TWI782160B - split device - Google Patents

Abstract

[Problems] To provide a dividing device capable of suppressing the components of the generated gas generated by the expanded flakes from adhering to the surface of the workpiece during heating. [Solution] The dividing device of the present invention is equipped with: a frame fixing part (40) of the ring frame (8) fixing the workpiece unit (9); Press in the direction perpendicular to the workpiece (1) to expand the expanded sheet (7), and the sheet expansion unit that breaks the processed object (1); expand the ring-shaped area of the expanded sheet (7) ( 101) A heating unit (60) that heats and shrinks; while the expanding sheet (7) is being heated, the surface of the workpiece (1) is covered with the supply gas (150) supplied to the surface of the workpiece (1), The gas supply unit (70) that shields the workpiece (1) by the generated gas (160) generated from the expanded sheet (7); and sucks the generated gas (160) and the supply gas ( 150) to exhaust the suction exhaust unit (80).

Description

Separation device

The present invention relates to a dividing device for dividing a workpiece into individual wafers.

In general, a processing method is known in which a laser beam is irradiated to a workpiece (wafer) with elements formed on its surface, and a modified layer is formed inside along the planned division line, and the wafer with the workpiece attached is The expanded sheet (dicing band) is expanded, and thereby divided into individual wafers with the modified layer as the breaking point. This type of processing method expands the expansion sheet on the outer periphery of the wafer, so after expansion, the expansion sheet relaxes, causing the gap between the gradually expanded wafers to narrow, or the cause of the gap caused by the friction between the wafers caused by the expansion sheet swinging during transportation. . Therefore, a processing technique and a dividing device have been developed that heat and shrink the expanded sheet that has been expanded and relaxed (see, for example, Patent Document 1). [Prior Art Document] [Patent Document]

[Patent Document 1] Japanese Patent No. 5791866

(Problem to be solved by the invention)

However, in the conventional method, since the expanded sheet is heated, gas is generated from the expanded sheet, and components of the generated gas may adhere to the surface of the workpiece (each wafer).

The present invention was made in view of the above circumstances, and an object of the present invention is to provide a dividing device capable of suppressing components of generated gas generated by expanding sheets during heating from adhering to the surface of a workpiece. (means to solve the problem)

In order to solve the above-mentioned problems and achieve the purpose, the present invention is a splitting device, which is composed of: a plate-shaped workpiece with a splitting starting point formed along a planned splitting line; an expanded sheet to which the workpiece is attached; and The dividing device for breaking the workpiece by expanding the expanded sheet of the workpiece unit formed by the annular frame attached to the outer periphery of the expanded sheet is provided with a frame fixing part for fixing the workpiece The annular frame of the unit; the sheet expansion unit, which is to press the outer periphery of the workpiece and the annular region of the expanded sheet of the inner periphery of the annular frame in a direction perpendicular to the workpiece to The expanded sheet is expanded to break the workpiece from the splitting point; a heating unit has a heating portion that heats and shrinks the expanded annular region of the expanded sheet; a gas supply unit includes During the heating of the expanding sheet, the surface of the workpiece is supplied with gas to cover the surface of the workpiece with the supplied gas, and the workpiece is shielded by the generated gas generated from the expanding sheet; and a suction and exhaust unit , which sucks the generated gas and the supplied gas to the outer periphery of the workpiece to exhaust.

With this configuration, it is possible to supply gas to the surface of the workpiece during heating of the expanding sheet, cover the surface of the workpiece with the supplied gas, and shield the workpiece with the generated gas generated from the expanding sheet. unit; and a suction and exhaust unit that sucks the generated gas and the supplied gas to the outer periphery of the workpiece to exhaust, so that the component of the generated gas generated by the expanded sheet during heating can be suppressed from adhering to the surface of the workpiece .

In this configuration, the air intake port of the suction and exhaust unit may be disposed on a surface opposite to the annular region and adjacent to the heating portion. With this configuration, the generated gas generated by the heating of the heating part is quickly sucked through the suction port adjacent to the heating part, so that components of the generated gas can be effectively suppressed from adhering to the surface of the workpiece. (Effect of Invention)

According to the present invention, there is provided a gas supply unit that supplies gas to the surface of the workpiece during heating of the expanding sheet, covers the surface of the workpiece with the supplied gas, and shields the workpiece with the generated gas generated from the expanding sheet. ; and a suction and exhaust unit that sucks the generated gas and the supply gas on the periphery of the workpiece to exhaust, so that the components of the generated gas generated by the expanded sheet can be suppressed from adhering to the surface of the workpiece during heating.

Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present inventors are not limited by the contents described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. In addition, the constitution described below can be combined suitably. In addition, various omissions, substitutions, or changes in configuration can be made without departing from the gist of the present invention.

The dividing device of this embodiment will be described based on the drawings. Fig. 1 is a perspective view showing an example of a workpiece to be processed by a dividing device according to the present embodiment. Fig. 2 is a perspective view showing an example of a workpiece unit including the workpiece shown in Fig. 1 . Fig. 3 is a perspective view showing a configuration example of the dividing device of the present embodiment. Fig. 4 is a schematic cross-sectional view showing a configuration example of a dividing device. Fig. 5 is a perspective view showing an example of arrangement and configuration of the heating unit of the heating unit and the exhaust unit of the suction and exhaust unit.

In this embodiment, the workpiece 1 shown in FIG. 1 is divided and processed into individual wafers. The workpiece 1 is a disc-shaped semiconductor wafer or an optical device wafer having silicon, sapphire, gallium arsenide, SiC (silicon carbide), or the like as a substrate 2 . As shown in FIG. 1 , the workpiece 1 has elements 4 formed on the surface 5 in the regions defined by a plurality of dividing lines 3 intersecting each other. The workpiece 1 is attached with an expanded sheet 7 on the back surface 6 on the back side of the surface 5, and an annular frame 8 is attached on the outer periphery of the expanded sheet 7, and the target substrate 2 is irradiated from the back surface 6 side along the planned dividing line 3. The laser light of a transparent wavelength forms the modified layer 100 (indicated by a dotted line in FIG. 2 ) which is the starting point of division along the planned division line 3 inside the substrate 2 . Here, the modified layer 100 refers to a region formed in a state different in density, refractive index, mechanical strength, or other physical properties from the surrounding states, and examples include a melted region, a crack region, a dielectric breakdown region, a refractive index change region, and An area where such areas exist mixedly, etc. In addition, in the present embodiment, the modified layer 100 is formed as a starting point for division, but instead of the modified layer 100 , laser processed grooves, cut grooves, etc. may be formed.

As shown in FIG. 2 , the workpiece 1 on which the modified layer 100 is formed along the planned dividing line 3, the expanded sheet 7 attached to the back surface 6 of the workpiece 1, and the outer periphery of the expanded sheet 7 are attached. The ring frame 8 constitutes the workpiece unit 9 . That is, the workpiece unit 9 is composed of the workpiece 1 , the expanded sheet 7 , and the ring frame 8 . Among them, the expanded sheet 7 is made of stretchable resin, and has heat shrinkability that shrinks when heated.

The dividing device 10 of the present embodiment is a device for dividing the workpiece 1 on which the modified layer 100 is formed into individual element wafers (wafers) along the dividing line 3 . The dividing device 10 is as shown in FIG. 3 , and is equipped with: a chamber 20, a holding platform 30, a frame fixing part 40, a sheet expansion unit 50, a heating unit 60, a gas supply unit 70, a suction and exhaust unit 80, and a control unit 96. .

The chamber 20 is formed in a box shape with an opening formed at the top. The chamber 20 accommodates the holding platform 30 , the frame mounting plate 41 of the frame fixing portion 40 , and the sheet expanding unit 50 .

The holding platform 30 has a holding surface 31 that attracts and holds the workpiece 1 of the workpiece unit 9 through the expansion sheet 7 . The holding platform 30 is in the shape of a disc, and has: a disc-shaped frame 32 made of metal such as stainless steel; Section 33. The frame body 32 and the upper surface of the suction part 33 are arranged on the same plane, and constitute the holding surface 31 for sucking and holding the workpiece 1 . The adsorption portion 33 has substantially the same diameter as the workpiece 1 . In the present embodiment, the workpiece unit 9 is transported to the holding table 30 while being sucked by the transport unit 95 .

