TWI787295B - Resin composition for encapsulation, semiconductor package and method of producing semiconductor package - Google Patents

Abstract

A resin composition for encapsulation, comprising an epoxy resin, a curing agent and a filler, the epoxy resin comprising a bisphenol epoxy resin and 1,6-bis(glycidyloxy)naphthalane, wherein a content of the 1,6-bis(glycidyloxy)naphthalane in the total epoxy resin is from 10% by mass to 30% by mass.

Description

Resin composition for sealing, semiconductor package, and semiconductor package manufacturing method

The invention relates to a resin composition for sealing, a semiconductor package and a manufacturing method of the semiconductor package.

Previously, the main performance improvement direction of the liquid sealing material (underfill material) used in the flip-chip semiconductor mounting technology is how to maintain the reliability of the semiconductor package at a high level and cope with the wiring pattern. Narrow pitch (fine pitch) (improve injectability) and many other requirements. For example, Patent Document 1 describes a liquid sealing material, which achieves good injectability and fillet crack after sealing by blending a specific amount of aminophenol epoxy resin into bisphenol epoxy resin. ) suppression.

[Prior art literature]

[Patent Document]

[Patent Document 1] International Publication No. 2016/093148

In recent years, along with the increase in size of semiconductor packages, there is a tendency that the sealing area also increases. Along with this, there is an increased possibility that the increase in stress generated between the sealing portion and the substrate inside the package will affect the reliability of the package. Therefore, it is considered that the importance of the design of the sealing material from the viewpoint of suppressing the stress generated inside the package will increase in the future.

In view of the above circumstances, an object of the present invention is to provide an encapsulating resin composition having excellent injectability and an excellent effect of suppressing stress generated inside a package, a semiconductor package using the encapsulating resin composition, and a method of manufacturing the same.

Means for solving the above-mentioned problems include the following implementation aspects.

<1> A resin composition for sealing, which includes an epoxy resin, a hardener, and a filler, and the epoxy resin includes a bisphenol-type epoxy resin and 1,6-bis(glycidyloxy)naphthalene, and the The proportion of 1,6-bis(glycidyloxy)naphthalene in the entire epoxy resin is 10% by mass to 30% by mass.

<2> The resin composition for sealing according to <1>, wherein the bisphenol-type epoxy resin includes a bisphenol F-type epoxy resin.

<3> The resin composition for sealing according to <1> or <2>, wherein the ratio of the bisphenol-type epoxy resin to the entire epoxy resin is 20% by mass to 90% by mass.

<4> The sealing resin composition according to any one of <1> to <3>, wherein the epoxy resin further includes a glycidylamine-type epoxy resin.

<5> The sealing resin composition according to <4>, wherein the glycidylamine epoxy resin includes a trifunctional or higher glycidylamine epoxy resin.

<6> The resin composition for sealing according to <4> or <5>, wherein the ratio of the glycidylamine-type epoxy resin to the entire epoxy resin is 10% by mass to 60% by mass .

<7> A semiconductor package comprising: a support, a semiconductor element arranged on the support, and the sealing resin according to any one of <1> to <6> for sealing the semiconductor element hardening of the composition.

<8> A method of manufacturing a semiconductor package, comprising: filling a space between a support and a semiconductor element arranged on the support with the sealing resin composition according to any one of <1> to <6> and a step of hardening the sealing resin composition.

According to the present invention, there can be provided a resin composition for sealing which is excellent in injectability and has an excellent effect of suppressing stress generated inside the package, a semiconductor package obtained using the resin composition for sealing, and a method of manufacturing the same.

Hereinafter, the form for carrying out this invention is demonstrated in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values and their ranges, and do not limit the present invention.

In this disclosure, the term "step" includes a step that is independent from other steps, and even when it cannot be clearly distinguished from other steps, as long as the purpose of the step is achieved.

In the present disclosure, the numerical range represented by "~" includes the numerical values described before and after "~" as the minimum value and the maximum value, respectively.

In the numerical ranges described step by step in this disclosure, the upper limit or lower limit described in one numerical range may also be replaced by the upper limit or lower limit of other numerical ranges described step by step. In addition, in the numerical range described in this indication, the upper limit or the lower limit of the numerical range may be replaced with the value shown in an Example.

In this disclosure, a plurality of substances corresponding to each component may also be included. When a plurality of substances corresponding to each component exist in the composition, unless otherwise specified, the content or content of each component refers to the total content or content of the plurality of substances present in the composition.

