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TWI776614B - 感光性薄膜層合體及使用其所形成之硬化物 - Google Patents

感光性薄膜層合體及使用其所形成之硬化物 Download PDF

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Publication number
TWI776614B
TWI776614B TW110127641A TW110127641A TWI776614B TW I776614 B TWI776614 B TW I776614B TW 110127641 A TW110127641 A TW 110127641A TW 110127641 A TW110127641 A TW 110127641A TW I776614 B TWI776614 B TW I776614B
Authority
TW
Taiwan
Prior art keywords
photosensitive film
film
photosensitive
resin
group
Prior art date
Application number
TW110127641A
Other languages
English (en)
Chinese (zh)
Other versions
TW202144919A (zh
Inventor
舟越千弘
梨子
岡田和也
佐藤和也
伊藤秀之
荒井康昭
伊藤信人
Original Assignee
日商太陽油墨製造股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商太陽油墨製造股份有限公司 filed Critical 日商太陽油墨製造股份有限公司
Publication of TW202144919A publication Critical patent/TW202144919A/zh
Application granted granted Critical
Publication of TWI776614B publication Critical patent/TWI776614B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
TW110127641A 2017-01-17 2018-01-16 感光性薄膜層合體及使用其所形成之硬化物 TWI776614B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017006196 2017-01-17
JP2017-006196 2017-01-17
JP2017186951A JP6345855B1 (ja) 2017-01-17 2017-09-27 感光性フィルム積層体およびそれを用いて形成された硬化物
JP2017-186951 2017-09-27

Publications (2)

Publication Number Publication Date
TW202144919A TW202144919A (zh) 2021-12-01
TWI776614B true TWI776614B (zh) 2022-09-01

Family

ID=62635704

Family Applications (3)

Application Number Title Priority Date Filing Date
TW107101481A TWI735731B (zh) 2017-01-17 2018-01-16 感光性薄膜層合體及使用其所形成之硬化物
TW110127640A TWI776613B (zh) 2017-01-17 2018-01-16 感光性薄膜層合體及使用其所形成之硬化物
TW110127641A TWI776614B (zh) 2017-01-17 2018-01-16 感光性薄膜層合體及使用其所形成之硬化物

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW107101481A TWI735731B (zh) 2017-01-17 2018-01-16 感光性薄膜層合體及使用其所形成之硬化物
TW110127640A TWI776613B (zh) 2017-01-17 2018-01-16 感光性薄膜層合體及使用其所形成之硬化物

Country Status (4)

Country Link
JP (1) JP6345855B1 (ja)
KR (1) KR102371010B1 (ja)
CN (1) CN108327357B (ja)
TW (3) TWI735731B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102604565B1 (ko) * 2019-01-10 2023-11-23 삼성디스플레이 주식회사 윈도우 및 이의 제조 방법
US12259652B2 (en) 2020-08-26 2025-03-25 Tamura Corporation Photosensitive dry film, and printed wiring board with photosensitive dry film
JPWO2022138468A1 (ja) * 2020-12-25 2022-06-30
WO2022210945A1 (ja) * 2021-03-31 2022-10-06 太陽インキ製造株式会社 硬化性樹脂組成物、積層構造体、硬化物および電子部品
JP2022157524A (ja) 2021-03-31 2022-10-14 太陽インキ製造株式会社 電子部材用絶縁膜、および電子部材用絶縁膜を製造する方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200941138A (en) * 2008-02-01 2009-10-01 Fujifilm Corp Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern, and printed board
CN102387666A (zh) * 2010-09-06 2012-03-21 日东电工株式会社 布线电路板及其制造方法
TW201217905A (en) * 2010-07-13 2012-05-01 Hitachi Chemical Co Ltd in which the Haze of the support film is 0.01-2.0%, and the total particles with diameter greater than 5 μm and agglutinate with diameter greater than 5 μm in the support film are less than 5 per mm<SP>2</SP>
WO2012157135A1 (ja) * 2011-05-17 2012-11-22 三共化成株式会社 成形回路基板の製造方法
TW201601608A (zh) * 2014-06-30 2016-01-01 太陽油墨製造股份有限公司 感光性乾膜及使用此之印刷配線板之製造方法