On the holding surface 31 of the holding table 30, as shown in FIG. The holding platform 30 is connected to the suction part 33 and the vacuum suction source 34 , and the suction part 33 is sucked by the vacuum suction source 34 , so that the back side 6 of the workpiece 1 can be sucked and held on the holding surface 31 .

The frame fixing part 40 fixes the annular frame 8 of the workpiece unit 9 . The frame fixing part 40 is equipped with the frame mounting plate 41 and the frame pressing plate 42 . The frame mounting plate 41 is, as shown in FIG. 3 , provided with a circular opening 411 in planar shape, and formed in a flat plate shape with an upper surface 412 parallel to the horizontal direction. The inner diameter of the opening 411 of the frame mounting plate 41 is formed slightly larger than the inner diameter of the annular frame 8 . The frame mounting plate 41 arranges the holding platform 30 in the opening 411 , and the opening 411 is arranged coaxially with the holding platform 30 . In addition, the frame mounting plate 41 is equipped with the piston rods 431 of the air cylinders 43 at the four corners, and the piston rods 431 are extended and retracted so that they can be freely moved up and down. The frame mounting plate 41 is provided with centering guides 44, which are freely movable in the horizontal direction on the four corners of the upper surface 412, and the position of the ring frame 8 is adjusted by moving in the horizontal direction, to be processed The object 1 is positioned coaxially with the suction portion 33 of the holding platform 30 .

The frame holding plate 42 is formed in a plate shape having approximately the same size as the frame mounting plate 41 , and a circular opening 421 having the same size as the opening 411 is provided in the center. The frame pressing plate 42 is mounted on the front end of the piston rod 451 of the air cylinder 45. The piston rod 451 expands and contracts, spreads over the position above the frame mounting plate 41, and retracts from above the frame mounting plate 41. The position can be moved freely. The four corners of the frame pressing plate 42 are provided with long holes 422 into which the centering guides 44 can penetrate.

The frame fixing part 40 is positioned at a position where the frame pressing plate 42 retreats from above the frame mounting plate 41, and is placed on the upper surface 412 of the frame mounting plate 41 in a state where the centering guides 44 are separated from each other. The ring frame 8 of the workpiece unit 9 transported by the transport unit 95 is placed. The frame fixing portion 40 positions the workpiece 1 of the workpiece unit 9 by bringing the centering guides 44 close to each other. The frame fixing part 40 positions the frame pressing plate 42 above the frame mounting plate 41 , and stretches the piston rod 431 of the air cylinder 43 to raise the frame mounting plate 41 . Thereby, as shown in FIG. 4 , the annular frame 8 of the workpiece unit 9 is sandwiched between the frame mounting plate 41 and the frame pressing plate 42 to be fixed.

The sheet expanding unit 50 moves the holding platform 30 and the frame fixing portion 40 to positions away from each other along the axis along the vertical direction, and expands the sheet 7 . The sheet expanding unit 50 includes a top member 51 and a lift unit 52 .

The top member 51 is formed in a cylindrical shape with an outer diameter smaller than the inner diameter of the annular frame 8 placed on the upper surface 412 of the frame mounting plate 41, and an inner diameter smaller than that attached to the expanded sheet. 7, the outer diameters of the workpiece 1 and the holding platform 30 are large. The upper top member 51 is disposed inside the holding platform 30 and arranged coaxially with the holding platform 30 . A roller member 511 (shown in FIG. 4 etc.) disposed on the same plane as the holding surface 31 of the holding platform 30 is rotatably attached to the upper end of the upper top member 51 .

As shown in FIG. 4 , the elevating unit 52 is provided with an upper member elevating mechanism 52A for elevating the upper member 51 and a holding platform elevating mechanism 52B for elevating the holding platform 30 . The upper lifter mechanism 52A includes two cylinder housings 520 and a piston rod 521 inserted through the cylinder housings 520 , and the upper end member 51 is fixed to the upper end of the piston rod 521 . The height position of the upper roof member 51 is adjusted by the two upper roof member elevating mechanisms 52A. Furthermore, the holding platform elevating mechanism 52B includes two cylinder housings 525 and a piston rod 526 inserted through the cylinder housings 525 , and the holding platform 30 is fixed to the upper end of the piston rod 526 . The height position of the holding platform 30 is adjusted by the two holding platform elevating mechanisms 52B. In this embodiment, the height position of the upper member 51 and the holding platform 30 can be adjusted integrally or independently by adjusting the lifting mechanism 52A of the lifting member and the lifting mechanism 52B of the holding platform.