In this disclosure, a plurality of particles corresponding to each component may be contained. When there are multiple types of particles corresponding to each component in the composition, unless otherwise specified, the particle size of each component refers to a value for a mixture of the plurality of types of particles present in the composition.

<Resin composition for sealing>

The sealing resin composition of the present embodiment includes an epoxy resin, a curing agent, and a filler, and the epoxy resin includes a bisphenol-type epoxy resin and 1,6-bis(glycidyloxy)naphthalene (the following formula ( 1) Epoxy resin represented; hereinafter, also referred to as specific naphthalene-type epoxy resin), and the proportion of the specific naphthalene-type epoxy resin in the entire epoxy resin is 10% by mass to 30% by mass.

The inventors of the present invention have conducted studies, and as a result, it has been found that the resin composition for sealing comprising bisphenol-type epoxy resin and The specific naphthalene-type epoxy resin is the epoxy resin, and the ratio of the specific naphthalene-type epoxy resin to the entire epoxy resin is 10% by mass to 30% by mass.

It is considered that if the thermal expansion coefficient in the cured state of the sealing resin composition is low, the difference in thermal expansion coefficient between the cured product and the support becomes small, and the effect of reducing the generated stress can be obtained. In addition, it is considered that if the elastic modulus in the cured state of the sealing resin composition is low, the effect of relieving the generated stress can be obtained.

Furthermore, in the sealing resin composition of this embodiment, the Compared with methods such as increasing the volume and adding a flexible agent, it can suppress the viscosity increase before hardening and reduce the thermal expansion rate and elastic coefficient after hardening. Therefore, it is believed that good injectability and stress reduction or relaxation effects can coexist.

The reason why the sealing resin composition having the above constitution has a low coefficient of thermal expansion and a low modulus of elasticity in a hardened state is not clear, but it is presumed that the reason is that the coefficient of thermal expansion is reduced by including a specific naphthalene-type epoxy resin as the epoxy resin. Furthermore, the modulus of elasticity is kept low by suppressing the amount of the specific naphthalene-type epoxy resin to a certain ratio or less and using bisphenol-type epoxy resin together.

The sealing resin composition is preferably liquid when used. More specifically, the preferred viscosity at 25°C (viscosity at 10 rpm) is 25Pa. below s. In addition, the preferred viscosity at 110°C is 0.12Pa. below s. The viscosity of the resin composition for sealing is a value measured by the method described in Examples described later.

[epoxy resin]

The specific naphthalene-type epoxy resin is liquid epoxy resin at normal temperature (25 degreeC), and can also be acquired as a commercial item. As a commercial item, the brand name "Epiclon (Epiclon) HP-4032D" of DIC Co., Ltd. is mentioned, for example.

From the viewpoint of reducing the coefficient of thermal expansion, the ratio of the specific naphthalene-type epoxy resin to the entire epoxy resin is 10% by mass or more, preferably 15% by mass or more. From the viewpoint of maintaining good injectability, the ratio of the specific naphthalene-type epoxy resin to the entire epoxy resin is 30% by mass or less, preferably 25% by mass or less.

The type of bisphenol epoxy resin is not particularly limited, and examples thereof include bisphenol A epoxy resin, bisphenol F epoxy resin, and bisphenol AD epoxy resin. seal The bisphenol-type epoxy resin contained in the resin composition for use may be only one kind, or may be two or more kinds. From the viewpoint of using the resin composition for sealing in a liquid state, the bisphenol-type epoxy resin is preferably liquid at normal temperature (25° C.). The bisphenol type epoxy resin is preferably a bisphenol F type epoxy resin from the viewpoint of viscosity reduction.

The proportion of the bisphenol-type epoxy resin in the whole epoxy resin is not particularly limited, and can be selected according to the required properties of the sealing resin composition. For example, you may select from the range of 20 mass % or more and less than 90 mass %, and may select from the range of 30 mass % - 80 mass %.

The sealing resin composition may contain epoxy resins other than specific naphthalene-type epoxy resins and bisphenol-type epoxy resins.

