TWI853065B - Expansion device - Google Patents
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- TWI853065B TWI853065B TW109127062A TW109127062A TWI853065B TW I853065 B TWI853065 B TW I853065B TW 109127062 A TW109127062 A TW 109127062A TW 109127062 A TW109127062 A TW 109127062A TW I853065 B TWI853065 B TW I853065B
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Abstract
[課題] 即使在連續擴張多個被加工物單元的擴張片之情況下,也能消除擴張後之被加工物單元的擴張片的鬆弛以防止晶片損傷,並且能抑制接著要擴張之被加工物單元的冷卻不良。[解決手段] 一種擴片裝置1,具備:框架保持單元20,保持被加工物單元的環狀框架;冷卻工作台30,包含抵接面31,並抵接於以框架保持單元20所保持之被加工物單元的擴張片;擴張單元40,將擴張片擴張;加熱單元50,具有熱風噴射部52,該熱風噴射部對在被加工物的外周側與環狀框架的內周緣之間的擴張片噴射熱風;以及彎曲板90,配設於被加工物與熱風噴射部52之間,且具有朝向被加工物噴出空氣的噴出口,防止從熱風噴射部52噴射的熱風進入。[Topic] Even when expanding the expansion pieces of multiple workpiece units in succession, the slack of the expansion pieces of the expanded workpiece unit can be eliminated to prevent chip damage, and poor cooling of the workpiece unit to be expanded next can be suppressed. [Solution] A sheet expansion device 1 comprises: a frame holding unit 20, an annular frame holding a workpiece unit; a cooling table 30, including an abutment surface 31, and abutting against the expansion sheet of the workpiece unit held by the frame holding unit 20; an expansion unit 40, expanding the expansion sheet; a heating unit 50, having a hot air spraying portion 52, which sprays hot air to the expansion sheet between the outer peripheral side of the workpiece and the inner peripheral edge of the annular frame; and a bending plate 90, which is arranged between the workpiece and the hot air spraying portion 52 and has a spray outlet for spraying air toward the workpiece to prevent the hot air sprayed from the hot air spraying portion 52 from entering.
Description
本發明是關於一種擴片裝置。The present invention relates to a film expansion device.
已知有一種加工方法,對在正面形成有元件的晶圓照射雷射光線,沿著分割預定線於內部形成改質層,並將晶圓所黏貼的擴張片(切割膠膜)擴張,藉此將改質層作為斷裂基點而分割成個別的晶片。A known processing method is to irradiate a wafer having components formed on the front side with laser light to form a modified layer inside along a predetermined dividing line, and to expand an expansion sheet (dicing tape) attached to the wafer to thereby separate the wafer into individual chips using the modified layer as a fracture base.
所述晶圓是黏貼有用於將分割後的元件固定在基板等的DAF(Die Attach Film,晶粒附接膜),並且藉由將擴張片擴張而謀求將DAF分割至每一個別的晶片。此情況下,已有人提出一種方法,在分割DAF時,為了使為延展性材料的DAF的分割性提升,例如使對應於DAF之區域的擴張片接觸冷卻板而冷卻DAF(例如,參照專利文獻1)。The wafer is attached with a DAF (Die Attach Film) for fixing the separated components to a substrate, etc., and the DAF is separated into individual chips by expanding the expansion sheet. In this case, a method has been proposed in which, when separating the DAF, in order to improve the separation of the DAF, which is a ductile material, for example, the expansion sheet corresponding to the area of the DAF is brought into contact with a cooling plate to cool the DAF (for example, refer to Patent Document 1).
另一方面,亦有人提出一種方法,為了防止已擴張的擴張片因鬆弛而導致相鄰的晶片彼此接觸而損傷,在擴張後,對在被加工物的外周與框架的內周之間的擴張片噴射熱風以加熱而使擴張片收縮(例如,參照專利文獻2)。 [習知技術文獻] [專利文獻]On the other hand, a method has been proposed in which, in order to prevent the expanded expansion sheet from being loosened and causing damage to adjacent chips, hot air is sprayed on the expansion sheet between the outer periphery of the workpiece and the inner periphery of the frame to heat and shrink the expansion sheet after expansion (for example, refer to Patent Document 2). [Known Technical Document] [Patent Document]
[專利文獻1] 日本特開2006-049591號公報 [專利文獻2] 日本特開2011-077482號公報[Patent Document 1] Japanese Patent Publication No. 2006-049591 [Patent Document 2] Japanese Patent Publication No. 2011-077482
[發明所欲解決的課題] 然而,專利文獻2所揭示的方法在收縮擴張片時,若噴射熱風則會導致亦加熱到冷卻板的周圍。因此,專利文獻2所揭示的方法例如在連續擴張多個被加工物單元的擴張片時,於擴張最初的被加工物單元的擴張片並加熱收縮後,擴張下一個被加工物單元的擴張片時,會有無法充分冷卻DAF的疑慮。專利文獻2所揭示的方法,當無法充分冷卻DAF時會有無法將DAF斷裂成每一晶片的疑慮。[Problems to be solved by the invention] However, when the method disclosed in Patent Document 2 shrinks the expansion sheet, if hot air is sprayed, the surrounding of the cooling plate will also be heated. Therefore, when the method disclosed in Patent Document 2, for example, continuously expands the expansion sheet of multiple workpiece units, after the expansion sheet of the first workpiece unit is expanded and heated and shrunk, there is a concern that the DAF cannot be sufficiently cooled when the expansion sheet of the next workpiece unit is expanded. When the method disclosed in Patent Document 2 cannot cool the DAF sufficiently, there is a concern that the DAF cannot be broken into individual chips.
本發明是鑑於此問題點而完成的發明,其目的在於提供一種擴片裝置,即使在連續擴張多個被加工物單元的擴張片之情況下,也能消除擴張後之被加工物單元的擴張片的鬆弛以防止晶片損傷,並且能抑制接著要擴張之被加工物單元的冷卻不良。The present invention is made in view of this problem, and its purpose is to provide an expansion device that can eliminate the looseness of the expansion sheets of the expanded workpiece unit to prevent chip damage even when the expansion sheets of multiple workpiece units are continuously expanded, and can suppress poor cooling of the workpiece unit to be expanded next.
[解決課題的技術手段] 為了解決所述課題並達成目的,本發明的擴片裝置是將由被加工物、黏貼在被加工物的擴張片及擴張片的外周側所黏貼之環狀框架所組成的被加工物單元的該擴張片擴張,其特徵在於具備:框架保持手段,保持被加工物單元的環狀框架;冷卻工作台,包含對應於被加工物之尺寸的抵接面,並抵接於包含以該框架保持手段所保持的該環狀框架之該被加工物單元的該擴張片;擴張手段,將黏貼於以該框架保持手段所保持的該環狀框架的該擴張片擴張;加熱手段,具有熱風噴射部,該熱風噴射部面對在被加工物的外周側與該環狀框架的內周緣之間的該擴張片並噴射熱風;以及熱風進入防止手段,配設於該被加工物與該熱風噴射部之間,且具有朝向該被加工物噴出氣體的噴出口,防止從該熱風噴射部噴射的熱風進入。[Technical means for solving the problem] In order to solve the above-mentioned problem and achieve the purpose, the expansion sheet device of the present invention is to expand the expansion sheet of a workpiece unit composed of a workpiece, an expansion sheet adhered to the workpiece, and an annular frame adhered to the outer peripheral side of the expansion sheet, and is characterized by having: a frame holding means for holding the annular frame of the workpiece unit; a cooling table including an abutment surface corresponding to the size of the workpiece and abutting against the annular frame held by the frame holding means; The expansion piece of the workpiece unit; expansion means, which expands the expansion piece adhered to the annular frame held by the frame holding means; heating means, which has a hot air spraying part, and the hot air spraying part faces the expansion piece between the outer peripheral side of the workpiece and the inner peripheral edge of the annular frame and sprays hot air; and hot air intrusion prevention means, which is arranged between the workpiece and the hot air spraying part and has a nozzle for spraying gas toward the workpiece, so as to prevent the hot air sprayed from the hot air spraying part from entering.
所述擴片裝置也可為,該熱風進入防止手段面對被加工物,且形成為對應於該抵接面的尺寸,並包含具有翹曲以使得從被加工物的外周側往中央側中與被加工物之間的距離變遠的彎曲面,在該彎曲面形成有該噴出口,藉此在該彎曲面與被加工物之間形成空氣聚集。The expansion device may also be such that the hot air entry prevention means faces the workpiece and is formed to have a size corresponding to that of the abutment surface, and includes a curved surface that is curved so that the distance between the workpiece and the workpiece becomes greater from the peripheral side of the workpiece toward the central side, and the nozzle is formed on the curved surface, thereby forming air accumulation between the curved surface and the workpiece.