The sheet expansion unit 50 is located on the same plane as the top 412 of the frame mounting plate 41 by the roller member 511 installed on the upper end of the upper top member 51 and the holding surface 31, and the lifting unit 52 (upper top member lifting mechanism) 52A and the holding platform elevating mechanism 52B) to lift the upper member 51 and the holding platform 30 integrally, thereby expanding the expansion sheet 7 in the plane direction.

The heating unit 60 heats the ring-shaped area 101 (shown in FIGS. 2 and 4 ) between the inner periphery of the annular frame 8 of the expanded sheet 7 , that is, the inner edge, and the outer periphery, that is, the outer edge of the workpiece 1 . Shrinkage by heating. The heating unit 60 includes a disc-shaped unit body 61 and a plurality of heating units 62 attached to the unit body 61 .

The unit body 61 is disposed above the holding platform 30 and is coaxial with the holding platform 30 . The unit body 61 has: a support shaft 611 extending in the vertical direction at the center; and a plurality of openings 612 formed at equal intervals in the circumferential direction on the outer edge of the unit body 61 . In addition, the unit main body 61 is provided to be freely raised and lowered by a moving unit not shown, and is provided to be freely rotatable around an axis parallel to the vertical direction.

The heating unit 62 is disposed in an opening 612 formed on the outer edge of the unit body 61 . The heating unit 62 is disposed at a position vertically facing the holding platform 30 and the annular region 101 of the expanded sheet 7 of the workpiece unit 9 held by the frame fixing unit 40 . In the present embodiment, four heating parts 62 (opening parts 612 ) are provided, but in the present invention, the number is not limited to four. The heating unit 62 is a type that irradiates infrared rays downward to heat the annular region 101 of the expanded sheet 7, for example, an infrared ceramic heater that is heated when a voltage is applied and emits infrared rays. In addition, the heating part 62 can move independently in the radial direction and the vertical direction of the unit body 61 in the opening part 612 .

The gas supply unit 70 supplies gas (such as air; supply gas) to the surface 5 of the workpiece 1 while the heating unit 62 is heating the annular region 101 of the expanded sheet 7, and covers the surface of the workpiece 1 with the gas. 5. Here, when the heating unit 62 heats the annular region 101 of the expanded sheet 7, gas (generated gas) may be generated from the expanded sheet 7 due to volatilization or the like. If the generated gas stagnates on the workpiece 1 , components of the generated gas may adhere to the surface (element) of the workpiece 1 . Therefore, the gas supply unit 70 covers the surface 5 of the workpiece 1 with the supplied gas, whereby the workpiece 1 is shielded by the generated gas generated when the expanded sheet 7 is heated. The gas supply unit 70 is provided with: an injection port 71 formed in the center of the unit body 61 of the heating unit 60 to inject gas toward the workpiece 1; 72; a valve 73 connected to the supply path 72; and a gas supply source 74. When the annular region 101 of the expanded sheet 7 is heated, the valve 73 is opened, and the gas supplied from the gas supply source 74 is injected from the injection port 71 . Thereby, a gas flow (air layer) is formed above the workpiece 1 to cover the surface 5 of the workpiece 1 .

The suction and exhaust unit 80 sucks and exhausts the gas supplied from the gas supply unit 70 and the generated gas generated when the expanded sheet 7 is heated on the outer peripheral side of the workpiece 1 . The suction and exhaust unit 80 includes an exhaust block (exhaust portion) 81 , exhaust passages 82 connected to the exhaust block 81 , and suction sources 83 connected to the exhaust passages 82 . In the present embodiment, as shown in FIG. 5 , two exhaust blocks 81 are arranged so as to sandwich the heating portion 62 , and an air intake port 811 is formed on the lower surface of each exhaust block 81 . These air inlets 811 are disposed adjacent to the heating portion 62 on the opposite surface to the annular region 101 of the expanded sheet 7, so the generated gas generated by heating of the heating portion 62 can pass through the air inlets 811 adjacent to the heating portion 62. And quickly attracted and exhausted. In addition, the exhaust block 81 is connected to the heating part 62 and moves in the radial direction and the vertical direction of the unit body 61 in the opening part 612 together with the heating part 62 .