The types of epoxy resins other than the specific naphthalene-type epoxy resin and the bisphenol-type epoxy resin are not particularly limited, and can be selected according to the required properties of the sealing resin composition. Specifically, examples include: phenol compounds such as phenol, cresol, xylenol, resorcinol, and catechol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthalene. Condensation or co-condensation of at least one phenolic compound in the composition group with aliphatic aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst to obtain a novolak resin and epoxidize the novolak resin Novolak type epoxy resin (phenol novolak type epoxy resin, o-cresol novolak type epoxy resin, etc.); Condensation or co-condensation to obtain a triphenylmethane type phenol resin and triphenylmethane type epoxy resin obtained by epoxidizing the triphenylmethane type phenol resin; making the phenol compound and naphthol compound and aldehyde compound Cocondensation under an acidic catalyst to obtain novolac Copolymer epoxy resin obtained by epoxidizing the novolak resin with resin; biphenyl type epoxy resin as diglycidyl ether of alkyl-substituted or unsubstituted biphenol; biphenyl type epoxy resin as stilbene phenol compound Stilbene-type epoxy resins of glycidyl ethers; epoxy resins containing sulfur atoms as diglycidyl ethers such as bisphenol S; rings of glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol epoxy resins; glycidyl ester type epoxy resins that are glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid; aniline, diaminodiphenylmethane, iso Glycidylamine type epoxy resin obtained by substituting active hydrogen bonded to nitrogen atom such as cyanuric acid with glycidyl group; dicyclopentadiene and phenolic compound co-condensation resin obtained by epoxidizing dicyclopentadiene Cyclopentadiene-type epoxy resins; diepoxidized vinylcyclohexene, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane obtained by epoxidizing olefin bonds in the molecule Alicyclic epoxy resins such as carboxylate, 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane; as p-xylene-modified epoxy resins as glycidyl ethers of p-xylene-modified phenolic resins; meta-xylene-modified epoxy resins as glycidyl ethers of meta-xylene-modified phenolic resins; as terpene-modified phenolic resins Terpene-modified epoxy resins of glycidyl ethers; dicyclopentadiene-modified epoxy resins of glycidyl ethers of dicyclopentadiene-modified phenol resins; Cyclopentadiene-modified epoxy resins of glyceryl ethers; polycyclic aromatic ring-modified epoxy resins as glycidyl ethers of polycyclic aromatic ring-modified phenol resins; naphthalene as glycidyl ethers of phenol resins containing naphthalene rings Halogenated phenol novolak type epoxy resins; Hydroquinone type epoxy resins; Trimethylolpropane type epoxy resins; Linear aliphatic resins obtained by oxidation of olefin bonds with peracids such as peracetic acid epoxy resin; phenol Aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenol resins such as aralkyl resins and naphthol aralkyl resins, and the like. These epoxy resins may be used alone or in combination of two or more.

In the case where the sealing resin composition contains a bisphenol-type epoxy resin and other epoxy resins as epoxy resins other than specific naphthalene-type epoxy resins, the mass ratio of the bisphenol-type epoxy resin to other epoxy resins (Bisphenol-type epoxy resin/epoxy resin other than it) is not specifically limited. For example, it can be selected from the range of 1/5~5/1.

In the case where the resin composition for sealing contains a bisphenol-type epoxy resin and other epoxy resins as epoxy resins other than specific naphthalene-type epoxy resins, from the viewpoint of using the resin composition for sealing in a liquid form, It is preferable to contain an epoxy resin which is liquid at normal temperature (25 degreeC), and it is more preferable to contain a glycidylamine type epoxy resin. From the viewpoint of reducing the viscosity of the sealing resin composition, the molecular weight of the glycidylamine epoxy resin is preferably 300 or less.

Glycidylamine-type epoxy resins may be difunctional or trifunctional or higher. From the viewpoint of improving the heat resistance after curing, glycidylamine-type epoxy resins having more than three functions (having three or more epoxy groups in one molecule) are preferable. N,N-diglycidylaniline, N,N-diglycidyl-o-toluidine, etc. are mentioned as a glycidylamine type epoxy resin more than bifunctional. Triglycidyl-p-aminophenol and 4,4'-methylenebis[N,N-bis(oxiranylmethyl)aniline are examples of glycidylamine-type epoxy resins with more than three functions. ]Wait. Among these, triglycidyl-p-aminophenol is preferred from the viewpoint of normal temperature (25° C.) viscosity.

In the case where the resin composition for sealing contains a glycidylamine-type epoxy resin as the epoxy resin, the ratio of the glycidylamine-type epoxy resin is not particularly limited. For example, it is preferable that the ratio occupied in the whole epoxy resin is 10 mass % - 60 mass %.

