TWI888109B - Three-dimensional vapor chamber heat dissipation device - Google Patents

Abstract

This disclosure id directed to a three-dimensional vapor chamber heat dissipation device having a body, a heat pipe, a fin assembly and a working fluid. The body has a bottom plate and a vertical plate. The vertical plate is up-right arranged on the bottom plate. A first chamber is defined in the bottom plate. A second chamber is defined in the vertical plate. The first chamber is communicated with the second chamber. The heat pipe is extended from one side of the upright plate and connected with the second chamber. The fin assembly is arranged on the heat pipe. The working fluid is filled in the bottom plate in a liquid state, and the working fluid flows in to the vertical plate and the heat pipe when vaporizing.

Description

Three-dimensional heat dissipation device

The present disclosure relates to a three-dimensional temperature averaging plate, and more particularly to a three-dimensional temperature averaging plate heat dissipation device having a structure that extends in a plane and is closely arranged.

3D Vapor Chamber is a phase change heat transfer device. Its structure is a combination of a vapor chamber and a heat pipe. Its internal chambers are connected, so that the substances that change between the internal vapor and liquid can move freely in the two chambers directly, achieving a better heat dissipation effect. However, the existing 3D Vapor Chamber has a heat pipe and fins for heat dissipation on the vapor chamber, which takes up a lot of space, so the application of the 3D Vapor Chamber is limited by the use of space, especially it is difficult to apply to flat space.

In view of this, the inventors have conducted intensive research and applied theories to the above-mentioned existing technologies to try their best to solve the above-mentioned problems, which has become the goal of the inventors' improvement.

The present disclosure provides a three-dimensional temperature-averaging plate heat dissipation device, which has heat pipes that extend laterally parallel to a bottom plate and are closely arranged.

The present disclosure provides a three-dimensional temperature-averaging plate heat dissipation device, which includes a body, a heat pipe, a fin assembly and a working fluid. The body includes a bottom plate and a vertical plate, the vertical plate is vertically arranged on the bottom plate, a first chamber is formed in the inner periphery of the bottom plate, a second chamber is formed in the inner periphery of the vertical plate, and the first chamber is connected to the second chamber. The heat pipe extends from one side of the vertical plate and the heat pipe is connected to the second chamber. The fin assembly is arranged on the heat pipe. The working fluid is filled in the bottom plate in a liquid state, and when the working fluid vaporizes, it can flow to the vertical plate and the heat pipe.

In one embodiment of the present disclosure, the heat pipe is parallel to the bottom plate.

In an embodiment of the present disclosure, a first capillary structure is attached to the inner wall of the bottom plate, a second capillary structure is attached to the inner wall of the vertical plate, and the first capillary structure is connected to the second capillary structure, a third capillary structure is attached to the inner wall of the heat pipe, and the second capillary structure is connected to the third capillary structure.

In an embodiment of the present disclosure, the second chamber extends into a buffer space, and the first chamber is connected to the buffer space.

In an embodiment of the present disclosure, the vertical plate is disposed on one side of the edge of the bottom plate.

In an embodiment of the present disclosure, another heat pipe extends from one side of the bottom plate and is connected to the first chamber. Another fin assembly is disposed on the other heat pipe.

In an embodiment of the present disclosure, the main body includes another vertical plate, the vertical plate and the other vertical plate are vertically arranged on the bottom plate and are relatively arranged on two sides of the bottom plate, and the heat pipe is connected between the vertical plate and the other vertical plate.

The vertical plate of the disclosed three-dimensional heat radiator with heat pipes extending laterally can extend the heat pipes in parallel with the bottom plate, thereby preventing the overall height of the three-dimensional heat radiator with heat pipes from being too high.

In the description of the present disclosure, it is necessary to understand that the terms "front", "rear", "left", "right", "front end", "rear end", "end", "longitudinal", "lateral", "vertical", "top", "bottom", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limiting condition for the present disclosure.

