TWI842615B - Three-dimension heat transmission device - Google Patents

Abstract

A three-dimensional heat transmission device includes a first thermally conductive shell, a second thermally conductive shell, a plurality of heat pipes, at least one thermally conductive assembly of hot area and at least one thermally conductive assembly of cold area. The second thermally conductive shell is mounted on the first thermally conductive shell, so that the first thermally conductive shell and the second thermally conductive shell together form a liquid-tight chamber. The plurality of heat pipes are disposed on the first thermally conductive shell, and are in fluid communication with the liquid-tight chamber. The at least one thermally conductive assembly of hot area is located in the liquid-tight chamber, and is disposed on the second thermally conductive shell. The at least one thermally conductive assembly of hot area includes a plurality of thermally conductive structures of hot area which is arranged side by side. The at least one thermally conductive assembly of cold area and the at least one thermally conductive assembly of hot area are arranged side by side. The at least one thermally conductive assembly of cold area includes a plurality of thermally conductive structures of cold area which is arranged side by side. The quantity of the at least one column of the plurality of thermally conductive structures of cold area is more than one, and the plurality of thermally conductive structures of cold area are separated to form at least one pressure reducing notch.

Description

Three-dimensional heat transfer device

The present invention relates to a heat transfer device, in particular to a three-dimensional heat transfer device.

The technical principle of the vapor chamber is similar to that of the heat pipe, but there is a difference in the conduction method. The heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber vapor chamber is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, the vapor chamber mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used to fill a working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity that dissipates heat is called the condensation zone. The working fluid absorbs heat in the evaporation zone and vaporizes and quickly expands to the entire cavity. In the condensation zone, heat is released and condensed into liquid. Then, the liquid working fluid returns to the evaporation zone through the capillary structure to form a cooling cycle.

Most of the temperature spreaders and heat pipes operate independently, resulting in only planar or linear heat transfer for each temperature spreader or heat pipe, rather than overall three-dimensional heat transfer, so that the heat dissipation effect has not been fully exerted. At present, some manufacturers have integrated temperature spreaders and heat pipes to produce heat transfer devices that can transfer heat in three dimensions. Generally speaking, manufacturers will increase the heat dissipation efficiency by increasing the capillary force of the capillary structure of the three-dimensional heat transfer device or increasing the thermal conductivity of the evaporation zone of the three-dimensional heat transfer device. However, the efficiency of the reflow of the vaporized working fluid in the current three-dimensional heat transfer device is still insufficient, so that the overall heat dissipation efficiency does not meet the needs of users. Therefore, how to improve the reflow efficiency of the gaseous working fluid to further improve the heat dissipation efficiency of the three-dimensional heat transfer device is one of the problems that researchers should solve.

The present invention provides a three-dimensional heat transfer device to improve the reflux efficiency of gaseous working fluid, so as to further improve the heat dissipation efficiency of the three-dimensional heat transfer device.

The three-dimensional heat transfer device disclosed in one embodiment of the present invention includes a first heat-conducting shell, a second heat-conducting shell, a plurality of heat pipes, at least one hot zone heat-conducting group and at least one cold zone heat-conducting group. The second heat-conducting shell is installed on the first heat-conducting shell so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber. These heat pipes are arranged in the first heat-conducting shell and connected to the liquid-tight chamber. At least one hot zone heat-conducting group is located in the liquid-tight chamber and arranged in the second heat-conducting shell, and includes a plurality of hot zone extension heat-conducting structures arranged side by side. At least one cold zone heat-conducting group is arranged side by side on one side of at least one hot zone heat-conducting group, and includes a plurality of cold zone extension heat-conducting structures arranged side by side, and the number of these cold zone extension heat-conducting structures in at least one row is multiple and separated to form at least one pressure-reducing gap.

According to the three-dimensional heat transfer device of the above-mentioned embodiment, since these cold zone extended heat-conducting structures are separated and form a plurality of pressure-reducing gaps, after the cooling fluid absorbs the heat of the heat source and vaporizes, the flow path of the vaporized cooling fluid can be dispersed through these pressure-reducing gaps to further reduce the vapor pressure, thereby further improving the heat dissipation efficiency.

In addition, the pressure loss between at least one hot zone heat conduction group and at least one cold zone heat conduction group will cause a temperature difference and form thermal resistance. The pressure loss can be reduced through these pressure reduction gaps to reduce thermal resistance and further improve heat dissipation efficiency.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 3. Figure 1 is a three-dimensional schematic diagram of a three-dimensional heat transfer device according to the first embodiment of the present invention. Figure 2 is a three-dimensional schematic diagram of a second heat-conducting shell of the three-dimensional heat transfer device of Figure 1. Figure 3 is a cross-sectional schematic diagram of the three-dimensional heat transfer device of Figure 1.