[hardener]

The type of curing agent is not particularly limited, and can be selected according to the required properties of the sealing resin composition and the like. For example, amine hardeners, phenol hardeners, acid anhydride hardeners, polythiol hardeners, polyaminoamide hardeners, isocyanate hardeners, blocked isocyanate hardeners, etc. are mentioned. A curing agent may be used alone or in combination of two or more.

From the viewpoint of using the sealing resin composition in a liquid form, the curing agent is preferably an amine curing agent. Examples of amine hardeners include: diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4'-diamino-dicyclohexyl Aliphatic amine compounds such as methane, 4,4'-diaminodiphenylmethane, aromatic amine compounds such as 2-methylaniline, imidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropyl imidazole compounds such as imidazole, imidazoline compounds such as imidazoline, 2-methylimidazoline, and 2-ethylimidazoline, and the like.

The equivalent ratio of the epoxy resin to the hardener, that is, the ratio of the number of functional groups in the hardener (active hydrogen in the case of an amine hardener) to the number of functional groups in the epoxy resin (number of functional groups in the hardener/ring The number of functional groups in the oxygen resin) is not particularly limited. From the viewpoint of suppressing each unreacted component to a small extent, it is preferable to set it within the range of 0.5 to 2.0, more preferably to set it within the range of 0.6 to 1.3. formability From the viewpoint of reflow resistance, it is more preferable to set it within the range of 0.8 to 1.2.

[Filler]

The type of filler is not particularly limited. Specifically, silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllium oxide, zirconia, zircon, forsterite Fosterite, steatite, spinel, mullite, titanium dioxide, talc, clay, mica and other inorganic materials. Fillers with flame retardant effects can also be used. Examples of the filler having a flame-retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, and composite hydroxides of magnesium and zinc, and zinc borate.

Among the above-mentioned fillers, silicon dioxide is preferable from the viewpoint of reducing thermal expansion coefficient, and alumina is preferable from the viewpoint of improvement of thermal conductivity. One type of filler may be used alone, or two or more types may be used in combination.

The content of the filler contained in the sealing resin composition is not particularly limited. From the standpoint of coexistence of good fluidity and curability of the filler, the content of the filler is preferably 30% by mass to 90% by mass of the entire resin composition for sealing, more preferably 50% by mass to 75% by mass. quality%.

When the filler is in the form of particles, the average particle diameter is not particularly limited. For example, the volume average particle diameter is preferably from 0.2 μm to 20 μm, more preferably from 0.5 μm to 15 μm. When the volume average particle diameter is 0.2 μm or more, the increase in the viscosity of the sealing resin composition tends to be further suppressed. When the volume average particle diameter is 20 μm or less, the filling property to narrow gaps tends to be further improved. The volume average particle size of the filler can be used as a particle size distribution measurement device by the laser scattering diffraction method In the obtained volume-based particle size distribution, the particle diameter (D50) at which the cumulative volume from the small particle diameter side becomes 50% was measured.

[Various additives]

The resin composition for sealing may contain various additives such as curing accelerators, stress relieving agents, coupling agents, mold release agents, and colorants in addition to the above-mentioned components. The resin composition for sealing may optionally contain various additives known in the art in addition to the additives exemplified below.

(hardening accelerator)

The resin composition for sealing may also contain a hardening accelerator. The type of curing accelerator is not particularly limited, and can be selected according to the type of epoxy resin and curing agent, required properties of the sealing resin composition, and the like.

When the sealing resin composition contains a hardening accelerator, the amount of the hardening accelerator is preferably 0.1 to 30 parts by mass relative to 100 parts by mass of the curable resin component (total of epoxy resin and hardener). , more preferably 1 mass part to 15 mass parts.

(stress reliever)

The resin composition for sealing may also contain a stress relieving agent. Examples of the stress relieving agent include particles of thermoplastic elastomer, natural rubber (Natural Rubber, NR), acrylonitrile butadiene rubber (acrylonitrile butadiene rubber, NBR), acrylic rubber, urethane rubber, silicone rubber, etc. Wait. The stress relieving agents may be used alone or in combination of two or more.

In the case where the resin composition for sealing contains a stress relieving agent, the stress relieving The amount of the compounding agent is preferably 0.1 to 30 parts by mass, more preferably 1 to 15 parts by mass, based on 100 parts by mass of the curable resin component (total of the epoxy resin and the curing agent).