In addition, in the present embodiment, the splitting device 10 is different from the suction and exhaust unit 80 and additionally includes an auxiliary suction and exhaust unit 90 . The auxiliary suction and exhaust unit 90 is provided on the outer peripheral side of the workpiece 1 than the suction and exhaust unit 80 , and sucks and exhausts generated gas that the suction and exhaust unit 80 cannot suck. The auxiliary suction and exhaust unit 90 is provided with, for example, a plurality of exhaust tubes 91 formed in a cylindrical shape and arranged on the outside of the frame mounting plate 41 at equal intervals in the circumferential direction; an air passage 92; and a suction source 93 connected to the exhaust passages 92. The exhaust pipes 91 are formed with air intake ports 911 facing the frame mounting plate 41 . In the present embodiment, two exhaust tubes 91 are formed outside the chamber 20 and two are provided inside the chamber 20, but the shape and number of the exhaust tubes 91 are not limited to the above-mentioned constituents. By providing the auxiliary suction and exhaust unit 90, for example, even if the above-mentioned generated gas has entered the chamber 20, the generated gas is sucked and exhausted through the exhaust tube 91, so that the gas generated in the chamber can be suppressed. 20 and various parts outside the chamber 20 are attached to the components of the generated gas.

The control unit 96 is to respectively control the above-mentioned constituent elements of the dividing device 10, that is, the sheet expanding unit 50, the heating unit 60, the gas supply unit 70, the suction and exhaust unit 80, and the auxiliary suction and exhaust unit 90, etc., so that the dividing device 10 is implemented. The processing operator of the workpiece 1. Wherein, the control unit 96 is a computer. The control unit 96 is connected to a display unit (not shown) constituted by a liquid crystal display device for displaying the status of processing operations or images, etc., and an input unit (not shown) used when the operator registers processing content information, etc. . The input unit is composed of at least one of a touch panel disposed on the display unit, and an external input device such as a keyboard.

Next, the operation of the dividing device 10 of this embodiment will be described. First, as shown in FIG. 4 , the workpiece 1 of the workpiece unit 9 is placed on the holding surface 31 of the holding platform 30 through the expanded sheet 7 , and the ring frame 8 is fixed by the frame fixing portion 40 . The control unit 96 positions the frame pressing plate 42 of the frame fixing portion 40 at the retracted position, shrinks the piston rod 431 of the air cylinder 43 and positions the upper surface 412 of the frame mounting plate 41 below the holding surface 31 In the state, the transport unit 95 (see FIG. 3 ) transports the workpiece unit 9 on which the modified layer 100 is formed along the planned dividing line 3 to above the holding platform 30 . Next, the rear surface 6 of the workpiece 1 is placed on the holding surface 31 through the expanded sheet 7 .

The control unit 96 stretches the piston rod 451 of the air cylinder 45 to position the frame pressing plate 42 above the frame mounting plate 41, stretches the piston rod 431 of the air cylinder 43, and raises the frame mounting plate 41. . Thereby, the annular frame 8 of the workpiece unit 9 is clamped between the frame mounting plate 41 and the frame pressing plate 42 .

Next, the control unit 96 approaches the centering guides 44 of the frame fixing portion 40 to position the workpiece 1 of the workpiece unit 9, and fixes the annular frame 8 of the workpiece unit 9 on the frame mounting. Between the plate 41 and the frame pressing plate 42 . At this time, if the annular frame 8 of the workpiece unit 9 is fixed between the frame mounting plate 41 and the frame pressing plate 42, the frame mounting plate 41 and the holding platform 30 are located on the upper surface 412 and are installed on the The roller member 511 at the upper end of the upper top member 51 and the holding surface 31 are located close to each other on the same plane, and the roller member 511 of the upper top member 51 abuts against the annular region 101 of the expanded sheet 7 .

