire 203a, their line width can be reduced without affecting the required conductivity. In one embodiment, the line width of the component wires of the second grid wire 201a, the extension 202a and the thin wire 203a is 25 microns to 100 microns.

Please continue to refer to Figure 1C. In one embodiment, the light-emitting display device 1a may also include a first patterned conductive metal seed layer 100a, which is disposed on the first surface 1001 and has the same pattern as the first grid wire 101a of the first patterned conductive layer 10a. It is used as a preparation layer for forming the first patterned conductive layer 10a, which helps to make the first patterned conductive layer 10a firmly attached to the substrate 100. Similarly, in one embodiment, the light-emitting display device 1a may further include a second patterned conductive metal seed layer 200a, which is disposed above the second surface 1002 and has the same pattern as the second grid wire 201a, the extension 202a, the thin wire 203a and the island 204a of the second patterned conductive layer 20a, and is used as a preparation layer for forming the second patterned conductive layer 20a, which helps to make the second patterned conductive layer 20a firmly attached to the substrate 100.

Please refer to FIG. 1D , in one embodiment, the manufacturing method of the light-emitting display device of FIG. 1C includes the following steps.

Step 11: Provide a substrate having a plurality of through holes. As shown in FIG. 1C , provide a substrate 100 having a plurality of through holes 1003 .

Step 12: Form a first patterned conductive metal seed layer on the first surface of the substrate using one of the processes of sputtering, screen printing and inkjet printing. As shown in FIG. 1C , a first patterned conductive metal seed layer 100a is formed on the first surface 1001 of the substrate 100.

Step 13: Form a first patterned conductive layer including a plurality of first grid-shaped wires on the first patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, align at least one grid node of the first grid wire with a through hole, and plate the material of the first grid wire on one side of the through hole close to the first surface of the substrate. As shown in FIGS. 1A to 1C , the first patterned conductive layer 10a including the first grid wire 101a is formed on the first patterned conductive metal seed layer 100a, and the pattern of the first grid wire 101a is the same as the pattern of the first patterned conductive metal seed layer 100a. At least one grid node 1011a of the first grid wire 101a is aligned with a through hole 1003, and the side of the through hole 1003 close to the first surface 1001 of the substrate 100 is plated with the material of the first grid wire 101a.

Step 14: Form a second patterned conductive metal seed layer on the second surface of the substrate using one of the processes of sputtering, screen printing and inkjet printing. As shown in FIG. 1C , a second patterned conductive metal seed layer 200a is formed on the second surface 1002 of the substrate 100.

Step 15: Form a second patterned conductive layer including a plurality of second grid-shaped wires, at least one extension connected from a grid node of the second grid wire, at least two thin wires and an island on the second patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, and make the through hole whose one side close to the first surface of the substrate is plated with the material of the first grid wire be plated with the material of the island on the other side close to the second surface of the substrate, and the island is electrically connected to the first grid wire. The second grid wire, the extension, the thin wire and the island can be formed in one process. As shown in FIG. 1B and FIG. 1C , the second patterned conductive layer 20a including the second grid wire 201a, the extension 202a, the elongated wire 203a and the island 204a is formed on the second patterned conductive metal seed layer 200a and has the same pattern as the second patterned conductive metal seed layer 200a. In addition, the through hole 1003 near the first surface 1001, which has been plated with the material of the first grid wire 101a, is plated with the material of the island 204a on the other side near the second surface 1002, and the island 204a is electrically connected to the first grid wire 101a through the through hole 1003. The material of the island 204a can be the same as or different from the material of the second grid wire 201a.

Step 16: respectively configure a portion of the island portion and a portion of the extension portion of the second grid wire as the pad area of the pin of the light-emitting component. As shown in FIG. 1B and FIG. 1C, a portion of the island portion 204a is configured as the first pad area 501a of the input voltage pin of the light-emitting component 90, and a portion of the extension portion 202a is configured as the fourth pad area 504a of the ground pin of the light-emitting component 90. In addition, each portion of the adjacent thin and long wires 203a is configured as the second pad area 502a, the third pad area 503a, the fifth pad area 505a, and the sixth pad area 506a.

As shown in FIG. 1E , in another embodiment, the light-emitting display device 1a 'does not include a second patterned conductive metal seed layer 200a, and the other steps that are the same as those in FIG. 1C are not described here. Referring to FIG. 1F , in another embodiment, the process of forming the second patterned conductive metal seed layer of the light-emitting display device omits the step of forming the second patterned conductive metal seed layer, and includes the following steps.

Step 21: Synchronize step 11.

Step 22: Synchronize with step 12.

Step 23: Synchronize with step 13.

Step 24: Use one of screen printing and inkjet printing processes to form a second patterned conductive layer on the second surface of the substrate as in step 15 above, and fill the through hole on one side close to the first surface of the substrate with the material of the first grid wire and fill the island material on the other side close to the second surface of the substrate, and the island and the first grid wire are electrically connected. As shown in FIG. 1B and FIG. 1E, a second patterned conductive layer 20a including a second grid wire 201a, an extension 202a of the second grid wire 201a, four thin wires 203a and an island 204a is formed on the second surface 1002 of the substrate 100. Other descriptions similar to step 15 above are not repeated here.

Step 25: Synchronize with step 16.

Please refer to Figures 2A, 2B and 2C at the same time. In the second embodiment, the light-emitting display device 1b has a substrate 100, a first patterned conductive layer 10b, a second patterned conductive layer 20b, six first pad regions 501b to sixth pad regions 506b separated from each other and electrically isolated, and a plurality of light-emitting components 90. In this embodiment, the similarities between the substrate 100, the first patterned conductive layer 10b, the second patterned conductive layer 20b and the light-emitting components 90 and the substrate 100, the first patterned conductive layer 10a, the second patterned conductive layer 20a and the light-emitting components 90 described in the first embodiment are not described here in detail. The following only describes the differences between this embodiment and the first embodiment.