(coupling agent)

The sealing resin composition may also contain a coupling agent. Examples of the coupling agent include silane compounds such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, and vinylsilane, titanium compounds, aluminum chelate compounds, aluminum/zirconium compounds, and the like. Among these, silane compounds are preferable from the viewpoint of fluidity. One type of coupling agent may be used alone, or two or more types may be used in combination.

When the sealing resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 to 5 parts by mass, more preferably 0.1 to 2.5 parts by mass, relative to 100 parts by mass of the filler.

(Colorant)

The sealing resin composition may also contain a colorant. Examples of the colorant include carbon black, organic dyes, organic pigments, titanium oxide, red lead, and iron oxide. A coloring agent may be used individually by 1 type, and may use it in combination of 2 or more types.

When the sealing resin composition contains a colorant, the amount of the colorant is preferably 0.01 parts by mass to 10 parts by mass relative to 100 parts by mass of the curable resin component (total of epoxy resin and hardener), and more preferably Preferably, it is 0.1 mass part - 5 mass parts.

(Use of resin composition for sealing)

The resin composition for sealing can be used in various installation techniques. In particular, preferably It is used as an underfill material used in flip chip type mounting technology. For example, it can be suitably used for filling the gap between the semiconductor element bonded by bumps etc., and a support body.

The types of semiconductor elements and supports are not particularly limited, and can be selected from those commonly used in the field of semiconductor packaging. The method of filling the gap between the semiconductor element and the support with the sealing resin composition is not particularly limited. For example, a dispenser etc. can be used and it can carry out by a well-known method.

<Semiconductor package>

The semiconductor package according to this embodiment includes a support, a semiconductor element disposed on the support, and a cured product of the sealing resin composition that seals the semiconductor element.

In the semiconductor package, the types of the semiconductor element and the support are not particularly limited, and can be selected from common users in the field of semiconductor packaging. In the above-mentioned semiconductor package, the cured product of the sealing resin composition has a low coefficient of thermal expansion and a low modulus of elasticity. Therefore, when stress occurs between the cured product of the sealing resin composition and the support, the effect of suppressing the stress is excellent.

<Manufacturing method of semiconductor package>

The method for manufacturing a semiconductor package according to this embodiment includes: filling a gap between a support and a semiconductor element disposed on the support with the sealing resin composition; and curing the sealing resin composition. A step of.

In the method, the types of the semiconductor element and the support are not particularly limited, and can be selected from common users in the field of semiconductor packaging. use seal The method of filling the gap between the semiconductor element and the support with the resin composition and the method of curing the sealing resin composition after filling are not particularly limited, and known methods can be used.

[Example]

Hereinafter, although the said embodiment is demonstrated concretely using an Example, the range of the said embodiment is not limited to these Examples.

(Preparation of resin composition for sealing)

The components shown in Table 1 were mixed in the amounts shown in Table 1 to prepare a sealing resin composition. The details of each component are as follows. "eq" in Table 1 represents the ratio based on the equivalent of the curing agent (the total of the curing agent 1 and the curing agent 2 is 1). The "mass %" of the filler represents the ratio to the entire resin composition for sealing.

Epoxy resin 1...Liquid bisphenol F epoxy resin, trade name "YDF-8170C", Nippon Steel & Sumikin Chemical Co., Ltd.

Epoxy resin 2...Triglycidyl-p-aminophenol, trade name "jER 630", Mitsubishi Chemical Corporation

Epoxy resin 3...1,6-bis(glycidyloxy)naphthalene, trade name "EPICLON (EPICLON) HP-4032D", DIC Co., Ltd.

Curing agent 1 - Liquid curing agent containing diethyltoluenediamine, brand name "jER Cure W", Mitsubishi Chemical Corporation

Curing agent 2...Liquid curing agent containing 3,3'-diethyl-4,4'-diaminodiphenylmethane, trade name "KAVAHARD AA", Nippon Kayaku Co., Ltd. company

Filler...High-purity synthetic spherical silica, trade name "SE2200-SEJ", average particle size: 0.5μm, Admatechs Co., Ltd.

Coupling agent...3-Glycidoxypropyltrimethoxysilane, trade name "KBM-403", Shin-Etsu Chemical Co., Ltd.

(Evaluation of flow characteristics)

Using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd., Visconic (VISCONIC) EHD type (trade name)) (cone angle 3°, rotation speed: 10 revolutions/minute), measure the viscosity of the resin composition for sealing at 25°C. Viscosity (Pa.s). The results are shown in Table 1.