Fig. 6 is a schematic cross-sectional view of the dividing device in a state where the expanded sheet is expanded by raising the sheet expanding unit. Fig. 7 is a schematic cross-sectional view showing the dividing device in a state where the sheet expanding unit is lowered after expanding the expanded sheet. After the annular frame 8 of the workpiece unit 9 is fixed between the frame mounting plate 41 and the frame pressing plate 42, the holding platform 30 and the frame fixing part 40 are made to be perpendicular to the surface of the workpiece 1. Relatively moving in the axial direction of the workpiece 1 expands the annular region 101 of the expanded sheet 7 between the outer periphery of the workpiece 1, that is, the outer edge, and the inner periphery, that is, the inner edge of the annular frame 8. That is, the control unit 96 stretches the respective piston rods 521, 526 of the elevating unit 52 (the upper lifting member elevating mechanism 52A and the holding platform elevating mechanism 52B) of the sheet expansion unit 50 to respectively stretch the upper lifting member 51 and the holding platform 30. The height position rises. In this way, since the roller member 511 provided at the upper end of the top member 51 abuts against the annular region 101 of the expanding sheet 7, the expanding sheet 7 is expanded in the planar direction. As the expansion sheet 7 expands, a tensile force acts radially on the expansion sheet 7 .

As described above, when a tensile force is applied radially to the extended sheet 7 attached to the back surface 6 of the workpiece 1, the workpiece 1 will have the modified layer 100 formed along the planned dividing line 3 (FIG. 4 ) as the base point, as shown in FIG. In addition, when the expansion sheet 7 expands, the annular region 101 of the expansion sheet 7 is such that the cross section of the annular region 101 becomes linear from the lower surface of the annular frame 8 toward the upper surface of the roller member 511 .

Next, the control unit 96 drives the vacuum suction source 34, and the suction part 33 is sucked by the vacuum suction source 34, and the back surface 6 side of the workpiece 1 is sucked and held on the holding surface 31 through the expansion sheet 7 to maintain the space between the wafers 110. The interval 111. Next, in the state of driving the vacuum suction source 34, the control unit 96 shortens the piston rods 521, 526 of the lifting unit 52 (upper member lifting mechanism 52A and holding platform lifting mechanism 52B) of the sheet expansion unit 50 respectively, as shown in FIG. As shown in FIG. 7 , the upper top member 51 and the holding platform 30 are lowered to the same height position as the frame mounting plate 41 . In this state, as shown in FIG. 7, since the roller member 511 provided at the upper end of the top member 51 is separated by the annular region 101 of the expanded sheet 7, the expanded annular region 101 of the extended sheet 7 is tied on the upper side. relaxation.

Fig. 8 is a schematic cross-sectional view of a dividing device showing a state in which an annular region of an expanded sheet is heated and shrunk. Next, the annular region 101 of the expanded sheet 7 that has been loosened by the expansion is heated and shrunk. As shown in FIG. 8 , the control unit 96 applies a voltage or the like to the heating unit 62 of the heating unit 60 , heats to a predetermined temperature, and emits infrared rays from the heating unit 62 . Next, the heating unit 60 is lowered using a moving unit (not shown), the heating unit 62 is brought close to the annular region 101 , and the heating unit 60 is rotated around the axis. In this embodiment, the unit body 61 of the heating unit 60 is provided with the injection port 71 of the gas supply unit 70 and the exhaust block 81 of the suction exhaust unit 80, so these injection ports 71 and the exhaust block 81 are also Descending together with the heating unit 60 . Furthermore, the control unit 96 opens the valve 73 of the gas supply unit 70 , injects the supply gas 150 from the injection port 71 toward the wafer 110 (workpiece 1 ), and operates the suction source 83 of the suction exhaust unit 80 .

Thereby, the annular region 101 of the expanded sheet 7 is heated by infrared rays radiated from the heating unit 62 facing the annular region 101 of the expanded sheet 7, and the annular region 101 can be slack and contracted. In addition, since the supply gas 150 is injected toward the wafer 110 (workpiece 1) from the injection port 71, and the suction source 83 of the suction and exhaust unit 80 is operated, a ring shape is formed above the workpiece 1 from the center toward the outside (annular shape). Frame 8 side) supply gas 150 flow (air layer). Therefore, even if the generated gas 160 is generated from the expanded sheet 7 by heating, the generated gas 160 passes through the suction port 811 ( FIG. 5 ) formed in the exhaust block 81 of the suction and exhaust unit 80 together with the supply gas 150 . Since it is exhausted, it is possible to suppress the components of the above-mentioned generated gas 160 from adhering to the wafer 110 (workpiece 1 ).