[發明功效] 本申請的發明可發揮以下效果:即使在連續擴張多個被加工物單元的擴張片之情況下,也能消除擴張後之被加工物單元的擴張片的鬆弛以防止晶片損傷,並且能抑制接著要擴張之被加工物單元的冷卻不良。[Effect of the invention] The invention of this application can exert the following effects: even when the expansion pieces of multiple workpiece units are continuously expanded, the slack of the expansion pieces of the expanded workpiece units can be eliminated to prevent chip damage, and the poor cooling of the workpiece unit to be expanded next can be suppressed.
關於用以實施本發明的方式(實施方式),一邊參照圖式一邊詳細地說明。本發明並非被記載於以下的實施方式之內容所限定者。此外,記載於以下的構成要素包含本領域具有通常知識者能想到者、實質上相同者。進一步,可將記載於以下的構成適當組合。此外,在不脫離本發明的主旨的範圍可進行各種省略、取代或變更。The method for implementing the present invention (implementation method) is described in detail with reference to the drawings. The present invention is not limited to the contents of the implementation method described below. In addition, the constituent elements described below include those that can be thought of by a person with ordinary knowledge in the field and are substantially the same. Furthermore, the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes can be made without departing from the scope of the subject matter of the present invention.
[實施方式1] 根據圖式說明本發明之實施方式1的擴片裝置。圖1為表示實施方式1之擴片裝置的加工對象之被加工物單元的一例的立體圖。圖2為示意性地表示實施方式1之擴片裝置的構成例的剖面圖。圖3為示意性地表示圖2所示之擴片裝置的彎曲板等的剖面圖。[Implementation method 1] The sheet expansion device of implementation method 1 of the present invention is described based on the drawings. FIG. 1 is a perspective view showing an example of a workpiece unit that is a processing object of the sheet expansion device of implementation method 1. FIG. 2 is a cross-sectional view schematically showing an example of the structure of the sheet expansion device of implementation method 1. FIG. 3 is a cross-sectional view schematically showing a bending plate, etc. of the sheet expansion device shown in FIG. 2.
實施方式1的擴片裝置為將圖1所示之加工物單元200的被加工物201分割成個別的晶片202的裝置。在實施方式1中,加工對象的被加工物單元200為如圖1所示,具備:被加工物201;擴張片210,黏貼於被加工物201;及環狀框架211,黏貼有擴張片210的外周側。The expansion sheet device of the embodiment 1 is a device for dividing the workpiece 201 of the workpiece unit 200 shown in Figure 1 into individual chips 202. In the embodiment 1, the workpiece unit 200 of the processing object is as shown in Figure 1, and has: the workpiece 201; the expansion sheet 210, which is attached to the workpiece 201; and the annular frame 211, to which the outer peripheral side of the expansion sheet 210 is attached.
被加工物201是將矽、藍寶石、砷化鎵或碳化矽(SiC)等作為基板203之圓板狀的半導體晶圓或光元件晶圓等的晶圓。被加工物201為如圖1所示,在以正面204之彼此交叉的多條分割預定線205所劃分的各區域分別形成有元件206。被加工物201是在正面204背側的背面207黏貼有擴張片210,且在擴張片210的外周黏貼有環狀框架211,並從背面207側沿著分割預定線205照射對基板203具有穿透性之波長的雷射光線,而在基板203的內部形成沿著分割預定線205之作為分割起點的改質層208。The workpiece 201 is a wafer such as a semiconductor wafer or an optical element wafer in a circular plate shape with a substrate 203 made of silicon, sapphire, gallium arsenide or silicon carbide (SiC). As shown in FIG. 1 , the workpiece 201 has elements 206 formed in each region divided by a plurality of predetermined dividing lines 205 intersecting each other on the front surface 204. The workpiece 201 has an expansion sheet 210 attached to the back surface 207 behind the front surface 204, and a ring frame 211 attached to the periphery of the expansion sheet 210. The laser beam having a wavelength penetrating the substrate 203 is irradiated from the back surface 207 along the predetermined dividing lines 205, and a modified layer 208 is formed inside the substrate 203 along the predetermined dividing lines 205 as a dividing starting point.
被加工物201是將改質層208作為分割起點而沿著分割預定線205分割成個別的晶片202。晶片202具備基板203的一部分及形成於基板203之正面的元件206。The workpiece 201 is divided into individual chips 202 along the predetermined dividing lines 205 with the modified layer 208 as the dividing starting point. The chip 202 includes a part of a substrate 203 and a device 206 formed on the front surface of the substrate 203.
另外,改質層208是指其密度、折射率、機械強度及其它的物理特性成為與周圍不同之狀態的區域,可以舉例有熔融處理區域、裂痕區域、絕緣破壞區域、折射率變化區域及混合所述區域的區域等。In addition, the modified layer 208 refers to a region whose density, refractive index, mechanical strength and other physical properties are different from the surrounding areas, and examples thereof include a melt-treated region, a crack region, an insulation-damaged region, a refractive index-changed region and a region that is a mixture of the above regions.
擴張片210形成為直徑比被加工物201的外徑還大的圓板狀,其由具有伸縮性的樹脂所構成,且具有加熱會收縮的熱收縮性。The expansion piece 210 is formed into a disk shape having a diameter larger than the outer diameter of the workpiece 201, and is made of a stretchable resin and has a thermal shrinkage property that shrinks when heated.
此外,在實施方式1中,被加工物單元200在被加工物201的基板203的背面207與擴張片210之間黏貼有圓板狀的DAF(Die Attach Film)212。DAF212是用於將晶片202固定在其他的晶片或是基板等的晶粒接合用的接著膜。在實施方式1中,DAF212是形成為直徑比被加工物201的外徑還大且比環狀框架211的內徑還小的圓板狀。DAF212被分割至每一個別的晶片。在分割後的晶片202中,DAF是被黏貼於晶片202之基板203的背面207。In addition, in the first embodiment, the workpiece unit 200 has a circular plate-shaped DAF (Die Attach Film) 212 attached between the back side 207 of the substrate 203 of the workpiece 201 and the expansion sheet 210. The DAF 212 is an adhesive film for die bonding used to fix the chip 202 to other chips or substrates. In the first embodiment, the DAF 212 is formed into a circular plate shape having a diameter larger than the outer diameter of the workpiece 201 and smaller than the inner diameter of the ring frame 211. The DAF 212 is divided into each individual chip. In the divided chip 202, the DAF is attached to the back side 207 of the substrate 203 of the chip 202.
實施方式1的擴片裝置1是將被加工物單元200的擴張片210擴張,並在將被加工物201分割成個別的晶片202的同時,將DAF212分割至每一晶片202的裝置。擴片裝置1為如圖2所示,具備:腔室10;框架保持單元20,為框架保持手段;冷卻工作台30;擴張單元40,為擴張手段;加熱單元50,為加熱手段;及控制單元100,為控制手段。The expansion device 1 of the embodiment 1 is a device that expands the expansion sheet 210 of the workpiece unit 200, and simultaneously divides the workpiece 201 into individual chips 202, and divides the DAF 212 into each chip 202. As shown in FIG. 2 , the expansion device 1 includes: a chamber 10; a frame holding unit 20, which is a frame holding means; a cooling table 30; an expansion unit 40, which is an expansion means; a heating unit 50, which is a heating means; and a control unit 100, which is a control means.
腔室10形成為箱狀,並容納有框架保持單元20、冷卻工作台30、擴張單元40以及為加熱手段的加熱單元50。腔室10在側壁11設置有開口12,通過開口12取出放入被加工物單元200。另外,開口12藉由開關門13進行開關。The chamber 10 is formed in a box shape and accommodates the frame holding unit 20, the cooling stage 30, the expansion unit 40 and the heating unit 50 as a heating means. The chamber 10 is provided with an opening 12 in the side wall 11, and the workpiece unit 200 is taken in and out through the opening 12. In addition, the opening 12 is opened and closed by the opening door 13.
框架保持單元20是保持並固定被加工物單元200的環狀框架211者。框架保持單元20具備框架載置板21及框架按壓板22。框架載置板21形成為內徑比環狀框架211的內徑再小一點且比被加工物201及DAF212的外徑還大,並且外徑比環狀框架211的外徑再大一點的圓環狀,上表面23為與水平方向平行且平坦地形成。框架載置板21是在上表面23載置被加工物單元200的環狀框架211。The frame holding unit 20 is a ring-shaped frame 211 that holds and fixes the workpiece unit 200. The frame holding unit 20 has a frame mounting plate 21 and a frame pressing plate 22. The frame mounting plate 21 is formed into a ring shape whose inner diameter is slightly smaller than the inner diameter of the ring-shaped frame 211 and larger than the outer diameter of the workpiece 201 and the DAF 212, and whose outer diameter is slightly larger than the outer diameter of the ring-shaped frame 211, and whose upper surface 23 is parallel to the horizontal direction and is flat. The frame mounting plate 21 is a ring-shaped frame 211 on which the workpiece unit 200 is mounted.