The viscosity (Pa·s) of the sealing resin composition at 110° C. was measured on a 40 mm parallel plate and a shear rate of 32.5 (l/s) using AR2000 (TA Instruments). The results are shown in Table 1.

(injective evaluation)

A gap of 25 μm was provided on the glass substrate, and a test piece in which a glass plate (20 mm×20 mm) was fixed instead of a semiconductor element was prepared. Next, the test piece was placed on a heating plate set at 110° C., the sealing resin composition was applied to one end side of the glass plate, and the time until the gap was filled with the sealing resin composition was measured (seconds/sec. ). The results are shown in Table 1.

(Evaluation of hardened product properties)

The coefficient of thermal expansion (ppm/°C), modulus of elasticity (GPa), and glass transition temperature (°C) of the cured product obtained by curing the resin composition for sealing were measured by the following methods. The results are shown in Table 1.

(Measurement method of thermal expansion coefficient)

Using a thermomechanical analyzer (TMA2940, TA Instruments), cut the hardened sealing resin composition into a size with a diameter of 8 mm and a length of 20 mm, and heated it from 0°C at 5°C/min by a compression method. up to 300°C The measurement was performed, and the gradient of the tangent line at 10°C to 30°C was defined as the coefficient of thermal expansion (ppm/°C). The results are shown in Table 1.

(Measuring method of modulus of elasticity)

Using a viscoelasticity measurement device (RSA III, TA Instruments), cut the hardened sealing resin composition into a size of 50mm×10mm×3mm, under the conditions of a span distance of 40mm and a frequency of 1Hz The value of the storage modulus (GPa) at 25°C was measured by the three-point bending method until the temperature was raised from 20°C to 300°C at 5°C/min. The results are shown in Table 1.

(Measuring method of glass transition temperature)

It measured with the same apparatus and conditions as said thermal expansion coefficient, and let the temperature corresponding to the intersection of the tangent line of 50 degreeC and 150 degreeC be glass transition temperature (degreeC). The results are shown in Table 1.

As shown in Table 1, regarding bisphenol-type epoxy resin and specific naphthalene-type epoxy resin as the epoxy resin and the proportion of the specific naphthalene-type epoxy resin in the entire epoxy resin is 10% by mass to 30% by mass The resin composition for sealing of the example is superior in injectability and has a lower coefficient of thermal expansion and modulus of elasticity than the resin composition for sealing of the comparative example which does not satisfy the above conditions. From this, it was revealed that even if stress occurs between the cured product of the sealing resin composition and the support, it is excellent in the effect of reducing or alleviating the stress.

The disclosure of Japanese Patent Application No. 2017-127581 is hereby incorporated by reference in its entirety.

Regarding all documents, patent applications and technical specifications described in this specification, Each document, patent application, and technical specification is cited and incorporated in this specification to the same extent as if it were specifically and individually described to be incorporated by reference.

Claims (8)

A resin composition for sealing, which is liquid when used, and includes epoxy resin, hardener and filler, and the epoxy resin includes bisphenol-type epoxy resin, 1,6-bis(glycidyloxy ) naphthalene and a trifunctional glycidylamine epoxy resin, the proportion of the 1,6-bis(glycidyloxy)naphthalene in the epoxy resin as a whole is 10% by mass to 30% by mass. The resin composition for sealing as described in claim 1 of the patent application, wherein the bisphenol type epoxy resin includes bisphenol F type epoxy resin. The resin composition for sealing according to claim 1 or 2, wherein the ratio of the bisphenol-type epoxy resin to the entire epoxy resin is 20% by mass or more and less than 90% by mass. quality%. The resin composition for sealing as described in item 1 of the scope of the patent application, wherein the trifunctional glycidylamine epoxy resin is triglycidyl-p-aminophenol. The sealing resin composition described in claim 4 of the patent application, wherein the proportion of the trifunctional glycidylamine-type epoxy resin in the entire epoxy resin is 10% by mass to 60% by mass. The resin composition for sealing according to claim 1, wherein the hardener includes an amine hardener. A semiconductor package comprising: a support, a semiconductor element disposed on the support, and the sealing resin according to any one of claims 1 to 6 of the patent application for sealing the semiconductor element hardening of the composition. A method for manufacturing a semiconductor package, comprising: using the encapsulating resin composition described in any one of claims 1 to 6 of the patent application to fill between a support and a semiconductor element disposed on the support and a step of hardening the sealing resin composition.