Please continue to refer to FIG. 2B and FIG. 2C . In this embodiment, each pin of each light-emitting component 90 is electrically connected to the first pad area 501b to the sixth pad area 506b. The first patterned conductive layer 10b is disposed on the first surface 1001 and has a plurality of first grid wires 101b in a grid shape. The first grid wires 101b occupy 70% to 90% of the area of the first surface 1001 of the substrate 100. The second patterned conductive layer 20b is disposed above the second surface 1002, and has a plurality of second grid wires 201b, at least one linear extension 202b connected from a grid node of the second grid wire 201b, four linear thin wires 203b adjacent to each other and parallel to each other and spaced equidistantly or unequally from each other, and an island 204b separated from the second grid wire 201b and the thin wire 203b. The extension 202b and the second grid wire 201b can be formed in one process or in different processes. The extension direction of the extension 202b and the extension direction of the thin wire 203b are intersecting, for example, perpendicular. The extension direction of the thin wire 203b is not parallel to the extension direction of the constituent wires of the second grid wire 201b. The extension portion 202b, the elongated wire 203b and the pad area connection portion of the island portion 204b are all disposed above the second surface 1002 of the substrate 100. The first pad area 501b to the sixth pad area 506b are disposed on the second patterned conductive layer 20b.

Please continue to refer to FIG. 2A to FIG. 2C . In this embodiment, the light-emitting display device 1b further has a third patterned conductive layer 30b disposed above the second surface 1002 and below the second patterned conductive layer 20b. The third patterned conductive layer 30b has a third grid wire 301b in a plurality of grid shapes, and the third grid wire 301b occupies 70% to 90% of the area of the second surface 1002. A portion of the third grid wire 301b, such as a grid node, is electrically connected to the grid node 1011b of the first grid wire 101b through one of the through holes 1003. The light-emitting display device 1b may also include a third patterned conductive metal seed layer 300b, which is disposed on the second surface 1002 and has the same pattern as the third grid wire 301b of the third patterned conductive layer 30b, and is used as a preparation layer for forming the third patterned conductive layer 30b.

Please continue to refer to Figures 2A to 2C. In this embodiment, the light-emitting display device 1b further has a patterned electrically insulating layer 40b, which is disposed above the third patterned conductive layer 30b and below the second patterned conductive layer 20b, for electrically isolating the second patterned conductive layer 20b and the third patterned conductive layer 30b. In this embodiment, the patterned electrically insulating layer 40b has a plurality of first electrically insulating blocks 401b, a plurality of second electrically insulating blocks 402b, and a plurality of third electrically insulating blocks 403b. Each first electrically insulating region 401b covers a configuration region on the third patterned conductive layer 30b corresponding to the second grid conductive line 201b, so as to isolate the electrical contact between the second grid conductive line 201b and the third grid conductive line 301b; each second electrically insulating region 402b covers a configuration region on the third patterned conductive layer 30b corresponding to the extension portion 202b and the adjacent portion of the pad region 504b. Area, used to isolate the electrical contact between the extension portion 202b and the adjacent portion of the pad area 504b and the third grid wire 301b; each third electrically insulating block 403b covers a configuration area on the third patterned conductive layer 30b corresponding to each thin wire 203b including the pad area connecting portion, used to isolate the electrical contact between the thin wire 203b and the third grid wire 301b. The portion of the third grid wire 301b electrically connected to the first grid wire 101b via one of the through holes 1003 is exposed from the patterned electrical insulating layer 40b and is directly in contact with the island portion 204b of the second patterned conductive layer 20b and electrically connected.

As shown in FIGS. 2B and 2C , all the pad regions except the first pad region 501b are located on the patterned electrically insulating layer 40b. The first pad region 501b is directly electrically connected to the third grid wire 301b. The fourth pad region 504b is electrically connected to the second grid wire 201b via the extension portion 202b. The second pad region 502b, the third pad region 503b, the fifth pad region 505b, and the sixth pad region 506b are each connected to a thin wire 203b. In other words, the island 204b, the third grid wire 301b and the first grid wire 101b are used as connecting wires between the input voltage pin and the input voltage source of the light-emitting component 90; the second grid wire 201b and its extension 202b are used as connecting wires between the ground pin and the ground end of the light-emitting component 90; and the thin wire 203b is used as a connecting wire for the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. Therefore, the first grid wire 101b, the second grid wire 201b and the third grid wire 301b are used to withstand the power supply voltage and current, and the wire width of the wires composed of them should be greater than or equal to the wire width of the thin wire 203b. In order to reduce the visibility of the first grid wire 101b, the second grid wire 201b and its extension 202b, the thin wire 203b, and the third grid wire 301b, their line width can be reduced without affecting the required conductivity. In one embodiment, the line width of the first grid wire 101b, the second grid wire 201b and the third grid wire 301b, the extension 202b and the thin wire 203b is 25 to 100 microns. The line width of the first grid wire 101b, the second grid wire 201b and the third grid wire 301b can be the same or different. Other aspects that are the same as those described in the above embodiments will not be repeated.

Please continue to refer to FIG. 2C. In one embodiment, the light-emitting display device 1b further includes a first patterned conductive metal seed layer 100b, which is disposed on the first surface 1001 and has the same pattern as the first grid wire 101b of the first patterned conductive layer 10b, and is used as a preparation layer for forming the first patterned conductive layer 10b. In another embodiment, the light-emitting display device 1b further includes a third patterned conductive metal seed layer 300b, which is disposed above the second surface 1002 of the substrate 100 and has the same pattern as the third grid wire 301b of the third patterned conductive layer 30b, and is used as a preparation layer for forming the third patterned conductive layer 30b.

Please refer to FIG. 2D , in one embodiment, the manufacturing method of the light-emitting display device of FIG. 2C includes the following steps.