此外,框架載置板21藉由擴張單元40的升降用汽缸42而設置為升降自如。框架載置板21安裝在升降用汽缸42之桿體45的前端,藉由桿體45伸縮而在腔室10內升降。另外,在實施方式1中,框架載置板21藉由升降用汽缸42,其圖2所示之上表面23從與開口12的下緣在水平方向大致並排的位置上升。In addition, the frame mounting plate 21 is provided to be freely raised and lowered by the lifting cylinder 42 of the expansion unit 40. The frame mounting plate 21 is mounted on the front end of the rod 45 of the lifting cylinder 42, and is raised and lowered in the chamber 10 by the extension and contraction of the rod 45. In the first embodiment, the frame mounting plate 21 is raised by the lifting cylinder 42, and its upper surface 23 shown in FIG. 2 rises from a position substantially parallel to the lower edge of the opening 12 in the horizontal direction.
框架按壓板22形成為內徑比框架載置板21的內徑還小且比被加工物201及DAF212的外徑還大,並且外徑比環狀框架211的外徑再大一點的圓環狀,下表面24為與水平方向平行且平坦地形成。框架按壓板22設置在與框架載置板21成為同軸的位置,且在實施方式1中,配置於比框架載置板21還上方。在實施方式1中,框架按壓板22是下表面24配置於與開口12在水平方向大致並排的位置,且與位於下方的框架載置板21隔開間隔而配置。在實施方式1中,框架按壓板22在腔室10內是藉由滑動支撐構件25而被支撐為升降自如。在實施方式1中,框架按壓板22其圖2所示的下表面24藉由滑動支撐構件25而被支撐為可從配置於與開口12在水平方向大致並排位置的位置上升。The frame pressing plate 22 is formed into a circular ring whose inner diameter is smaller than the inner diameter of the frame mounting plate 21 and larger than the outer diameter of the workpiece 201 and the DAF 212, and whose outer diameter is slightly larger than the outer diameter of the annular frame 211, and whose lower surface 24 is parallel to the horizontal direction and flat. The frame pressing plate 22 is arranged at a position coaxial with the frame mounting plate 21, and in the first embodiment, it is arranged above the frame mounting plate 21. In the first embodiment, the frame pressing plate 22 is arranged such that the lower surface 24 is arranged at a position roughly parallel to the opening 12 in the horizontal direction, and is arranged at a distance from the frame mounting plate 21 located below. In the first embodiment, the frame pressing plate 22 is supported by the sliding support member 25 in the chamber 10 so as to be freely raised and lowered. In the first embodiment, the lower surface 24 of the frame pressing plate 22 shown in FIG. 2 is supported by the sliding support member 25 so as to be able to rise from a position arranged substantially parallel to the opening 12 in the horizontal direction.
框架保持單元20是在藉由升降用汽缸42而定位於下方的框架載置板21的上表面23載置通過開口12而被插入腔室10內的被加工物單元200之環狀框架211。框架保持單元20是藉由升降用汽缸42使在上表面23載置有環狀框架211的框架載置板21上升,以將環狀框架211及擴張片210的外周側夾在框架載置板21與框架按壓板22之間,並於保持環狀框架211的同時,框架載置板21及框架按壓板22會從夾住環狀框架211及擴張片210的外周側之位置上升。此外,在實施方式1中,框架保持單元20在遍及框架按壓板22之下表面24的全周安裝有將與擴張片210之間密封的密封構件26。The frame holding unit 20 carries the annular frame 211 of the workpiece unit 200 inserted into the chamber 10 through the opening 12 on the upper surface 23 of the frame mounting plate 21 positioned below by the lifting cylinder 42. The frame holding unit 20 raises the frame mounting plate 21 with the annular frame 211 carried on the upper surface 23 by the lifting cylinder 42 to sandwich the outer peripheral side of the annular frame 211 and the expansion sheet 210 between the frame mounting plate 21 and the frame pressing plate 22, and while holding the annular frame 211, the frame mounting plate 21 and the frame pressing plate 22 rise from the position where they sandwich the outer peripheral side of the annular frame 211 and the expansion sheet 210. In addition, in Embodiment 1, the frame holding unit 20 is provided with a sealing member 26 which seals the expansion piece 210 all around the lower surface 24 of the frame pressing plate 22 .
此外,在實施方式1中,在框架保持單元20的框架按壓板22的下表面24之密封構件26的內周側設置有壓縮空氣吹出口63,該壓縮空氣吹出口63是透過設置於框架按壓板22之內部的供給路60、渦流管64及開關閥61而從壓縮空氣供給源62供給壓縮空氣。壓縮空氣吹出口63是遍及框架按壓板22的全周而設置。In addition, in the first embodiment, a compressed air blow-out port 63 is provided on the inner peripheral side of the sealing member 26 of the lower surface 24 of the frame pressing plate 22 of the frame holding unit 20. The compressed air blow-out port 63 is supplied with compressed air from a compressed air supply source 62 via a supply path 60, a vortex tube 64 and a switch valve 61 provided inside the frame pressing plate 22. The compressed air blow-out port 63 is provided over the entire circumference of the frame pressing plate 22.
冷卻工作台30包含對應於被加工物201之尺寸的抵接面31,且為與包含以框架保持單元20保持的環狀框架211之被加工物單元200的擴張片210抵接者。冷卻工作台30具備:厚的圓板狀之工作台本體32;冷卻單元33,冷卻工作台本體32;及工作台升降單元34。The cooling table 30 includes a contact surface 31 corresponding to the size of the workpiece 201 and is in contact with the expansion piece 210 of the workpiece unit 200 including the annular frame 211 held by the frame holding unit 20. The cooling table 30 includes: a thick circular plate-shaped table body 32; a cooling unit 33, the cooling table body 32; and a table lifting unit 34.
工作台本體32在實施方式1中是由鋁合金所構成,外徑形成為比框架按壓板22之内徑還小,且被配置在框架按壓板22之內周的與框架按壓板22成為同軸的位置。工作台本體32的下表面是外徑與被加工物201之尺寸的外徑相對應的抵接面31。在實施方式1中,工作台本體32的外徑與DAF212的外徑相等,藉此為下表面的抵接面31之外徑會與為被加工物201之尺寸的外徑相對應。工作台本體32的抵接面31是隔著由框架保持單元20保持住環狀框架211的被加工物單元200之擴張片210及DAF212而與被加工物201的背面207對向。In the first embodiment, the table body 32 is made of aluminum alloy, has an outer diameter smaller than the inner diameter of the frame pressing plate 22, and is arranged at a position coaxial with the frame pressing plate 22 on the inner periphery of the frame pressing plate 22. The lower surface of the table body 32 is a contact surface 31 having an outer diameter corresponding to the outer diameter of the size of the workpiece 201. In the first embodiment, the outer diameter of the table body 32 is equal to the outer diameter of the DAF 212, so that the outer diameter of the contact surface 31 on the lower surface corresponds to the outer diameter of the size of the workpiece 201. The abutting surface 31 of the table body 32 faces the back surface 207 of the workpiece 201 via the expansion piece 210 and the DAF 212 of the workpiece unit 200 held by the annular frame 211 by the frame holding unit 20 .
此外,在工作台本台32的抵接面31有開孔多個吸引孔35,該吸引孔35透過設置在工作台本體32內的吸引路70及開關閥71而與噴射器等的吸引源72連接。工作台本體32是藉由吸引孔35透過吸引路70及開關閥71被吸引源72吸引,而可將被加工物201的背面207側隔著擴張片210及DAF212吸引保持在抵接面31。In addition, a plurality of suction holes 35 are opened on the contact surface 31 of the worktable main body 32, and the suction holes 35 are connected to a suction source 72 such as an ejector through a suction path 70 and a switch valve 71 provided in the worktable main body 32. The worktable main body 32 is sucked by the suction source 72 through the suction holes 35 through the suction path 70 and the switch valve 71, and the back side 207 of the workpiece 201 can be sucked and held on the contact surface 31 through the expansion sheet 210 and the DAF 212.
在實施方式1中,冷卻單元33被設置在工作台本體32之上表面的中央部,是冷卻工作台本體32及抵接面31者。在實施方式1中,冷卻單元33雖然是可冷卻工作台本體32的活塞冷卻器,但在本發明中則不限定為活塞冷卻器。In the first embodiment, the cooling unit 33 is provided at the center of the upper surface of the table body 32, and cools the table body 32 and the contact surface 31. In the first embodiment, the cooling unit 33 is a piston cooler that can cool the table body 32, but in the present invention, it is not limited to a piston cooler.
工作台升降單元34是以未圖示的馬達、藉由馬達而旋轉的滾珠螺桿等所構成,並使工作台本體32及冷卻單元33在腔室10內升降。The table lifting unit 34 is composed of a motor (not shown), a ball screw rotated by the motor, etc., and moves the table body 32 and the cooling unit 33 up and down in the chamber 10.