The three-dimensional heat transfer device 10 of this embodiment includes a first heat conductive shell 11, a second heat conductive shell 12, two hot zone heat conductive groups 13, two cold zone heat conductive groups 14, a plurality of hot zone support structures 15, a plurality of cold zone support structures 16, a plurality of heat pipes 17, a first capillary structure 18 and a second capillary structure 19.

The second heat-conducting shell 12 is installed on the first heat-conducting shell 11, so that the first heat-conducting shell 11 and the second heat-conducting shell 12 together form a liquid-tight chamber S. The liquid-tight chamber S is used to accommodate a cooling fluid (not shown). The cooling fluid is, for example, water or a refrigerant.

The second heat-conducting shell 12 includes a bottom plate 121, a first convex structure 122 and a second convex structure 123. The first convex structure 122 protrudes from the bottom plate 121 in a direction away from the first heat-conducting shell 11, and the second convex structure 123 protrudes from the first convex structure 122 in a direction away from the first heat-conducting shell 11.

Please refer to Figures 4 and 5 together. Figure 4 is a schematic plan view of the second heat-conducting shell of the three-dimensional heat transfer device of Figure 1. Figure 5 is a schematic plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device of Figure 1.

The second convex structure 123 has an inner surface 1231, a heat exchange surface 1232, a bottom side 1233, a top side 1234, a left side 1235 and a right side 1236. The inner surface 1231 faces the first heat-conducting shell 11. The heat exchange surface 1232 faces away from the inner surface 1231 and is used to thermally couple with a heat source H, so that the cooling fluid in the liquid-tight chamber S can absorb the heat transferred from the heat source to the second convex structure 123 through the heat exchange surface 1232. The so-called thermal coupling refers to thermal contact or connection through other heat-conducting media. The bottom side 1233 is opposite to the top side 1234, and the left side 1235 is opposite to the right side 1236. The bottom side 1233 , the top side 1234 , the left side 1235 , and the right side 1236 together surround the inner surface 1231 and the heat exchange surface 1232 .

The two hot zone heat conducting groups 13 and the two cold zone heat conducting groups 14 are located in the liquid-tight chamber S and protrude from the inner surface 1231 of the second convex hull structure 123, and one of the two hot zone heat conducting groups 13 is adjacent to the top side 1234 and the right side 1236 of the second convex hull structure 123, and the other of the two hot zone heat conducting groups 13 is adjacent to the bottom side 1233 and the left side 1235 of the second convex hull structure 123. In other words, the two hot zone heat conducting groups 13 are arranged along the diagonal of the second convex hull structure 123. The two cold zone heat conducting groups 14 are arranged side by side on one side of the two hot zone heat conducting groups 13. The two hot zone heat conducting groups 13 are used to correspond to two hot spots H1 of the heat source H, respectively. It should be noted that, relative to the hot zone referred to by the second hot zone heat conducting group 13 , the cold zone referred to by the second cold zone heat conducting group 14 refers to the area in the corresponding heat source whose temperature is lower than the hot spot H1 .

Each hot zone heat conductive group 13 includes a plurality of hot zone extension heat conductive structures 131 arranged side by side, and each cold zone heat conductive group 14 includes a plurality of cold zone extension heat conductive structures 141 arranged side by side. There is a gap between these hot zone extension heat conductive structures 131 and the first heat conductive shell 11, that is, the top side of these hot zone extension heat conductive structures 131 has space for cooling fluid to flow. These hot zone extension heat conductive structures 131 and these cold zone extension heat conductive structures 141 can provide the required vapor pressure drop in the liquid-tight chamber S and reduce the high liquid pressure drop caused by the capillary action of the powder burning capillary structure to improve the heat dissipation efficiency. The number of these cold zone extension heat conductive structures 141 in each row is multiple and separated, so as to form a plurality of pressure reduction gaps N.

The hot zone support structures 15 protrude from the hot zone extended heat conductive structures 131, and the cold zone support structures 16 protrude from the cold zone extended heat conductive structures 141, respectively. The length L1 of the hot zone support structures 15 is, for example, greater than the length L2 of the cold zone support structures 16. The heat pipes 17 are disposed in the first heat conductive shell 11 and connected to the liquid-tight chamber S, so that the cooling fluid absorbs the heat of the heat source and evaporates, flows between the hot zone extended heat conductive structures 131 along the direction A1, flows through the top space of the hot zone extended heat conductive structures 131 and the pressure reducing notches N along the direction A2, and then flows into the heat pipes 17 for heat dissipation.