Step 31: Provide a substrate having a plurality of through holes. As shown in FIG. 2C , provide a substrate 100 having a plurality of through holes 1003 .

Step 32: Synchronize with step 12.

Step 33: Synchronize with step 13.

Step 34: Form a third patterned conductive metal seed layer on the second surface of the substrate using one of the processes of sputtering, screen printing and inkjet printing. As shown in FIG. 2C , a third patterned conductive metal seed layer 300b is formed on the second surface 1002 of the substrate 100.

Step 35: Form a third patterned conductive layer including a plurality of third grid-shaped wires on the third patterned conductive metal seed layer by one of the processes of sputtering, etching, chemical plating and electroplating, and make the through-holes on one side close to the first surface of the substrate, which have been plated with the material of the first grid wire, be plated with the material of the third grid wire on the other side close to the second surface of the substrate, and a part of the third grid wire is electrically connected to the first grid wire through one of the through-holes. As shown in FIGS. 2B and 2C , the third patterned conductive layer 30b is formed on the third patterned conductive metal seed layer 300b, and the third patterned conductive layer 30b includes the third grid wire 301b, and the pattern of the third grid wire 301b is the same as the pattern of the third patterned conductive metal seed layer 300b. In addition, the through hole 1003 near the first surface 1001, which is coated with the material of the first grid wire 101b, is coated with the material of the third grid wire 301b on the other side near the second surface 1002. The material of the third grid wire 301b may be the same as or different from the material of the first grid wire 101b. A portion of the third grid wire 301b is electrically connected to the first grid wire 101b via one of the through holes 1003.

Step 36: Form a patterned electrically insulating layer including the first, second and third electrically insulating blocks on the third patterned conductive layer by using one of screen printing and inkjet printing processes, and expose a portion of the third grid wire electrically connected to the first grid wire through one of the through holes from the patterned electrically insulating layer. The first, second and third electrically insulating blocks can be formed in one process. As shown in FIGS. 2B and 2C , a patterned electrically insulating layer 40b including a first electrically insulating block 401b, a second electrically insulating block 402b and a third electrically insulating block 403b is formed on the third patterned conductive layer 30b, and a portion of the third grid wire 301b electrically connected to the first grid wire 101b via one of the through holes 1003 is not covered by the patterned electrically insulating layer 40b but is exposed from the patterned electrically insulating layer 40b.

Step 37: Use one of screen printing and inkjet printing processes to form a second patterned conductive layer on top of the patterned electrical insulating layer as in step 15 above, and position the second grid wire on the first electrical insulating block, position the extension on the second electrical insulating block, position each thin wire on the third electrical insulating block, and position the island directly in contact with the portion of the third grid wire exposed from the patterned electrical insulating layer. As shown in FIGS. 2B and 2C , a second patterned conductive layer 20b including a second grid wire 201b, an extension 202b, a thin wire 203b, and an island 204b is formed on top of the patterned electrical insulating layer 40b.

Step 38: A portion of the island portion and a portion of the extension portion of the second grid wire are respectively configured as pad regions of the pins of the light-emitting component. As shown in FIGS. 2B and 2C , a portion of the island portion 204b is configured as the first pad region 501b of the input voltage pin of the light-emitting component 90, and a portion of the extension portion 202b of the second grid wire 201b is configured as the fourth pad region 504b of the ground pin of the light-emitting component 90. In addition, a portion of each of the four adjacent thin wires 203b is respectively configured as the second pad region 502b, the third pad region 503b, the fifth pad region 505b, and the sixth pad region 506b. Since the second patterned conductive layer 20b is formed by screen printing or inkjet printing, the island portion 204b and the first pad area 501b are integrated, the extension portion 202b and the fourth pad area 504b are integrated, and the four adjacent thin wires 203b are integrated with the second pad area 502b, the third pad area 503b, the fifth pad area 505b, and the sixth pad area 506b respectively.

As shown in FIG. 2E , in another embodiment, the light-emitting display device 1b 'does not include a third patterned conductive metal seed layer 300b, and the other steps that are the same as those in FIG. 2C are not described here in detail. Referring to FIG. 2F , in another embodiment, the process of forming the third patterned conductive metal seed layer of the light-emitting display device omits the step of forming the third patterned conductive metal seed layer, and includes the following steps, wherein the details of the steps that are the same as those in FIG. 2D are not described in detail.

Step 41: Synchronize step 31.

Step 42: Synchronize with step 32.

Step 43: Synchronize with step 33.

Step 44: Form the third patterned conductive layer of step 35 on the second surface of the substrate by using one of screen printing and inkjet printing processes, and fill the third grid wire material on the other side of the through hole near the second surface of the substrate whose side near the first surface of the substrate has been coated with the material of the first grid wire, and make a part of the third grid wire electrically connected to the first grid wire through one of the through holes. As shown in FIGS. 2B and 2E , the third patterned conductive layer 30b is formed on the second surface 1002, and the third patterned conductive layer 30b includes the third grid wire 301b. In addition, the through hole 1003 whose side near the first surface 1001 has been coated with the material of the first grid wire 101b is filled with the material of the third grid wire 301b on the other side near the second surface 1002. The material of the third grid wire 301b may be the same as or different from the material of the first grid wire 101b. A portion of the third grid wire 301b is electrically connected to the first grid wire 101b via one of the through holes 1003.

Step 45: Synchronize with step 36.

Step 46: Synchronize with step 37.

Step 47: Synchronize with step 38.

As shown in FIG. 2G, in another embodiment, the light-emitting display device 1b" does not include the first patterned conductive metal seed layer 100b, and the other steps that are the same as those in FIG. 2G and 2C are not described here in detail. Please refer to FIG. 2H, in another embodiment, the process of forming the first patterned conductive metal seed layer of the light-emitting display device omits the step of forming the first patterned conductive metal seed layer, and includes the following steps, wherein the details of the steps that are the same as those in FIG. 2F and FIG. 2D are not described in detail.