此外,在實施方式1中,冷卻工作台30的工作台本體32及冷卻單元33是被工作台蓋36所覆蓋。工作台蓋36是將工作台本體32保冷的構件,在實施方式中,其與工作台本體32及冷卻單元33同軸地配置並一體地具備:圓筒狀的大徑圓筒部37,與工作台本體32的外周面隔開間隔而覆蓋於外周面;環狀的圓環部38,外緣連接於大徑圓筒部37且與工作台本體32的上表面隔開間隔而覆蓋於上表面;及圓筒狀的小徑圓筒部39,連接於圓環部38的內緣且與冷卻單元33的外周面隔開間隔而覆蓋於外周面。工作台蓋36藉由升降單元34而與工作台本體32及冷卻單元33一體地升降。In addition, in the first embodiment, the workbench body 32 and the cooling unit 33 of the cooling workbench 30 are covered by the workbench cover 36. The workbench cover 36 is a member for keeping the workbench body 32 cool. In the embodiment, it is coaxially arranged with the workbench body 32 and the cooling unit 33 and integrally comprises: a cylindrical large-diameter cylindrical portion 37 that is spaced apart from the outer peripheral surface of the workbench body 32 and covers the outer peripheral surface; an annular ring portion 38 whose outer edge is connected to the large-diameter cylindrical portion 37 and is spaced apart from the upper surface of the workbench body 32 and covers the upper surface; and a cylindrical small-diameter cylindrical portion 39 that is connected to the inner edge of the annular portion 38 and is spaced apart from the outer peripheral surface of the cooling unit 33 and covers the outer peripheral surface. The workbench cover 36 is raised and lowered integrally with the workbench body 32 and the cooling unit 33 by the lifting unit 34.
另外,實施方式1是在冷卻工作台30與工作台蓋36之間,透過供給路80、開關閥81而從壓縮空氣供給源82供給壓縮空氣。In addition, in the first embodiment, compressed air is supplied from a compressed air supply source 82 between the cooling table 30 and the table cover 36 via a supply path 80 and a switch valve 81.
擴張單元40是將黏貼在以框架保持單元20保持之環狀框架211的擴張片210擴張者。擴張單元40具備:擴張鼓輪41,固定於腔室10;及升降用汽缸42,使框架載置板21升降。The expansion unit 40 expands the expansion sheet 210 attached to the ring frame 211 held by the frame holding unit 20. The expansion unit 40 includes an expansion drum 41 fixed to the chamber 10 and a lifting cylinder 42 for lifting the frame mounting plate 21.
擴張鼓輪41具備圓筒狀的鼓輪部43。鼓輪部43形成為內徑比工作台蓋36之大徑圓筒部37的外徑還大,外徑比框架按壓板22的內徑還小。鼓輪部43被配置在工作台本體32之大徑圓筒部37的外周側且在框架按壓板22的內周側,並且與框架保持單元20及冷卻工作台30同軸地配置。在擴張鼓輪41的下端安裝有圓柱狀的滾動構件44,該滾動構件44被設置在與位於下方之框架按壓板22的下表面24同一平面上且設置為繞著軸心旋轉自如。The expansion drum 41 has a cylindrical drum portion 43. The drum portion 43 is formed so that its inner diameter is larger than the outer diameter of the large diameter cylindrical portion 37 of the table cover 36 and its outer diameter is smaller than the inner diameter of the frame pressing plate 22. The drum portion 43 is arranged on the outer peripheral side of the large diameter cylindrical portion 37 of the table body 32 and on the inner peripheral side of the frame pressing plate 22, and is arranged coaxially with the frame holding unit 20 and the cooling table 30. A cylindrical rolling member 44 is mounted at the lower end of the expansion drum 41, and the rolling member 44 is arranged on the same plane as the lower surface 24 of the frame pressing plate 22 located below and is arranged to be rotatable around the axis.
加熱單元50是將在被加工物單元200之被加工物201的外周側與環狀框架211的內周緣之間的擴張片210加熱並收縮者,該被加工物單元200被以框架保持單元20保持且擴張片210已被擴張。加熱單元50具備:加熱板51、多個熱風噴射部52及擋板53。The heating unit 50 heats and contracts the expansion sheet 210 between the outer periphery of the workpiece 201 of the workpiece unit 200 and the inner periphery of the annular frame 211. The workpiece unit 200 is held by the frame holding unit 20 and the expansion sheet 210 is expanded. The heating unit 50 includes a heating plate 51, a plurality of hot air spraying parts 52, and a baffle plate 53.
加熱板51形成為外徑與框架按壓板22的內徑相等的圓板狀,其配置在框架載置板21的內周側且與框架保持單元20及冷卻單元33同軸地配置。加熱板51是上表面與水平方向平行且配置在比位於下方之框架載置板21的下表面還下方的位置。加熱板51藉由安裝於腔室10的加熱板旋轉用馬達54而繞著軸心旋轉。The heating plate 51 is formed into a disk shape with an outer diameter equal to the inner diameter of the frame pressing plate 22, and is arranged on the inner peripheral side of the frame mounting plate 21 and coaxially with the frame holding unit 20 and the cooling unit 33. The upper surface of the heating plate 51 is parallel to the horizontal direction and is arranged below the lower surface of the frame mounting plate 21 located below. The heating plate 51 is rotated around the axis by the heating plate rotating motor 54 installed in the chamber 10.
多個熱風噴射部52為面對在以框架保持單元20保持且擴張片210已被擴張的被加工物單元200之被加工物201的外周側與環狀框架211的內周緣之間的擴張片210,並噴射熱風300(圖7所示)者。多個熱風噴射部52在加熱板51的上表面之外緣部於圓周方向等間隔地設置,且面對在以框架保持單元20保持且擴張片210已被擴張的被加工物單元200之被加工物201的外周側與環狀框架211的內周緣之間的擴張片210。The plurality of hot air spraying parts 52 face the expansion piece 210 between the outer peripheral side of the workpiece 201 of the workpiece unit 200 held by the frame holding unit 20 and expanded by the expansion piece 210 and the inner peripheral edge of the ring frame 211, and spray hot air 300 (as shown in FIG. 7). The plurality of hot air spraying parts 52 are arranged at equal intervals in the circumferential direction on the outer edge of the upper surface of the heating plate 51, and face the expansion piece 210 between the outer peripheral side of the workpiece 201 of the workpiece unit 200 held by the frame holding unit 20 and expanded by the expansion piece 210 and the inner peripheral edge of the ring frame 211.
熱風噴射部52具備:在上部設有開口的有底筒狀的噴射部本體521;線圈加熱器522,為容納在噴射部本體521內的加熱部;及空氣供給源525,透過供給路523及開關閥524而在噴射部本體521內供給空氣。線圈加熱器522是關閉開關藉此被供給來自直流電源的電力以發熱。熱風噴射部52是打開開關閥524且空氣供給源525往噴射部本體521供給空氣,所供給的空氣藉由線圈加熱器522加熱並從開口部噴射熱風300。The hot air spraying part 52 includes: a bottomed cylindrical spraying part body 521 with an opening at the top; a coil heater 522, which is a heating part accommodated in the spraying part body 521; and an air supply source 525, which supplies air in the spraying part body 521 through a supply path 523 and a switch valve 524. The coil heater 522 is switched off and thus supplied with power from a DC power source to generate heat. The hot air spraying part 52 is switched on and off and the air supply source 525 supplies air to the spraying part body 521, and the supplied air is heated by the coil heater 522 and the hot air 300 is sprayed from the opening.
擋板53形成為外徑比框架載置板21的內徑還小一點的圓盤狀,其在熱風噴射部52的上方且與框架保持單元20及冷卻單元30同軸地配置在框架載置板21之內周側。擋板53是藉由安裝在加熱板51的擋板旋轉用馬達55而繞著軸心旋轉。此外,擋板53在外緣部設置有可使熱風噴射部52露出的開口部56。The baffle plate 53 is formed in a disk shape with an outer diameter slightly smaller than the inner diameter of the frame mounting plate 21, and is disposed on the inner circumference of the frame mounting plate 21 above the hot air spraying portion 52 and coaxially with the frame holding unit 20 and the cooling unit 30. The baffle plate 53 is rotated around the axis by a baffle rotating motor 55 mounted on the heating plate 51. In addition, the baffle plate 53 is provided with an opening 56 at the outer edge to expose the hot air spraying portion 52.
如此,實施方式1的擴片裝置1是在以框架保持單元20保持之被加工物單元200的上方配置冷卻工作台30,且在被加工物單元200的下方配置加熱單元50。As described above, in the sheet expanding device 1 of the first embodiment, the cooling table 30 is disposed above the workpiece unit 200 held by the frame holding unit 20 , and the heating unit 50 is disposed below the workpiece unit 200 .
控制單元100分別控制擴片裝置1的構成要素,為使針對被加工物200的加工動作在擴片裝置1上實施者。另外,控制單元100是具有以下裝置的電腦,所述裝置為:運算處理裝置,具有如CPU(central processing unit,中央處理單元)般的微處理器;記憶裝置,具有如ROM(read only memory,唯讀記憶體)或RAM(random access memory,隨機存取記憶體)般的記憶體;及輸入輸出介面裝置。控制單元100的運算處理裝置依據記憶於記憶裝置的電腦程式實施運算處理,並透過輸入輸出介面裝置將用於控制擴片裝置1的控制訊號輸出至擴片裝置1的構成要素。The control unit 100 controls the components of the expansion device 1 respectively so that the processing action on the workpiece 200 is implemented on the expansion device 1. In addition, the control unit 100 is a computer having the following devices: an operation processing device having a microprocessor such as a CPU (central processing unit); a memory device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input-output interface device. The operation processing device of the control unit 100 performs operation processing according to a computer program stored in the memory device, and outputs a control signal for controlling the expansion device 1 to the components of the expansion device 1 through the input-output interface device.
