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TWI799618B - 切割用黏著帶及半導體晶片之製造方法 - Google Patents

切割用黏著帶及半導體晶片之製造方法 Download PDF

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Publication number
TWI799618B
TWI799618B TW108125200A TW108125200A TWI799618B TW I799618 B TWI799618 B TW I799618B TW 108125200 A TW108125200 A TW 108125200A TW 108125200 A TW108125200 A TW 108125200A TW I799618 B TWI799618 B TW I799618B
Authority
TW
Taiwan
Prior art keywords
dicing
adhesive tape
semiconductor wafer
manufacturing semiconductor
manufacturing
Prior art date
Application number
TW108125200A
Other languages
English (en)
Other versions
TW202020094A (zh
Inventor
増田晃良
下田敬之
酒井貴広
Original Assignee
日商麥克賽爾股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商麥克賽爾股份有限公司 filed Critical 日商麥克賽爾股份有限公司
Publication of TW202020094A publication Critical patent/TW202020094A/zh
Application granted granted Critical
Publication of TWI799618B publication Critical patent/TWI799618B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Led Device Packages (AREA)
TW108125200A 2018-09-03 2019-07-17 切割用黏著帶及半導體晶片之製造方法 TWI799618B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-164411 2018-09-03
JP2018164411 2018-09-03

Publications (2)

Publication Number Publication Date
TW202020094A TW202020094A (zh) 2020-06-01
TWI799618B true TWI799618B (zh) 2023-04-21

Family

ID=69721630

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108125200A TWI799618B (zh) 2018-09-03 2019-07-17 切割用黏著帶及半導體晶片之製造方法

Country Status (5)

Country Link
JP (2) JP7374909B2 (zh)
KR (1) KR102632461B1 (zh)
CN (1) CN112602172B (zh)
TW (1) TWI799618B (zh)
WO (1) WO2020050167A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021124725A1 (ja) * 2019-12-19 2021-06-24 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
KR102841521B1 (ko) * 2019-12-20 2025-08-04 맥셀 주식회사 다이싱용 점착 테이프 및 반도체칩의 제조 방법
EP4144808A4 (en) 2020-04-30 2024-06-05 Shin-Etsu Chemical Co., Ltd. TEMPORARY ADHESIVE FOR WAFER PROCESSING, WAFER LAMINATE AND METHOD FOR PRODUCING A THIN WAFER
JP7560991B2 (ja) * 2020-10-15 2024-10-03 日鉄ケミカル＆マテリアル株式会社 接着剤層形成用組成物、積層体の製造方法および処理方法
CN113320036B (zh) * 2021-06-18 2024-02-13 常州时创能源股份有限公司 条状硅材的开方截断工艺及其应用
JPWO2024210000A1 (zh) * 2023-04-06 2024-10-10

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952397A (en) * 1996-09-25 1999-09-14 Shin-Etsu Chemical Co., Ltd. Photo-curable liquid silicone rubber compositions for templating mother molds
TW201520295A (zh) * 2013-08-30 2015-06-01 日立麥克賽爾股份有限公司 切割用黏著帶及半導體晶片之製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4171898B2 (ja) 2003-04-25 2008-10-29 信越化学工業株式会社 ダイシング・ダイボンド用接着テープ
JP2005093503A (ja) 2003-09-12 2005-04-07 Hitachi Cable Ltd ダイシング方法
JP2013038408A (ja) 2011-07-14 2013-02-21 Nitto Denko Corp 半導体ウェハ固定用粘着テープ、半導体チップの製造方法及び接着フィルム付き粘着テープ
JP5053455B1 (ja) 2011-10-28 2012-10-17 古河電気工業株式会社 半導体加工用ダイシングテープ
JP5880399B2 (ja) 2012-11-13 2016-03-09 信越化学工業株式会社 シリコーンゴム成形物の製造方法
KR20150112851A (ko) 2014-03-28 2015-10-07 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 점착제 조성물, 그의 제조 방법 및 점착 필름
JP6395597B2 (ja) * 2014-12-25 2018-09-26 マクセルホールディングス株式会社 ダイシング用粘着テープおよび半導体チップの製造方法
US9777203B2 (en) * 2015-06-08 2017-10-03 Momentive Performance Materials Silicone pressure sensitive adhesive compositions and protective films containing the same
JP6743377B2 (ja) 2015-12-01 2020-08-19 三菱ケミカル株式会社 離型フィルム付粘着物品の製造方法、及び光学装置構成用積層体の製造方法
US20200164613A1 (en) 2016-09-26 2020-05-28 Dow Corning Toray Co., Ltd. Laminate, method of manufacturing the same, and method of manufacturing electronic component

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5952397A (en) * 1996-09-25 1999-09-14 Shin-Etsu Chemical Co., Ltd. Photo-curable liquid silicone rubber compositions for templating mother molds
TW201520295A (zh) * 2013-08-30 2015-06-01 日立麥克賽爾股份有限公司 切割用黏著帶及半導體晶片之製造方法

Also Published As

Publication number Publication date
TW202020094A (zh) 2020-06-01
KR20210056334A (ko) 2021-05-18
JPWO2020050167A1 (ja) 2021-08-26
JP2023138530A (ja) 2023-10-02
JP7558346B2 (ja) 2024-09-30
JP7374909B2 (ja) 2023-11-07
WO2020050167A1 (ja) 2020-03-12
CN112602172A (zh) 2021-04-02
KR102632461B1 (ko) 2024-02-02
CN112602172B (zh) 2024-10-15

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