Step 51: Synchronize with step 41.

Step 52: Use one of screen printing and inkjet printing to form the first patterned conductive layer in the above step 13 on the first surface of the substrate, so that at least one grid node of the first grid wire is aligned with a through hole, and the side of the through hole close to the first surface of the substrate is coated with the material of the first grid wire. As shown in FIG. 2G, the first patterned conductive layer 10b is directly formed on the first surface 1001 and at least one grid node of the first grid wire 101b is aligned with a through hole 1003, and the side of the through hole 1003 close to the first surface 1001 of the substrate 100 is coated with the material of the first grid wire 101b.

Step 53: Form the third patterned conductive layer of step 35 on the second surface of the substrate by using one of screen printing and inkjet printing processes, and fill the third grid wire material on the other side of the through hole near the second surface of the substrate that has been filled with the material of the first grid wire on one side of the substrate near the first surface, and make a part of the third grid wire electrically connected to the first grid wire through one of the through holes. As shown in Figures 2B and 2G, the through hole 1003 near the second surface 1002 that has been filled with the material of the first grid wire 101b on one side of the first surface 1001 is filled with the material of the third grid wire 301b. A part of the third grid wire 301b is electrically connected to the first grid wire 101b through one of the through holes 1003.

Step 54: Synchronize steps 36 and 45.

Step 55: Synchronize steps 37 and 46.

Step 56: Synchronize steps 38 and 47.

3A, 3B and 3C, in the third embodiment, the light-emitting display device 1c has a substrate 100, a first patterned conductive layer 10c, a second patterned conductive layer 20c, a third patterned conductive layer 30c, a patterned electrical insulating layer 40c, six first to sixth solder pad areas 501c to 506c separated from each other and electrically isolated, and a plurality of light-emitting components 90. In this embodiment, the substrate 100, the first patterned conductive layer 10c, the second patterned conductive layer 20c, the third patterned conductive layer 30c, the patterned electrical insulating layer 40c and the light-emitting component 90 are similar to the substrate 100, the first patterned conductive layer 10b, the second patterned conductive layer 20b, the third patterned conductive layer 30b, the patterned electrical insulating layer 40b and the light-emitting component 90 described in the second embodiment. The following only describes the differences between this embodiment and the second embodiment.

Please continue to refer to FIG. 3B and FIG. 3C . In this embodiment, each pin of each light-emitting component 90 is electrically connected to the first pad area 501c to the sixth pad area 506c. The first patterned conductive layer 10c is disposed on the first surface 1001 and has a plurality of first grid wires 101c in a grid shape. The first grid wires 101c occupy 70% to 90% of the area of the first surface 1001 of the substrate 100. The second patterned conductive layer 20c is disposed above the second surface 1002 and has a plurality of second grid wires 201c, at least one linear extension 202c connected from a grid node of the second grid wire 201c, and four linear thin wires 203c adjacent to each other, parallel to each other, and equidistant or unequally spaced from each other. The extension 202c and the pad area connection portion of the thin wire 203c are both disposed on the second surface 1002 of the substrate 100. The other pad areas except the first pad area 501c are disposed on the second patterned conductive layer 20c.

Please continue to refer to FIG. 3A to FIG. 3C. In this embodiment, the light-emitting display device 1c further has a third patterned conductive layer 30c disposed above the second surface 1002 of the substrate 100 and below the second patterned conductive layer 20c. The third patterned conductive layer 30c has a third grid wire 301c in a plurality of grid shapes. A portion of the third grid wire 301c, such as a grid node, is electrically connected to the grid node 1011c of the first grid wire 101c through one of the through holes 1003. The luminescent display device 1c may also include a third patterned conductive metal seed layer 300c, which is disposed on the second surface 1002 and has the same pattern as the third grid wire 301c of the third patterned conductive layer 30c, and is used as a preparation layer for forming the third patterned conductive layer 30c.

Please continue to refer to FIG. 3A to FIG. 3C . In this embodiment, the light-emitting display device 1c further has a patterned electrically insulating layer 40c, which is disposed above the third patterned conductive layer 30c and below the second patterned conductive layer 20c, for electrically isolating the second patterned conductive layer 20c and the third patterned conductive layer 30c. In this embodiment, the patterned electrically insulating layer 40c has a plurality of first electrically insulating blocks 401c, a plurality of second electrically insulating blocks 402c, and a plurality of third electrically insulating blocks 403c. Each first electrically insulating block 401c covers a configuration area on the third patterned conductive layer 30c corresponding to the second grid conductive line 201c, so as to isolate the electrical contact between the second grid conductive line 201c and the third grid conductive line 301c; each second electrically insulating block 402c covers a configuration area on the third patterned conductive layer 30c corresponding to the extension portion 202c and the adjacent portion of the second grid conductive line 201c, so as to isolate the electrical contact between the second grid conductive line 201c and the third grid conductive line 301c. The electrical contact between the adjacent part of the extension portion 202c and the second grid wire 201c and the third grid wire 301c; each third electrically insulating block 403c covers a configuration area on the third patterned conductive layer 30c corresponding to each thin wire 203c except the pad area connection part, which is used to isolate the electrical contact between the part of the thin wire 203c except the pad area connection part and the third grid wire 301c. The part of the third grid wire 301c electrically connected to the first grid wire 101c through one of the through holes 1003 is exposed from the patterned electrically insulating layer 40c.