In addition, the control unit 96 operates the suction source 93 of the auxiliary suction and exhaust unit 90 to suck and exhaust the generated gas 160 that cannot be sucked by the suction and exhaust unit 80 through the exhaust tube 91 . Therefore, for example, even if the generated gas 160 that cannot be sucked by the suction and exhaust unit 80 has entered the chamber 20, the generated gas 160 is sucked and exhausted through the exhaust tube 91, so that the exhaust gas can be suppressed. Components of the gas 160 adhere to various places inside the chamber 20 and outside the chamber 20 .

If the annular region 101 of the expansion sheet 7 is sufficiently contracted, the valve 73 is closed, the heating of the heating portion 62 and the suction sources 83, 93 are stopped, and the heating unit 60 is raised to release the tension of the annular frame 8 of the frame fixing portion 40. fixed. In this way, the workpiece unit 9 is contracted by the expanded annular region 101 of the expanded sheet 7 , and the gap 111 between the wafers 110 is maintained even if the suction of the suction portion 33 holding the platform 30 is released.

As described above, the dividing device 10 of this embodiment is composed of: a plate-shaped workpiece 1 formed with a modified layer 100 serving as a starting point for dividing along the planned dividing line 3; The expanded sheet 7; and the expanded sheet 7 of the processed object unit 9 formed by the annular frame 8 attached to the outer periphery of the expanded sheet 7 to break the processed object 1 has: a fixed processed object unit The frame fixing part 40 of the annular frame 8 of 9; the outer circumference of the workpiece 1 and the annular region 101 of the expanded sheet 7 of the inner circumference of the annular frame 8 are pressed in a direction perpendicular to the workpiece 1 to The expansion sheet 7 expands, and the sheet expansion unit 50 breaks the workpiece 1 from the modified layer 100; the heating unit 60 has a heating unit 62 that heats and contracts the expanded annular region 101 of the expansion sheet 7; During the heating of the expanding sheet 7, gas is supplied to the surface of the workpiece 1, the surface of the workpiece 1 is covered with the supplied gas 150, and the gas supply unit 70 of the workpiece 1 is shielded by the generated gas 160 generated from the expanding sheet 7. ; and the suction and exhaust unit 80 that sucks the generated gas 160 and the supply gas 150 to exhaust the outer periphery of the workpiece 1, so that the components of the generated gas 160 generated by the expanded sheet 7 can be suppressed from adhering to the processed object during heating. The condition of the surface of object 1.

In addition, the suction port 811 of the suction exhaust unit 80 is arranged adjacent to the heating portion 62 on the opposite side to the annular region 101 , so the generated gas 160 generated by the heating of the heating portion 62 passes through the adjacent heating portion 62 . The air suction port 811 is quickly sucked in, so that components of the generated gas 160 can be effectively suppressed from adhering to the surface of the workpiece 1 .

One embodiment of the present invention has been described above, but the above-mentioned embodiment is presented as an example and is not intended to limit the scope of the invention.

1‧‧‧processed object 2‧‧‧substrate 3‧‧‧separation plan 4‧‧‧component 5‧‧‧surface 6‧‧‧rear surface 7‧‧‧extended sheet 8‧‧‧ring frame 9‧‧ ‧Processed object unit 10 ‧‧Frame fixing part 41‧‧‧Frame mounting plate 411‧‧‧Opening part 412‧‧‧Front surface 42‧‧‧Frame pressing plate 421‧‧‧Circular opening 422‧‧‧Elongated hole 43‧‧ ‧Air cylinder 431‧‧‧piston rod 44‧‧‧centering guide 45‧‧‧air cylinder 451‧‧‧piston rod 50‧‧‧sheet expansion unit 51‧‧‧top member 511‧‧‧roller member 52 ‧‧‧Elevating Unit 52A‧‧‧Elevating Mechanism for Upper Member 52B‧‧‧Holding Platform Lifting Mechanism 520‧‧‧Cylinder Housing 521‧‧‧Piston Rod 525‧‧‧Cylinder Housing 526‧‧‧Piston Rod 60‧‧‧ Heating unit 61‧‧‧unit body 611‧‧‧support shaft 612‧‧‧opening portion 62‧‧‧heating part 70‧‧‧gas supply unit 71‧‧‧injection port 72‧‧‧supply path 73‧‧‧valve 74‧‧‧gas supply source 80‧‧‧suction exhaust unit 81‧‧‧exhaust block 811‧‧‧suction port 82‧‧‧exhaust path 83‧‧‧suction source 90‧‧‧auxiliary suction exhaust Air unit 91‧‧‧Exhaust tube 911‧‧‧Suction port 92‧‧‧Exhaust path 93‧‧‧Suction source 95‧‧‧Conveying unit 96‧‧‧Control unit 100‧‧‧Modified layer (divided Starting point) 101‧‧‧annular area 110‧‧‧wafer 111‧‧‧interval 150‧‧‧gas supply 160‧‧‧generated gas

