TWI876895B - Liquid cooling system and electronic device - Google Patents

Abstract

An electronic device is configured to accommodate a first cooling liquid and a second cooling liquid, and includes a heat source and a liquid cooling system. The liquid cooling system includes a liquid cooling cavity and a three-dimensional heat transfer device. The liquid cooling cavity is configured to accommodate the first cooling liquid. The three-dimensional heat transfer device is disposed in the liquid cooling cavity, and configured to accommodate the second cooling liquid. The three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber is thermally coupled to the heat source via the liquid cooling cavity, and the at least one heat pipe is disposed on the vapor chamber.

Description

Liquid cooling system and electronic devices

The present invention relates to an electronic device, in particular to an electronic device with a liquid cooling system.

Vapor chamber is a liquid cooling device, and its technical principle is similar to that of heat pipe, but there are some differences in the conduction method. Heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber vapor chamber is conducted on a two-dimensional surface, so it is more efficient. Specifically, the vapor chamber mainly includes a cavity and a capillary structure. The cavity has a hollow chamber inside, and the hollow chamber is used to fill the working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity that dissipates heat is called the condensation zone. The working fluid absorbs heat in the evaporation zone, vaporizes and quickly expands to the entire cavity. In the condensation zone, heat is released and condenses into liquid. Then, the liquid working fluid returns to the evaporation zone through the capillary structure, forming a cooling cycle.

Generally speaking, in most liquid cooling devices, the temperature spreader and the heat pipe operate independently, resulting in only planar or linear heat transfer for each temperature spreader or heat pipe, rather than overall three-dimensional heat transfer, so that the heat dissipation effect has not been fully exerted. At present, some manufacturers have integrated the temperature spreader and the heat pipe to produce a heat transfer device that can transfer heat in three dimensions. However, the heat transfer efficiency of the current three-dimensional heat transfer device is still insufficient, so that the heat dissipation efficiency does not meet the needs of users. Therefore, how to further improve the heat dissipation efficiency of the liquid cooling device is one of the problems that researchers should solve.

The present invention provides a liquid cooling heat dissipation system and an electronic device to further improve the heat dissipation efficiency of the liquid cooling heat dissipation system.

The liquid cooling heat dissipation system disclosed in one embodiment of the present invention is used to accommodate a first cooling fluid and a second cooling fluid, and is thermally coupled to a heat source. The liquid cooling heat dissipation system includes a liquid cooling chamber and a three-dimensional heat transfer device. The liquid cooling chamber is used to accommodate the first cooling fluid. The three-dimensional heat transfer device is arranged in the liquid cooling chamber and is used to accommodate the second cooling fluid. The three-dimensional heat transfer device includes a temperature averaging plate and at least one heat pipe. The temperature averaging plate is used to thermally couple to the heat source through the liquid cooling chamber, and at least one heat pipe is arranged on the temperature averaging plate.

Another embodiment of the present invention discloses an electronic device for accommodating a first cooling fluid and a second cooling fluid, and includes a heat source and a liquid cooling heat dissipation system. The liquid cooling heat dissipation system includes a liquid cooling cavity and a three-dimensional heat transfer device. The liquid cooling cavity is used to accommodate the first cooling fluid. The three-dimensional heat transfer device is arranged in the liquid cooling cavity and is used to accommodate the second cooling fluid. The three-dimensional heat transfer device includes a temperature averaging plate and at least one heat pipe. The temperature averaging plate is thermally coupled to the heat source through the liquid cooling cavity, and at least one heat pipe is arranged on the temperature averaging plate.

According to the liquid cooling heat dissipation system and electronic device of the above-mentioned embodiment, since the three-dimensional heat transfer device is disposed in the liquid cooling cavity and together constitutes the liquid cooling heat dissipation system, in addition to cooling the heat source through the cooling circulation of the second cooling fluid in the three-dimensional heat transfer device, the heat absorbed by the heat source by the second cooling fluid can also be further taken away through the flow of the first cooling fluid in the liquid cooling cavity. In this way, the heat dissipation efficiency of the liquid cooling heat dissipation system can be improved.

The above description of the content of the present invention and the following description of the implementation method are used to demonstrate and explain the principle of the present invention and provide a further explanation of the scope of the patent application of the present invention.

Please refer to Figures 1 to 3. Figure 1 is a three-dimensional schematic diagram of an electronic device according to the first embodiment of the present invention with the heat source omitted. Figure 2 is a cross-sectional schematic diagram of the electronic device of Figure 1. Figure 3 is a top view schematic diagram of a three-dimensional heat transfer device of the electronic device of Figure 1.

The electronic device 10 of this embodiment is used to accommodate a first cooling fluid (not shown) and a second cooling fluid (not shown). The first cooling fluid and the second cooling fluid are cooling fluids such as water. The electronic device 10 includes a heat source 11, a liquid cooling heat dissipation system 12, and a thermal interface material (TIM) 13. The heat source 11 is, for example, a central processing unit (CPU), but is not limited thereto.