As shown in FIGS. 3B and 3C , all the pad regions are exposed from the patterned electrically insulating layer 40c. The first pad region 501c is disposed on the third patterned conductive layer 30c and is electrically connected to the first grid wire 101c via the through hole 1003. The fourth pad region 504c is electrically connected to the second grid wire 201c via the extension portion 202c. The second pad region 502c, the third pad region 503c, the fifth pad region 505c, and the sixth pad region 506c are each connected to a thin wire 203c. In other words, the third grid wire 301c and the first grid wire 101c serve as connecting wires between the input voltage pin and the input voltage source of the light-emitting component 90; the second grid wire 201c and its extension 202c serve as connecting wires between the ground pin and the ground end of the light-emitting component 90; and the thin wire 203c serves as connecting wires for the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. Therefore, the first grid wire 101c, the second grid wire 201c and the third grid wire 301c are used to withstand the power supply voltage and current, and the wire width of the wires they form should be greater than or equal to the wire width of the thin wire 203c. In order to reduce the visibility of the first grid wire 101c, the second grid wire 201c and its extension 202c, the thin wire 203c, and the third grid wire 301c, their line width can be reduced as required without affecting the required conductivity. In one embodiment, the line width of the first grid wire 101c, the second grid wire 201c, and the third grid wire 301c, the extension 202c, and the thin wire 203c is 25 to 100 microns. The line width of the first grid wire 101c, the second grid wire 201c, and the third grid wire 301c can be the same or different. Other aspects that are the same as those described in the above embodiments will not be repeated.

Please continue to refer to FIG. 3C. In one embodiment, the light-emitting display device 1c further includes a first patterned conductive metal seed layer 100c, which is disposed on the first surface 1001 and has the same pattern as the first grid wire 101c of the first patterned conductive layer 10c, and is used as a preparation layer for forming the first patterned conductive layer 10c. In another embodiment, the light-emitting display device 1c further includes a third patterned conductive metal seed layer 300c, which is disposed above the second surface 1002 and has the same pattern as the third grid wire 301c of the third patterned conductive layer 30c, and is used as a preparation layer for forming the third patterned conductive layer 30c.

Please refer to FIG. 3D , in one embodiment, the manufacturing method of the light-emitting display device of FIG. 3C includes the following steps.

Step 61: Synchronize with step 31.

Step 62: Synchronize with step 12.

Step 63: Synchronize with step 13.

Step 64: Synchronize with step 34.

Step 65: Synchronize with step 35.

Step 66: In addition to the above step 36, this step further exposes all the pad areas from the patterned electrical insulating layer. As shown in FIGS. 3B and 3C , a patterned electrical insulating layer 40c including a first electrical insulating block 401c, a second electrical insulating block 402c, and a third electrical insulating block 403c is formed on the third patterned conductive layer 30c. The portion of the third grid wire 301c electrically connected to the first grid wire 101c via one of the through holes 1003 is not covered by the patterned electrical insulating layer 40c and is exposed from the patterned electrical insulating layer 40c. In addition, all pad regions 501c to 506c are exposed from the patterned electrically insulating layer 40c.

Step 67: Using one of screen printing and inkjet printing processes, a second patterned conductive layer is formed on top of the patterned electrically insulating layer, including a plurality of second grid wires, at least one extension connected from one grid node of the second grid wire, and at least two thin wires, and the second grid wire is located on the first electrically insulating block, the extension portion except the pad area connection portion is located on the second electrically insulating block, and the portion of each thin wire except the pad area connection portion is located on the third electrically insulating block, and the extension portion of the second grid wire and the pad area connection portion of each thin wire are formed on the substrate. As shown in FIGS. 3B and 3C , a second patterned conductive layer 20c including a second grid conductive line 201c, an extension portion 202c, and a thin and long conductive line 203c is formed on the patterned electrically insulating layer 40c.

Step 68: respectively configuring a portion of the third grid wire and a portion of the extension of the second grid wire as the pad area of the pin of the light-emitting component. As shown in FIGS. 3B and 3C , a portion of the third grid wire 301c is configured as the first pad area 501c of the input voltage pin of the light-emitting component 90, and a portion of the extension 202c of the second grid wire 201c is configured as the fourth pad area 504c of the ground pin of the light-emitting component 90. In addition, a portion of each of the four adjacent thin wires 203c is configured as the second pad area 502c, the third pad area 503c, the fifth pad area 505c, and the sixth pad area 506c. Since the second patterned conductive layer 20c is formed by screen printing or inkjet printing, the extension portion 202c and the fourth pad area 504c are integrated, and the four adjacent thin wires 203c are integrated with the second pad area 502c, the third pad area 503c, the fifth pad area 505c, and the sixth pad area 506c respectively.

As shown in FIG. 3E , in another embodiment, the light-emitting display device 1c 'does not include the third patterned conductive metal seed layer 300c, and the other steps that are the same as those in FIG. 3C are not described here in detail. Please refer to FIG. 3F , in another embodiment, the process of forming the third patterned conductive metal seed layer of the light-emitting display device omits the step of forming the third patterned conductive metal seed layer, and includes the following steps, wherein the details of the steps that are the same as those in FIG. 3D are not described in detail.

Step 71: Synchronize with step 61.

Step 72: Synchronize with step 62.

Step 73: Synchronize with step 63.

Step 74: Synchronize with step 44. As shown in FIGS. 3B and 3E, a third patterned conductive layer 30c is formed on the second surface 1002 of the substrate 100, and the third patterned conductive layer 30c includes a third grid conductor 301c. In addition, the through hole 1003, which has been coated with the material of the first grid conductor 101c on one side close to the first surface 1001, is filled with the material of the third grid conductor 301c on the other side close to the second surface 1002.

Step 75: Synchronize with step 66.

Step 76: Synchronize with step 67.

Step 77: Synchronize with step 68.

As shown in FIG. 3G, in another embodiment, the light-emitting display device 1c" does not include the first patterned conductive metal seed layer 100c, and the other steps that are the same as those in FIG. 3E are not described here in detail. Please refer to FIG. 3H, in another embodiment, the process of forming the first patterned conductive metal seed layer of the light-emitting display device omits the step of forming the first patterned conductive metal seed layer, and includes the following steps, wherein the details of the steps that are the same as those in FIG. 3F are not described in detail.

Step 81: Synchronize with step 71.