Fig. 1 is a perspective view showing an example of a workpiece to be processed by a dividing device according to the present embodiment. Fig. 2 is a perspective view showing an example of a workpiece unit including the workpiece shown in Fig. 1 . Fig. 3 is a perspective view showing an example of the structure of the dividing device of this embodiment. Fig. 4 is a schematic cross-sectional view showing an example of the structure of the dividing device. Fig. 5 is a perspective view showing an example of the arrangement of the heating unit of the heating unit and the exhaust unit of the suction and exhaust unit. Fig. 6 is a schematic cross-sectional view showing the splitting device in a state where the expanded sheet is expanded by raising the sheet expanding unit. Fig. 7 is a schematic cross-sectional view showing the splitting device in a state where the sheet expanding unit is lowered after expanding the expanded sheet. Fig. 8 is a schematic cross-sectional view of a splitting device showing a state in which an annular region of an expanded sheet is heated and shrunk.

1‧‧‧processed object

7‧‧‧Extended sheet

8‧‧‧Ring frame

9‧‧‧Processed object unit

10‧‧‧Splitting device

20‧‧‧chamber

30‧‧‧maintain the platform

33‧‧‧Adsorption part

34‧‧‧Vacuum suction source

40‧‧‧Frame fixing part

41‧‧‧Frame mounting plate

42‧‧‧Frame pressing plate

43‧‧‧air cylinder

431‧‧‧piston rod

51‧‧‧top member

511‧‧‧Roller component

52A‧‧‧Elevating mechanism of upper member

52B‧‧‧maintaining platform lifting mechanism

520‧‧‧Cylinder shell

521‧‧‧piston rod

525‧‧‧Cylinder shell

526‧‧‧piston rod

60‧‧‧heating unit

61‧‧‧unit body

611‧‧‧Support shaft

612‧‧‧opening

62‧‧‧Heating Department

70‧‧‧gas supply unit

71‧‧‧jet port

72‧‧‧Supply Road

73‧‧‧valve

74‧‧‧gas supply source

80‧‧‧Suction exhaust unit

81‧‧‧Exhaust block

82‧‧‧Exhaust Road

83‧‧‧Attraction source

90‧‧‧Auxiliary suction exhaust unit

91‧‧‧exhaust pipe

92‧‧‧Exhaust Road

93‧‧‧Attraction source

101‧‧‧circular area

110‧‧‧chip

150‧‧‧gas supply

160‧‧‧Gas generation

Claims (1)

A splitting device comprising: a plate-shaped workpiece having a splitting starting point formed along a planned splitting line; an expanded sheet attached to the processed object; and an annular frame attached to the outer periphery of the expanded sheet The splitting device that expands the expanded sheet of the formed workpiece unit to break the processed object includes: a frame fixing part that fixes the annular frame of the processed object unit; a sheet expanding unit, In this method, the outer circumference of the workpiece and the annular region of the expanded sheet on the inner circumference of the annular frame are pressed in a direction perpendicular to the workpiece to expand the expanded sheet, and the workpiece is formed by The division starting point is broken; the heating unit has a heating part that heats the expanded annular region of the expanded sheet to shrink it; the gas supply unit is used for heating the expanded sheet, and the processed The surface of the object is supplied with gas to cover the surface of the object to be processed, and the object to be processed is shielded by the generated gas generated from the expanding sheet; The generated gas and the supplied gas are exhausted, and the suction port of the suction and exhaust unit is disposed adjacent to the heating portion on a surface opposite to the annular region.

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