控制單元100與未圖示的顯示單元及未圖示的輸入單元連接,該顯示單元是由顯示加工動作之狀態或影像等的液晶顯示裝置等所構成,該輸入單元是在操作員將加工內容資訊等登錄時使用。輸入單元是由設置於顯示單元的觸控面板及鍵盤等的外部輸入裝置的至少一者所構成。The control unit 100 is connected to a display unit (not shown) and an input unit (not shown). The display unit is composed of a liquid crystal display device that displays the state or image of the processing operation, etc. The input unit is used when the operator logs the processing content information, etc. The input unit is composed of at least one of an external input device such as a touch panel and a keyboard provided on the display unit.
此外,擴片裝置1具備為熱風侵入防止手段的彎曲板90。彎曲板90配設在被保持於框架保持單元20之被加工物單元200的被加工物201與多個熱風噴射部52之間,並具有朝向被加工物201且噴出氣體之空氣的圖3所示的噴出口91,為抑制從熱風噴射部52噴射之熱風的侵入的構件。彎曲板90形成為外徑與冷卻工作台30之工作台本體32的抵接面31大致相等的圓板狀,與框架保持單元20及冷卻工作台33同軸地配置,並且安裝在擋板53的上表面。In addition, the sheet expansion device 1 has a bent plate 90 as a means for preventing hot air from intruding. The bent plate 90 is disposed between the workpiece 201 of the workpiece unit 200 held in the frame holding unit 20 and the plurality of hot air ejection parts 52, and has an ejection port 91 shown in FIG. 3 that ejects gaseous air toward the workpiece 201, and is a member for suppressing the intrusion of hot air ejected from the hot air ejection part 52. The bent plate 90 is formed in a circular plate shape having an outer diameter substantially equal to the abutment surface 31 of the worktable body 32 of the cooling worktable 30, is coaxially disposed with the frame holding unit 20 and the cooling worktable 33, and is mounted on the upper surface of the baffle plate 53.
彎曲板90藉由被安裝在擋板53的上表面,而面對被保持於框架保持單元20之被加工物單元200的被加工物201。彎曲板90是外徑與冷卻工作台30之工作台本體32的抵接面31大致相等,藉此形成為對應於抵接面31的尺寸。此外,彎曲板90是外徑與冷卻工作台30之工作台本體32的抵接面31的外徑大致相等,藉此配置為比加熱板51上之熱風噴射部52在擋板53的內周側。The bending plate 90 is mounted on the upper surface of the baffle plate 53 so as to face the workpiece 201 of the workpiece unit 200 held by the frame holding unit 20. The bending plate 90 has an outer diameter substantially equal to that of the abutting surface 31 of the worktable body 32 of the cooling worktable 30, thereby being formed to have a size corresponding to the abutting surface 31. In addition, the bending plate 90 has an outer diameter substantially equal to that of the abutting surface 31 of the worktable body 32 of the cooling worktable 30, thereby being arranged on the inner peripheral side of the baffle plate 53 than the hot air spraying portion 52 on the heating plate 51.
在實施方式1中,彎曲板90的厚度不變,並且形成為具有翹曲以使得從被框架保持單元20保持的被加工物單元200之被加工物201的外周側往中央側中與被加工物201的距離變遠。因此,彎曲板90的上表面為具有翹曲以使得從被框架保持單元20保持的被加工物單元200之被加工物201的外周側往中央側中與被加工物201的距離變遠的彎曲面92。如此,彎曲板90包含彎曲面92。In the first embodiment, the thickness of the curved plate 90 is constant, and the curved plate 90 is formed to have a curve so that the distance from the workpiece 201 to the center of the workpiece unit 200 held by the frame holding unit 20 increases from the outer peripheral side to the center of the workpiece 201 held by the frame holding unit 20. Therefore, the upper surface of the curved plate 90 is a curved surface 92 having a curve so that the distance from the workpiece 201 to the center of the workpiece unit 200 held by the frame holding unit 20 increases. In this way, the curved plate 90 includes the curved surface 92.
在實施方式1中,噴出口91如圖3所示,設置於彎曲板90的中央,透過供給源93及開關閥94而從空氣供給源95供給空氣。從空氣供給源95供給且從噴出口91噴出的空氣因為彎曲板90的彎曲面92以所述方式彎曲,所以會在彎曲面92與被加工物201之間聚集,而抑制從熱風噴射部52噴射的熱風300侵入彎曲面92與被加工物201之間。In the first embodiment, the nozzle 91 is provided at the center of the curved plate 90 as shown in FIG3, and air is supplied from the air supply source 95 through the supply source 93 and the switch valve 94. The air supplied from the air supply source 95 and ejected from the nozzle 91 gathers between the curved surface 92 and the workpiece 201 because the curved surface 92 of the curved plate 90 is bent in the above manner, thereby suppressing the hot air 300 ejected from the hot air ejection portion 52 from intruding between the curved surface 92 and the workpiece 201.
接著,本說明書要說明所述擴片裝置1的加工動作。圖4為示意性地表示在圖2所示之擴片裝置的框架載置板載置有被加工物單元之環狀框架的狀態的剖面圖。圖5為示意性地表示圖4所示之擴片裝置的框架保持單元將環狀框架固定後之狀態的剖面圖。圖6為示意性地表示使圖5所示之框架載置板上升並將擴張片擴張後之狀態的剖面圖。圖7為示意性地表示將圖6所示之擴張片加熱、收縮之狀態的剖面圖。Next, this specification will explain the processing action of the expansion device 1. FIG4 is a cross-sectional view schematically showing a state in which an annular frame of a workpiece unit is mounted on the frame mounting plate of the expansion device shown in FIG2. FIG5 is a cross-sectional view schematically showing a state in which the frame holding unit of the expansion device shown in FIG4 fixes the annular frame. FIG6 is a cross-sectional view schematically showing a state in which the frame mounting plate shown in FIG5 is raised and the expansion sheet is expanded. FIG7 is a cross-sectional view schematically showing a state in which the expansion sheet shown in FIG6 is heated and contracted.
所述構成的擴片裝置1是當控制單元100登錄有加工內容資訊,並接收加工開始指示後開始加工動作。在加工動作中,擴片裝置1是讓框架載置板21下降,並將冷卻工作台30之工作台本體32的抵接面31定位在比框架按壓板22之下表面24更上方的位置。擴片裝置1關閉開關閥61、71、81、94、524,且以冷卻單元33冷卻工作台本體32,並關閉開關而將來自直流電源的電力供給至線圈加熱器522,在已將線圈發熱器522發熱的狀態下,藉由開關門13打開開口12。擴片裝置1是通過開口12而讓被加工物被插入腔室10內,如圖4所示,在框架載置板21的上表面23載置有被插入腔室10內的被加工物單元200的環狀框架211。The sheet expansion device 1 of the above structure starts processing after the control unit 100 registers the processing content information and receives the processing start instruction. During the processing, the sheet expansion device 1 allows the frame mounting plate 21 to descend and positions the abutment surface 31 of the workbench body 32 of the cooling workbench 30 at a position higher than the lower surface 24 of the frame pressing plate 22. The sheet expansion device 1 closes the switch valves 61, 71, 81, 94, 524, and cools the workbench body 32 with the cooling unit 33, and closes the switch to supply power from the DC power supply to the coil heater 522. When the coil heater 522 is heated, the opening 12 is opened by the switch door 13. The sheet expansion device 1 allows the workpiece to be inserted into the chamber 10 through the opening 12 . As shown in FIG. 4 , a ring-shaped frame 211 of the workpiece unit 200 inserted into the chamber 10 is placed on the upper surface 23 of the frame mounting plate 21 .
擴片裝置1藉由開關門13關閉開口12,且打開開關閥61、81而從壓縮空氣吹出口63吹出壓縮空氣,並且在工作台本體32及冷卻單元33與工作台蓋36之間供給來自壓縮空氣供給源82的壓縮空氣。擴片裝置1將升降用汽缸42的桿體45伸長,讓框架載置板21上升的同時,藉由工作台升降單元34讓冷卻工作台30的工作台本體32等下降。The sheet expansion device 1 closes the opening 12 by the switch door 13, opens the switch valves 61 and 81, blows out compressed air from the compressed air blowing port 63, and supplies compressed air from the compressed air supply source 82 between the workbench body 32, the cooling unit 33, and the workbench cover 36. The sheet expansion device 1 extends the rod 45 of the lifting cylinder 42 to raise the frame mounting plate 21, and at the same time, lowers the workbench body 32 of the cooling workbench 30 by the workbench lifting unit 34.