Step 82: Synchronize with step 52. As shown in FIGS. 3B and 3G, a first patterned conductive layer 10c is formed on the first surface 1001, and the first patterned conductive layer 10c includes a first grid conductive line 101c.

Step 83: This step is the same as the above step 53. As shown in Figures 3B and 3G, the third patterned conductive layer 30c is formed on the second surface 1002 of the substrate 100, and the third patterned conductive layer 30c includes a third grid conductor 301c. In addition, the through hole 1003 on one side of the first surface 1001 close to the substrate 100 has been filled with the material of the first grid conductor 101c, and the other side of the through hole 1003 close to the second surface 1002 of the substrate 100 is filled with the material of the third grid conductor 301c. A portion of the third grid conductor 301c is electrically connected to the first grid conductor 101c through one of the through holes 1003.

Step 84: Synchronize with step 75.

Step 85: Synchronize with step 76.

Step 86: Synchronize with step 77.

Please refer to FIGS. 4A, 4B and 4C simultaneously. In the fourth embodiment, the patterns of the first patterned conductive layer 10d and the second patterned conductive layer 20d of the light-emitting display device 1d are different from those described in the above embodiments. The following only describes the differences between this embodiment and the above embodiments. In this embodiment, the first patterned conductive layer 10d and the second patterned conductive layer 20d are respectively disposed above the first surface 1001 and above the second surface 1002. The first patterned conductive layer 10d has two first grid wires 101d in a plurality of grid shapes, at least one linear extension 102d connected from a grid node of the first grid wire 101d, and four linear thin elongated wires 103d adjacent to each other and parallel to each other and spaced equidistantly or unequally from each other. The extension direction of the extension portion 102d is parallel to the configuration plane of the first grid wire 101d, and the extension direction of the thin wire 103d is intersecting with the extension direction of the extension portion 102d, for example, perpendicular. The second patterned conductive layer 20d has only island portions 204d that are separated and correspond to the first pad area 501d to the sixth pad area 506d. The island portions 204d are each electrically connected to the extension portion 102d or the thin wire 103d through a through hole 1003. In an embodiment with only four pad areas, the number of thin wires 103d can be only two.

As shown in FIGS. 4B and 4C , the first to sixth bonding pad regions 501d to 506d are electrically connected to the six islands 204d respectively and connected to the extension 102d or the elongated wire 103d of the first grid wire 101d of the first patterned conductive layer 10d via the through hole 1003 . In other words, the first grid wire 101d and the island 204d on one side serve as wires between the input voltage pin and the input voltage source of the light-emitting component 90; the first grid wire 101d and the island 204d on the other side serve as wires between the ground pin and the ground end of the light-emitting component 90; the thin wire 103d serves as a wire for the data signal input/output pin or the clock signal input/output pin of the light-emitting component 90. In one embodiment, the wires of the first grid wire 101d, the extension 102d, and the thin wire 103d have a line width of 25 microns to 100 microns.

Please continue to refer to FIG. 4C. As in the above embodiment, the luminescent display device 1d may further include a first patterned conductive metal seed layer 100d and a second patterned conductive metal seed layer 200d, which are respectively arranged above the first surface 1001 and above the second surface 1002. As shown in FIG. 4D, the manufacturing method of the luminescent display device of FIG. 4C includes the following steps.

Step 91: Synchronize step 11.

Step 92: Synchronize step 12.

Step 93: Form a first patterned conductive layer including a first grid wire, an extension of the first grid wire, and at least two thin wires on the first patterned conductive metal seed layer by one of sputtering, etching, chemical plating, and electroplating processes, so that each extension of the first grid wire and each thin wire are aligned with a through hole, and the material of the first grid wire is plated on one side of the through hole close to the first surface of the substrate. As shown in FIGS. 4A to 4C , a first patterned conductive layer 10d including a first grid wire 101d, an extension of the first grid wire 102d, and at least two thin wires 103d is formed on the first patterned conductive metal seed layer 100d. Each extension portion 102d and each elongated wire 103d is aligned with a through hole 1003, and the side of the through hole 1003 close to the first surface 1001 of the substrate 100 is plated with the material of the first grid wire 101d.

Step 94: Synchronize with step 14.

Step 95: Form a second patterned conductive layer including a plurality of islands on the second patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes, and plate the material of the islands on the other side of the through hole near the second surface of the substrate where the material of the first grid wire is plated on the side near the first surface of the substrate, and the islands are electrically connected to the extension of the first grid wire and the thin wire through the through hole. As shown in FIG. 4B and FIG. 4C , the second patterned conductive layer 20d including the island 201d is formed on the second patterned conductive metal seed layer 200d. In addition, the through hole 1003 near the first surface 1001 is coated with the material of the first grid wire 101d, and the other side near the second surface 1002 is coated with the material of the island 201d. The island 201d is electrically connected to the extension 102d and the elongated wire 103d through the through hole 1003.

Step 96: respectively configure a portion of the island portion as a soldering pad area of the pin of the light-emitting component. As shown in FIG. 4B and FIG. 4C, a portion of the six island portions 201d is respectively configured as the first soldering pad area 501d to the sixth soldering pad area 506d of the light-emitting component 90.

Similar to the above embodiment, the steps 92 and 93 of forming the first patterned conductive layer 10d can be completed by using one of the processes of screen printing and inkjet printing, and the steps 94 and 95 of forming the second patterned conductive layer 20d can also be completed by using one of the processes of screen printing and inkjet printing, which will not be described here. In other words, the luminescent display device 1d may not have the first patterned conductive metal seed layer 100d and the second patterned conductive metal seed layer 200d.

Please refer to FIG. 5 . In the aforementioned embodiment, the first, second or third electrically insulating regions of the patterned electrically insulating layer 40b or 40c can be formed by stacking a plurality of electrically insulating layers 411 to 415 and the sides are stepped, thereby increasing flexibility.