The first capillary structure 18 is disposed on the first heat-conducting shell 11. The second capillary structure 19 is disposed on the second heat-conducting shell 12, the two hot zone heat-conducting groups 13, the two cold zone heat-conducting groups 14, the hot zone support structures 15, and the cold zone support structures 16. By disposing the first capillary structure 18 and the second capillary structure 19, the cooling fluid can absorb the heat of the heat source and evaporate and then flow back through the first capillary structure 18 and the second capillary structure 19.

Regarding the second capillary structure 19, part of the second capillary structure 19 is disposed in the long and unsegmented hot zone extended heat conductive structures 131 in the second hot zone heat conductive group 13, and can be used to transfer the heat of the hot spot H1. Part of the second capillary structure 19 is disposed in the segmented cold zone extended heat conductive structures 141 in the second cold zone heat conductive group 14 to form a plurality of pressure reducing notches N, and can be used to allow the vaporized cooling fluid to flow to reduce the vapor pressure.

In this embodiment, the cold zone support structures 16 are, for example, quadrangular column-shaped, and the second capillary structures 19 disposed on the cold zone support structures 16 are, for example, cylindrical. In other words, the shapes of the cold zone support structures 16 and the shapes of the second capillary structures 19 disposed on the cold zone support structures 16 are different.

In the present embodiment, the top sides of the hot zone extended thermal conductive structures 131 have spaces for the cooling fluid to flow, and the cold zone extended thermal conductive structures 141 are separated and form a plurality of pressure reducing gaps N. The advantage is that after the cooling fluid absorbs the heat from the heat source and vaporizes, the flow path of the vaporized cooling fluid can be dispersed through the top side spaces of the hot zone extended thermal conductive structures 131 and the pressure reducing gaps N to further reduce the vapor pressure, thereby further improving the heat dissipation efficiency.

In addition, the pressure loss between the second hot zone heat conducting group 13 and the second cold zone heat conducting group 14 will cause a temperature difference and form a thermal resistance. The pressure loss can be reduced through these pressure reduction gaps N to reduce the thermal resistance and further improve the heat dissipation efficiency.

In this embodiment, the three-dimensional heat transfer device 10 is arranged upright according to the location of the heat source, so the second convex structure 123 of the three-dimensional heat transfer device 10 has a bottom side 1233, a top side 1234, a left side 1235 and a right side 1236, but the present invention is not limited thereto. In other embodiments, the three-dimensional heat transfer device can also be arranged flat according to the location of the heat source, so the second convex structure of the three-dimensional heat transfer device can also have a front side, a rear side, a left side and a right side.

In this embodiment, the length L1 of these hot zone support structures 15 is greater than the length L2 of these cold zone support structures 16, but not limited thereto. In other embodiments, the length of these hot zone support structures may also be less than or equal to the length of these cold zone support structures.

In this embodiment, the second capillary structures 19 disposed in the second heat-conducting shell 12, the second hot zone heat-conducting groups 13, the second cold zone heat-conducting groups 14, the hot zone support structures 15, and the cold zone support structures 16 are, for example, made of the same material, but not limited thereto. In other embodiments, the second capillary structures disposed in the second heat-conducting shell, the second hot zone heat-conducting groups, the second cold zone heat-conducting groups, the hot zone support structures, and the cold zone support structures may also be made of different materials.

In this embodiment, the shapes of the cold zone support structures 16 and the shapes of the second capillary structures 19 disposed on the cold zone support structures 16 are different, but not limited thereto. In other embodiments, the shapes of the cold zone support structures and the shapes of the second capillary structures disposed on the cold zone support structures may also be the same.

In this embodiment, the inner sides of these heat pipes 17 are not provided with capillary structures, but not limited thereto. In other embodiments, the inner sides of these heat pipes may also be provided with capillary structures.

In the first embodiment, the three-dimensional heat transfer device 10 includes two hot zone heat conduction groups 13 corresponding to two hot spots H1 of the heat source H respectively, but not limited to this. Please refer to Figure 6. Figure 6 is a plan view of the second convex hull structure of the second heat conduction shell in the three-dimensional heat transfer device described in the second embodiment of the present invention. The three-dimensional heat transfer device 10A of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10A only includes one hot zone heat conduction group 13A, and the hot zone heat conduction group 13A is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13A is adjacent to the top side 1234 and the right side 1236 of the second convex hull structure 123. That is, the hot zone heat conducting assembly 13A is located at the upper right corner of the second convex structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it flows along the direction B1 between the hot zone extended heat conducting structures 131 and flows along the direction B2 through the top space of the hot zone extended heat conducting structures 131 and the pressure reducing notches N, thereby reducing the vapor pressure.