As used herein and not otherwise defined, the terms "substantially" and "approximately" are used to describe and describe small variations. When used in conjunction with an event or circumstance, the terms may include the exact time at which the event or circumstance occurred, as well as the event or circumstance occurring to a close approximation. For example, when used in conjunction with a numerical value, the terms may include a variation range of less than or equal to ±10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.

The detailed description and technical contents of the present disclosure are described below with the help of drawings. However, the attached drawings are only used for illustration and are not used to limit the present disclosure.

1 to 4 , the present disclosure provides a three-dimensional vapor chamber heat dissipation device, which includes a body 100 , at least one heat pipe 200 , at least one fin assembly 300 , and a working fluid (not shown).

In this embodiment, the body 100 includes a bottom plate 110 and a vertical plate 120. The vertical plate 120 is vertically arranged on the top surface of the bottom plate 110. Specifically, the vertical plate 120 is arranged on one side of the edge of the bottom plate 110. The bottom plate 110 is hollow and a first chamber 101 is formed on its inner periphery. The vertical plate 120 is hollow and a second chamber 102 is formed on its inner periphery. The first chamber 101 is connected to the second chamber 102. A first capillary structure 111 is attached to the inner wall of the bottom plate 110, and a second capillary structure 121 is attached to the inner wall of the vertical plate 120. The first capillary structure 111 is connected to the second capillary structure 121.

In this embodiment, a portion of the vertical plate 120 can be selectively configured to be in a boss shape and a buffer space 103 is provided in its inner periphery, and the buffer space 103 extends from the second chamber 102. The first chamber 101 and the buffer space 103 can be selectively configured to be connected.

In the simplest implementation, a single heat pipe 200 can achieve the effect of the present invention. The heat pipe 200 extends from one side of the vertical plate 120 and is connected to the second chamber 102. In this embodiment, the heat pipe 200 extends parallel to the bottom plate 110 to the outside of the boundary of the bottom plate 110, but the present disclosure is not limited to this. A third capillary structure 201 is attached to the inner wall of the heat pipe 200, and the second capillary structure 121 is connected to the third capillary structure 201. The fin assembly 300 is disposed on the outer wall of the heat pipe 200. Although a plurality of heat pipes 200 with the same structure and function are disposed on the same surface of the vertical plate 120 in this embodiment, the present disclosure does not limit the number of heat pipes 200.

The working fluid is filled in the bottom plate 110 in liquid form, and when the working fluid vaporizes, it can flow to the vertical plate 120 and the heat pipe 200. When the three-dimensional temperature-averaging plate heat sink of this embodiment is used, the bottom surface of the bottom plate 110 is used to contact a heat source (not shown in the figure). The heat source is generally arranged on a circuit board (not shown in the figure), and the bottom plate 110 of the three-dimensional temperature-averaging plate heat sink is stacked on the circuit board. After the bottom plate 110 absorbs heat from the heat source, the working fluid vaporizes in the first chamber 101 due to the heat, and the vaporized working fluid can flow to the second chamber 102 and the heat pipe 200. The buffer space 103 can be used to regulate the gaseous working fluid. When the heating power of the heat source suddenly increases, it can prevent the sudden increase of the gaseous working fluid from not being able to enter the heat pipe 200, resulting in insufficient heat dissipation. The gaseous working fluid in the heat pipe 200 condenses into liquid after dissipating heat energy through the fin assembly 300 . The liquid working fluid in the heat pipe 200 is adsorbed by the third capillary structure 201 and then flows back to the first chamber 101 through the second capillary structure 121 and the first capillary structure 111 .

The vertical plate 120 of the disclosed three-dimensional heat spreader heat sink extends the heat pipe 200 laterally, so that the heat pipe 200 can be arranged parallel to the circuit board, thereby avoiding the overall height of the three-dimensional heat spreader heat sink being too high. According to different configuration requirements, the disclosed three-dimensional heat spreader heat sink can have various possible configuration variations as described below.