In summary, the luminescent display device and the manufacturing method thereof described in the embodiments of the present invention stagger the input voltage connection wire and the ground wire in the pad area to increase the plane configuration space of the input voltage connection wire and the ground wire. Therefore, the input voltage connection wire and the ground wire can be subdivided into a plurality of grid wires with smaller line widths in the enlarged plane configuration space to improve the transparency of the display screen. In this way, when the configuration substrate of the luminescent component is transparent, the visibility of the configuration wire located on the substrate in the display screen can be greatly reduced, thereby improving the contrast and clarity of such luminescent displays viewed from a certain distance. On the other hand, since each patterned conductive layer electrically connected to the light-emitting component can be manufactured by a printing process such as screen printing and inkjet printing, near-infrared light irradiation can be further used to quickly cure the printed or inkjet printed patterned conductive layer to shorten the process time and facilitate the process procedure. In addition, in terms of process design, the material of each patterned conductive layer can be selected according to different processes and has flexibility, as long as it has conductive properties, the present invention is not limited thereto. For example, the material of the first grid wire of the first patterned conductive layer, the third grid wire of the third patterned conductive layer, the second grid wire of the second patterned conductive layer and the extension part in each embodiment can be a slurry mixed with conductive powder and can further add a material that can be chemically plated, which can be a highly transparent indium tin oxide (ITO) film, fluorine-doped tin oxide (FTO) film, zinc oxide (ZnO) film or aluminum zinc oxide (AZO) film, which can be copper, silver, nickel or nickel gold, or graphene, carbon nanotubes and other materials.

The above description should be understandable and implementable to those with ordinary knowledge in the technical field to which the present invention belongs. Some embodiments of the present invention are disclosed as above, but they are not used to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. In other words, other equivalent embodiments completed without departing from the spirit disclosed by the present invention should be included in the present invention, and the scope of protection of the present invention shall be defined by the scope of the attached patent application.

1a: Luminescent display device

80: Electrical connection materials

90: Light-emitting components

100: Substrate

1001: First surface

1002: Second surface

1003:Through hole

10a: First patterned conductive layer

100a: first patterned conductive metal seed layer

101a: First grid wire

20a: Second patterned conductive layer

200a: Second patterned conductive metal seed layer

201a: Second grid wire

202a: Extension

203a: Thin and long wire

204a: Island Department

501a: First welding pad area

502a: Second pad area

504a: Fourth pad area

Claims (15)