Please refer to Figure 7. Figure 7 is a plan view of the second convex structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the third embodiment of the present invention. The three-dimensional heat transfer device 10B of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10B only includes a hot zone heat conductive group 13B, and the hot zone heat conductive group 13B is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conductive group 13B is adjacent to the bottom side 1233 and the left side 1235 of the second convex structure 123. In other words, the hot zone heat conductive group 13B is located at the lower left corner of the second convex structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it flows between the hot zone extended heat conductive structures 131 along the direction C1 and flows through the top space of the hot zone extended heat conductive structures 131 and the pressure reducing notches N along the direction C2, thereby reducing the vapor pressure.

Please refer to Figure 8. Figure 8 is a plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the fourth embodiment of the present invention. The three-dimensional heat transfer device 10C of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10C only includes a hot zone heat conductive group 13C, and the hot zone heat conductive group 13C is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conductive group 13C is adjacent to the top side 1234 and the left side 1235 of the second convex hull structure 123. In other words, the hot zone heat conductive group 13C is located at the upper left corner of the second convex hull structure 123. After the cooling fluid absorbs the heat of the heat source and vaporizes, it flows between the hot zone extended heat conductive structures 131 along the direction D1 and flows through the top space of the hot zone extended heat conductive structures 131 and the pressure reducing notches N along the direction D2, thereby reducing the vapor pressure.

Please refer to Figure 9. Figure 9 is a schematic plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device described in the fifth embodiment of the present invention. The three-dimensional heat transfer device 10D of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10D only includes a hot zone heat conductive group 13D, and the hot zone heat conductive group 13D is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conductive group 13D is adjacent to the bottom side 1233 and the right side 1236 of the second convex hull structure 123. In other words, the hot zone heat conductive group 13D is located at the lower right corner of the second convex hull structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it flows between the hot zone extended heat conductive structures 131 along the direction E1 and flows through the top space of the hot zone extended heat conductive structures 131 and the pressure reducing notches N along the direction E2, thereby reducing the vapor pressure.

Please refer to Figure 10. Figure 10 is a plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device described in the sixth embodiment of the present invention. The three-dimensional heat transfer device 10E of this embodiment is similar to the three-dimensional heat transfer device 10 of the first embodiment, so the differences between this embodiment and the first embodiment will be described below, and the similarities will not be repeated. In this embodiment, the three-dimensional heat transfer device 10E only includes a hot zone heat conduction group 13E, and the hot zone heat conduction group 13E is used to correspond to a hot spot H1 of the heat source H. The hot zone heat conduction group 13E is separated from the bottom side 1233, the top side 1234, the left side 1235 and the right side 1236 of the second convex hull structure 123. That is, the hot zone heat conducting group 13E is located at the center of the second convex structure 123. After the cooling fluid absorbs the heat from the heat source and vaporizes, it flows along the direction F1 between the hot zone extended heat conducting structures 131 and flows along the direction F2 through the top space of the hot zone extended heat conducting structures 131 and the pressure reducing notches N, thereby reducing the vapor pressure.

According to the three-dimensional heat transfer device of the above-mentioned embodiment, since the top sides of these hot zone extended heat conductive structures have spaces for cooling fluid to flow and these cold zone extended heat conductive structures are separated and form a plurality of pressure reducing gaps, after the cooling fluid absorbs the heat of the heat source and vaporizes, the flow path of the vaporized cooling fluid can be dispersed through the top side spaces of these hot zone extended heat conductive structures and these pressure reducing gaps to further reduce the vapor pressure, thereby further improving the heat dissipation efficiency.

In addition, the pressure loss between the hot zone heat conduction group and the cold zone heat conduction group will cause a temperature difference and form thermal resistance. These pressure reduction gaps can reduce the pressure loss, thereby reducing thermal resistance and further improving heat dissipation efficiency.

Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the patent protection scope of the present invention shall be subject to the scope defined by the application patent attached to this specification.