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* Cited by examiner, † Cited by third party
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JPH0289631A (ja) * 1988-09-27 1990-03-29 Somar Corp ケミカルマットフィルム及びそれを用いた感光性フィルム
JPH0836258A (ja) * 1994-07-25 1996-02-06 Hitachi Chem Co Ltd 感光性エレメント、その積層方法及びレジスト形成方法
JPH0961996A (ja) * 1995-08-28 1997-03-07 Hitachi Chem Co Ltd 感光性樹脂組成物、感光性エレメント及びプラズマディスプレイの背面板の製造法
JP4415175B2 (ja) * 2003-11-06 2010-02-17 ソニー株式会社 電鋳金型の製造方法
EP1963920B1 (en) * 2005-12-21 2012-05-16 FUJIFILM Corporation Photosensitive sheets and method and apparatus for manufacturing the same
WO2007125992A1 (ja) * 2006-04-28 2007-11-08 Asahi Kasei Emd Corporation 感光性樹脂積層体
JP5279423B2 (ja) * 2008-05-19 2013-09-04 富士フイルム株式会社 感光性組成物、感光性フィルム、感光性積層体、永久パターン形成方法、及びプリント基板
JP2010085513A (ja) * 2008-09-30 2010-04-15 Toyo Ink Mfg Co Ltd 感光性ドライフィルム
JP2012116130A (ja) * 2010-12-02 2012-06-21 Fujifilm Corp 金属膜を有する積層体の製造方法
CN103261966A (zh) * 2010-12-16 2013-08-21 日立化成株式会社 感光性元件、抗蚀图案的形成方法以及印刷布线板的制造方法
CN103764385B (zh) * 2012-06-13 2016-02-17 旭化成电子材料株式会社 功能转印体、功能层的转印方法、封装物以及功能转印膜辊
JP6014680B2 (ja) * 2012-11-19 2016-10-25 タツタ電線株式会社 積層フィルム及びシールドプリント配線板
JP2017165589A (ja) * 2014-08-01 2017-09-21 旭硝子株式会社 無機膜付き支持基板およびガラス積層体、ならびに、その製造方法および電子デバイスの製造方法
JP2016151578A (ja) * 2015-02-16 2016-08-22 旭化成株式会社 光学基材の製造装置及び光学基材の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200941138A (en) * 2008-02-01 2009-10-01 Fujifilm Corp Photosensitive composition, photosensitive film, photosensitive laminate, method of forming permanent pattern, and printed board
TW201217905A (en) * 2010-07-13 2012-05-01 Hitachi Chemical Co Ltd in which the Haze of the support film is 0.01-2.0%, and the total particles with diameter greater than 5 μm and agglutinate with diameter greater than 5 μm in the support film are less than 5 per mm<SP>2</SP>
CN102387666A (zh) * 2010-09-06 2012-03-21 日东电工株式会社 布线电路板及其制造方法
WO2012157135A1 (ja) * 2011-05-17 2012-11-22 三共化成株式会社 成形回路基板の製造方法
TW201601608A (zh) * 2014-06-30 2016-01-01 太陽油墨製造股份有限公司 感光性乾膜及使用此之印刷配線板之製造方法

Also Published As

Publication number Publication date
TW201839516A (zh) 2018-11-01
KR102371010B1 (ko) 2022-03-07
TW202144918A (zh) 2021-12-01
TW202144919A (zh) 2021-12-01
JP6345855B1 (ja) 2018-06-20
CN108327357B (zh) 2021-09-28
TWI735731B (zh) 2021-08-11
TWI776613B (zh) 2022-09-01
CN108327357A (zh) 2018-07-27
JP2018116255A (ja) 2018-07-26
KR20180084674A (ko) 2018-07-25

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