Referring to the second embodiment of the present disclosure shown in FIG. 5 , the three-dimensional temperature-averaging plate heat dissipation device of the present embodiment comprises a body 100, a plurality of heat pipes 200, a plurality of fin assemblies 300, and a working fluid. The body 100 has a bottom plate 110 as in the first embodiment, but the vertical plate 120a in the present embodiment is erected in the middle of the body 100, and heat pipes 200 are respectively arranged on both sides of the vertical plate 120a, and the heat pipes 200 on both sides of the vertical plate 120a are connected to the second chamber 102. In the present embodiment, each heat pipe 200 extends parallel to the bottom plate 110, and at least a portion of each heat pipe 200 is stacked with the bottom plate 110. The inner wall of each heat pipe 200 is provided with a third capillary structure 201, and the second capillary structure 121 in the vertical plate 120a is connected to each third capillary structure 201. The fin assembly 300 is respectively arranged on two sides of the vertical plate 120a, and each heat pipe 200 is respectively connected in series with the corresponding fin assembly 300. In this way, the space on both sides of the vertical plate 120a can be effectively utilized to arrange the heat pipe 200 and the fin assembly 300.

In this embodiment, a portion of the vertical plate 120a can be selectively configured as the buffer space 103 as described in the first embodiment, and a portion of the heat pipe 200 can also be directly connected to the buffer space 103.

Referring to the third embodiment of the present disclosure shown in FIG. 6 , the three-dimensional temperature averaging plate heat dissipation device of this embodiment comprises a body 100, a plurality of heat pipes 200b, a fin assembly 300b and a working fluid. The body 100 has a bottom plate 110 as in the first embodiment and a vertical plate 120b. The structure of each heat pipe 200b is the same as in the above embodiment and the heat pipe 200b is arranged on one side of the vertical plate 120b. In this embodiment, each heat pipe 200b extends parallel to the bottom plate 110, and at least a portion of each heat pipe 200b is stacked with the bottom plate 110, and each heat pipe 200b is respectively connected in series with the fin assembly 300b, so that the heat pipe 200b, the fin assembly 300b and the bottom plate 110 are closely arranged. In this embodiment, a portion of the vertical plate 120b can be selectively configured in a boss shape and a buffer space 103 is set in its inner periphery. The buffer space 103 extends from the second chamber 102 and is respectively configured on two sides of the vertical plate 120b with the heat pipes 200b to effectively utilize the space on the two sides of the vertical plate 120b.

Referring to the fourth embodiment of the present disclosure shown in FIG. 7 , the three-dimensional temperature-averaging plate heat dissipation device of this embodiment comprises a body 100, a plurality of heat pipes 200, 200c, a plurality of fin assemblies 300, 300c and a working fluid. The body 100 has a bottom plate 110 as in the first embodiment, but the body 100 in this embodiment has an opposing plate 120c, which is disposed on two sides of the bottom plate 110 opposite to each other. The heat pipes 200, 200c extend from two sides of each of the opposing plates 120c parallel to the bottom plate 110. Specifically, a portion of the heat pipes 200c are connected between the opposing plates 120c and are stacked with the bottom plate 110, and the remaining heat pipes 200 extend from each of the opposing plates 120c to the outside of the bottom plate 110. The fin assemblies 300, 300c are respectively arranged on two sides of each vertical plate 120c, that is, a part of the fin assemblies 300c are arranged between the two vertical plates 120c, and the remaining fin assemblies 300 are respectively arranged on two opposite sides outside the bottom plate 110. Moreover, each heat pipe 200, 200c is respectively connected in series with the corresponding fin assemblies 300, 300c. This embodiment allows the heat pipes 200, 200c and the fin assemblies 300, 300c to extend to the maximum in a direction parallel to the bottom plate 110.

Referring to the fifth embodiment of the present disclosure shown in FIG. 8 , the structure of the three-dimensional temperature equalizing plate heat sink of this embodiment is roughly the same as that of the first embodiment, but according to the heat dissipation requirements, a heat pipe 200a and a fin assembly 300a can be set on the top surface of the base plate 110 to directly dissipate the heat energy of the base plate 110.