擴片裝置1為如圖5所示,在位於下方的框架按壓板22與框架載置板21之間夾住並保持環狀框架211及擴張片210之外周側,並且將抵接面31定位於與密封構件26的下表面同一平面上,以靠近黏貼在擴張片210的DAF212。The expansion sheet device 1 is as shown in FIG. 5 , which clamps and holds the outer peripheral side of the annular frame 211 and the expansion sheet 210 between the frame pressing plate 22 and the frame mounting plate 21 located below, and positions the abutting surface 31 on the same plane as the lower surface of the sealing member 26 so as to be close to the DAF 212 adhered to the expansion sheet 210.
擴片裝置1在讓框架載置板21進一步上升並且在擴張片210接觸抵接面31的時間點,藉由工作台升降單元34讓冷卻工作台30的工作台本體32等上升。另外,當擴張片210接觸抵接面31,則DAF212透過擴張片210及工作台本體32而被冷卻單元33冷卻。The expansion sheet device 1 further raises the frame mounting plate 21 and at the time when the expansion sheet 210 contacts the abutting surface 31, the workbench body 32 of the cooling workbench 30 is raised by the workbench lifting unit 34. In addition, when the expansion sheet 210 contacts the abutting surface 31, the DAF 212 is cooled by the cooling unit 33 through the expansion sheet 210 and the workbench body 32.
擴片裝置1中,框架按壓板22是被從環狀框架211及框架載置板21等按壓上升,框架按壓板22的下表面24上升至比滾動構件44的下端更上方,且藉由工作台升降單元34將冷卻工作台30的工作台本體32的抵接面31定位於與滾動構件44的下端同一平面上。如此,如圖6所示,框架保持單元20所保持之被加工物單元200的擴張片210抵接於滾動構件44,而將擴張片210往面方向擴張。擴張的結果,擴張片210中伸力放射狀地作用。In the expansion sheet device 1, the frame pressing plate 22 is pressed and raised by the annular frame 211 and the frame mounting plate 21, and the lower surface 24 of the frame pressing plate 22 is raised to a position higher than the lower end of the rolling member 44, and the abutting surface 31 of the worktable body 32 of the cooling worktable 30 is positioned on the same plane as the lower end of the rolling member 44 by the worktable lifting unit 34. In this way, as shown in FIG6 , the expansion sheet 210 of the workpiece unit 200 held by the frame holding unit 20 abuts against the rolling member 44, and the expansion sheet 210 is expanded in the surface direction. As a result of the expansion, the extension force acts radially on the expansion sheet 210.
如此,當在黏貼於被加工物201之背面207的擴張片拉伸力放射狀地作用時,則因為被加工物201沿著分割預定線205形成有改質層208,所以會以改質層208作為基準點,沿著分割預定線205分割成個別的晶片202。此外,黏貼在被加工物201之背面207的DAF212,在被加工物201被分割成個別的晶片202時,從擴張片210作用之擴張方向的力集中至晶片202之間,而被分割至每一個別的晶片202。擴片裝置1是當升降用汽缸42的桿體45完成伸長,則開啟開關閥71,在冷卻工作台30之工作台本體32的抵接面31隔著擴張片210吸引保持被加工物201即分割成個別的晶片202。Thus, when the tensile force of the expansion sheet attached to the back surface 207 of the workpiece 201 acts radially, the workpiece 201 is divided into individual chips 202 along the predetermined dividing line 205 with the modified layer 208 as a reference point because the modified layer 208 is formed along the predetermined dividing line 205. In addition, when the workpiece 201 is divided into individual chips 202, the force in the expansion direction acting from the expansion sheet 210 is concentrated between the chips 202, and the workpiece 201 is divided into each individual chip 202. When the rod 45 of the lifting cylinder 42 is completely extended, the expansion device 1 opens the switch valve 71, and the workpiece 201 is sucked and held through the expansion sheet 210 at the contact surface 31 of the worktable body 32 of the cooling worktable 30, that is, it is divided into individual chips 202.
擴片裝置1是縮短升降用汽缸42的桿體45,讓框架載置板21與框架按壓板22一起下降的同時,藉由工作台升降單元34讓冷卻工作台30的工作台本體32等與框架載置板21一起下降。擴片裝置1是如圖7所示,關閉開關閥61而停止從壓縮空氣吹出口63吹出的壓縮空氣,並打開開關閥94,在彎曲板90的彎曲面92與被冷卻工作台30之工作台本體32的抵接面31所吸引保持的被加工物201之間供給空氣。進一步,擴片裝置1是打開開關閥524,一邊從熱風噴射部52噴射熱風300一邊以加熱板旋轉用馬達54旋轉加熱板51。The sheet expansion device 1 shortens the rod 45 of the lifting cylinder 42 to lower the frame mounting plate 21 and the frame pressing plate 22 together, and at the same time, the worktable body 32 of the cooling worktable 30 and the like are lowered together with the frame mounting plate 21 by the worktable lifting unit 34. As shown in FIG. 7 , the sheet expansion device 1 closes the switch valve 61 to stop the compressed air blown out from the compressed air blowing port 63, and opens the switch valve 94 to supply air between the curved surface 92 of the curved plate 90 and the workpiece 201 attracted and held by the contact surface 31 of the worktable body 32 of the cooling worktable 30. Furthermore, the sheet expansion device 1 opens the switch valve 524, and while the hot air 300 is ejected from the hot air ejection portion 52, the heating plate 51 is rotated by the heating plate rotating motor 54.
然後,擴片裝置1是在下降框架載置板21等的同時,擴張片210從滾動構件44遠離,因此在從被加工物201的外周側到環狀框架211的內周緣之間的擴張片210被暫時擴張而產生的鬆弛部,遍及全周地吹附熱風300,而加熱收縮鬆弛部。Then, the expansion sheet device 1 moves the expansion sheet 210 away from the rolling member 44 while lowering the frame mounting plate 21, etc., so that the expansion sheet 210 is temporarily expanded and the slack portion generated between the outer peripheral side of the workpiece 201 and the inner peripheral edge of the annular frame 211 is blown with hot air 300 all around to heat and shrink the slack portion.
另外,擴片裝置1是在加熱收縮從被加工物201的外周側到環狀框架211的內周緣之間的擴張片210時,在彎曲板90與被加工物201之間從空氣供給源95供給空氣。因此,藉由彎曲板90包含所述的彎曲面92,且在彎曲面92形成有噴出口91,而在彎曲面92與被加工物201之間形成聚集從空氣供給源95所供給之空氣的空氣聚集301。擴片裝置1是藉由形成空氣聚集301抑制熱風300往空氣聚集301的侵入,即抑制由熱風300加熱被加工物201及冷卻工作台30之工作台本體32的抵接面31。如此,彎曲板90會抑制從熱風噴射部52所噴射之熱風300侵入彎曲板90與被加工物201之間。In addition, the sheet expansion device 1 supplies air from the air supply source 95 between the curved plate 90 and the workpiece 201 when the expansion sheet 210 between the outer peripheral side of the workpiece 201 and the inner peripheral edge of the annular frame 211 is heated and contracted. Therefore, the curved plate 90 includes the curved surface 92, and the nozzle 91 is formed on the curved surface 92, so that the air collection 301 where the air supplied from the air supply source 95 is collected is formed between the curved surface 92 and the workpiece 201. The sheet expansion device 1 suppresses the invasion of the hot air 300 into the air collection 301 by forming the air collection 301, that is, suppresses the hot air 300 from heating the workpiece 201 and cooling the contact surface 31 of the worktable body 32 of the worktable 30. In this way, the bending plate 90 prevents the hot air 300 ejected from the hot air ejecting portion 52 from intruding between the bending plate 90 and the workpiece 201 .
擴片裝置1是當升降用汽缸42的桿體45完成縮短後,關閉開關閥71、81、94、524,且以開關門13打開開口12,將被加工物201被分割成個別的晶片202且DAF212被分割至每一個別的晶片202的被加工物單元200搬出至腔室10外。被加工物201被分割成個別的晶片202且DAF212被分割至每一個別的晶片202的被加工物單元200,是在將擴張片210擴張後,在被吸引保持於冷卻工作台30之工作台本體32的抵接面31的狀態下加熱收縮擴張片210,因此可抑制被分割後之晶片202彼此摩擦。此外,擴片裝置1重複圖4到圖7所示的步驟,依序連續進行多個被加工物單元200,將被加工物201分割成個別的晶片202,並將DAF分割至每一個別的晶片202。The expansion device 1 closes the switch valves 71, 81, 94, 524 after the rod 45 of the lifting cylinder 42 is shortened, and the opening 12 is opened by the switch door 13, so that the workpiece 201 is divided into individual chips 202 and the DAF 212 is divided into each individual chip 202. The workpiece unit 200 in which the workpiece 201 is divided into individual chips 202 and the DAF 212 is divided into each individual chip 202 is carried out of the chamber 10. After the expansion sheet 210 is expanded, the expansion sheet 210 is heated and contracted in a state of being attracted and held on the abutting surface 31 of the worktable body 32 of the cooling worktable 30, so that the divided chips 202 can be prevented from rubbing against each other. In addition, the wafer expansion device 1 repeats the steps shown in FIG. 4 to FIG. 7 to sequentially and continuously process a plurality of workpiece units 200 to separate the workpiece 201 into individual chips 202 and to separate the DAF into each individual chip 202 .
