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TWI787295B - 密封用樹脂組成物、半導體封裝及半導體封裝的製造方法 - Google Patents

密封用樹脂組成物、半導體封裝及半導體封裝的製造方法 Download PDF

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Publication number
TWI787295B
TWI787295B TW107122574A TW107122574A TWI787295B TW I787295 B TWI787295 B TW I787295B TW 107122574 A TW107122574 A TW 107122574A TW 107122574 A TW107122574 A TW 107122574A TW I787295 B TWI787295 B TW I787295B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
sealing
resin composition
mass
type epoxy
Prior art date
Application number
TW107122574A
Other languages
English (en)
Chinese (zh)
Other versions
TW201905025A (zh
Inventor
平井友貴
井上英俊
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW201905025A publication Critical patent/TW201905025A/zh
Application granted granted Critical
Publication of TWI787295B publication Critical patent/TWI787295B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/28—Di-epoxy compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/308—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing halogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H10W74/01—
    • H10W74/10—
    • H10W74/40—
    • H10W74/473—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW107122574A 2017-06-29 2018-06-29 密封用樹脂組成物、半導體封裝及半導體封裝的製造方法 TWI787295B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-127851 2017-06-29
JP2017127851 2017-06-29

Publications (2)

Publication Number Publication Date
TW201905025A TW201905025A (zh) 2019-02-01
TWI787295B true TWI787295B (zh) 2022-12-21

Family

ID=64741610

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107122574A TWI787295B (zh) 2017-06-29 2018-06-29 密封用樹脂組成物、半導體封裝及半導體封裝的製造方法
TW111145423A TWI839971B (zh) 2017-06-29 2018-06-29 密封用樹脂組成物、半導體封裝及半導體封裝的製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW111145423A TWI839971B (zh) 2017-06-29 2018-06-29 密封用樹脂組成物、半導體封裝及半導體封裝的製造方法

Country Status (5)

Country Link
JP (1) JP7231833B2 (ja)
KR (1) KR102795674B1 (ja)
CN (1) CN110709443A (ja)
TW (2) TWI787295B (ja)
WO (1) WO2019004457A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117736550A (zh) * 2022-09-15 2024-03-22 华为技术有限公司 树脂组合物及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08240809A (ja) * 1995-03-02 1996-09-17 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子
JPH1129624A (ja) * 1997-07-09 1999-02-02 Toshiba Corp 半導体封止用液状エポキシ樹脂組成物
TW201716501A (zh) * 2015-08-03 2017-05-16 日立化成股份有限公司 環氧樹脂組成物、薄膜狀環氧樹脂組成物及電子裝置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002194053A (ja) * 2000-12-22 2002-07-10 Shin Etsu Chem Co Ltd 半導体スクリーン印刷封止用液状エポキシ樹脂組成物
JP2006299247A (ja) * 2005-03-25 2006-11-02 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP5210011B2 (ja) * 2008-03-18 2013-06-12 積水化学工業株式会社 電子部品用接着剤
JP2011057617A (ja) * 2009-09-10 2011-03-24 Nissan Chem Ind Ltd ジカルボン酸化合物及びそれを含有した熱硬化性樹脂組成物
WO2011039879A1 (ja) * 2009-10-01 2011-04-07 株式会社Ｉｈｉエアロスペース 繊維強化プラスチック用のマトリックス樹脂組成物及び繊維強化プラスチック構造体
JP5555532B2 (ja) * 2010-04-22 2014-07-23 積水化学工業株式会社 有機ｅｌ素子用封止剤及び有機ｅｌ素子
JP2013028659A (ja) * 2011-07-26 2013-02-07 Hitachi Chemical Co Ltd アンダーフィル用エポキシ樹脂液状封止材及びこれを用いた電子部品装置
JP5862176B2 (ja) * 2011-10-06 2016-02-16 日立化成株式会社 液状エポキシ樹脂組成物の選択方法及び製造方法、並びに電子部品装置の製造方法
JP2013163747A (ja) * 2012-02-10 2013-08-22 Sumitomo Bakelite Co Ltd 半導体封止用液状樹脂組成物及び半導体装置
JP6969729B2 (ja) 2014-12-12 2021-11-24 ナミックス株式会社 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08240809A (ja) * 1995-03-02 1996-09-17 Sumitomo Bakelite Co Ltd 液晶表示素子用シール材組成物及びそれを用いた液晶表示素子
JPH1129624A (ja) * 1997-07-09 1999-02-02 Toshiba Corp 半導体封止用液状エポキシ樹脂組成物
TW201716501A (zh) * 2015-08-03 2017-05-16 日立化成股份有限公司 環氧樹脂組成物、薄膜狀環氧樹脂組成物及電子裝置

Also Published As

Publication number Publication date
KR102795674B1 (ko) 2025-04-11
TW202313756A (zh) 2023-04-01
JP7231833B2 (ja) 2023-03-02
KR20200023312A (ko) 2020-03-04
TWI839971B (zh) 2024-04-21
WO2019004457A1 (ja) 2019-01-03
CN110709443A (zh) 2020-01-17
TW201905025A (zh) 2019-02-01
JPWO2019004457A1 (ja) 2020-05-21

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