The above is only the preferred embodiment of the present invention and is not intended to limit the patent scope of the present invention. Other equivalent variations that utilize the patent spirit of the present invention should all fall within the patent scope of the present invention.

100: body 101: first chamber 102: second chamber 103: buffer space 110: bottom plate 120,120a,120b,120c: vertical plate 111: first capillary structure 121: second capillary structure 200,200a,200b,200c: heat pipe 201,201c: third capillary structure 300,300a,300b,300c: fin assembly

FIG. 1 is a three-dimensional schematic diagram of a three-dimensional temperature averaging plate heat dissipation device according to a first embodiment of the present disclosure.

FIG. 2 is a schematic diagram of a three-dimensional exploded view of the three-dimensional temperature averaging plate heat dissipation device according to the first embodiment of the present disclosure.

FIG. 3 and FIG. 4 are cross-sectional views of the three-dimensional temperature averaging plate heat sink of the first embodiment of the present disclosure.

FIG. 5 is a cross-sectional view of a three-dimensional temperature averaging plate heat sink according to a second embodiment of the present disclosure.

FIG6 is a cross-sectional view of a three-dimensional temperature averaging plate heat sink according to a third embodiment of the present disclosure.

FIG. 7 is a cross-sectional view of a three-dimensional temperature averaging plate heat sink according to a fourth embodiment of the present disclosure.

FIG8 is a cross-sectional view of a three-dimensional temperature averaging plate heat sink according to a fifth embodiment of the present disclosure.

100:Entity

110: Base plate

120: Vertical board

200: Heat pipe

300: Fin assembly

Claims (11)

A three-dimensional temperature-averaging plate heat dissipation device comprises: A body, comprising a bottom plate and a vertical plate, the vertical plate being vertically arranged on the bottom plate, a first chamber being formed in the inner periphery of the bottom plate, a second chamber being formed in the inner periphery of the vertical plate, and the first chamber being connected to the second chamber; A heat pipe extending from one side of the vertical plate and the heat pipe being connected to the second chamber; A fin assembly being arranged on the heat pipe; and A working fluid being filled in the bottom plate in a liquid state, and being able to flow to the vertical plate and the heat pipe when the working fluid vaporizes. In the three-dimensional temperature equalizing plate cooling device as described in claim 1, the heat pipe is parallel to the base plate. As described in claim 1, the three-dimensional temperature equalizing plate heat dissipation device, wherein the inner wall of the base plate is provided with a first capillary structure. As described in claim 3, the three-dimensional temperature-averaging plate heat dissipation device, wherein a second capillary structure is attached to the inner wall of the vertical plate, and the first capillary structure is connected to the second capillary structure. In the three-dimensional temperature-averaging plate heat dissipation device as described in claim 4, a third capillary structure is attached to the inner wall of the heat pipe, and the second capillary structure is connected to the third capillary structure. A three-dimensional temperature-averaging plate heat sink as described in claim 1, wherein the second chamber extends a buffer space. A three-dimensional temperature-averaging plate heat dissipation device as described in claim 6, wherein the first chamber is connected to the buffer space. A three-dimensional temperature-averaging plate heat dissipation device as described in claim 1, wherein the vertical plate is arranged on one side of the edge of the base plate. A three-dimensional temperature-averaging plate cooling device as described in claim 1, wherein another heat pipe extends from one side of the base plate and the other heat pipe is connected to the first chamber. A three-dimensional temperature-averaging plate heat dissipation device as described in claim 9, wherein another fin assembly is disposed on the other heat pipe. A three-dimensional temperature equalizing plate heat dissipation device as described in claim 1, wherein the main body includes another vertical plate, the vertical plate and the other vertical plate are vertically arranged on the bottom plate and are arranged on two sides of the bottom plate opposite to the ground, and the heat pipe is connected between the vertical plate and the other vertical plate.