如以上說明,實施方式1的擴片裝置1具備為熱風進入防止手段的彎曲板90,其抑制從熱風噴射部52噴射之熱風300侵入彎曲板90與被加工物201之間。因此,擴片裝置1可抑制熱風300進入以冷卻工作台30冷卻被加工物201之區域,亦即工作台本體32與彎曲板90之間,而抑制此區域間的空氣溫度上升;並能夠冷卻黏貼在下一個被加工物201的背面207之DAF212,而抑制在將擴張片210擴張時的被加工物201及DAF212的冷卻不良。其結果,擴片裝置1可發揮以下效果:即使在連續擴張多個被加工物單元200之擴張片210的情況下,也能消除擴張後的被加工物單元200之擴張片210的鬆弛以防止晶片202的損傷,並且能抑制接著要擴張之被加工物單元200的冷卻不良,並抑制產生分割不良的情形。As described above, the sheet expansion device 1 of the first embodiment includes the bending plate 90 as a hot air intrusion prevention means, which prevents the hot air 300 ejected from the hot air ejection portion 52 from intruding between the bending plate 90 and the workpiece 201. Therefore, the sheet expansion device 1 can prevent the hot air 300 from entering the area where the worktable 30 cools the workpiece 201, that is, between the worktable body 32 and the bending plate 90, thereby preventing the air temperature in this area from rising; and can cool the DAF 212 attached to the back side 207 of the next workpiece 201, thereby preventing poor cooling of the workpiece 201 and the DAF 212 when the expansion sheet 210 is expanded. As a result, the expansion device 1 can achieve the following effects: even when the expansion sheets 210 of a plurality of workpiece units 200 are continuously expanded, the slack of the expansion sheets 210 of the expanded workpiece units 200 can be eliminated to prevent damage to the chip 202, and poor cooling of the workpiece unit 200 to be expanded next can be suppressed, thereby suppressing the occurrence of poor segmentation.
此外,實施方式1的擴片裝置1是彎曲板90包含彎曲面92,且在彎曲面92形成噴出空氣的噴出口91,並在彎曲面92與被加工物201之間形成空氣聚集301,因此可抑制熱風300侵入彎曲面92與被加工物201之間。In addition, in the expansion device 1 of embodiment 1, the curved plate 90 includes a curved surface 92, and an air ejection outlet 91 is formed on the curved surface 92, and an air gathering 301 is formed between the curved surface 92 and the workpiece 201, thereby preventing hot air 300 from intruding between the curved surface 92 and the workpiece 201.
此外,實施方式1的擴片裝置1是在加熱收縮擴張片210時,打開開關閥81,而在冷卻工作台30的工作台本體32及冷卻單元33與工作台蓋36之間供給從壓縮空氣供給源82所供給的壓縮空氣,因此,從壓縮空氣供給源82所供給的壓縮空氣成為在所述空氣聚集301的外周流動,而可抑制熱風300侵入空氣聚集301。In addition, the expansion sheet device 1 of embodiment 1 opens the switch valve 81 when the expansion sheet 210 is heated and contracted, and the compressed air supplied from the compressed air supply source 82 is supplied between the workbench body 32 of the cooling workbench 30 and the cooling unit 33 and the workbench cover 36. Therefore, the compressed air supplied from the compressed air supply source 82 flows around the air gathering 301, thereby suppressing the hot air 300 from invading the air gathering 301.
[變形例] 根據圖式說明本發明的實施方式1之變形例的擴片裝置。圖8為示意性地表示實施方式1的變形例之擴片裝置的構成例的剖面圖。另外,在圖8中對與實施方式1相同部分標註同一符號並省略說明。[Variation] The following describes a variation of the first embodiment of the present invention according to the drawings. FIG8 is a cross-sectional view schematically showing a configuration example of the variation of the first embodiment. In FIG8 , the same reference numerals are used for the same parts as those of the first embodiment, and description thereof is omitted.
實施方式1的變形例的擴片裝置1-1是在以框架保持單元20所保持之被加工物單元200的下方配置不具備工作台蓋36的冷卻工作台30及擴張鼓輪41-1,且在被加工物單元200的上方配置加熱單元50,藉由固定框架按壓板22,擴張鼓輪41-1被安裝在鼓輪用汽缸46之伸縮的桿體47並與冷卻工作台30一起上升至比框架載置板21的上表面23更上方,而將擴張片210擴張,除此之外,構成與實施方式1的擴片裝置1相同。另外,圖8省略腔室10。The expansion sheet device 1-1 of the modified example of the embodiment 1 is configured in the same manner as the expansion sheet device 1 of the embodiment 1, wherein a cooling table 30 without a table cover 36 and an expansion drum 41-1 are arranged below the workpiece unit 200 held by the frame holding unit 20, and a heating unit 50 is arranged above the workpiece unit 200, and the expansion drum 41-1 is mounted on the extension rod 47 of the drum cylinder 46 by fixing the frame pressing plate 22 and rises together with the cooling table 30 to a position above the upper surface 23 of the frame mounting plate 21, thereby expanding the expansion sheet 210. In addition, the chamber 10 is omitted in FIG. 8 .
因為變形例的擴片裝置1具配為熱風進入防止手段的彎曲板90,所以可抑制熱風300進入工作台本體32與彎曲板90之間而讓此區域間的空氣溫度上升的情形,且與實施方式1相同,可發揮以下效果:即使在連續擴張多個被加工物單元200之擴張片210的情況下,也能消除擴張後的被加工物單元200之擴張片210的鬆弛以防止晶片202的損傷,並且能抑制接著要擴張之被加工物單元200的冷卻不良,並抑制產生分割不良的情形。Since the expansion device 1 of the modified example has the bending plate 90 equipped with a means for preventing hot air from entering, it is possible to prevent the hot air 300 from entering between the worktable body 32 and the bending plate 90 and causing the air temperature in this area to rise. Similar to the first embodiment, the following effects can be achieved: even when the expansion sheets 210 of a plurality of workpiece units 200 are continuously expanded, the slack of the expansion sheets 210 of the expanded workpiece units 200 can be eliminated to prevent damage to the chip 202, and poor cooling of the workpiece unit 200 to be expanded next can be suppressed, thereby suppressing the occurrence of poor segmentation.
另外,本發明並非限定於上述實施方式者。亦即,可在不脫離本發明之主旨的範圍進行各種變形並實施。另外,在實施方式1中,雖然將框架保持單元20的框架按壓板22設置為升降自如,但在本發明中,也可將框架保持單元20的框架按壓板22固定在腔室10。In addition, the present invention is not limited to the above-mentioned embodiments. That is, various modifications can be made and implemented within the scope of the main purpose of the present invention. In addition, in Embodiment 1, although the frame pressing plate 22 of the frame holding unit 20 is set to be freely raised and lowered, in the present invention, the frame pressing plate 22 of the frame holding unit 20 can also be fixed to the chamber 10.
此外,在實施方式1中,雖然說明了在被加工物201沿著分割預定線205形成作為分割起點的改成層208的例子,但在本發明中並不限定於改質層208。在本發明中,可於擴片裝置1的擴張前,對被加工物201實施切割加工或雷射燒蝕加工而沿著分割預定線205分割成個別的晶片202,也可對被加工物201實施切割加工或雷射燒蝕加工而沿著分割預定線205從正面204形成凹的加工槽。此外,在實施方式1中,雖然被加工物單元200具備被加工物201及DAF212,但本發明不限定於此,也可具備被加工物201及DAF212的其中一者而不具備另一者。In the first embodiment, although the modified layer 208 as the starting point of division is formed on the workpiece 201 along the predetermined division line 205, the present invention is not limited to the modified layer 208. In the present invention, the workpiece 201 may be cut or laser etched before the expansion of the expansion device 1 to be divided into individual wafers 202 along the predetermined division line 205, or the workpiece 201 may be cut or laser etched to form a concave processing groove from the front surface 204 along the predetermined division line 205. In the first embodiment, although the workpiece unit 200 includes the workpiece 201 and the DAF 212, the present invention is not limited thereto, and may include one of the workpiece 201 and the DAF 212 but not the other.