10,10A,10B,10C,10D,10E: three-dimensional heat transfer device 11: first heat-conducting shell 12: second heat-conducting shell 121: bottom plate 122: first convex structure 123: second convex structure 1231: inner surface 1232: heat exchange surface 1233: bottom side 1234: top side 1235: left side 1236: right side 13,13A,13B,13C,13D,13E: hot zone heat-conducting group 131: hot zone extended heat-conducting structure 14: cold zone heat-conducting group 141: cold zone extended heat-conducting structure 15: hot zone support structure 16: cold zone support structure 17: heat pipe 18: First capillary structure 19: Second capillary structure A1, A2, B1, B2, C1, C2, D1, D2, E1, E2, F1, F2: Direction H: Heat source H1: Hot spot L1, L2: Length N: Pressure relief notch S: Liquid-tight chamber

FIG. 1 is a three-dimensional schematic diagram of a three-dimensional heat transfer device according to the first embodiment of the present invention. FIG. 2 is a three-dimensional schematic diagram of a second heat-conducting shell of the three-dimensional heat transfer device of FIG. 1. FIG. 3 is a cross-sectional schematic diagram of the three-dimensional heat transfer device of FIG. 1. FIG. 4 is a plan schematic diagram of a second heat-conducting shell of the three-dimensional heat transfer device of FIG. 1. FIG. 5 is a plan schematic diagram of a second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device of FIG. 1. FIG. 6 is a plan schematic diagram of a second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the second embodiment of the present invention. FIG. 7 is a plan schematic diagram of a second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the third embodiment of the present invention. FIG. 8 is a plan schematic diagram of a second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the fourth embodiment of the present invention. FIG. 9 is a schematic plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the fifth embodiment of the present invention. FIG. 10 is a schematic plan view of the second convex hull structure of the second heat-conducting shell in the three-dimensional heat transfer device according to the sixth embodiment of the present invention.

12: Second heat-conducting shell

123: Second convex hull structure

1231: Inner surface

1233: Bottom side

1234: Top side

1235: Left side

1236: Right side

13: Hot zone heat conduction group

131: Hot zone extension heat conduction structure

14: Cold zone heat transfer group

141: Cold zone extension heat conduction structure

15: Hot zone support structure

16: Cold zone support structure

H: Heat source

H1: Hot spot

L1, L2: length

N: Voltage reduction gap

Claims (10)

A three-dimensional heat transfer device, comprising: a first heat-conducting shell; a second heat-conducting shell, installed on the first heat-conducting shell, so that the first heat-conducting shell and the second heat-conducting shell together form a liquid-tight chamber; a plurality of heat pipes, arranged on the first heat-conducting shell and connected to the liquid-tight chamber; at least one hot zone heat-conducting group, located in the liquid-tight chamber and arranged on the second heat-conducting shell, and comprising a plurality of hot zone extension heat-conducting structures arranged side by side; and at least one cold zone heat-conducting group, arranged on one side of the at least one hot zone heat-conducting group, and comprising a plurality of cold zone extension heat-conducting structures arranged side by side, and the number of the cold zone extension heat-conducting structures in at least one row is multiple and separated to form at least one pressure-reducing gap. A three-dimensional heat transfer device as described in claim 1, wherein the second heat-conducting shell comprises a base plate, a first convex structure and a second convex structure, the first convex structure protrudes from the base plate toward a direction away from the first heat-conducting shell, the second convex structure protrudes from the first convex structure toward a direction away from the first heat-conducting shell, the second convex structure has an inner surface facing the first heat-conducting shell, and the at least one hot zone heat-conducting group and the at least one cold zone heat-conducting group protrude from the inner surface of the second convex structure. The three-dimensional heat transfer device as described in claim 2 further includes multiple hot zone support structures and multiple cold zone support structures, wherein the hot zone support structures respectively protrude from the hot zone extension heat conductive structure, and the cold zone support structures respectively protrude from the cold zone extension heat conductive structure, and the length of the hot zone support structures is greater than the length of the cold zone support structures. The three-dimensional heat transfer device as described in claim 3 further includes a first capillary structure, and the first capillary structure is disposed on the first heat-conducting shell. The three-dimensional heat transfer device as described in claim 4 further includes a second capillary structure, which is arranged on the second heat-conducting shell, the at least one hot zone heat-conducting group, the at least one cold zone heat-conducting group, the hot zone supporting structures and the cold zone supporting structures. A three-dimensional heat transfer device as described in claim 2, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the top side and the right side of the second convex hull structure. A three-dimensional heat transfer device as described in claim 2, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the bottom side and the left side of the second convex hull structure. A three-dimensional heat transfer device as described in claim 2, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the top side and the left side of the second convex hull structure. A three-dimensional heat transfer device as described in claim 2, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is adjacent to the bottom side and the right side of the second convex hull structure. A three-dimensional heat transfer device as described in claim 2, wherein the second convex hull structure has a bottom side, a top side, a left side and a right side, the bottom side is opposite to the top side, the left side is opposite to the right side, and the at least one hot zone heat conduction group is separated from the bottom side, the top side, the left side and the right side of the second convex hull structure.

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