TWI753071B - 配線基板及其製造方法以及可拉伸元件 - Google Patents

配線基板及其製造方法以及可拉伸元件 Download PDF

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Publication number: TWI753071B
Authority: TW; Taiwan
Prior art keywords: rubber; resin layer; meth; group; wiring board
Prior art date: 2016-12-26

Application number

TW106145176A

Other languages

English (en)

Chinese (zh)

Other versions

TW201828374A (zh

Inventor

正木剛史

川守崇司

山田薫平

唐伊沈

小川禎宏

Original Assignee

日商昭和電工材料股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2016-12-26

Filing date

2017-12-22

Publication date

2022-01-21

2017-12-22 Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司

2018-08-01 Publication of TW201828374A publication Critical patent/TW201828374A/zh

2022-01-21 Application granted granted Critical

2022-01-21 Publication of TWI753071B publication Critical patent/TWI753071B/zh

Links

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Images

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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections

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Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Laminated Bodies (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Structure Of Printed Boards (AREA)
Manufacturing Of Printed Circuit Boards (AREA)

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US20070141757A1 (en) *	2005-12-20	2007-06-21	Shinko Electric Industries Co., Ltd.	Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure
TW201643898A (zh) *	2015-03-18	2016-12-16	Tatsuta Densen Kk	可伸縮電纜及可伸縮電路基板

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JP5465124B2 (ja) *	2010-07-30	2014-04-09	東海ゴム工業株式会社	柔軟配線体
JP2013187380A (ja) *	2012-03-08	2013-09-19	Nippon Mektron Ltd	伸縮性フレキシブル回路基板およびその製造方法
CN106663638B (zh)	2014-11-18	2020-04-07	日立化成株式会社	半导体装置及其制造方法和挠性树脂层形成用树脂组合物

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US20070141757A1 (en) *	2005-12-20	2007-06-21	Shinko Electric Industries Co., Ltd.	Method of manufacturing flexible wiring substrate and method of manufacturing electronic component mounting structure
TW201643898A (zh) *	2015-03-18	2016-12-16	Tatsuta Densen Kk	可伸縮電纜及可伸縮電路基板

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