1:擴片裝置 20:框架保持裝置(框架保持手段) 30:冷卻工作台 31:抵接面 40:擴張單元(擴張手段) 50:加熱單元(加熱手段) 52:熱風噴射部 90:彎曲板(熱風進入防止手段) 92:噴出口 92:彎曲面 200:被加工物單元 201:被加工物 210:擴張片 211:環狀框架 300:熱風 301:空氣聚集1: Expansion sheet device 20: Frame holding device (frame holding means) 30: Cooling table 31: Contact surface 40: Expansion unit (expansion means) 50: Heating unit (heating means) 52: Hot air spraying unit 90: Bending plate (hot air ingress prevention means) 92: Spray outlet 92: Bending surface 200: Workpiece unit 201: Workpiece 210: Expansion sheet 211: Ring frame 300: Hot air 301: Air gathering
圖1為表示實施方式1之擴片裝置的加工對象之被加工物單元的一例的立體圖。 圖2為示意性地表示實施方式1之擴片裝置的構成例的剖面圖。 圖3為示意性地表示圖2所示之擴片裝置的彎曲板等的剖面圖。 圖4為示意性地表示在圖2所示之擴片裝置的框架載置板載置有被加工物單元之環狀框架的狀態的剖面圖。 圖5為示意性地表示圖4所示之擴片裝置的框架保持單元將環狀框架固定後之狀態的剖面圖。 圖6為示意性地表示使圖5所示之框架載置板上升並將擴張片擴張後之狀態的剖面圖。 圖7為示意性地表示將圖6所示之擴張片加熱、收縮之狀態的剖面圖。 圖8為示意性地表示實施方式1的變形例之擴片裝置的構成例的剖面圖。FIG. 1 is a perspective view showing an example of a workpiece unit to be processed by the sheet expansion device of embodiment 1. FIG. 2 is a cross-sectional view schematically showing an example of the structure of the sheet expansion device of embodiment 1. FIG. 3 is a cross-sectional view schematically showing a bending plate, etc. of the sheet expansion device shown in FIG. 2. FIG. 4 is a cross-sectional view schematically showing a state where an annular frame of the workpiece unit is mounted on the frame mounting plate of the sheet expansion device shown in FIG. 2. FIG. 5 is a cross-sectional view schematically showing a state where the frame holding unit of the sheet expansion device shown in FIG. 4 fixes the annular frame. FIG. 6 is a cross-sectional view schematically showing a state where the frame mounting plate shown in FIG. 5 is raised and the expansion sheet is expanded. FIG7 is a cross-sectional view schematically showing the state of heating and shrinking the expansion sheet shown in FIG6. FIG8 is a cross-sectional view schematically showing a configuration example of an expansion sheet device of a modified example of implementation method 1.
1:擴片裝置 1: Expansion device
10:腔室 10: Chamber
11:側壁 11: Side wall
12:開口 12: Open mouth
13:開關門 13: Open and close the door
20:框架保持單元(框架保持手段) 20: Frame holding unit (frame holding means)
21:框架載置板 21: Frame mounting plate
22:框架按壓板 22: Frame pressure plate
23:框架載置板的上表面 23: Upper surface of the frame mounting plate
24:框架按壓板的下表面 24: Lower surface of the frame pressing plate
25:滑動支撐構件 25: Sliding support member
26:密封構件 26: Sealing components
30:冷卻工作台 30: Cooling table
31:抵接面 31: Butt surface
32:工作台本體 32: Workbench body
33:冷卻單元 33: Cooling unit
34:工作台升降單元 34: Workbench lifting unit
35:吸引孔 35: Suction hole
36:工作台蓋 36: Workbench cover
37:大徑圓筒部 37: Large diameter cylindrical part
38:圓環部 38: Ring part
39:小徑圓筒部 39: Small diameter cylindrical part
40:擴張單元(擴張手段) 40: Expansion unit (expansion means)
41:擴張鼓輪 41: Expansion drum
42:升降用汽缸 42: Cylinder for lifting
43:鼓輪部 43: Drum part
44:滾動構件 44: Rolling member
45:桿體 45: Rod
50:加熱單元(加熱手段) 50: Heating unit (heating means)
51:加熱板 51: Heating plate
52:熱風噴射部 52: Hot air spraying section
521:噴射部本體 521: Jet unit body
522:線圈加熱器 522: Coil heater
523:供給路 523: Supply Road
524:開關閥 524:Switch valve
525:空氣供給源 525: Air supply source
53:擋板 53:Block
54:加熱板旋轉用馬達 54: Motor for heating plate rotation
55:擋板旋轉用馬達 55: Motor for baffle rotation
56:開口部 56: Opening
60:供給路 60: Supply Road
61:開關閥 61:Switch valve
62:壓縮空氣供給源 62: Compressed air supply source
63:壓縮空氣吹出口 63: Compressed air blowing outlet
64:渦流管 64: Vortex tube
70:吸引路 70: Attraction Road
71:開關閥 71:Switch valve
72:吸引源 72: Attraction source
80:供給路 80: Supply Road
81:開關閥 81:Switch valve
82:壓縮空氣供給源 82: Compressed air supply source
90:彎曲板(熱風進入防止手段) 90: Bending plate (means to prevent hot air from entering)
92:彎曲面 92: Curved surface
100:控制單元 100: Control unit
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019148838A JP7325258B2 (en) | 2019-08-14 | 2019-08-14 | Expanding device |
| JP2019-148838 | 2019-08-14 |
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| TW202107624A TW202107624A (en) | 2021-02-16 |
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| TW109127062A TWI853065B (en) | 2019-08-14 | 2020-08-10 | Expansion device |
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| JP (1) | JP7325258B2 (en) |
| KR (1) | KR102819437B1 (en) |
| CN (1) | CN112397416B (en) |
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| KR20230081644A (en) | 2021-11-30 | 2023-06-07 | 가부시기가이샤 디스코 | Expand apparatus |
| KR20230100060A (en) * | 2021-12-28 | 2023-07-05 | 세메스 주식회사 | Wafer expander for uniformly expanding gap between die, and die suppying module and die bonding equipment including the same |
| JP2024080353A (en) | 2022-12-02 | 2024-06-13 | 株式会社ディスコ | Chip spacing method |
| JP7584696B1 (en) * | 2024-05-22 | 2024-11-15 | 日機装株式会社 | Pressurizing Device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224775A (en) * | 2008-02-20 | 2009-10-01 | Tokyo Electron Ltd | Gas supply equipment, film-forming apparatus, and film formation method |
| TW201929064A (en) * | 2017-12-20 | 2019-07-16 | 日商迪思科股份有限公司 | Dividing device capable of suppressing a component of a gas generated by an expanded sheet during heating from adhering to a surface of a workpiece |
| TW201929060A (en) * | 2017-10-02 | 2019-07-16 | 日商迪思科股份有限公司 | Tape expansion apparatus and tape expansion method |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0650187B2 (en) * | 1987-05-13 | 1994-06-29 | 三洋電機株式会社 | Air conditioner |
| JP3171055B2 (en) * | 1995-04-28 | 2001-05-28 | 株式会社トヨトミ | Hot air heater |
| JPH09292175A (en) * | 1996-04-26 | 1997-11-11 | Daisoo:Kk | Container dryer |
| EP1608201A1 (en) | 2004-06-15 | 2005-12-21 | Alcatel | Positioning of network processor in a packet based access multiplexer |
| JP4542859B2 (en) * | 2004-10-04 | 2010-09-15 | 大陽日酸株式会社 | Vapor growth equipment |
| KR20110077482A (en) | 2009-12-30 | 2011-07-07 | 이유에스티(주) | Data management system and method of donor and beneficiary through RFID stored EPI tree data |
| JP6249586B2 (en) | 2011-08-31 | 2017-12-20 | 株式会社東京精密 | Work dividing apparatus and work dividing method |
| JP5985245B2 (en) * | 2012-05-15 | 2016-09-06 | 株式会社ディスコ | Tip spacing maintenance device |
| KR101620027B1 (en) * | 2014-04-30 | 2016-05-12 | 주식회사 에스에프에이 | Vent chamber for thin layer deposition apparatus |
| JP6425435B2 (en) * | 2014-07-01 | 2018-11-21 | 株式会社ディスコ | Tip spacing maintenance device |
| JP6829806B2 (en) * | 2016-12-28 | 2021-02-17 | 株式会社東京精密 | Work dividing device and work dividing method |
| JP6846205B2 (en) * | 2017-01-12 | 2021-03-24 | 株式会社ディスコ | Dividing device and dividing method |
| CN207626956U (en) * | 2017-07-26 | 2018-07-20 | 深港东成睡袋(深圳)有限公司 | A kind of Novel heat-preservation sleeping bag |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009224775A (en) * | 2008-02-20 | 2009-10-01 | Tokyo Electron Ltd | Gas supply equipment, film-forming apparatus, and film formation method |
| TW201929060A (en) * | 2017-10-02 | 2019-07-16 | 日商迪思科股份有限公司 | Tape expansion apparatus and tape expansion method |
| TW201929064A (en) * | 2017-12-20 | 2019-07-16 | 日商迪思科股份有限公司 | Dividing device capable of suppressing a component of a gas generated by an expanded sheet during heating from adhering to a surface of a workpiece |
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| JP7325258B2 (en) | 2023-08-14 |
| JP2021034397A (en) | 2021-03-01 |
| KR102819437B1 (en) | 2025-06-11 |
| KR20210020766A (en) | 2021-02-24 |
| TW202107624A (en) | 2021-02-16 |
| CN112397416A (en) | 2021-02-23 |
| CN112397416B (en) | 2025-11-28 |
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