The liquid cooling heat dissipation system 12 includes a liquid cooling chamber 121 and a three-dimensional heat transfer device 122. The liquid cooling chamber 121 is used to accommodate the first cooling fluid, and includes a chamber body 1211 and a top plate 1212. The top plate 1212 is disposed on the chamber body 1211. The chamber body 1211 and the top plate 1212 together surround a containing space S. The liquid cooling chamber 121 has a liquid inlet 1213 and a liquid outlet 1214. The liquid inlet 1213 and the liquid outlet 1214 are located on the top plate 1212 and are connected to the containing space S. In other words, the first cooling fluid enters and exits the containing space S through the liquid inlet 1213 and the liquid outlet 1214 of the top plate 1212. The three-dimensional heat transfer device 122 is located at one side of the accommodating space S away from the top plate 1212 and is used to accommodate the second cooling fluid, and the first cooling fluid and the second cooling fluid are not in contact with each other.

The three-dimensional heat transfer device 122 includes a temperature averaging plate 1221 and a plurality of heat pipes 1222. The temperature averaging plate 1221 is thermally coupled to the heat source 11 through the liquid cooling cavity 121. The so-called thermal coupling refers to thermal contact or connection through other heat conductive media. In addition, a thermal interface material 13 is applied between the liquid cooling cavity 121 and the heat source 11 to further transfer the heat generated by the heat source 11 to the temperature averaging plate 1221. These heat pipes 1222 are disposed on the temperature averaging plate 1221 and arranged in an array. For example, these heat pipes 1222 can be arranged in arrays such as 3×4, 3×5, 2×6, etc., but are not limited thereto. In this way, the heat dissipation efficiency can be improved by arranging these heat pipes 1222 in an array. The heat pipes 1222 are, for example, round tubes, and the radius R1 of the heat pipes 1222 is, for example, 2 mm.

In this embodiment, the liquid cooling heat dissipation system 12 may further include a plurality of fins 123. The fins 123 are disposed on the heat pipes 1222 of the three-dimensional heat transfer device 122 to further improve the heat dissipation efficiency of the liquid cooling heat dissipation system 12. The thickness T1 of the fins 123 is, for example, 0.2 mm, and the distance D1 between the fins 123 is, for example, 0.3 mm, but the present invention is not limited thereto.

In this embodiment, the three-dimensional heat transfer device 122 may also be provided with a capillary structure 124. By providing the capillary structure 124, the second cooling fluid can absorb the heat of the heat source 11 and evaporate, and then flow back to the temperature equalizing plate 1221 through the capillary structure 124.

In this embodiment, since the three-dimensional heat transfer device 122 is disposed in the liquid cooling cavity 121 and together constitutes the liquid cooling heat dissipation system 12, in addition to cooling the heat source 11 through the cooling cycle of the second cooling fluid in the three-dimensional heat transfer device 122, the heat of the second cooling fluid self-absorbed from the heat source 11 can also be further taken away through the flow of the first cooling fluid in the liquid cooling cavity 121. In this way, the heat dissipation efficiency of the liquid cooling heat dissipation system 12 can be improved.

In this embodiment, the number of heat pipes 1222 is multiple, but not limited to this. In other embodiments, the number of heat pipes can also be only single.

In the present embodiment, these heat pipes 1222 are round tubes, but are not limited thereto. In other embodiments, these heat pipes may also be flat tubes or other forms of heat pipes.

Please refer to Figures 4 and 5 together. Figure 4 is a cross-sectional schematic diagram of the first cooling fluid and the second cooling fluid flowing in the liquid cooling heat dissipation system in the electronic device of Figure 1. Figure 5 is a partially enlarged cross-sectional schematic diagram of the first cooling fluid and the second cooling fluid flowing in the liquid cooling heat dissipation system in the electronic device of Figure 1.

In this embodiment, when the heat generated by the heat source 11 is transferred to the temperature averaging plate 1221 through the liquid cooling chamber 121, the liquid second cooling fluid in the temperature averaging plate 1221 absorbs the heat and vaporizes into a gas state, and flows to the heat pipes 1222 along direction A. At the same time, the first cooling fluid flows into the accommodating space S from the liquid inlet 1213 along direction B, and flows through the heat pipes 1222 along direction C to cool the gaseous second cooling fluid. Then, the first cooling fluid flows out of the accommodating space S through the liquid outlet 1214 along direction D.

At this time, the gaseous second cooling fluid is cooled by the first cooling fluid and condensed into liquid, and flows back to the temperature equalizing plate 1221 through the capillary structure 124 along the direction E to the direction H. In this way, the heat source 11 can be dissipated through the cooling cycle of the second cooling fluid in the three-dimensional heat transfer device 122 and the flow of the first cooling fluid in the liquid cooling chamber 121.

According to the liquid cooling heat dissipation system and electronic device of the above-mentioned embodiment, since the three-dimensional heat transfer device is disposed in the liquid cooling cavity and together constitutes the liquid cooling heat dissipation system, in addition to cooling the heat source through the cooling circulation of the second cooling fluid in the three-dimensional heat transfer device, the heat absorbed by the heat source by the second cooling fluid can also be further taken away through the flow of the first cooling fluid in the liquid cooling cavity. In this way, the heat dissipation efficiency of the liquid cooling heat dissipation system can be improved.

Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone skilled in similar techniques may make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be subject to the scope of the patent application attached to this specification.

10: Electronic device 11: Heat source 12: Liquid cooling system 121: Liquid cooling chamber 1211: Chamber body 1212: Top plate 1213: Liquid inlet 1214: Liquid outlet 122: Three-dimensional heat transfer device 1221: Temperature plate 1222: Heat pipe 123: Fin 124: Capillary structure 13: Thermal interface material A~H: Direction D1: Spacing R1: Radius S: Accommodation space T1: Thickness

FIG. 1 is a three-dimensional schematic diagram of an electronic device according to the first embodiment of the present invention with a heat source omitted. FIG. 2 is a cross-sectional schematic diagram of the electronic device of FIG. 1 . FIG. 3 is a top view schematic diagram of a three-dimensional heat transfer device of the electronic device of FIG. 1 . FIG. 4 is a cross-sectional schematic diagram of the first cooling fluid and the second cooling fluid flowing in the liquid cooling heat dissipation system in the electronic device of FIG. 1 . FIG. 5 is a partially enlarged cross-sectional schematic diagram of the first cooling fluid and the second cooling fluid flowing in the liquid cooling heat dissipation system in the electronic device of FIG. 1 .

10: Electronic devices

11: Heat source

12: Liquid cooling system

121: Liquid cooling chamber

1211: Cavity body

1212: Top plate

1213: Liquid inlet

1214: Liquid outlet

122: Three-dimensional heat transfer device

1221: Temperature balancing board

1222: Heat pipe

123: Fins

124: Capillary structure

13: Thermal interface materials

D1: Spacing

S: Storage space

T1:Thickness

Claims (10)

A liquid cooling heat dissipation system is used to accommodate a first cooling fluid and a second cooling fluid and is thermally coupled to a heat source. The liquid cooling heat dissipation system includes: A liquid cooling cavity for accommodating the first cooling fluid; and a three-dimensional heat transfer device, disposed in the liquid cooling cavity and used to accommodate the second cooling fluid, the three-dimensional heat transfer device comprising a temperature averaging plate and at least one heat pipe, the temperature averaging plate is used to thermally couple to the heat source through the liquid cooling cavity, and the at least one heat pipe is disposed on the temperature averaging plate; wherein, when the liquid cooling cavity is used to transfer the heat generated by the heat source to the temperature averaging plate, the liquid second cooling fluid located in the temperature averaging plate absorbs the heat and vaporizes into a gaseous state, and flows to the at least one heat pipe, and the first cooling fluid flows through the at least one heat pipe to cool the gaseous second cooling fluid. A liquid cooling heat dissipation system as described in claim 1, wherein the liquid cooling cavity has a accommodating space, a liquid inlet and a liquid outlet, the three-dimensional heat transfer device is located in the accommodating space, and the liquid inlet and the liquid outlet are connected to the accommodating space. A liquid cooling heat dissipation system as described in claim 2, wherein the liquid cooling cavity includes a cavity body and a top plate, the top plate is arranged on one side of the cavity body and away from the three-dimensional heat transfer device, and the cavity body and the top plate together surround the accommodating space, and the liquid inlet and the liquid outlet are located on the top plate. The liquid cooling heat dissipation system as described in claim 1 further comprises a plurality of fins, wherein the fins are arranged on at least one heat pipe of the three-dimensional heat transfer device. A liquid cooling system as described in claim 4, wherein the thickness of the fins is 0.2 mm. A liquid cooling system as described in claim 4, wherein the spacing between the fins is 0.3 mm. A liquid cooling heat dissipation system as described in claim 1, wherein at least one heat pipe is a circular tube. A liquid cooling heat dissipation system as described in claim 1, wherein the radius of at least one heat pipe is 2 mm. A liquid cooling heat dissipation system as described in claim 1, wherein the number of the at least one heat pipe is multiple and the heat pipes are arranged in an array. An electronic device for accommodating a first cooling fluid and a second cooling fluid, the electronic device comprising: A heat source; and a liquid cooling heat dissipation system, comprising: a liquid cooling chamber for accommodating the first cooling fluid; and a three-dimensional heat transfer device, disposed in the liquid cooling chamber and for accommodating the second cooling fluid, the three-dimensional heat transfer device comprising a temperature averaging plate and at least one heat pipe, the temperature averaging plate is thermally coupled to the heat source through the liquid cooling chamber, and the at least one heat pipe is disposed on the temperature averaging plate; wherein, when the liquid cooling chamber transfers the heat generated by the heat source to the temperature averaging plate, the liquid second cooling fluid in the temperature averaging plate absorbs the heat and vaporizes into a gaseous state, and flows to the at least one heat pipe, and the first cooling fluid flows through the at least one heat pipe to cool the gaseous second cooling fluid.