A light-emitting display device comprises: a substrate having a first surface and a second surface opposite to the first surface, the substrate having a plurality of through holes; at least four electrically isolated pad regions, respectively electrically connected to an input voltage pin, a data signal input or output pin, a clock signal input or output pin and a ground pin of a light-emitting component, the light-emitting component having at least one light-emitting diode driving chip; a first patterned conductive layer disposed on the first surface; The invention relates to a first surface having a plurality of grid-shaped first grid wires; and a second patterned conductive layer disposed above the second surface, having the plurality of pad regions; wherein one of the pad regions is electrically connected to the first grid wire via one of the through holes; the wire width of the first grid wire is 25 microns to 100 microns; and the plurality of light-emitting components are disposed in an array on the same side of the first surface and the minimum distance between them is 2 to 3 mm. As in claim 1, the light-emitting display device, wherein the first patterned conductive layer occupies 70% to 90% of the area of the first surface; the second patterned conductive layer has a plurality of second grid-shaped wires, at least one extension portion connected from a grid node of the second grid wire, and at least two parallel linear thin wires, the extension direction of the extension portion is parallel to the configuration plane of the second grid wire, and the extension direction of the thin wires and the extension direction of the extension portion are intersecting; the pad area electrically connected to the ground pin is electrically connected to the second grid wire via the extension portion; and the pad areas electrically connected to the data signal input or output pin and the clock signal input or output pin are each connected to one of the thin wires. As in claim 2, the light-emitting display device, wherein the second patterned conductive layer also has an island portion separated from the second grid wire and the thin and long wires, the island portion is electrically connected to the first grid wire through one of the through holes, and the pad area electrically connected to the input voltage pin is electrically connected to the first grid wire through the island portion. The light-emitting display device of claim 2 further comprises: a third patterned conductive layer, disposed above the second surface and below the second patterned conductive layer, having a third grid conductive line in a plurality of grid shapes, the third grid conductive line occupying 70% to 90% of the area of the second surface of the substrate; and a patterned electrical insulating layer, disposed above the third patterned conductive layer and below the second patterned conductive layer, for electrically isolating the second patterned conductive layer and the third patterned conductive layer; wherein a portion of the third grid conductive line is electrically connected to the first grid conductive line via one of the through holes. The light-emitting display device of claim 4, wherein: the patterned electrically insulating layer has a plurality of first electrically insulating blocks, a plurality of second electrically insulating blocks, and a plurality of third electrically insulating blocks; and each of the first electrically insulating blocks covers a configuration area on the third patterned conductive layer corresponding to the second grid conductive line, so as to isolate the electrical contact between the second grid conductive line and the third grid conductive line; each of the second electrically insulating blocks covers a configuration area on the third patterned conductive layer corresponding to the extension portion and the adjacent portion of the solder pad area electrically connected to the ground pin, so as to isolate the extension portion and the ground pin from the adjacent portion of the solder pad area electrically connected to the ground pin. The ground pin corresponds to the electrical contact between the adjacent portion of the pad area and the third grid wire; each of the third electrically insulating blocks covers a configuration area on the third patterned conductive layer corresponding to each of the thin wires including the pad area connection portion, for isolating the electrical contact between the thin wires and the third grid wires; the portion of the third grid wire electrically connected to the first grid wire through one of the through holes is exposed from the patterned electrically insulating layer and electrically connected to an island portion in the second patterned conductive layer that is separated from the second grid wire and the thin wires. The light-emitting display device of claim 4, wherein: the patterned electrically insulating layer has a plurality of first electrically insulating blocks, a plurality of second electrically insulating blocks, and a plurality of third electrically insulating blocks; and each of the first electrically insulating blocks covers a configuration area on the third patterned conductive layer corresponding to the second grid wire, so as to isolate the second grid wire from the second grid wire. The second electrically insulating regions cover a configuration area on the third patterned conductive layer corresponding to the adjacent portion of the extension and the second grid wire, and isolate the adjacent portion of the extension and the second grid wire from the electrical contact with the third grid wire; each of the second electrically insulating regions covers a configuration area on the third patterned conductive layer corresponding to the adjacent portion of the extension and the second grid wire, and isolates the adjacent portion of the extension and the second grid wire from the electrical contact with the third grid wire; The third electrically insulating blocks cover a configuration area on the third patterned conductive layer corresponding to each of the thin wires except the pad area connection part, so as to isolate the electrical contact between the parts of the thin wires except the pad area connection part and the third grid wire; the part of the third grid wire electrically connected to the first grid wire through one of the through holes is exposed from the patterned electrically insulating layer and the pad areas are exposed from the patterned electrically insulating layer; the pad area connection part of each of the thin wires is configured on the second surface, and the part of the extension connected to the pad area electrically connected to the ground pin is configured on the second surface. A method for manufacturing a light-emitting display device comprises: providing a substrate having a plurality of through holes; forming a first patterned conductive layer on a first surface of the substrate, the first patterned conductive layer having a plurality of first grid-shaped conductive lines; forming a second patterned conductive layer on a second surface of the substrate opposite to the first surface, the second patterned conductive layer having at least four pad regions electrically isolated from each other and respectively electrically connected to an input voltage pin, a data signal input or output pin, a clock signal input or output pin and a ground pin of a light-emitting component, the light-emitting component having at least one driving chip of a light-emitting diode; and electrically connecting one of the pad regions to the first grid conductive line through one of the through holes. The manufacturing method of the light-emitting display device of claim 7, wherein the second patterned conductive layer has a plurality of second grid-shaped wires, at least one extension portion connected from a grid node of the second grid wires, and at least two parallel linear thin wires, the extension direction of the extension portion is parallel to the configuration plane of the second grid wires, and the extension direction of the thin wires and the extension direction of the extension portion are intersecting; and the manufacturing method further comprises: configuring a portion of the extension portion as a welding pad area of the ground pin of the light-emitting component, and configuring a portion of each of the thin wires as a welding pad area of the data signal input pin, the data signal output pin, the clock signal input pin or the clock signal output pin of the light-emitting component. A method for manufacturing a light-emitting display device as claimed in claim 8, wherein the second patterned conductive layer is further formed with an island portion separated from the second grid wire and the thin and long wires, and the island portion is electrically connected to the first grid wire via one of the through holes, and the method further comprises: configuring a portion of the island portion as a pad area of the input voltage pin of the light-emitting component. The manufacturing method of the light-emitting display device of claim 8 further comprises: Forming a third patterned conductive layer above the second surface and below the second patterned conductive layer, the third patterned conductive layer having a third grid conductive line in a plurality of grid shapes, a portion of the third grid conductive line being electrically connected to the first grid conductive line via one of the through holes. The manufacturing method of the light-emitting display device of claim 10 further comprises: forming a third patterned conductive metal seed layer on the second surface by one of sputtering, screen printing and inkjet printing processes; wherein the third patterned conductive layer is formed on the third patterned conductive metal seed layer by one of sputtering, etching, chemical plating and electroplating processes. The manufacturing method of the light-emitting display device of claim 10, wherein the second patterned conductive layer also has an island portion separated from the second grid conductive line and the thin and long conductive lines, and the manufacturing method further comprises: using a process of screen printing and inkjet printing to form a patterned electrically insulating layer including first, second and third electrically insulating blocks above the third patterned conductive layer and below the second patterned conductive layer, and making the conductive layer pass through one of the through holes and the first grid conductive line. The portion of the electrically connected third grid wire is exposed from the patterned electrically insulating layer; the second grid wire is located on the first electrically insulating block, the extension portion is located on the second electrically insulating block, each of the thin and long wires is located on the third electrically insulating block, and the island portion is directly in contact with the portion of the third grid wire exposed from the patterned electrically insulating layer; and a portion of the island portion is configured as a pad area of the input voltage pin of the light-emitting component. The manufacturing method of the light-emitting display device of claim 10 further comprises: forming a patterned electrically insulating layer including first, second and third electrically insulating blocks on the upper side of the third patterned conductive layer and below the second patterned conductive layer by one of screen printing and inkjet printing processes, and exposing the portion of the third grid conductive line electrically connected to the first grid conductive line through one of the through holes from the patterned electrically insulating layer, so that the pad area of the thin and long conductive lines configured as the data signal input pin, the data signal output pin, the clock signal input pin or the clock signal output pin of the light-emitting component is exposed. The portion of the first grid wire is exposed from the patterned electrically insulating layer; the second grid wire is located on the first electrically insulating block, the portion of the extension except the pad area connection portion is located on the second electrically insulating block, and the portion of each of the thin wires except the pad area connection portion is located on the third electrically insulating block, and the pad area connection portion of the extension and the pad area connection portion of each of the thin wires are formed on the second surface; and the portion of the third grid wire electrically connected to the first grid wire through one of the through holes is configured as the pad area of the input voltage pin of the light-emitting component. A method for manufacturing a light-emitting display device as claimed in any one of claims 7 to 13, wherein the second patterned conductive layer is formed by a process of screen printing and inkjet printing. The manufacturing method of the light-emitting display device of any one of claims 7 to 13 further comprises: forming a first patterned conductive metal seed layer on the first surface of the substrate by one of the processes of sputtering, screen printing and inkjet printing; and the first patterned conductive layer is formed on the first patterned conductive metal seed layer by one of the processes of sputtering, etching, chemical plating and electroplating.